Design and Performance Research of a New Dual-Excitation Uniform Eddy Current Probe

A dual-excitation uniform eddy current probe, composed of two excitation coils placed tangentially and one detection coil placed horizontally, is developed to solve the difficulties of detection rate and direction recognition of crack defect. Firstly, a probe simulation model is established using COMSOL Multiphysics, and the differences of eddy current distribution between the dual-excitation probe and the traditional probe are investigated. Then, the influence of the distance between excitation coils on sensitivity and the test capability for crack defects with different depths and directions are investigated. Besides, the sensitivity of the dual-excitation probe is compared to that of the traditional probe made of the same coils. Finally, a physical probe and an experimental system are developed, and the performance of the dual-excitation probe is tested. The experimental results show that the probe developed in this paper exhibits a slightly higher sensitivity than the traditional probe for crack defects with different depths in the range of 0.5 mm-4.0 mm; the measurement accuracy of crack length is about 3.0 mm and can avoid missing detection of crack defects with different directions. In testing, the detection signal can be compensated to achieve precision measurement by identifying the angle of crack defects. This dual-excitation uniform eddy current probe can be used for precise quantification and direction identification of crack defect in eddy current testing.

Cracking the Si Shell Growth in Hexagonal GaP-Si Core-Shell Nanowires

Semiconductor nanowires have increased the palette of possible heterostructures thanks to their more effective strain relaxation. Among these, core-shell heterostructures are much more sensitive to strain than axial ones. It is now accepted that the formation of misfit dislocations depends both on the lattice mismatch and relative dimensions of the core and the shell. Here, we show for the first time the existence of a new kind of defect in core-shell nanowires: cracks. These defects do not originate from a lattice mismatch (we demonstrate their appearance in an essentially zero-mismatch system) but from the thermal history during the growth of the nanowires. Crack defects lead to the development of secondary defects, such as type-I1 stacking faults and Frank-type dislocations. These results provide crucial information with important implications for the optimized synthesis of nanowire-based core-shell heterostructures.