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Yang H, Wang H, Du G, Ni K, Wu Y, Su H, Gao W, Tan X, Yang Z, Yang L, Ran X. Ureido Hyperbranched Polymer Modified Urea-Formaldehyde Resin as High-Performance Particleboard Adhesive. Materials (Basel) 2023;16:ma16114021. [PMID: 37297155 DOI: 10.3390/ma16114021] [Citation(s) in RCA: 2] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/04/2023] [Revised: 05/23/2023] [Accepted: 05/25/2023] [Indexed: 06/12/2023]
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