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Ye Z, Wen X, Wan W, Liu F, Bai W, Xu C, Chen H, Gong P, Han G. Precision Grinding Technology of Silicon Carbide (SiC) Ceramics by Longitudinal Torsional Ultrasonic Vibrations. Materials (Basel) 2023; 16:5572. [PMID: 37629863 PMCID: PMC10456965 DOI: 10.3390/ma16165572] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/30/2023] [Revised: 08/02/2023] [Accepted: 08/04/2023] [Indexed: 08/27/2023]
Abstract
Silicon carbide (SiC) ceramic material has become the most promising third-generation semiconductor material for its excellent mechanical properties at room temperature and high temperature. However, SiC ceramic machining has serious tool wear, low machining efficiency, poor machining quality and other disadvantages due to its high hardness and high wear resistance, which limits the promotion and application of such materials. In this paper, comparison experiments of longitudinal torsional ultrasonic vibration grinding (LTUVG) and common grinding (CG) of SiC ceramics were conducted, and the longitudinal torsional ultrasonic vibration grinding SiC ceramics cutting force model was developed. In addition, the effects of ultrasonic machining parameters on cutting forces, machining quality and subsurface cracking were investigated, and the main factors and optimal parameters affecting the cutting force improvement rate were obtained by orthogonal tests. The results showed that the maximum improvement of cutting force, surface roughness and subsurface crack fracture depth by longitudinal torsional ultrasonic vibrations were 82.59%, 22.78% and 30.75%, respectively. A longitudinal torsional ultrasonic vibrations cutting force prediction model containing the parameters of tool, material properties and ultrasound was established by the removal characteristics of SiC ceramic material, ultrasonic grinding principle and brittle fracture theory. And the predicted results were in good agreement with the experimental results, and the maximum error was less than 15%. The optimum process parameters for cutting force reduction were a spindle speed of 22,000 rpm, a feed rate of 600 mm/min and a depth of cut of 0.011 mm.
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Affiliation(s)
- Zejiu Ye
- School of Mechanical Engineering and Electronic Information, China University of Geosciences, Wuhan 430074, China
| | - Xu Wen
- School of Mechanical Engineering and Electronic Information, China University of Geosciences, Wuhan 430074, China
| | - Weiqiang Wan
- School of Mechanical Engineering and Electronic Information, China University of Geosciences, Wuhan 430074, China
| | - Fuchu Liu
- School of Mechanical Engineering and Electronic Information, China University of Geosciences, Wuhan 430074, China
- Shenzhen Research Institute, China University of Geosciences, Shenzhen 518063, China
| | - Wei Bai
- School of Mechanical Engineering and Electronic Information, China University of Geosciences, Wuhan 430074, China
- Shenzhen Research Institute, China University of Geosciences, Shenzhen 518063, China
| | - Chao Xu
- Shenzhen Tsingding Technology Co., Ltd., Shenzhen 518108, China
- Division of Advanced Manufacturing, Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, China
| | - Hui Chen
- State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an 710072, China;
| | - Pan Gong
- State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China;
| | - Guangchao Han
- School of Mechanical Engineering and Electronic Information, China University of Geosciences, Wuhan 430074, China
- Shenzhen Research Institute, China University of Geosciences, Shenzhen 518063, China
- Division of Advanced Manufacturing, Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, China
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