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Chaudhary M, Shih YC, Tang SY, Yang TY, Kuo TW, Chung CC, Shen YC, Anbalagan AK, Lee CH, Hou TH, He JH, Chueh YL. Phase/Interfacial-Engineered Two-Dimensional-Layered WSe 2 Films by a Plasma-Assisted Selenization Process: Modulation of Oxygen Vacancies in Resistive Random-Access Memory. ACS Appl Mater Interfaces 2023. [PMID: 37428508 DOI: 10.1021/acsami.3c05384] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Subscribe] [Scholar Register] [Indexed: 07/11/2023]
Abstract
Here, we propose phase and interfacial engineering by inserting a functional WO3 layer and selenized it to achieve a 2D-layered WSe2/WO3 heterolayer structure by a plasma-assisted selenization process. The 2D-layered WSe2/WO3 heterolayer was coupled with an Al2O3 film as a resistive switching (RS) layer to form a hybrid structure, with which Pt and W films were used as the top and bottom electrodes, respectively. The device with good uniformity in SET/RESET voltage and high low-/high-resistance window can be obtained by controlling a conversion ratio from a WO3 film to a 2D-layered WSe2 thin film. The Pt/Al2O3/(2D-layered WSe2/WO3)/W structure shows remarkable improvement to the pristine Pt/Al2O3/W and Pt/Al2O3/2D-layered WO3/W in terms of low SET/RESET voltage variability (-20/20)%, multilevel characteristics (uniform LRS/HRS distribution), high on/off ratio (104-105), and retention (∼105 s). The thickness of the obtained WSe2 was tuned at different gas ratios to optimize different 2D-layered WSe2/WO3 (%) ratios, showing a distinctive trend of reduced and uniform SET/RESET voltage variability as 2D-layered WSe2/WO3 (%) changes from 90/10 (%) to 45/55 (%), respectively. The electrical measurements confirm the superior ability of the metallic 1T phase of the 2D-layered WSe2 over the semiconducting 2H phase. Through systemic studies of RS behaviors on the effect of 1T/2H phases and 2D-layered WSe2/WO3 ratios, the low-temperature plasma-assisted selenization offers compatibility with the temperature-limited 3D integration process and also provides much better thickness control over a large area.
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Affiliation(s)
- Mayur Chaudhary
- Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan
- International Intercollegiate Ph.D. Program, National Tsing Hua University, Hsinchu 30013, Taiwan
- College of Semiconductor Research, National Tsing Hua University, Hsinchu 30013, Taiwan
- Department of Physics, National Sun Yat-Sen University, Kaohsiung 80424, Taiwan
- Frontier Research Center on Fundamental and Applied Sciences of Matters, National Tsing Hua University, Hsinchu 30013, Taiwan
| | - Yu-Chuan Shih
- Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan
- College of Semiconductor Research, National Tsing Hua University, Hsinchu 30013, Taiwan
- Department of Physics, National Sun Yat-Sen University, Kaohsiung 80424, Taiwan
- Frontier Research Center on Fundamental and Applied Sciences of Matters, National Tsing Hua University, Hsinchu 30013, Taiwan
| | - Shin-Yi Tang
- Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan
- College of Semiconductor Research, National Tsing Hua University, Hsinchu 30013, Taiwan
- Department of Physics, National Sun Yat-Sen University, Kaohsiung 80424, Taiwan
- Frontier Research Center on Fundamental and Applied Sciences of Matters, National Tsing Hua University, Hsinchu 30013, Taiwan
- Semiconductor Research Center, Hon Hai Research Institute, Taipei 11492, Taiwan
| | - Tzu-Yi Yang
- Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan
- College of Semiconductor Research, National Tsing Hua University, Hsinchu 30013, Taiwan
- Department of Physics, National Sun Yat-Sen University, Kaohsiung 80424, Taiwan
- Frontier Research Center on Fundamental and Applied Sciences of Matters, National Tsing Hua University, Hsinchu 30013, Taiwan
| | - Tzu-Wen Kuo
- Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan
- College of Semiconductor Research, National Tsing Hua University, Hsinchu 30013, Taiwan
- Department of Physics, National Sun Yat-Sen University, Kaohsiung 80424, Taiwan
- Frontier Research Center on Fundamental and Applied Sciences of Matters, National Tsing Hua University, Hsinchu 30013, Taiwan
| | - Chia-Chen Chung
- Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan
- College of Semiconductor Research, National Tsing Hua University, Hsinchu 30013, Taiwan
- Department of Physics, National Sun Yat-Sen University, Kaohsiung 80424, Taiwan
- Frontier Research Center on Fundamental and Applied Sciences of Matters, National Tsing Hua University, Hsinchu 30013, Taiwan
| | - Ying-Chun Shen
- Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan
- College of Semiconductor Research, National Tsing Hua University, Hsinchu 30013, Taiwan
- Department of Physics, National Sun Yat-Sen University, Kaohsiung 80424, Taiwan
- Frontier Research Center on Fundamental and Applied Sciences of Matters, National Tsing Hua University, Hsinchu 30013, Taiwan
| | - Aswin Kumar Anbalagan
- Department of Engineering and System Science, National Tsing Hua University, Hsinchu 30013, Taiwan
| | - Chih-Hao Lee
- Department of Engineering and System Science, National Tsing Hua University, Hsinchu 30013, Taiwan
| | - Tuo-Hung Hou
- Department of Electronic Engineering, National Yang Ming Chiao Tung University, Hsinchu 30013, Taiwan
| | - Jr-Hau He
- Department of Materials Science and Engineering, City University of Hong Kong, Hong Kong 999077, China
| | - Yu-Lun Chueh
- Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, Taiwan
- College of Semiconductor Research, National Tsing Hua University, Hsinchu 30013, Taiwan
- Department of Physics, National Sun Yat-Sen University, Kaohsiung 80424, Taiwan
- Frontier Research Center on Fundamental and Applied Sciences of Matters, National Tsing Hua University, Hsinchu 30013, Taiwan
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Shen YC, Lee CY, Wang HH, Kao MH, Hou PC, Chen YY, Huang WH, Shen CH, Chueh YL. Embedded Integration of Sb 2Se 3 Film by Low-Temperature Plasma-Assisted Chemical Vapor Reaction with Polycrystalline Si Transistor for High-Performance Flexible Visible-to-Near-Infrared Photodetector. ACS Nano 2023; 17:2019-2028. [PMID: 36689417 DOI: 10.1021/acsnano.2c07288] [Citation(s) in RCA: 2] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/17/2023]
Abstract
Flexible optoelectronics have garnered considerable interest for applications such as optical communication, motion capture, biosignal detection, and night vision. Transition-metal dichalcogenides are widely used as flexible photodetectors owing to their outstanding electrical and optical properties and high flexibility. Herein, a two-dimensional (2D) Sb2Se3 film-based one transistor-one resistor (1T1R) flexible photodetector with high photosensing current and detection ranges from visible to near-infrared was developed. The flexible 1T1R was fabricated using an efficient field-effect transistor platform with the 2D Sb2Se3 film directly deposited on the sensing region using a low-temperature plasma-assisted chemical vapor reaction. The photodetector could achieve a maximum Iphoto/Idark of 15,000 under white light with a power density of 26 mW/cm2, in which the photodetector showed quick rising and falling response times of 0.16 and 0.28 s, respectively. The 2D Sb2Se3 film exhibits broadband absorption in the visible and IR regions, yielding an excellent photoresponse under laser illumination with different wavelengths. To investigate the flexibility and stability of the 1T1R photodetector, the photoresponses were measured under different bending cycles and curvatures, which maintained its functions and exhibited high stability under convex and concave bending at a curvature radius of 20 mm.
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Affiliation(s)
- Ying-Chun Shen
- Department of Physics, National Sun Yat-Sen University, Kaohsiung 80424, Taiwan
| | - Cheng-Yu Lee
- Department of Physics, National Sun Yat-Sen University, Kaohsiung 80424, Taiwan
| | - Hsing-Hsiang Wang
- National Applied Research Laboratories, Taiwan Semiconductor Research Institute, Hsinchu 300091, Taiwan
| | - Ming-Hsuan Kao
- National Applied Research Laboratories, Taiwan Semiconductor Research Institute, Hsinchu 300091, Taiwan
| | - Po-Cheng Hou
- National Applied Research Laboratories, Taiwan Semiconductor Research Institute, Hsinchu 300091, Taiwan
| | - Yen-Yu Chen
- Department of Physics, National Sun Yat-Sen University, Kaohsiung 80424, Taiwan
| | - Wen-Hsien Huang
- National Applied Research Laboratories, Taiwan Semiconductor Research Institute, Hsinchu 300091, Taiwan
| | - Chang-Hong Shen
- National Applied Research Laboratories, Taiwan Semiconductor Research Institute, Hsinchu 300091, Taiwan
| | - Yu-Lun Chueh
- Department of Physics, National Sun Yat-Sen University, Kaohsiung 80424, Taiwan
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