1
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Tian H, Liu C, Hao H, Wang X, Chen H, Ruan Y, Huang J. Recent advances in wearable flexible electronic skin: types, power supply methods, and development prospects. JOURNAL OF BIOMATERIALS SCIENCE. POLYMER EDITION 2024; 35:1455-1492. [PMID: 38569070 DOI: 10.1080/09205063.2024.2334974] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/13/2023] [Accepted: 11/27/2023] [Indexed: 04/05/2024]
Abstract
In recent years, wearable e-skin has emerged as a prominent technology with a wide range of applications in healthcare, health surveillance, human-machine interface, and virtual reality. Inspired by the properties of human skin, arrayed wearable e-skin is a novel technology that offers multifunctional sensing capabilities. It can detect and quantify various stimuli, mimicking the human somatosensory system, and record a wide range of physical and physiological parameters in real time. By combining flexible electronic device units with a data acquisition system, specific functional sensors can be distributed in targeted areas to achieve high sensitivity, resolution, adjustable sensing range, and large-area expandability. This review provides a comprehensive overview of recent advances in wearable e-skin technology, including its development status, types of applications, power supply methods, and prospects for future development. The emphasis of current research is on enhancing the sensitivity and stability of sensors, improving the comfort and reliability of wearable devices, and developing intelligent data processing and application algorithms. This review aims to serve as a scientific reference for the intelligent development of wearable e-skin technology.
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Affiliation(s)
- Hongying Tian
- School of Mechanical and Vehicle Engineering, Taiyuan University of Technology, Shanxi, China
| | - Chang Liu
- School of Mechanical and Vehicle Engineering, Taiyuan University of Technology, Shanxi, China
| | - Huimin Hao
- School of Mechanical and Vehicle Engineering, Taiyuan University of Technology, Shanxi, China
| | - Xiangrong Wang
- School of Mechanical and Vehicle Engineering, Taiyuan University of Technology, Shanxi, China
| | - Hui Chen
- School of Mechanical and Vehicle Engineering, Taiyuan University of Technology, Shanxi, China
| | - Yilei Ruan
- Chemical Engineering and Technology, North University of China, Shanxi, China
| | - Jiahai Huang
- School of Mechanical and Vehicle Engineering, Taiyuan University of Technology, Shanxi, China
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2
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Lee S, Liang X, Kim JS, Yokota T, Fukuda K, Someya T. Permeable Bioelectronics toward Biointegrated Systems. Chem Rev 2024; 124:6543-6591. [PMID: 38728658 DOI: 10.1021/acs.chemrev.3c00823] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 05/12/2024]
Abstract
Bioelectronics integrates electronics with biological organs, sustaining the natural functions of the organs. Organs dynamically interact with the external environment, managing internal equilibrium and responding to external stimuli. These interactions are crucial for maintaining homeostasis. Additionally, biological organs possess a soft and stretchable nature; encountering objects with differing properties can disrupt their function. Therefore, when electronic devices come into contact with biological objects, the permeability of these devices, enabling interactions and substance exchanges with the external environment, and the mechanical compliance are crucial for maintaining the inherent functionality of biological organs. This review discusses recent advancements in soft and permeable bioelectronics, emphasizing materials, structures, and a wide range of applications. The review also addresses current challenges and potential solutions, providing insights into the integration of electronics with biological organs.
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Affiliation(s)
- Sunghoon Lee
- Thin-Film Device Laboratory & Center for Emergent Matter Science (CEMS), RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Xiaoping Liang
- Electrical and Electronic Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan
| | - Joo Sung Kim
- Thin-Film Device Laboratory & Center for Emergent Matter Science (CEMS), RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Tomoyuki Yokota
- Electrical and Electronic Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan
| | - Kenjiro Fukuda
- Thin-Film Device Laboratory & Center for Emergent Matter Science (CEMS), RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
| | - Takao Someya
- Thin-Film Device Laboratory & Center for Emergent Matter Science (CEMS), RIKEN, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan
- Electrical and Electronic Engineering and Information Systems, The University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan
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3
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Ye Y, Hong Y, Liang Q, Wang Y, Wang P, Luo J, Yin A, Ren Z, Liu H, Qi X, He S, Yu S, Wei J. Bioinspired electrically stable, optically tunable thermal management electronic skin via interfacial self-assembly. J Colloid Interface Sci 2024; 660:608-616. [PMID: 38266342 DOI: 10.1016/j.jcis.2024.01.041] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/27/2023] [Revised: 12/27/2023] [Accepted: 01/06/2024] [Indexed: 01/26/2024]
Abstract
The skin is the largest organ in the human body and serves vital functions such as sensation, thermal management, and protection. While electronic skin (E-skin) has made significant progress in sensory functions, achieving adaptive thermal management akin to human skin has remained a challenge. Drawing inspiration from squid skin, we have developed a hybrid electronic-photonic skin (hEP-skin) using an elastomer semi-embedded with aligned silver nanowires through interfacial self-assembly. With mechanically adjustable optical properties, the hEP-skin demonstrates adaptive thermal management abilities, warming in the range of +3.5°C for heat preservation and cooling in the range of -4.2°C for passive cooling. Furthermore, it exhibits an ultra-stable high electrical conductivity of ∼4.5×104 S/cm, even under stretching, bending or torsional deformations over 10,000 cycles. As a proof of demonstration, the hEP-skin successfully integrates stretchable light-emitting electronic skin with adaptive thermal management photonic skin.
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Affiliation(s)
- Yang Ye
- Shenzhen Key Laboratory of Flexible Printed Electronics Technology, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
| | - Yang Hong
- School of Science, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
| | - Qimin Liang
- School of Science, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
| | - Yuxin Wang
- Shenzhen Key Laboratory of Flexible Printed Electronics Technology, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
| | - Peike Wang
- Shenzhen Key Laboratory of Flexible Printed Electronics Technology, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
| | - Jingjing Luo
- Shenzhen Key Laboratory of Flexible Printed Electronics Technology, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
| | - Ao Yin
- Shenzhen Key Laboratory of Flexible Printed Electronics Technology, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
| | - Zhongqi Ren
- Shenzhen Key Laboratory of Flexible Printed Electronics Technology, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
| | - Haipeng Liu
- Shenzhen Key Laboratory of Flexible Printed Electronics Technology, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
| | - Xue Qi
- Shenzhen Key Laboratory of Flexible Printed Electronics Technology, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
| | - Sisi He
- School of Science, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China.
| | - Suzhu Yu
- Shenzhen Key Laboratory of Flexible Printed Electronics Technology, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China.
| | - Jun Wei
- Shenzhen Key Laboratory of Flexible Printed Electronics Technology, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China.
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4
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Won D, Bang J, Choi SH, Pyun KR, Jeong S, Lee Y, Ko SH. Transparent Electronics for Wearable Electronics Application. Chem Rev 2023; 123:9982-10078. [PMID: 37542724 PMCID: PMC10452793 DOI: 10.1021/acs.chemrev.3c00139] [Citation(s) in RCA: 52] [Impact Index Per Article: 26.0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/07/2023] [Indexed: 08/07/2023]
Abstract
Recent advancements in wearable electronics offer seamless integration with the human body for extracting various biophysical and biochemical information for real-time health monitoring, clinical diagnostics, and augmented reality. Enormous efforts have been dedicated to imparting stretchability/flexibility and softness to electronic devices through materials science and structural modifications that enable stable and comfortable integration of these devices with the curvilinear and soft human body. However, the optical properties of these devices are still in the early stages of consideration. By incorporating transparency, visual information from interfacing biological systems can be preserved and utilized for comprehensive clinical diagnosis with image analysis techniques. Additionally, transparency provides optical imperceptibility, alleviating reluctance to wear the device on exposed skin. This review discusses the recent advancement of transparent wearable electronics in a comprehensive way that includes materials, processing, devices, and applications. Materials for transparent wearable electronics are discussed regarding their characteristics, synthesis, and engineering strategies for property enhancements. We also examine bridging techniques for stable integration with the soft human body. Building blocks for wearable electronic systems, including sensors, energy devices, actuators, and displays, are discussed with their mechanisms and performances. Lastly, we summarize the potential applications and conclude with the remaining challenges and prospects.
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Affiliation(s)
- Daeyeon Won
- Applied
Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, Seoul 08826, Korea
| | - Junhyuk Bang
- Applied
Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, Seoul 08826, Korea
| | - Seok Hwan Choi
- Applied
Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, Seoul 08826, Korea
| | - Kyung Rok Pyun
- Applied
Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, Seoul 08826, Korea
| | - Seongmin Jeong
- Applied
Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, Seoul 08826, Korea
| | - Youngseok Lee
- Applied
Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, Seoul 08826, Korea
| | - Seung Hwan Ko
- Applied
Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, Seoul 08826, Korea
- Institute
of Engineering Research/Institute of Advanced Machinery and Design
(SNU-IAMD), Seoul National University, Seoul 08826, South Korea
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5
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Zhang S, Zhao W, Zeng J, He Z, Wang X, Zhu Z, Hu R, Liu C, Wang Q. Wearable non-invasive glucose sensors based on metallic nanomaterials. Mater Today Bio 2023; 20:100638. [PMID: 37128286 PMCID: PMC10148187 DOI: 10.1016/j.mtbio.2023.100638] [Citation(s) in RCA: 8] [Impact Index Per Article: 4.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/20/2023] [Revised: 04/01/2023] [Accepted: 04/14/2023] [Indexed: 05/03/2023] Open
Abstract
The development of wearable non-invasive glucose sensors provides a convenient technical means to monitor the glucose concentration of diabetes patients without discomfortability and risk of infection. Apart from enzymes as typical catalytic materials, the active catalytic materials of the glucose sensor are mainly composed of polymers, metals, alloys, metal compounds, and various metals that can undergo catalytic oxidation with glucose. Among them, metallic nanomaterials are the optimal materials applied in the field of wearable non-invasive glucose sensing due to good biocompatibility, large specific surface area, high catalytic activity, and strong adsorption capacity. This review summarizes the metallic nanomaterials used in wearable non-invasive glucose sensors including zero-dimensional (0D), one-dimensional (1D), and two-dimensional (2D) monometallic nanomaterials, bimetallic nanomaterials, metal oxide nanomaterials, etc. Besides, the applications of wearable non-invasive biosensors based on these metallic nanomaterials towards glucose detection are summarized in detail and the development trend of the wearable non-invasive glucose sensors based on metallic nanomaterials is also outlook.
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Affiliation(s)
- Sheng Zhang
- Ningbo Innovation Center, Zhejiang University, Ningbo, 315100, China
- School of Mechanical Engineering, Zhejiang University, Hangzhou, 310027, China
- NingboTech University, Ningbo, 315100, China
- Faculty of Science and Engineering, University of Nottingham Ningbo China, Ningbo, 315100, China
| | - Wenjie Zhao
- Ningbo Innovation Center, Zhejiang University, Ningbo, 315100, China
- School of Mechanical Engineering, Zhejiang University, Hangzhou, 310027, China
| | - Junyan Zeng
- Ningbo Innovation Center, Zhejiang University, Ningbo, 315100, China
- School of Mechanical Engineering, Zhejiang University, Hangzhou, 310027, China
| | - Zhaotao He
- Ningbo Innovation Center, Zhejiang University, Ningbo, 315100, China
- School of Mechanical Engineering, Zhejiang University, Hangzhou, 310027, China
| | - Xiang Wang
- Faculty of Science and Engineering, University of Nottingham Ningbo China, Ningbo, 315100, China
| | - Zehui Zhu
- Ningbo Innovation Center, Zhejiang University, Ningbo, 315100, China
| | - Runqing Hu
- NingboTech University, Ningbo, 315100, China
| | - Chen Liu
- Ningbo Innovation Center, Zhejiang University, Ningbo, 315100, China
- Faculty of Science and Engineering, University of Nottingham Ningbo China, Ningbo, 315100, China
- Corresponding author. Ningbo Innovation Center, Zhejiang University, Ningbo, 315100, China.
| | - Qianqian Wang
- Ningbo Innovation Center, Zhejiang University, Ningbo, 315100, China
- NingboTech University, Ningbo, 315100, China
- Corresponding author. Ningbo Innovation Center, Zhejiang University, Ningbo, 315100, China.
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6
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Zhu Y, Li J, Kim J, Li S, Zhao Y, Bahari J, Eliahoo P, Li G, Kawakita S, Haghniaz R, Gao X, Falcone N, Ermis M, Kang H, Liu H, Kim H, Tabish T, Yu H, Li B, Akbari M, Emaminejad S, Khademhosseini A. Skin-interfaced electronics: A promising and intelligent paradigm for personalized healthcare. Biomaterials 2023; 296:122075. [PMID: 36931103 PMCID: PMC10085866 DOI: 10.1016/j.biomaterials.2023.122075] [Citation(s) in RCA: 5] [Impact Index Per Article: 2.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/26/2022] [Revised: 02/23/2023] [Accepted: 03/02/2023] [Indexed: 03/09/2023]
Abstract
Skin-interfaced electronics (skintronics) have received considerable attention due to their thinness, skin-like mechanical softness, excellent conformability, and multifunctional integration. Current advancements in skintronics have enabled health monitoring and digital medicine. Particularly, skintronics offer a personalized platform for early-stage disease diagnosis and treatment. In this comprehensive review, we discuss (1) the state-of-the-art skintronic devices, (2) material selections and platform considerations of future skintronics toward intelligent healthcare, (3) device fabrication and system integrations of skintronics, (4) an overview of the skintronic platform for personalized healthcare applications, including biosensing as well as wound healing, sleep monitoring, the assessment of SARS-CoV-2, and the augmented reality-/virtual reality-enhanced human-machine interfaces, and (5) current challenges and future opportunities of skintronics and their potentials in clinical translation and commercialization. The field of skintronics will not only minimize physical and physiological mismatches with the skin but also shift the paradigm in intelligent and personalized healthcare and offer unprecedented promise to revolutionize conventional medical practices.
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Affiliation(s)
- Yangzhi Zhu
- Terasaki Institute for Biomedical Innovation, Los Angeles, CA, 90064, United States.
| | - Jinghang Li
- Terasaki Institute for Biomedical Innovation, Los Angeles, CA, 90064, United States
| | - Jinjoo Kim
- Terasaki Institute for Biomedical Innovation, Los Angeles, CA, 90064, United States
| | - Shaopei Li
- Terasaki Institute for Biomedical Innovation, Los Angeles, CA, 90064, United States
| | - Yichao Zhao
- Interconnected and Integrated Bioelectronics Lab, Department of Electrical and Computer Engineering, and Materials Science and Engineering, University of California, Los Angeles, CA, 90095, United States
| | - Jamal Bahari
- Terasaki Institute for Biomedical Innovation, Los Angeles, CA, 90064, United States
| | - Payam Eliahoo
- Biomedical Engineering Department, University of Southern California, Los Angeles, CA, 90007, United States
| | - Guanghui Li
- The Centre of Nanoscale Science and Technology and Key Laboratory of Functional Polymer Materials, Institute of Polymer Chemistry, College of Chemistry, Nankai University, Tianjin, 300071, China; Renewable Energy Conversion and Storage Center (RECAST), Nankai University, Tianjin, 300071, China
| | - Satoru Kawakita
- Terasaki Institute for Biomedical Innovation, Los Angeles, CA, 90064, United States
| | - Reihaneh Haghniaz
- Terasaki Institute for Biomedical Innovation, Los Angeles, CA, 90064, United States
| | - Xiaoxiang Gao
- Department of Nanoengineering, University of California, San Diego, La Jolla, CA, 92093, United States
| | - Natashya Falcone
- Terasaki Institute for Biomedical Innovation, Los Angeles, CA, 90064, United States
| | - Menekse Ermis
- Terasaki Institute for Biomedical Innovation, Los Angeles, CA, 90064, United States
| | - Heemin Kang
- Department of Materials Science and Engineering, Korea University, Seoul, 02841, Republic of Korea
| | - Hao Liu
- Bioinspired Engineering and Biomechanics Center (BEBC), Xi'an Jiaotong University, Xi'an, 710049, PR China
| | - HanJun Kim
- Terasaki Institute for Biomedical Innovation, Los Angeles, CA, 90064, United States; College of Pharmacy, Korea University, Sejong, 30019, Republic of Korea
| | - Tanveer Tabish
- Division of Cardiovascular Medicine, Radcliffe Department of Medicine, University of Oxford, Oxford, OX3 7BN, United Kingdom
| | - Haidong Yu
- Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University, Xi'an, 710072, PR China
| | - Bingbing Li
- Terasaki Institute for Biomedical Innovation, Los Angeles, CA, 90064, United States; Department of Manufacturing Systems Engineering and Management, California State University, Northridge, CA, 91330, United States
| | - Mohsen Akbari
- Terasaki Institute for Biomedical Innovation, Los Angeles, CA, 90064, United States; Laboratory for Innovation in Microengineering (LiME), Department of Mechanical Engineering, Center for Biomedical Research, University of Victoria, Victoria, BC V8P 2C5, Canada
| | - Sam Emaminejad
- Interconnected and Integrated Bioelectronics Lab, Department of Electrical and Computer Engineering, and Materials Science and Engineering, University of California, Los Angeles, CA, 90095, United States
| | - Ali Khademhosseini
- Terasaki Institute for Biomedical Innovation, Los Angeles, CA, 90064, United States.
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Yuan X, Li C, Yin X, Yang Y, Ji B, Niu Y, Ren L. Epidermal Wearable Biosensors for Monitoring Biomarkers of Chronic Disease in Sweat. BIOSENSORS 2023; 13:313. [PMID: 36979525 PMCID: PMC10045998 DOI: 10.3390/bios13030313] [Citation(s) in RCA: 14] [Impact Index Per Article: 7.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 12/02/2022] [Revised: 02/15/2023] [Accepted: 02/21/2023] [Indexed: 06/18/2023]
Abstract
Biological information detection technology is mainly used for the detection of physiological and biochemical parameters closely related to human tissues and organ lesions, such as biomarkers. This technology has important value in the clinical diagnosis and treatment of chronic diseases in their early stages. Wearable biosensors can be integrated with the Internet of Things and Big Data to realize the detection, transmission, storage, and comprehensive analysis of human physiological and biochemical information. This technology has extremely wide applications and considerable market prospects in frontier fields including personal health monitoring, chronic disease diagnosis and management, and home medical care. In this review, we systematically summarized the sweat biomarkers, introduced the sweat extraction and collection methods, and discussed the application and development of epidermal wearable biosensors for monitoring biomarkers in sweat in preclinical research in recent years. In addition, the current challenges and development prospects in this field were discussed.
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Affiliation(s)
- Xichen Yuan
- School of Mechanical Engineering, Northwestern Polytechnical University, Xi’an 710072, China
- Key Laboratory for Space Bioscience and Biotechnology, School of Life Sciences, Northwestern Polytechnical University, Xi’an 710072, China
- MOE Key Laboratory of Micro and Nano Systems for Aerospace, Northwestern Polytechnical University, Xi’an 710072, China
| | - Chen Li
- Key Laboratory for Space Bioscience and Biotechnology, School of Life Sciences, Northwestern Polytechnical University, Xi’an 710072, China
- Key Laboratory of Flexible Electronics of Zhejiang, Ningbo Institute of Northwestern Polytechnical University, Ningbo 315103, China
| | - Xu Yin
- School of Mechanical Engineering, Northwestern Polytechnical University, Xi’an 710072, China
| | - Yang Yang
- Ministry of Education Key Laboratory of Low-Grade Energy Utilization Technologies and Systems, Chongqing University, Chongqing 400030, China
| | - Bowen Ji
- Unmanned System Research Institute, Northwestern Polytechnical University, Xi’an 710072, China
| | - Yinbo Niu
- Key Laboratory for Space Bioscience and Biotechnology, School of Life Sciences, Northwestern Polytechnical University, Xi’an 710072, China
| | - Li Ren
- Key Laboratory for Space Bioscience and Biotechnology, School of Life Sciences, Northwestern Polytechnical University, Xi’an 710072, China
- Key Laboratory of Flexible Electronics of Zhejiang, Ningbo Institute of Northwestern Polytechnical University, Ningbo 315103, China
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8
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Yang J, Zhang Z, Zhou P, Zhang Y, Liu Y, Xu Y, Gu Y, Qin S, Haick H, Wang Y. Toward a new generation of permeable skin electronics. NANOSCALE 2023; 15:3051-3078. [PMID: 36723108 DOI: 10.1039/d2nr06236d] [Citation(s) in RCA: 14] [Impact Index Per Article: 7.0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
Skin-mountable electronics are considered to be the future of the next generation of portable electronics, due to their softness and seamless integration with human skin. However, impermeable materials limit device comfort and reliability for long-term, continuous usage. The recent emergence of permeable skin-mountable electronics has attracted tremendous attention in the soft electronics field. Herein, we provide a comprehensive and systematic review of permeable skin-mountable electronics. Typical porous materials and structures are first highlighted, followed by discussion of important device properties. Then, we review the latest representative applications of breathable skin-mountable electronics, such as bioelectrical sensors, temperature sensors, humidity and hydration sensors, strain and pressure sensors, and energy harvesting and storage devices. Finally, a conclusion and future directions for permeable skin electronics are provided.
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Affiliation(s)
- Jiawei Yang
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
- Department of Chemical Engineering, Technion-Israel Institute of Technology (IIT), Haifa 3200003, Israel
| | - Zongman Zhang
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
| | - Pengcheng Zhou
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
| | - Yujie Zhang
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
- Department of Chemical Engineering, Technion-Israel Institute of Technology (IIT), Haifa 3200003, Israel
| | - Yi Liu
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
- Department of Chemical Engineering, Technion-Israel Institute of Technology (IIT), Haifa 3200003, Israel
| | - Yumiao Xu
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
| | - Yuheng Gu
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
| | - Shenglin Qin
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
| | - Hossam Haick
- Department of Chemical Engineering and Russell Berrie Nanotechnology Institute, Technion-Israel Institute of Technology, Haifa 3200003, Israel.
| | - Yan Wang
- Department of Chemical Engineering, Guangdong Technion-Israel Institute of Technology (GTIIT), Shantou, Guangdong 515063, China.
- Department of Chemical Engineering, Technion-Israel Institute of Technology (IIT), Haifa 3200003, Israel
- Guangdong Provincial Key Laboratory of Materials and Technologies for Energy Conversion, Guangdong Technion-Israel Institute of Technology, Shantou, Guangdong 515063, China
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9
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Affiliation(s)
- Baoying Dai
- State Key Laboratory of Organic Electronics and Information Displays & Institute of Advanced Materials (IAM) Jiangsu Key Laboratory for Biosensors Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM) Nanjing University of Posts and Telecommunications Nanjing China
| | - Chenchen Gao
- State Key Laboratory of Organic Electronics and Information Displays & Institute of Advanced Materials (IAM) Jiangsu Key Laboratory for Biosensors Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM) Nanjing University of Posts and Telecommunications Nanjing China
| | - Yannan Xie
- State Key Laboratory of Organic Electronics and Information Displays & Institute of Advanced Materials (IAM) Jiangsu Key Laboratory for Biosensors Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM) Nanjing University of Posts and Telecommunications Nanjing China
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10
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Yang Y, Cui T, Li D, Ji S, Chen Z, Shao W, Liu H, Ren TL. Breathable Electronic Skins for Daily Physiological Signal Monitoring. NANO-MICRO LETTERS 2022; 14:161. [PMID: 35943631 PMCID: PMC9362661 DOI: 10.1007/s40820-022-00911-8] [Citation(s) in RCA: 43] [Impact Index Per Article: 14.3] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/30/2022] [Accepted: 06/30/2022] [Indexed: 05/26/2023]
Abstract
With the aging of society and the increase in people's concern for personal health, long-term physiological signal monitoring in daily life is in demand. In recent years, electronic skin (e-skin) for daily health monitoring applications has achieved rapid development due to its advantages in high-quality physiological signals monitoring and suitability for system integrations. Among them, the breathable e-skin has developed rapidly in recent years because it adapts to the long-term and high-comfort wear requirements of monitoring physiological signals in daily life. In this review, the recent achievements of breathable e-skins for daily physiological monitoring are systematically introduced and discussed. By dividing them into breathable e-skin electrodes, breathable e-skin sensors, and breathable e-skin systems, we sort out their design ideas, manufacturing processes, performances, and applications and show their advantages in long-term physiological signal monitoring in daily life. In addition, the development directions and challenges of the breathable e-skin are discussed and prospected.
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Affiliation(s)
- Yi Yang
- School of Integrated Circuit, and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, 100084, People's Republic of China.
| | - Tianrui Cui
- School of Integrated Circuit, and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, 100084, People's Republic of China
| | - Ding Li
- School of Integrated Circuit, and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, 100084, People's Republic of China
| | - Shourui Ji
- School of Integrated Circuit, and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, 100084, People's Republic of China
| | - Zhikang Chen
- School of Integrated Circuit, and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, 100084, People's Republic of China
| | - Wancheng Shao
- School of Integrated Circuit, and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, 100084, People's Republic of China
| | - Houfang Liu
- School of Integrated Circuit, and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, 100084, People's Republic of China.
| | - Tian-Ling Ren
- School of Integrated Circuit, and Beijing National Research Center for Information Science and Technology, Tsinghua University, Beijing, 100084, People's Republic of China.
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, People's Republic of China.
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