Advances on Thermally Conductive Epoxy-Based Composites as Electronic Packaging Underfill Materials-A Review

Carbon Fiber Reinforced Thermoplastics: From Materials to Manufacturing and Applications

Carbon fiber reinforced thermoplastics (CFRTs) have witnessed a resurgence in recent times since their first industrial use over five decades ago, with revitalized interest from aerospace companies and other key sectors including energy and automotive sectors. CFRTs are increasingly gaining footholds in high volume rapid manufacturing in aerospace and nonaerospace sectors owing to their inherent recyclability. However, there has been a lack of contemporary and critical review on this topic so far. This work aims to review the recent advances in CFRTs with emphasis on high performance thermoplastics. Both continuous and discontinuous fiber forms in tape, organosheet and short/long fiber architectures are discussed, their processing and postprocessing methods are reviewed, with emphasis on state-of-the-art welding techniques. Typical applications of CFRTs in industry are examined, including fuselage, pressure vessel, and automotive components. Finally, insights are provided into ongoing challenges, future development, and a roadmap for expediting the development of high-performance CFRTs.

The Influence of Microsecond Pulsed Electric Field and Direct Current Electric Field on the Orientation Angle of Boron Nitride Nanosheets and the Thermal Conductivity of Epoxy Resin Composites

The electric field orientation method effectively promotes the orientation and arrangement of BN nanosheets, forming a thermal conduction network and enhancing the thermal conductivity of the composite material. In this study, microsecond pulsed electric field and direct current electric field were applied to induce the orientation and arrangement of BN nanosheets and improve the thermal conductivity of epoxy resin composites. Under a microsecond pulsed electric field of 50 Hz, 1.5 μs, and 8 kV/mm, the average orientation angle of BN nanosheets increased by 147.7%, and the thermal conductivity of the composite reached 0.352 W/(m·K), which is 1.84 times that of pure epoxy resin. In contrast, under a DC electric field of 70 V/mm, the average orientation angle of BN nanosheets increased by only 57.9%, while the thermal conductivity of the composite reached 0.364 W/(m·K), 1.91 times that of pure epoxy resin. The results indicate that the microsecond pulsed electric field primarily enhances the local orientation of the fillers to improve thermal conductivity, whereas the DC electric field mainly enhances the global arrangement of the fillers to achieve a similar effect. Additionally, thermogravimetric analysis and differential scanning calorimetry were conducted to evaluate the thermal properties of the composites. The results demonstrate that after BN nanosheets orientation and arrangement within the epoxy resin induced by both microsecond pulsed and DC electric fields, the composites exhibited a higher glass transition temperature and improved thermal stability. This study systematically explores the effects of microsecond pulsed and DC electric fields on filler orientation and arrangement, providing valuable insights for the fabrication of electric field-oriented composites.

Preparation of Thermally Conductive and Flame Retardant Epoxy Composites from Polyethylenimine-Boron Nitride Skeleton and Phosphate Ester Hyperbranched Flame Retardant

In the electronics field, the demand for polymer-based interface materials with high thermal conductivity is increasing. In this study, a three-dimensional thermally conductive framework was fabricated using a bidirectional freezing technique, incorporating hexagonal boron nitride (h-BN) as the primary filler and polyethylenimine (PEI) as the binder. Moreover, a phosphate ester hyperbranched flame retardant (DTFR) was synthesized. It was miscible with the epoxy (EP) prepolymer, allowing the flame retardant to be immersed into the three-dimensional thermal conductivity skeleton along with the EP prepolymer. The thermal conductivity of EP composites was increased to 1.35 W m-1 K-1 by introducing only 12.5 vol % of h-BN, exhibiting an increase of 744% compared to that of control EP. In addition, the peak of heat release rate and total heat release of EP composites containing 4% DTFR was significantly reduced by 41.5 and 34.9%, respectively, and the limiting oxygen index was improved from 23.7 to 31.5% compared with that of control EP. This work was believed to provide an interesting and promising strategy for preparing EP composites with good thermal conductivity, homogeneous fire safety, low dielectric constant, and low dielectric loss.

Regio-Selective Mechanical Enhancement of Polymer-Grafted Nanoparticle Composites via Light-Mediated Crosslinking

Polymer-brush-grafted nanoparticles (PGNPs) that can be covalently crosslinked post-processing enable the fabrication of mechanically robust and chemically stable polymer nanocomposites with high inorganic filler content. Modifying PGNP brushes to append UV-activated crosslinkers along the polymer chains would permit a modular crosslinking strategy applicable to a diverse range of nanocomposite compositions. Further, light-activated crosslinking reactions enable spatial control of crosslink density to program intentionally inhomogeneous mechanical responses. Here, a method of synthesizing composites using UV-crosslinkable brush-coated nanoparticles (referred to as UV-XNPs) is introduced that can be applied to various monomer compositions by incorporating photoinitiators into the polymer brushes. UV crosslinking of processed UV-XNP structures can increase their tensile modulus up to 15-fold without any noticeable alteration to their appearance or shape. By using photomasks to alter UV intensity across a sample, intentionally designed inhomogeneities in crosslink density result in predetermined anisotropic shape changes under strain. This unique capability of UV-XNP materials is applied to stiffness-patterned flexible electronic substrates that prevent the delamination of rigid components under deformation. The potential of UV-XNPs as functional, soft device components is further demonstrated by wearable devices that can be modified post-fabrication to customize their performance, permitting the ability to add functionality to existing device architectures.

Revolutionizing High-Temperature Electrical Properties of Epoxy Resin via Tailoring Weak Conjugation Rigid Structures

The escalating demand for high-power and compact-size advanced electronic devices and power systems necessitates polymers to exhibit superior electrical properties even under harsh environments. However, reconciling the seemingly contradictory attributes of excellent electrical properties and thermal stability poses a formidable challenge for current epoxy polymer (EP) materials and their applications. To meet the need, here two classes of bi-aryl diamine curing agents are described that enable polymers to exhibit well-balanced thermal and dielectric properties with functional bridging groups. A weak conjugation system in highly thermally stable polymers with an aromatic backbone is constructed, using electron-modulating bridging groups to immobilize intramolecular free carriers by tailoring trap sites, and bulky bridging groups to prevent molecular stacking to inhibit intermolecular charge transport. The resultant polymer exhibits a volume resistance of 7.45 × 1012 Ω m and a direct current breakdown strength of 368.74 kV mm-1 at 120 °C, which are 2.2 and 2.4 times higher than that of commercial anhydride-cured EP, respectively. It is demonstrated to be due to the inhibition of charge injection and transport. The proposed aromatic amine multimolecule approach, combined with diverse functional bridging groups, is a promising direction for exploring next-generation EP insulation materials suitable for extreme conditions.

Constructing High-Performance Composite Epoxy Resins: Interfacial π-π Stacking Interactions-Driven Physical Rolling Behavior of Silica Microspheres

The intrinsic compromise between strength and toughness in composite epoxy resins significantly constrains their practical applications. In this study, a novel strategy is introduced, leveraging interfacial π-π stacking interactions to induce the "rolling behavior" of microsphere fillers, thereby facilitating efficient energy dissipation. This approach is corroborated through theoretical simulations and experimental validation. The resulting composite epoxy resin demonstrates an impressive 49.8% enhancement in strength and a remarkable 358.9% improvement in toughness compared to conventional epoxy resins, accompanied by substantially reduced hysteresis. Moreover, this system achieves reversible closed-loop recyclability and rapid repair capabilities. The preliminary demonstration of "force-temperature equivalence" further establishes a novel pathway for the design of high-performance composite epoxy materials.

Self-Adaptive Dielectrics with Tunable Nonlinear Electrical Conductivity via Virus-Like Structures Composed of Metal Particles

Self-adaptive dielectrics (SADs), with the characteristics of rapid charge dissipation in electric field distortion, is regarded as the future material for package insulation of advanced electronic devices. The current landscape of SADs is incapable to achieve tunable nonlinear electrical conductivity and threshold field strength due to the inherent Schottky barrier, significantly limiting the application scenarios of SADs. Here, a strategy is reported to construct a stepped Schottky barrier through virus-like structures, which are composed of subminiature metal particles and semiconductor microspheres. It is found that the metal particles can serve as the capture center to attract the free charge in the matrix, precisely instructing the charge transfer pathway. The barriers between metal particles and semiconductor filler, flexibly controlled by the composition of metal particles, endow with extra source of nonlinear conductivity. Under the optimal composition and size of metal particles, SADs exhibit prominent nonlinear electrical conductivity and reliable adaptive charge release characteristics under pulsed electric field. The work pioneers a breakthrough by overcoming the constraint that SADs are previously limited to the inherent Schottky barrier of semiconductor materials and enabling the unprecedented controllability and flexibility of nonlinear electrical characteristics by metal particles, contributing a distinctive perspective to the development of SADs.

Oxygen-Driven Atom Transfer Radical Polymerization

In traditional atom transfer radical polymerization (ATRP), oxygen must be meticulously eliminated due to its propensity to quench radical species and halt the polymerization process. Additionally, oxygen oxidizes the lower-valent Cu catalyst, compromising its ability to activate alkyl halides and propagate polymerization. In this study, we present an oxygen-driven ATRP utilizing alkylborane compounds, a method that not only circumvents the need for stringent oxygen removal but also exploits oxygen as an essential cofactor to promote polymerization. This approach exhibits broad compatibility in organic or aqueous media, yielding well-defined polymers with low dispersity (Đ as low as 1.11) and molecular weights closely aligned with theoretical values. Triethylborane (Et3B) and its air-stable triethylborane-amine complex (Et3B-DMAP) facilitate controlled polymerization under open-to-air conditions, demonstrating efficiency across a wide range of monomers. Moreover, the technique enables the successful synthesis of protein-polymer conjugates and supports surface modifications of nanoparticles and silicon wafers under aerobic conditions. This oxygen-driven ATRP represents a robust and versatile platform for precision polymerization with far-reaching implications in materials science, biomedicine, and advanced surface engineering.

Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology

Short-wave infrared (SWIR) imaging has a wide range of applications in civil and military fields. Over the past two decades, significant efforts have been devoted to developing high-resolution, high-sensitivity, and cost-effective SWIR sensors covering the spectral range from 0.9 μm to 3 μm. These advancements stimulate new prospects across a wide array of fields including life sciences, medical diagnostics, defense, surveillance, security, free-space optics (FSO), thermography, agriculture, food inspection, and LiDAR applications. In this review, we begin by introducing monolithic SWIR image sensors and hybrid SWIR image sensors and indicate that flip-chip bump bonding technology remains the predominant integration method for hybrid SWIR image sensors owing to its outstanding performance, adaptable integration with innovative epitaxial SWIR materials, long-term stability, and long-term reliability. Subsequently, we comprehensively summarize recent advancements in epitaxial thin-film SWIR sensors, encompassing FPAs and flip-chip bump bonding technology for epitaxial InGaAs and Ge (Sn) thin-film SWIR sensors. Finally, a summary and outlook regarding the development of InGaAs and Ge (Sn) SWIR sensors are provided and discussed. The ongoing evolution of epitaxial thin-film SWIR sensors with flip-chip bump bonding technology is poised to foster new applications in both academic and industry fields.

Bioinspired thermally conducting packaging for heat management of high performance electronic chips

Conventional electronic chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Here we propose and fabricate a closed high-conducting heat chip package based on passive phase change, using silicon carbide which is physically and structurally compatible with chip die materials. Our "chip on vapor chamber" (CoVC) concept realizes rapid diffusion of hot spots, and eliminates the high energy consumption of refrigeration ordinarily required for heat management. Multi-scale wicks and bionic vein structures are applied to CoVC leading to an increase of 164% in heat transfer performance. The thermal resistance of the package was only a third that of traditional packaging systems. This means that the structure of CoVC has a good thermal conducting ability and can reduce energy consumption for heat dissipation.

All-Polymer Composite Film with Outstanding Mechanical, Thermal Conductive, and EMI Shielding Performances

Robust polymer-based composites with high thermal conductivity (TC) and electromagnetic interference shielding effectiveness (EMI SE) hold great promise for applications in rapidly developing electronics. Traditional composites containing inorganic fillers often suffer from increases in processing difficulty, density, and significant deterioration in mechanical properties. Herein, we report for the first time a flexible multilayered all-polymer composite of poly(p-phenyl-2,6-phenylene bisoxazole) (PBO) and poly(3,4-ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS), featuring excellent mechanical strength of 203.9 MPa, in-plane TC of 21.9 W/mK, EMI shielding effectiveness (SE) of 44.2 dB, high-temperature stability, and flame retardancy. The excellent TC, mechanical strength, and flame retardancy of PBO, the remarkable EMI shielding performance of PEDOT:PSS, and the π-π stacking interactions between adjacent layers contribute to the comprehensive properties, which outperform most of the traditional composites of polymers and inorganic fillers reported so far. This full-polymer design may pioneer a new strategy for the preparation of robust and lightweight multifunctional composites.

Core-Shell Engineered Fillers Overcome the Electrical-Thermal Conductance Trade-Off

The rapid development of modern electronic devices increasingly requires thermal management materials with controllable electrical properties, ranging from conductive and dielectric to insulating, to meet the needs of diverse applications. However, highly thermally conductive materials usually have a high electrical conductivity. Intrinsically highly thermally conductive, but electrically insulating materials are still limited to a few kinds of materials. To overcome the electrical-thermal conductance trade-off, here, we report a facile Pechini-based method to prepare multiple core (metal)/shell (metal oxide) engineered fillers, such as aluminum-oxide-coated and beryllium-oxide-coated Ag microspheres. In contrast to the previous in situ growth method which mainly focused on small-sized spheres with specific coating materials, our method combined with ultrafast joule heating treatment is more versatile and robust for varied-sized, especially large-sized core-shell fillers. Through size compounding, the as-synthesized core-shell-filled epoxy composites exhibit high isotropic thermal conductivity (∼3.8 W m-1 K-1) while maintaining high electrical resistivity (∼1012 Ω cm) and good flowability, showing better heat dissipation properties than commercial thermally conductive packaging materials. The successful preparation of these core-shell fillers endows thermally conductive composites with controlled electrical properties for emerging electronic package applications, as demonstrated in circuit board and battery thermal management.

Controllable Self-Assembly of Carbon Nanotubes on Ammonium Polyphosphate as a Game-Changer for Flame Retardancy and Thermal Conductivity in Epoxy Resin

The optimization of flame retardancy and thermal conductivity in epoxy resin (EP), utilized in critical applications such as mechanical components and electronics packaging, is a significant challenge. This study introduces a novel, ultrasound-assisted self-assembly technique to create a dual-functional filler consisting of carbon nanotubes and ammonium polyphosphate (CNTs@APP). This method, leveraging dynamic ligand interactions and strategic solvent selection, allows for precise control over the assembly and distribution of CNTs on APP surfaces, distinguishing it from conventional blending approaches. The integration of 7.5 wt.% CNTs@APP10 into EP nanocomposites results in substantial improvements in flame retardancy, as evidenced by a limiting oxygen index (LOI) value of 31.8% and achievement of the UL-94 V-0 rating. Additionally, critical fire hazard indicators, including total heat release (THR), total smoke release (TSR), and the peak intensity of CO yield (PCOY), are significantly reduced by 45.9% to 77.5%. This method also leads to a remarkable 3.6-fold increase in char yield, demonstrating its game-changing potential over traditional blending techniques. Moreover, despite minimal CNTs addition, thermal conductivity is notably enhanced, showing a 53% increase. This study introduces a novel approach in the development of multifunctional EP nanocomposites, offering potential for wide range of applications.

2D Materials-Based Thermal Interface Materials: Structure, Properties, and Applications

The challenges associated with heat dissipation in high-power electronic devices used in communication, new energy, and aerospace equipment have spurred an urgent need for high-performance thermal interface materials (TIMs) to establish efficient heat transfer pathways from the heater (chip) to heat sinks. Recently, emerging 2D materials, such as graphene and boron nitride, renowned for their ultrahigh basal-plane thermal conductivity and the capacity to facilitate cross-scale, multi-morphic structural design, have found widespread use as thermal fillers in the production of high-performance TIMs. To deepen the understanding of 2D material-based TIMs, this review focuses primarily on graphene and boron nitride-based TIMs, exploring their structures, properties, and applications. Building on this foundation, the developmental history of these TIMs is emphasized and a detailed analysis of critical challenges and potential solutions is provided. Additionally, the preparation and application of some other novel 2D materials-based TIMs are briefly introduced, aiming to offer constructive guidance for the future development of high-performance TIMs.

Thermal Conductive Polymer Composites: Recent Progress and Applications

As microelectronics technology advances towards miniaturization and higher integration, the imperative for developing high-performance thermal management materials has escalated. Thermal conductive polymer composites (TCPCs), which leverage the benefits of polymer matrices and the unique effects of nano-enhancers, are gaining focus as solutions to overheating due to their low density, ease of processing, and cost-effectiveness. However, these materials often face challenges such as thermal conductivities that are lower than expected, limiting their application in high-performance electronic devices. Despite these issues, TCPCs continue to demonstrate broad potential across various industrial sectors. This review comprehensively presents the progress in this field, detailing the mechanisms of thermal conductivity (TC) in these composites and discussing factors that influence thermal performance, such as the intrinsic properties of polymers, interfacial thermal resistance, and the thermal properties of fillers. Additionally, it categorizes and summarizes methods to enhance the TC of polymer composites. The review also highlights the applications of these materials in emerging areas such as flexible electronic devices, personal thermal management, and aerospace. Ultimately, by analyzing current challenges and opportunities, this review provides clear directions for future research and development.

Recyclable and elastic highly thermally conductive epoxy-based composites with covalent-noncovalent interpenetrating networks

High-power electronic architectures and devices require elastic thermally conductive materials. The use of epoxy resin in thermal management is limited due to its rigidity. Here, based on epoxy vitrimer, flexible polyethylene glycol (PEG) chains are introduced into covalent adaptable networks to construct covalent-noncovalent interpenetrating networks, enabling the elasticity of epoxy resins. Compared to traditional silicone-based thermal interface materials, the newly developed elastic epoxy resin shows the advantages of reprocessability, self-healing, and no small molecule release. Results show that, even after being filled with boron nitride and liquid metal, the material maintains its resilience, reprocessability and self-healing properties. Leveraging these characteristics, the composite can be further processed into thin films through a repeated pressing-rolling technique that facilitates the forced orientation of the fillers. Subsequently, the bulk composites are reconstructed using a film-stacking method. The results indicate that the thermal conductivity of the reconstructed bulk composite reaches 3.66 W m-1 K-1, achieving a 68% increase compared to the composite prepared through blending. Due to the existence of covalent adaptable networks, the inorganic and inorganic components of the composite prepared in this work can be completely separated under mild conditions, realizing closed-loop recycling.

Review of Recent Progress on Silicone Rubber Composites for Multifunctional Sensor Systems

The latest progress (the year 2021-2024) on multifunctional sensors based on silicone rubber is reported. These multifunctional sensors are useful for real-time monitoring through relative resistance, relative current change, and relative capacitance types. The present review contains a brief overview and literature survey on the sensors and their multifunctionalities. This contains an introduction to the different functionalities of these sensors. Following the introduction, the survey on the types of filler or rubber and their fabrication are briefly described. The coming section deals with the fabrication methodology of these composites where the sensors are integrated. The special focus on mechanical and electro-mechanical properties is discussed. Electro-mechanical properties with a special focus on response time, linearity, and gauge factor are reported. The next section of this review reports the filler dispersion and its role in influencing the properties and applications of these sensors. Finally, various types of sensors are briefly reported. These sensors are useful for monitoring human body motions, breathing activity, environment or breathing humidity, organic gas sensing, and, finally, smart textiles. Ultimately, the study summarizes the key takeaway from this review article. These conclusions are focused on the merits and demerits of the sensors and are followed by their future prospects.

Ultrahigh Thermal Conductivity of Epoxy/Ag Flakes/MXene@Ag Composites Achieved by In Situ Sintering of Silver Nanoparticles

The growing use of high-power and integrated electronic devices has created a need for thermal conductive adhesives (TCAs) with high thermal conductivity (TC) to manage heat dissipation at the interface. However, TCAs are often limited by contact thermal resistance at the interface between materials. In this study, we synthesized MXene@Ag composites through a direct in situ reduction process. The Ag nanoparticles (Ag NPs) generated by the reduction of the MXene interlayer and surface formed effective thermally conductive pathways with Ag flakes within an epoxy resin matrix. Various characterization analyses revealed that adding MXene@Ag composites at a concentration of 3 wt % resulted in a remarkable TC of 40.80 W/(m·K). This value is 8.77 times higher than that achieved with Ag flakes and 7.9 times higher than with MXene filler alone. The improved TC is attributed to the sintering of the in situ reduced Ag NPs during the curing process, which formed a connection between MXene (a highly conductive material) and the Ag flakes, thereby reducing contact thermal resistance. This reduction in contact thermal resistance significantly enhanced the TC of the thermal interface materials (TIMs). This study presents a novel approach for developing materials with exceptionally high TC, opening new possibilities for the design and fabrication of advanced thermal management systems.

Relief of Residual Stress in Bulk Thermosets in the Glassy State by Local Bond Exchange

The covalently cross-linked network gives thermosets superior thermal, mechanical, and electrical properties, which, however, squarely makes the large residual stress that is inevitably induced during preparation hardly relieved in the glassy state. In this work, an incredible reduction in residual stress is successfully achieved in bulk thermosets in the glassy state through introducing highly dynamic thiocarbamate bonds by "click" reactions of thiols and isocyanates. Due to the excellent dynamic behaviors of thiocarbamate bonds, local network rearrangement is achieved through thermal stimulation, while the strong 3D cross-linked network is well maintained. Ultimately, a decrease by 44% in residual stress is detected by simply annealing samples at 30 °C below glass transition temperature (Tg), during which they could well maintain more than 98.4% of the storage modulus. After the annealing, more uniform residual stress distribution is also observed, showing a 32% decline in sample standard deviation. However, the residual stress of epoxy resin, a typical thermoset as a reference, changes little even after annealing at Tg. The results prove it a feasible strategy to reduce residual stress in bulk thermosets in the glassy state by introducing proper dynamic covalent bonds.

Highly Thermally Conductive Aramid Nanofiber Composite Films with Synchronous Visible/Infrared Camouflages and Information Encryption

The development of highly thermally conductive composites that combine visible light/infrared camouflage and information encryption has been endowed with great significance in facilitating the application of 5G communication technology in military fields. This work uses aramid nanofibers (ANF) as the matrix, hetero-structured silver nanowires@boron nitride nanosheets (AgNWs@BNNS) prepared by in situ growth as fillers, which are combined to fabricate sandwich structured thermally conductive and electrically insulating (BNNS/ANF)-(AgNWs@BNNS)-(BNNS/ANF) (denoted as BAB) composite films by "filtration self-assembly, air spraying, and hot-pressing" method. When the mass ratio of AgNWs@BNNS to BNNS is 1 : 1 and the total mass fraction is 50 wt %, BAB composite film has the maximum in-plane thermal conductivity coefficient (λ∥ of 10.36 W/(m ⋅ K)), excellent electrical insulation (breakdown strength and volume resistivity of 41.5 kV/mm and 1.21×1015 Ω ⋅ cm, respectively) and mechanical properties (tensile strength of 170.9 MPa). 50 wt % BAB composite film could efficiently reduce the equilibrium temperature of the central processing unit (CPU) working at full power, resulting in 7.0 °C lower than that of the CPU solely integrated with ANF directly. In addition, BAB composite film boasts adaptive visible light/infrared dual camouflage properties on cement roads and jungle environments, as well as the function of fast encryption of QR code information within 24 seconds.

Alveoli-Mimetic Synergistic Liquid and Solid Thermal Conductive Interface as a Novel Strategy for Designing High-Performance Thermal Interface Materials

Thermal interface materials (TIMs) are in desperate desire with the development of the modern electronic industry. An excellent TIM needs desired comprehensive properties including but not limited to high thermal conductivity, low Yong's modulus, lightweight, as well as low price. However, as is typically the case, those properties are naturally contradictory. To tackle such dilemmas, a strategy of construction high-performance TIM inspired by alveoli is proposed. The material design includes the self-alignment of graphite into 3D interconnected thermally conductive networks by polydimethylsiloxane beads (PBs) -the alveoli; and a small amount of liquid metal (LM) - capillary networks bridging the PBs and graphite network. Through the delicate structural regulation and the synergistic effect of the LM and solid graphite filler, superb thermal conductivity (9.98 ± 0.34 W m-1 K-1) can be achieved. The light emitting diode (LED) application and their performance in the central processing unit (CPU) heat dispersion manifest the TIM developed in the work has stable thermal conductivity for long-term applications. The thermally conductive, soft, and lightweight composites are believed to be high-performance silicone bases TIMs for advanced electronics.

Characterization of Potting Epoxy Resins Performance Parameters Based on a Viscoelastic Constitutive Model

To describe the evolution of residual stresses in epoxy resin during the curing process, a more detailed characterization of its viscoelastic properties is necessary. In this study, we have devised a simplified apparatus for assessing the viscoelastic properties of epoxy resin. This apparatus employs a confining cylinder to restrict the circumferential and radial deformations of the material. Following the application of load by the testing machine, the epoxy resin sample gradually reduces the gap between its surface and the inner wall of the confining cylinder, ultimately achieving full contact and establishing a continuous interface. By recording the circumferential stress-strain on the outer surface of the confining cylinder, we can deduce the variations in material bulk and shear moduli with time. This characterization spans eight temperature points surrounding the glass transition temperature, revealing the bulk and shear relaxation moduli of the epoxy resin. Throughout the experiments, the epoxy resin's viscoelastic response demonstrated a pronounced time-temperature dependency. Below the glass transition temperature, the stress relaxation response progressively accelerated with increasing temperature, while beyond the glass transition temperature, the stress relaxation time underwent a substantial reduction. By applying the time-temperature superposition principle, it is possible to construct the relaxation master curves for the bulk and shear moduli of the epoxy resin. By fitting the data, we can obtain expressions for the constitutive model describing the viscoelastic behavior of the epoxy resin. In order to validate the reliability of the test results, a uniaxial tensile relaxation test was conducted on the epoxy resin casting body. The results show good agreement between the obtained uniaxial relaxation modulus curves and those derived from the bulk and shear relaxation modulus equations, confirming the validity of both the device design and the testing methodology.

Thermal Conductivity Enhancement of Polymeric Composites Using Hexagonal Boron Nitride: Design Strategies and Challenges

With the integration and miniaturization of chips, there is an increasing demand for improved heat dissipation. However, the low thermal conductivity (TC) of polymers, which are commonly used in chip packaging, has seriously limited the development of chips. To address this limitation, researchers have recently shown considerable interest in incorporating high-TC fillers into polymers to fabricate thermally conductive composites. Hexagonal boron nitride (h-BN) has emerged as a promising filler candidate due to its high-TC and excellent electrical insulation. This review comprehensively outlines the design strategies for using h-BN as a high-TC filler and covers intrinsic TC and morphology effects, functionalization methods, and the construction of three-dimensional (3D) thermal conduction networks. Additionally, it introduces some experimental TC measurement techniques of composites and theoretical computational simulations for composite design. Finally, the review summarizes some effective strategies and possible challenges for the design of h-BN fillers. This review provides researchers in the field of thermally conductive polymeric composites with a comprehensive understanding of thermal conduction and constructive guidance on h-BN design.

Application and Development of Smart Thermally Conductive Fiber Materials

In recent years, with the rapid advancement in various high-tech technologies, efficient heat dissipation has become a key issue restricting the further development of high-power-density electronic devices and components. Concurrently, the demand for thermal comfort has increased; making effective personal thermal management a current research hotspot. There is a growing demand for thermally conductive materials that are diversified and specific. Therefore, smart thermally conductive fiber materials characterized by their high thermal conductivity and smart response properties have gained increasing attention. This review provides a comprehensive overview of emerging materials and approaches in the development of smart thermally conductive fiber materials. It categorizes them into composite thermally conductive fibers filled with high thermal conductivity fillers, electrically heated thermally conductive fiber materials, thermally radiative thermally conductive fiber materials, and phase change thermally conductive fiber materials. Finally, the challenges and opportunities faced by smart thermally conductive fiber materials are discussed and prospects for their future development are presented.

Amphiphilic Polyoxazoline Copolymer-Imidazole Complexes as Tailorable Thermal Latent Curing Agents for One-Component Epoxy Resins

One-component epoxy resins (OCERs) are proposed to overcome the energy inefficiency and processing difficulties of conventional two-component epoxy resins by employing latent curing agents, specifically thermal latent curing agents (TLCs). Despite recent progress, the need for TLCs with a simple preparation method for different curing agents, epoxy resins, and process conditions remains. Here, tailorable TLCs were prepared by forming complexes between imidazole (Im) and amphiphilic polyoxazoline copolymers with tunable structures and properties by a solvent evaporation method. The obtained TLCs were manually mixed with DGEBA to prepare OCERs. The miscibility of the complexes with DGEBA was studied, considering the functionalities of copolymers. The curing behaviors of TLCs were compared using dynamic Differential Scanning Calorimetry (DSC) studies considering the side chain and composition of the copolymers, copolymer:Im ratio, and concentration of Im in DGEBA. The curing behavior of the promising OCERs was studied by isothermal DSC studies to investigate their stability at different temperatures and curing rate at elevated temperatures revealing the stability of these OCERs.

Study on Cavitation, Warpage Deformation, and Moisture Diffusion of Sop-8 Devices during Molding Process

Plastic packaging has shown its advantages over ceramic packaging and metal packaging in lightweight, thin, and high-density electronic devices. In this paper, the reliability and moisture diffusion of Sop-8 (Small Out-Line Package-8) plastic packaging devices are studied, and we put forward a set of complete optimization methods. Firstly, we propose to improve the reliability of plastic packaging devices by reducing the amount of cavitation and warpage deformation. Structural and process factors were investigated in the injection molding process. An orthogonal experiment design was used to create 25 groups of simulation experiments, and Moldflow software was used to simulate the flow mode analysis. Then, the simulation results are subjected to range analysis and comprehensive weighted score analysis. Finally, different optimization methods are proposed according to different production conditions, and each optimization method can reduce cavitation or warpage by more than 9%. The moisture diffusion of the Sop-8 plastic packing devices was also investigated at the same time. It was determined that the contact surface between the lead frame and the plastic packaging material was more likely to exhibit delamination under the condition of MSL2 moisture diffusion because the humidity gradient was easily produced at the crucial points of different materials. The diffusion of moisture is related to the type of plastic packaging material and the diffusion path.

Self-standing boron nitride bulks enabled by liquid metals for thermal management

Thermally conductive materials (TCMs) are highly desirable for thermal management applications to tackle the "overheating" concerns in the electronics industry. Despite recent progress, the development of high performance TCMs integrated with an in-plane thermal conductivity (TC) higher than 50.0 W (m K)-1 and a through-plane TC greater than 10.0 W (m K)-1 is still challenging. Herein, self-standing liquid metal@boron nitride (LM@BN) bulks with ultrahigh in-plane TC and through-plane TC were reported for the first time. In the LM@BN bulks, LM could serve as a bonding and thermal linker among the oriented BN platelets, thus remarkably accelerating heat transfer across the whole system. Benefiting from the formation of a unique structure, the LM@BN bulk achieved an ultrahigh in-plane TC of 82.2 W (m K)-1 and a through-plane TC of 20.6 W (m K)-1, which were among the highest values ever reported for TCMs. Furthermore, the LM@BN bulks exhibited superior compressive and leakage-free performances, with a high compressive strength (5.2 MPa) and without any LM leakage even after being crushed. It was also demonstrated that the excellent TCs of the LM@BN bulks made them effectively cool high-power light emitting diode modules. This work opens up one promising pathway for the development of high-performance TCMs for thermal management in the electronics industry.

In Situ Construction of High-Thermal-Conductivity and Negative-Permittivity Epoxy/Carbon Fiber@Carbon Composites with a 3D Network by High-Temperature Chemical Vapor Deposition

Modern highly integrated microelectronic devices are unable to dissipate heat over time, which greatly affects the operating efficiency and service life of electronic equipment. Constructing high-thermal-conductivity composites with 3D network structures is a hot research topic. In this article, carbon fiber felt (CFF) was prepared by airflow netting forming technology and needle punching combined with stepped heat treatment. Then, carbon-coated carbon fiber felt (C@CFF) with a three-dimensional network structure was constructed in situ by high-temperature chemical vapor deposition (CVD). Finally, high-temperature treatment was used to improve the degree of crystallinity of C@CFF and further enhance its graphitization. The epoxy (EP) composites were prepared by simple vacuum infiltration-molding curing. The test results showed that the in-plane thermal conductivity (K∥) and through-plane thermal conductivity (K⊥) of EP/C@CFF-2300 °C could reach up to 13.08 and 2.78 W/mK, respectively, where the deposited carbon content was 11.76 vol %. The in-plane thermal conductivity enhancement (TCE) of EP/C@CFF-2300 °C was improved by 6440 and 808% compared to those of pure EP and EP/CFF, respectively. The high-temperature treatment greatly provides an improvement in thermal conductivity for the in-plane and the through-plane. Infrared imaging showed excellent thermal management properties of the prepared epoxy composites. EP/C@CFF-2300 °C owned an in-plane AC conductivity of up to 0.035 S/cm at 10 kHz, and Lorentz-Drude-type negative permittivity behaviors were observed at the tested frequency region. The CFF thermally conductive composites prepared by the above method have a broad application prospect in the field of advanced thermal management and electromagnetics.

Coaxial Wet Spinning of Boron Nitride Nanosheet-Based Composite Fibers with Enhanced Thermal Conductivity and Mechanical Strength

Hexagonal boron nitride nanosheets (BNNSs) exhibit remarkable thermal and dielectric properties. However, their self-assembly and alignment in macroscopic forms remain challenging due to the chemical inertness of boron nitride, thereby limiting their performance in applications such as thermal management. In this study, we present a coaxial wet spinning approach for the fabrication of BNNSs/polymer composite fibers with high nanosheet orientation. The composite fibers were prepared using a superacid-based solvent system and showed a layered structure comprising an aramid core and an aramid/BNNSs sheath. Notably, the coaxial fibers exhibited significantly higher BNNSs alignment compared to uniaxial aramid/BNNSs fibers, primarily due to the additional compressive forces exerted at the core-sheath interface during the hot drawing process. With a BNNSs loading of 60 wt%, the resulting coaxial fibers showed exceptional properties, including an ultrahigh Herman orientation parameter of 0.81, thermal conductivity of 17.2 W m-1 K-1, and tensile strength of 192.5 MPa. These results surpassed those of uniaxial fibers and previously reported BNNSs composite fibers, making them highly suitable for applications such as wearable thermal management textiles. Our findings present a promising strategy for fabricating high-performance composite fibers based on BNNSs.

Enhanced In-Plane Thermal Conductivity and Mechanical Strength of Flexible Films by Aligning and Interconnecting Si3N4 Nanowires

As the rapid development of advanced foldable electronic devices, flexible and insulating composite films with ultra-high in-plane thermal conductivity have received increasing attention as thermal management materials. Silicon nitride nanowires (Si₃N₄NWs) have been considered as promising fillers for preparing anisotropic thermally conductive composite films due to their extremely high thermal conductivity, low dielectric properties, and excellent mechanical properties. However, an efficient approach to synthesize Si₃N₄NWs in a large scale still need to be explored. In this work, large quantities of Si₃N₄NWs were successfully prepared using a modified CRN method, presenting the advantages of high aspect ratio, high purity, and easy collection. On the basis, the super-flexible PVA/Si₃N₄NWs composite films were further prepared with the assistance of vacuum filtration method. Due to the highly oriented Si₃N₄NWs interconnected to form a complete phonon transport network in the horizontal direction, the composite films exhibited a high in-plane thermal conductivity of 15.4 W·m^-1·K^-1. The enhancement effect of Si₃N₄NWs on the composite thermal conductivity was further demonstrated by the actual heat transfer process and finite element simulations. More significantly, the Si₃N₄NWs enabled the composite film presenting good thermal stability, high electrical insulation, and excellent mechanical strength, which was beneficial for thermal management applications in modern electronic devices.

Recent Progress on Multifunctional Thermally Conductive Epoxy Composite

In last years, the requirements for materials and devices have increased exponentially. Greater competitiveness; cost and weight reduction for structural materials; greater power density for electronic devices; higher design versatility; materials customizing and tailoring; lower energy consumption during the manufacturing, transport, and use; among others, are some of the most common market demands. A higher operational efficiency together with long service life claimed. Particularly, high thermally conductive in epoxy resins is an important requirement for numerous applications, including energy and electrical and electronic industry. Over time, these materials have evolved from traditional single-function to multifunctional materials to satisfy the increasing demands of applications. Considering the complex application contexts, this review aims to provide insight into the present state of the art and future challenges of thermally conductive epoxy composites with various functionalities. Firstly, the basic theory of thermally conductive epoxy composites is summarized. Secondly, the review provides a comprehensive description of five types of multifunctional thermally conductive epoxy composites, including their fabrication methods and specific behavior. Furthermore, the key technical problems are proposed, and the major challenges to developing multifunctional thermally conductive epoxy composites are presented. Ultimately, the purpose of this review is to provide guidance and inspiration for the development of multifunctional thermally conductive epoxy composites to meet the increasing demands of the next generation of materials.

Reliability Analysis of Flip-Chip Packaging GaN Chip with Nano-Silver Solder BUMP

Gallium nitride (GaN) power devices have many benefits, including high power density, small footprint, high operating voltage, and excellent power gain capability. However, in contrast to silicon carbide (SiC), its performance and reliability can be negatively impacted by its low thermal conductivity, which can cause overheating. Hence, it is necessary to provide a reliable and workable thermal management model. In this paper, a model of a flip-chip packing (FCP) GaN chip was established, and it was assigned to the Ag sinter paste structure. The different solder bumps and under bump metallurgy (UBM) were considered. The results indicated that the FCP GaN chip with underfill was a promising method because it not only reduced the size of the package model but also reduced thermal stress. When the chip was in operation, the thermal stress was about 79 MPa, only 38.77% of the Ag sinter paste structure, lower than any of the GaN chip packaging methods currently in use. Moreover, the thermal condition of the module often has little to do with the material of the UBM. Additionally, nano-silver was found to be the most suitable bump material for FCP GaN chip. Temperature shock experiments were also conducted with different UBM materials when nano-silver was used as bump. It was found that Al as UBM is a more reliable option.

Facile and Scalable Strategy for Fabricating Highly Thermally Conductive Epoxy Composites Utilizing 3D Graphitic Carbon Nitride Nanosheet Skeleton

The application of high-performance thermal interface materials (TIMs) for thermal management is commonly used to tackle the problem of heat accumulation, which influences the performance and reliability of microelectronic devices. Herein, a novel three-dimensional (3D) carbon nitride nanosheet (CNNS)/epoxy composite with high thermal conductivity was developed by introducing 3D CNNS skeleton fillers prepared by a facile and scalable strategy assisted by a salt template. Benefiting from the continuous heat transfer pathways formed in the CNNS skeleton, 17.0 wt % 3D CNNS/epoxy composites achieve a superior thermal conductivity of 1.27 W/m·K, which is 6.35 and 1.57 times higher than those of epoxy resin and convention CNNS/epoxy, respectively. With the aid of theoretical model analysis and finite element simulation, the pronounced enhancement effect of the 3D CNNS skeleton on the thermal conductivity of epoxy composites is found to be attributed to the continuous 3D CNNS thermally conductive network, the diminished CNNS-CNNS interfacial thermal resistance, and the effective interfacial interactions between epoxy and CNNS. In addition, the 3D CNNS/epoxy composites possess high electrical insulation and desirable mechanical strength. Therefore, 3D CNNS/epoxy composites are promising TIMs for advanced electronic thermal management.

A binder-free ice template method for vertically aligned 3D boron nitride polymer composites towards thermal management

Hexagonal boron nitride (BN) is an attractive filler candidate for thermal interface materials, but the thermal conductivity enhancement is limited by the anisotropic thermal conductivity of BN and disordered thermal pathways in the polymer matrix. Herein, a facile and economic ice template method is proposed, wherein BN modified by tannic acid (BN-TA) directly self-assemble to form vertically aligned nacre-mimetic scaffold without additional binders and post-treatment. The effects of the BN slurry concentration and the ratio of BN/TA on three-dimensional (3D) skeleton morphology are fully investigated. The corresponding polydimethylsiloxane (PDMS) composite via vacuum-impregnation achieves a high through-plane thermal conductivity of 3.8 W/mK at a low filler loading of 18.7 vol%, which is 2433% and 100% higher than that of pristine PDMS and the PDMS composite with randomly distributed BN-TA, respectively. The finite element analysis results theoretically demonstrate the superiority of the highly longitudinally ordered 3D BN-TA skeleton in axial heat transfer. Additionally, 3D BN-TA/PDMS exhibits excellent practical heat dissipation capability, lower thermal expansion coefficient, and enhanced mechanical properties. This strategy offers an anticipated perspective for developing high-performance thermal interface materials to address the thermal challenges of modern electronics.

Preparation and Properties of Hollow Glass Microspheres/Dicyclopentadiene Phenol Epoxy Resin Composite Materials

With the development of the integrated circuit and chip industry, electronic products and their components are becoming increasingly miniaturized, high-frequency, and low-loss. These demand higher requirements for the dielectric properties and other aspects of epoxy resins to develop a novel epoxy resin system that meets the needs of current development. This paper employs ethyl phenylacetate cured dicyclopentadiene phenol (DCPD) epoxy resin as the matrix and incorporates KH550 coupling-agent-treated SiO₂ hollow glass microspheres to produce composite materials with low dielectric, high heat resistance, and high modulus. These materials are applied as insulation films for high density interconnect (HDI) and substrate-like printed circuit board (SLP) boards. The Fourier transform infrared spectroscopy (FTIR) technique was used to characterize the reaction between the coupling agent and HGM, as well as the curing reaction between the epoxy resin and ethyl phenylacetate. The curing process of the DCPD epoxy resin system was determined using differential scanning calorimetry (DSC). The various properties of the composite material with different HGM contents were tested, and the mechanism of the impact of HGM on the properties of the composite material was discussed. The results indicate that the prepared epoxy resin composite material exhibits good comprehensive performance when the HGM content is 10 wt.%. The dielectric constant at 10 MHz is 2.39, with a dielectric loss of 0.018. The thermal conductivity is 0.1872 Wm^-1 k^-1, the coefficient of thermal expansion is 64.31 ppm/K, the glass transition temperature is 172 °C, and the elastic modulus is 1221.13 MPa.

One-pot synthesis of hyperbranched polymers via visible light regulated switchable catalysis

Switchable catalysis promises exceptional efficiency in synthesizing polymers with ever-increasing structural complexity. However, current achievements in such attempts are limited to constructing linear block copolymers. Here we report a visible light regulated switchable catalytic system capable of synthesizing hyperbranched polymers in a one-pot/two-stage procedure with commercial glycidyl acrylate (GA) as a heterofunctional monomer. Using (salen)CoIIICl (1) as the catalyst, the ring-opening reaction under a carbon monoxide atmosphere occurs with high regioselectivity (>99% at the methylene position), providing an alkoxycarbonyl cobalt acrylate intermediate (2a) during the first stage. Upon exposure to light, the reaction enters the second stage, wherein 2a serves as a polymerizable initiator for organometallic-mediated radical self-condensing vinyl polymerization (OMR-SCVP). Given the organocobalt chain-end functionality of the resulting hyperbranched poly(glycidyl acrylate) (hb-PGA), a further chain extension process gives access to a core-shell copolymer with brush-on-hyperbranched arm architecture. Notably, the post-modification with 2,2,6,6-tetramethylpiperidine-1-oxyl (TEMPO) affords a metal-free hb-PGA that simultaneously improves the toughness and glass transition temperature of epoxy thermosets, while maintaining their storage modulus.

Reprocessable and Chemically Recyclable Hard Vitrimers Based on Liquid-Crystalline Epoxides

The rapid increase in demand for recyclable and reusable thermosets has necessitated the development of materials with chemical structures that exhibit these features. Thus, functional mesogenic epoxide monomers bearing both ester and imine groups that can be vitrimerized and recycled are reported herein. The compounds show mesophase characteristics at 100-200 °C and can be converted into hard epoxides by a common curing reaction. The obtained hard epoxides have high isotropic thermal conductivity (≈0.64 W m^-1 K^-1 ), which is derived from their highly ordered microstructures. The cured products can be easily reprocessed through imine metathesis and transesterification, and decomposed products can be obtained through imine hydrolysis under acidic or basic conditions and subsequently be re-cured. Surprisingly, recycled materials can be repeatedly reprocessed or chemically decomposed. The reprocessed materials retain the properties of their pristine counterparts, and the recycled products preserve the advantages of the hard thermosets without alteration to any of their unique properties. A dehydration reaction occurs between the residual hydroxyl groups during the re-hardening, which dramatically increases the glass transition temperature by ≈60 °C. These reprocessable and recyclable vitrimers demonstrate the effectiveness and environmental friendliness of the molecular design strategy reported herein.

Enhanced Thermal Conductivity of Epoxy Composites by Introducing 1D AlN Whiskers and Constructing Directionally Aligned 3D AlN Filler Skeletons

With the miniaturization of current electronic products, ceramic/polymer composites with excellent thermal conductivity have attracted increasing attention. For regular ceramic particles as fillers, it is necessary to achieve the highest filling fraction to obtain high thermal conductivity, yet leading to higher production cost and reduced mechanical properties. In this paper, AlN whiskers with a high aspect ratio were successfully prepared using a modified direct nitriding method, which was further paired with AlN particles as fillers to prepare the AlN/epoxy composites. It is indicated that AlN whiskers could form bridging links between AlN particles, which favored the establishment of thermal pathways inside the polymer matrix. On this basis, we constructed the 3D AlN skeletons as a thermal conductivity pathway by the freeze-casting method, which could further enhance the thermal conductivity of the composites. The synergistic enhancement effect of 1D AlN whiskers and directional filler skeletons on the composite thermal conductivity was further demonstrated by the actual heat transfer process and finite element simulations. More significantly, the experimental results showed that the addition of one-dimensional fillers could also effectively improve the thermal stability and mechanical properties of the composites, which was beneficial for preparing high-performance TIMs.

Multifunctional Epoxy-Based Electronic Packaging Material MDCF@LDH/EP for Electromagnetic Wave Absorption, Thermal Management, and Flame Retardancy

The sharp reduction in size and increase in power density of next-generation integrated circuits lead to electromagnetic interference and heat failure being a key roadblock for their widespread applications in polymer-based electronic packaging materials. This work demonstrates a multifunctional epoxy-based composite (MDCF@LDH/EP) with high electromagnetic wave (EMW) absorption, thermal conductivity, and flame retardancy performance. In which, the synergistic effect of porous structure and heterointerface promotes the multiple reflection and absorption, and dielectric loss of EMW. A low reflection loss of -57.77 dB, and an effective absorption bandwidth of 7.20 GHz are achieved under the fillings of only 10 wt%. Meanwhile, a 241.4% enhanced thermal conductivity of EP is due to the high continuous 3D melamine-derived carbon foams (MDCF), which provides a broad path for the transport of phonons. In addition, MDCF@LDH/EP composite exhibits high thermal stability and flame retardancy, thanks to the physical barrier effect of MDCF@LDH combined with the high temperature cooling properties of NiAl-LDH-CO₃ ^2- . Compared with pure epoxy resin, the peak heat release rate and the total heat release rate are reduced by 19.4% and 30.7%, respectively. Such an excellent comprehensive performance enables MDCF@LDH/EP to a promising electronic packaging material.

AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics

Thermal management of flexible/stretchable electronics has been a crucial issue. Mass supernumerary thermal heat is created in the repetitive course of deformation because of the large nanocontact resistance between electric conductive fillers, as well as the interfacial resistance between fillers and the polymer matrix. Here, we report a stretchable thermoplastic polyurethane (TPU)-boron nitride nanosheet (BNNS) composite film with a high in-plane thermal conductivity based on an air/water interfacial (AWI) assembly method. In addition to rigid devices, it was capable for thermal management of flexible electronics. During more than 2000 cycles of the bending-releasing process, the average saturated surface temperature of the flexible conductor covered with composite film with 30 wt % BNNSs was approximately 40.8 ± 1 °C (10.5 °C lower than that with pure TPU). Moreover, the thermal dissipating property of the composite under stretching was measured. All the results prove that this TPU-BNNS composite film is a candidate for thermal management of next-generation flexible/stretchable electronics with high power density.