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Tang X. Progress on the Sound Absorption of Viscoelastic Damping Porous Polymer Composites. Macromol Rapid Commun 2025; 46:e2400646. [PMID: 39401290 DOI: 10.1002/marc.202400646] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 08/09/2024] [Revised: 09/24/2024] [Indexed: 01/25/2025]
Abstract
Porous polymer composites (PPC) have developed rapidly recently, which are widely used in various industrial fields. Viscoelastic damping is an important behavior of porous polymer composites, and it can determine the sound absorption for noise reduction applications. This review has mainly covered the viscoelastic damping and sound absorption of porous polymer composites. Different fabrication approaches of porous polymer composites are gathered. The mechanism of viscoelastic damping behavior is described, and also the sound absorption properties. Followed by the introduction of enhanced sound absorption of viscoelastic damping porous polymer composites, including the incorporation of fillers, microstructures modification, combination with nanofibrous materials, and multilayer configuration, etc. The incorporated fillers can effectively adjust the interfacial area in composites, and obtain desired bonding conditions. Microstructures modification is an effective tool to improve the morphologies of both polymer matrix and fillers, which can be achieved by chemical treatment and surface coating. The combination with lightweight nanofibrous layer can increase the low frequency absorption. The configuration of multilayer composites can improve both acoustical and mechanical properties for engineering applications. It is hoped that this comprehensive review is benefit for the promising development of porous polymer composites in related fields.
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Affiliation(s)
- Xiaoning Tang
- State Key Laboratory for New Textile Materials and Advanced Processing Technology, School of Textile Science and Engineering, Wuhan Textile University, Wuhan, 430200, China
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Huang L, Zhu Z, Cheng C, Gao Y. A parylene/graphene UV photodetector with ultrahigh responsivity and long term stability. NANOTECHNOLOGY 2024; 35:365202. [PMID: 38744249 DOI: 10.1088/1361-6528/ad4b25] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/19/2024] [Accepted: 05/14/2024] [Indexed: 05/16/2024]
Abstract
Long term stability, high responsivity, and fast response speed are essential for the commercialization of graphene photodetectors (GPDs). In this work, a parylene/graphene UV photodetector with long term stability, ultrahigh responsivity and fast response speed, is demonstrated. Parylene as a stable physical and chemical insulating layer reduces the environmental sensitivity of graphene, and enhances the performances of GPDs. In addition, utilizing bilayer electrodes reduces the buckling and damage of graphene after transferring. The parylene/graphene UV photodetector exhibits an ultrahigh responsivity of 5.82 × 105AW-1under 325 nm light irradiation at 1 V bias. Additionally, it shows a fast response speed with a rise time of 80μs and a fall time of 17μs, and a long term stability at 405 nm wavelength which is absent in the device without parylene. The parylene/graphene UV photodetector possesses superior performances. This paves the way for the commercial application of the high-performance graphene hybrid photodetectors, and provides a practical method for maintaining the long term stability of two dimensional (2D) materials.
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Affiliation(s)
- Liting Huang
- College of Science, China Agricultural University, Beijing 100083, People's Republic of China
| | - Zhaowei Zhu
- College of Science, China Agricultural University, Beijing 100083, People's Republic of China
| | - Chuantong Cheng
- Key Laboratory of Optoelectronic Materials and Devices, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, People's Republic of China
| | - Y Gao
- College of Science, China Agricultural University, Beijing 100083, People's Republic of China
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Zuo P, Li J, Chen D, Nie L, Gao L, Lin J, Zhuang Q. Scalable co-cured polyimide/poly( p-phenylene benzobisoxazole) all-organic composites enabling improved energy storage density, low leakage current and long-term cycling stability. MATERIALS HORIZONS 2024; 11:271-282. [PMID: 37938919 DOI: 10.1039/d3mh01479g] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/10/2023]
Abstract
The all-organic high-temperature polymer dielectrics with promising scale-up potential have witnessed much progress in the energy storage area, etc. However, the electron suppression trap mechanisms behind many all-organic dielectrics are still unclear, especially for high temperature resistant poly(p-phenylene benzobisoxazole) (PBO) polymers. To resolve this tough issue, we herein innovatively prepared PBO-based all-organic thin films containing sulfone-based polyimide (P(DSDA-ODA)) functioning as an electron trap phase using a facile and scalable co-curing method. The great linear dielectric properties of the prepared P(DSDA-ODA)/PBO films hold high dielectric thermal stability over the temperature range from 25 °C to 200 °C. The 60 wt% P(DSDA-ODA) systems yield the lowest leakage current (3.8 × 10-8 A cm-2). The tight structure and reduced leakage current enable an enhanced breakdown strength of 60 wt% P(DSDA-ODA)/PBO (470 kV mm-1), which is 1.7 times that of pure PBO. Meanwhile, it can reach 4.16 J cm-3 of energy density, which is 257% higher than that for pure PBO thin films while concurrently maintaining a long stable charge-discharge cycle (at least 5000 times) and high charge-discharge efficiency at 85.10%. Moreover, P(DSDA-ODA)/PBO still exhibits excellent energy storage performance at high temperature compared to PBO. This innovative strategy is further verified by replacing P(DSDA-ODA) with P(6FDA-ODA), and therefore lays a solid foundation for more investigation on scalable all-organic dielectrics.
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Affiliation(s)
- Peiyuan Zuo
- The Key Laboratory of Advanced Polymer Materials of Shanghai, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China.
| | - Jinpeng Li
- The Key Laboratory of Advanced Polymer Materials of Shanghai, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China.
| | - Donglin Chen
- The Key Laboratory of Advanced Polymer Materials of Shanghai, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China.
| | - Lingzhi Nie
- The Key Laboratory of Advanced Polymer Materials of Shanghai, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China.
| | - Liang Gao
- The Key Laboratory of Advanced Polymer Materials of Shanghai, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China.
| | - Jingyu Lin
- The Key Laboratory of Advanced Polymer Materials of Shanghai, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China.
| | - Qixin Zhuang
- The Key Laboratory of Advanced Polymer Materials of Shanghai, School of Materials Science and Engineering, East China University of Science and Technology, Shanghai 200237, China.
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Kohler A, Blendinger F, Müller S, Mescheder U, Bucher V. Feasibility of Parylene C for encapsulating piezoelectric actuators in active medical implants. FRONTIERS IN MEDICAL TECHNOLOGY 2023; 5:1211423. [PMID: 38045886 PMCID: PMC10690945 DOI: 10.3389/fmedt.2023.1211423] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/24/2023] [Accepted: 10/26/2023] [Indexed: 12/05/2023] Open
Abstract
Parylene C is well-known as an encapsulation material for medical implants. Within the approach of miniaturization and automatization of a bone distractor, piezoelectric actuators were encapsulated with Parylene C. The stretchability of the polymer was investigated with respect to the encapsulation functionality of piezoelectric chips. We determined a linear yield strain of 1% of approximately 12-µm-thick Parylene C foil. Parylene C encapsulation withstands the mechanical stress of a minimum of 5×105 duty cycles by continuous actuation. The experiments demonstrate that elongation of the encapsulation on piezoelectric actuators and thus the elongation of Parylene C up to 0.8 mm are feasible.
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Affiliation(s)
- Alina Kohler
- Faculty Mechanical and Medical Engineering (MME), Institute for Microsystems Technology (iMST), Furtwangen University, Furtwangen, Germany
- Laboratory for Biomedical Microtechnology, Department of Microsystems Engineering-IMTEK, University of Freiburg, Freiburg, Germany
- BrainLinks-BrainTools Center, University of Freiburg, Freiburg, Germany
| | - Felix Blendinger
- Faculty Mechanical and Medical Engineering (MME), Institute for Microsystems Technology (iMST), Furtwangen University, Furtwangen, Germany
| | - Sonja Müller
- Faculty Mechanical and Medical Engineering (MME), Institute for Microsystems Technology (iMST), Furtwangen University, Furtwangen, Germany
- Department of Microsystems Engineering IMTEK, University of Freiburg, Freiburg, Germany
| | - Ulrich Mescheder
- Faculty Mechanical and Medical Engineering (MME), Institute for Microsystems Technology (iMST), Furtwangen University, Furtwangen, Germany
| | - Volker Bucher
- Faculty Mechanical and Medical Engineering (MME), Institute for Microsystems Technology (iMST), Furtwangen University, Furtwangen, Germany
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Liu X, Tong H, Luo J, Zhu J, Cao S, Xu J, Hou Y. Interface modified BTO@PS- co-mah/PS composite dielectrics with enhanced breakdown strength and ultralow dielectric loss. RSC Adv 2023; 13:1278-1287. [PMID: 36686916 PMCID: PMC9811355 DOI: 10.1039/d2ra06524j] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/16/2022] [Accepted: 12/19/2022] [Indexed: 01/05/2023] Open
Abstract
Dielectrics of the polymer-matrix composite are considered to present combined advantages from both the polymer matrix and inorganic fillers. However, the breakdown strength, as well as energy density, is not effectively enhanced due to the poor compatibility between the organic and inorganic components. Herein, polymer composites derived from polystyrene (PS) and barium titanate (BTO) are proposed and beneficial interface modification by poly(styrene-co-maleic anhydride) (PS-co-mah) is conducted to improve compatibility between the inorganic filler and polymer matrix. The results show that the BTO@PS-co-mah/PS composites, in which the interfacial layer of PS-co-mah would undergo chemical reactions with the aminated BTO and blend PS matrix with excellent physical compatibility, exhibit enhanced breakdown strength and declined dielectric loss compared with both pure PS and BTO/PS without interfacial modulation. Particularly, the BTO@PS-co-mah/PS composite with 5 wt% filler content indicates optimized performance with an E b of 507 MV m-1 and tan δ of 0.085%. It is deduced that the deep energy traps introduced by the PS-co-mah layer would weaken the local electric field and suppress the space charge transporting so as to optimize the performance of composites. Consequently, the interfacial-modified BTO@PS-co-mah/PS would present great potential for applications, such as film capacitors.
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Affiliation(s)
- Xuepeng Liu
- Faculty of Materials and Manufacturing, Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology Beijing 100124 China
- Department of Micro-Nano Processing Technology and Intelligent Electrical Equipment, Institute of Electrical Engineering, Chinese Academy of Science Beijing 100190 China
| | - Hui Tong
- Department of Micro-Nano Processing Technology and Intelligent Electrical Equipment, Institute of Electrical Engineering, Chinese Academy of Science Beijing 100190 China
| | - Jinpeng Luo
- Department of Micro-Nano Processing Technology and Intelligent Electrical Equipment, Institute of Electrical Engineering, Chinese Academy of Science Beijing 100190 China
| | - Jiafeng Zhu
- Department of Micro-Nano Processing Technology and Intelligent Electrical Equipment, Institute of Electrical Engineering, Chinese Academy of Science Beijing 100190 China
| | - Shimo Cao
- Department of Micro-Nano Processing Technology and Intelligent Electrical Equipment, Institute of Electrical Engineering, Chinese Academy of Science Beijing 100190 China
- College of Engineering Science, University of Chinese Academy of Sciences Beijing 100049 China
| | - Ju Xu
- Department of Micro-Nano Processing Technology and Intelligent Electrical Equipment, Institute of Electrical Engineering, Chinese Academy of Science Beijing 100190 China
- College of Engineering Science, University of Chinese Academy of Sciences Beijing 100049 China
| | - Yudong Hou
- Faculty of Materials and Manufacturing, Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology Beijing 100124 China
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