Improvement of thermal and mechanical properties by control of morphologies in PES-modified epoxy resins

Addressing diffusion behavior and impact in an epoxy-amine cure system using molecular dynamics simulations

To deepen understanding of diffusion-controlled crosslinking, molecular dynamics (MD) simulations are carried out by taking the diffusion image of 3,3'-diamino diphenyl sulfone (3,3'-DDS) and polyethersulfone (PES) with epoxy resin varying temperatures from 393.15 to 473.15 K over crosslinking conversion of 0-85%. The diffusion of PES and 3,3'-DDS into the bulk increased with increasing the temperature as a result of enhanced mobility of the molecules when the difference between the glass-transition temperature (T_g) and the curing temperature. Beyond the onset points of the converged crosslinking conversion ratio of 3,3'-DDS and PES, their diffusion properties are obviously restricted with crosslinking conversion ratio. At low crosslinking conversion ratios (> 10%), the diffusion coefficients of triglycidyl p-aminophenol (TGAP) were 1.1 times higher than those of diglycidyl ether of bisphenol F (DGEBF) because of the lower molecular weight of TGAP. On the other hand, the diffusion coefficients of TGAP decreased when the crosslinking ratio was up to ~ 60% because, compared with DGEBF, it had more functional groups available to react with the curing agent. At higher crosslinking ratios, the diffusion coefficients of both resins converged to zero as a result of their highly crosslinked structures.

Structure and Properties of Epoxy Polysulfone Systems Modified with an Active Diluent

An epoxy resin modified with polysulfone (PSU) and active diluent furfuryl glycidyl ether (FGE) was studied. Triethanolaminotitanate (TEAT) and iso-methyltetrahydrophthalic anhydride (iso-MTHPA) were used as curing agents. It is shown that during the curing of initially homogeneous mixtures, heterogeneous structures are formed. The type of these structures depends on the concentration of active diluent and the type of hardener. The physico-mechanical properties of the hybrid matrices are determined by the structure formed. The maximum resistance to a growing crack is provided by structures with a thermoplastic-enriched matrix-interpenetrating structures. The main mechanism for increasing the energy of crack propagation is associated with the implementation of microplasticity of extended phases enriched in polysulfone and their involvement in the fracture process.

Effect of the Addition of Thermoplastic Resin and Composite on Mechanical and Thermal Properties of Epoxy Resin

When the thermoplastic composites reach the service limits during the service, the recovery and utilization are the key concerns. Meanwhile, the improvement of strength, toughness and durability of epoxy resin is the effective method to prolong the service life of materials and structures. In the present paper, three kinds of thermoplastic resins (polypropylene-PP, polyamide 6-PA6 and polyether-ether-ketone-PEEK) and composites (carbon fiber-PEEK, glass fiber-PA6 and glass fiber-PP) were adopted as the fillers to reinforce and toughen the epoxy resin (Ts). The mechanical, thermal and microscopic analysis were conducted to reveal the performance improvement mechanism of Ts. It can be found that adding thermoplastic resin and composite fillers at the low mass ratio of 0.5~1.0% brought about the maximum improvement of tensile strength (7~15%), flexural strength (7~15%) and shear strength (20~30%) of Ts resin. The improvement mechanism was because the addition of thermoplastic fillers can prolong the cracking path and delay the failure process through the load bearing of fiber, energy absorption of thermoplastic resin and superior interface bonding. In addition, the thermoplastic composite had better enhancement effect on the mechanical/thermal properties of Ts resin compared to thermoplastic resin. When the mass ratio was increased to 2.0~3.0%, the agglomeration and stress concentration of thermoplastic filler in Ts resin appeared, leading to the decrease of mechanical and thermal properties. The optimal addition ratios of thermoplastic resin were 0.5~1.0% (PEEK), 1.0~2.0% (PA6) and 0.5~1.0% (PP) to obtain the desirable property improvement. In contrast, the optimal mass ratios of three kinds of composite were determined to be 0.5~1.0%. Application prospect analysis indicated adding the thermoplastic resin and composite fillers to Ts resin can promote the recycling and reutilization of thermoplastic composites and improve the performance of Ts resin, which can be used as the resin matrix, interface adhesive and anti-corrosion coating.

In Situ Characterization of the Reaction-Diffusion Behavior during the Gradient Interphase Formation of Polyetherimide with a High-Temperature Epoxy System

This study presents two novel methods for in situ characterization of the reaction-diffusion process during the co-curing of a polyetherimide thermoplastic interlayer with an epoxy-amine thermoset. The first method was based on hot stage experiments using a computer vision point tracker algorithm to detect and trace diffusion fronts, and the second method used space- and time-resolved Raman spectroscopy. Both approaches provided essential information, e.g., type of transport phenomena and diffusion rate. They can also be combined and serve to elucidate phenomena occurring during diffusion up to phase separation of the gradient interphase between the epoxy system and the thermoplastic. Accordingly, it was possible to distinguish reaction-diffusion mechanisms, describe the diffusivity of the present system and evaluate the usability of the above-mentioned methods.

Epoxyorganosilane Finishing Compositions for Fibrous Fillers of Thermosetting and Thermoplastic Binders

The development of universal finishing compositions for fibers of various natures is an urgent task for polymer composite materials science. The developed finishes can be used for the fiber reinforcement of polymer matrices with a wide range of surface free energy characteristics. Epoxy systems modified with diaminesilane in a wide concentration range were examined by optical interferometry, FTIR spectroscopy, DSC and the sessile drop technique. It was shown that the partial curing of epoxy resin by diaminesilane at room temperature under an inert atmosphere, followed by contact with air, leads to a significant increase of the surface free energy of the system. Varying the concentration of diaminesilane allows us to effectively regulate the surface free energy of the composition. This makes it possible to use fibers finished with epoxyaminosilane compositions in composite materials based on a various thermosetting and thermoplastic binders with a surface tension of up to 75 mJ/m2.

Improvement Prediction on the Dynamic Performance of Epoxy Composite Used in Packaging by Using Nano-Particle Reinforcements in Addition to 2-Hydroxyethyl Methacrylate Toughener

Epoxy with low viscosity and good fluidity before curing has been widely applied in the packaging of electronic and electrical devices. Nevertheless, its low flexibility and toughness renders the requirement of property improvement before it can be widely acceptable in dynamic loading applications. This study investigates the possible use of 2-hydroxyethyl methacrylate (HEMA) toughening agent and nano-powders, such as alumina, silicon dioxide, and carbon black, to form epoxy composites for dynamic property improvement. Considering the different combinations of the nano-powders and HEMA toughener, the Taguchi method with an L9 orthogonal array was adopted for composition optimization. The dynamic storage modulus and loss tangent of the prepared specimen were measured by employing a dynamic mechanical analyzer. With polynomial regression, the curve-fitted relationships of the glass transition temperature and storage modulus with respect to the design factors were obtained. It was found that although the raise in the weight fraction of nano-powders was beneficial in increasing the rigidity of the epoxy composite, an optimal amount of HEMA toughener existed for its best damping improvement.

Construction and Mechanism Analysis of a Self-Assembled Conductive Network in DGEBA/PEI/HRGO Nanocomposites by Controlling Filler Selective Localization

Herein, a feasible and effective approach is developed to build an electrically conductive and double percolation network-like structure via the incorporation of highly reduced graphene oxide (HRGO) into a polymer blend of diglycidyl ether of bisphenol A/polyetherimide (DGEBA/PEI). With the assistance of the curing reaction-induced phase separation (CRIPS) technique, an interconnected network of HRGO is formed in the phase-separated structure of the DGEBA/PEI polymer blend due to selective localization behavior. In this study, HRGO was prepared from a unique chemical reduction technique. The DGEBA/PEI/HRGO nanocomposite was analyzed in terms of phase structure by content of PEI and low weight fractions of HRGO (0.5 wt.%). The HRGO delivered a high electrical conductivity in DGEBA/PEI polyblends, wherein the value increased from 5.03 × 10⁻¹⁶ S/m to 5.88 S/m at a low content of HRGO (0.5 wt.%). Furthermore, the HRGO accelerated the curing reaction process of CRIPS due to its amino group. Finally, dynamic mechanical analyses (DMA) were performed to understand the CRIPS phenomenon and selective localization of HRGO reinforcement. The storage modulus increased monotonically from 1536 MPa to 1660 MPa for the 25 phr (parts per hundred in the DGEBA) PEI polyblend and reached 1915 MPa with 0.5 wt.% HRGO reinforcement. These simultaneous improvements in electrical conductivity and dynamic mechanical properties clearly demonstrate the potential of this conductive polyblend for various engineering applications.

Phase Equilibrium, Morphology, and Physico-Mechanics in Epoxy-Thermoplastic Mixtures with Upper and Lower Critical Solution Temperatures

The mutual solubility of epoxy oligomer with polysulfone (PSU) and polyethersulfone (PES) was studied by optical interferometry. Additionally, phase diagrams (PDs) were plotted and their evolution during the curing process was shown. The phase structures of modified hardened systems, as well as their tensile strengths, elastic moduli, and crack resistance, have been studied by scanning electron microscopy and physico-mechanical techniques. The effect of initial components' mutual solubility on the phase structure and, subsequently, on the physico-mechanical properties of the composite material is shown. Differences in the structure and properties of the cured modified compositions depending on the type of PD (with Upper Critical Solution Temperature (UCST) for PSU and Lower Critical Solution Temperature (LCST) for PES) of the initial components are shown.

Toughening of Epoxy Systems with Interpenetrating Polymer Network (IPN): A Review

Epoxy resins are widely used for different commercial applications, particularly in the aerospace industry as matrix carbon fibre reinforced polymers composite. This is due to their excellent properties, i.e., ease of processing, low cost, superior mechanical, thermal and electrical properties. However, a pure epoxy system possesses some inherent shortcomings, such as brittleness and low elongation after cure, limiting performance of the composite. Several approaches to toughen epoxy systems have been explored, of which formation of the interpenetrating polymer network (IPN) has gained increasing attention. This methodology usually results in better mechanical properties (e.g., fracture toughness) of the modified epoxy system. Ideally, IPNs result in a synergistic combination of desirable properties of two different polymers, i.e., improved toughness comes from the toughener while thermosets are responsible for high service temperature. Three main parameters influence the mechanical response of IPN toughened systems: (i) the chemical structure of the constituents, (ii) the toughener content and finally and (iii) the type and scale of the resulting morphology. Various synthesis routes exist for the creation of IPN giving different means of control of the IPN structure and also offering different processing routes for making composites. The aim of this review is to provide an overview of the current state-of-the-art on toughening of epoxy matrix system through formation of IPN structure, either by using thermoplastics or thermosets. Moreover, the potential of IPN based epoxy systems is explored for the formation of composites particularly for aerospace applications.

Enhancing the Mechanical and Thermal Properties of Epoxy Resin via Blending with Thermoplastic Polysulfone

Efficient enhancement of the toughness of epoxy resins has been a bottleneck for expanding their suitability for advanced applications. Here, polysulfone (PSF) was adopted to toughen and modify the epoxy. The influences of PSF on the mechanical and thermal properties of the epoxy resin were systematically studied by optical microscopy, Fourier transform infrared spectrometer (FT-IR), differential scanning calorimetry (DSC), thermogravimetric analyzer (TG), dynamic mechanical thermal analyzer (DMA), mechanical tests and scanning electron microscope (SEM). The dissolution experimental results showed that PSF presents a good compatibility with the epoxy resin and could be well dissolved under controlled conditions. The introduction of PSF was found to promote the curing reaction of the epoxy resin without participating in the curing reaction and changing the curing mechanism as revealed by the FT-IR and DSC studies. The mechanical properties of PSF/epoxy resin blends showed that the fracture toughness and impact strength were significantly improved, which could be attributed to the bicontinuous phase structure of PSF/epoxy blends. Representative phase structures resulted from the reaction induced phase separation process were clearly observed in the PSF/epoxy blends during the curing process of epoxy resin, which presented dispersed particles, bicontinuous and phase inverted structures with the increase of the PSF content. Our work further confirmed that the thermal stability of the PSF/epoxy blends was slightly increased compared to that of the pure epoxy resin, mainly due to the good heat resistance of the PSF component.

Polyether Sulfone-Based Epoxy Toughening: From Micro- to Nano-Phase Separation via PES End-Chain Modification and Process Engineering

The toughness of a high-performance thermosetting epoxy network can be greatly improved by generating polyether sulfone-based macro- to nano-scale morphologies. Two polyethersulfones (PES) which only differ by their chain-end nature have been successively investigated as potential tougheners of a high-T_g thermoset matrix based on a mixture of trifunctional and difunctional aromatic epoxies and an aromatic diamine. For a given PES content, morphologies and toughness of the resulting matrices have been tuned by changing curing conditions and put into perspective with PES chain-end nature.

Routine million-particle simulations of epoxy curing with dissipative particle dynamics

Mesoscale simulation techniques have helped to bridge the length scales and time scales needed to predict the microstructures of cured epoxies, but gaps in computational cost and experimental relevance have limited their impact. In this work, we develop an open-source plugin epoxpy for HOOMD-Blue that enables epoxy crosslinking simulations of millions of particles to be routinely performed on a single modern graphics card. We demonstrate the first implementation of custom temperature-time curing profiles with dissipative particle dynamics and show that reaction kinetics depend sensitively on the stochastic bonding rates. We provide guidelines for modeling first-order reaction dynamics in a classic epoxy/hardener/toughener system and show structural sensitivity to the temperature-time profile during cure. We conclude with a discussion of how these efficient large-scale simulations can be used to evaluate ensembles of epoxy processing protocols to quantify the sensitivity of microstructure on processing.

High-Tg, Low-Dielectric Epoxy Thermosets Derived from Methacrylate-Containing Polyimides

Three methacrylate-containing polyimides (Px⁻MMA; x = 1⁻3) were prepared from the esterification of hydroxyl-containing polyimides (Px⁻OH; x = 1⁻3) with methacrylic anhydride. Px⁻MMA exhibits active ester linkages (Ph⁻O⁻C(=O)⁻) that can react with epoxy in the presence of 4-dimethylaminopyridine (DMAP), so Px⁻MMA acted as a curing agent for a dicyclopentadiene-phenol epoxy (HP7200) to prepare epoxy thermosets (Px⁻MMA/HP7200; x = 1⁻3) thermosets. For property comparisons, P1⁻OH/HP7200 thermosets were also prepared. The reaction between active ester and epoxy results in an ester linkage, which is less polar than secondary alcohol resulting from the reaction between phenolic OH and epoxy, so P1⁻MMA/HP7200 are more hydrophobic and exhibit better dielectric properties than P1⁻OH/HP7200. The double bond of methacrylate can cure at higher temperatures, leading to epoxy thermosets with a high-Tg and moderate-to-low dielectric properties.

Improved epoxy thermosets by the use of poly(ethyleneimine) derivatives

Epoxy resins are commonly used as thermosetting materials due to their excellent mechanical properties, high adhesion to many substrates and good heat and chemical resistances. This type of thermosets is intensively used in a wide range of fields, where they act as fiber-reinforced materials, general-purpose adhesives, high-performance coatings and encapsulating materials. These materials are formed by the chemical reaction of multifunctional epoxy monomers forming a polymer network produced through an irreversible way. In this article the improvement of the characteristics of epoxy thermosets using different hyperbranched poly(ethyleneimine) (PEI) derivatives will be explained.

A comparative study on the effects of ultrathin luminescent graphene oxide quantum dot (GOQD) and graphene oxide (GO) nanosheets on the interfacial interactions and mechanical properties of an epoxy composite

The reinforcement effect of graphene oxide nanosheets on the mechanical properties of an epoxy coating has been extensively studied. However, the effect of graphene oxide quantum dot (GOQD) as a new unique carbon based nanomaterial (with lateral dimension of 5-6nm and thickness of one carbon atom) on the mechanical properties of epoxy coating has not been reported and compared with GO yet. So this study aims at fabrication of a high-performance polymer composite with unique mechanical properties using GOQD nanosheets. GO and GOQD were obtained through two different strategies of "top-down" synthesis from an expandable graphite by a modified Hummers' method and an easy "bottom-up" method by carbonizing citric acid, respectively. The morphology, size distribution, microstructure and chemistry of the GO and GOQD were compared by utilizing X-ray diffraction (XRD) analysis, atomic force microscopy (AFM), high resolution-transmission electron microscopy (HR-TEM), high resolution field-emission scanning electron microscopy (FE-SEM), thermal gravimetric analysis (TGA), Fourier transform infrared spectroscopy (FT-IR), X-ray photoelectron spectroscopy (XPS). Results obtained from these analyses confirmed successful synthesize of GOQD and GO nanosheets. The reinforcement effect of GO and GOQD nanosheets on the mechanical properties of the epoxy coating was studied by dynamic mechanical thermal analysis (DMTA) and tensile test. It was found that the GOQD could remarkably enhance the energy of break, Young's modulus, tensile stress and interfacial interactions compared to the neat epoxy and the one reinforced with GO nanosheets. GOQD improved the fracture toughness by factor of 175% and 700% compared to the GO/Epoxy and neat epoxy, respectively.