Noncovalent Modification of Boron Nitrite Nanosheets for Thermally Conductive, Mechanically Resilient Epoxy Nanocomposites

Enhanced Thermal Pad Composites Using Densely Aligned MgO Nanowires

Owing to the increasing demand for the miniaturization and integration of electronic devices, thermal interface materials (TIMs) are crucial components for removing heat and improving the lifetime and safety of electronic devices. Among these, thermal pads are reusable alternatives to thermal paste-type TIMs; however, conventional thermal pads comprise a homogeneous polymer with low thermal conductivity. Composite materials of thermally conducting fillers and polymer matrices are considered suitable alternatives to high-performance pad materials owing to their controllable thermal properties. However, they degrade the thermal performance of the filler materials at high loading ratios via aggregation. In this study, we propose novel nanocomposites using densely aligned MgO nanowire fillers and polydimethylsiloxane (PDMS) matrices. The developed nanocomposites ensured the enhanced thermal conducting properties, while maintaining mechanical flexibility. The three-step preparation process involves the (i) fabrication of the MgO structure using a freeze dryer; (ii) compression of the MgO structure; and (iii) the infiltration of PDMS in the structure. The resulting aligned composites exhibited a superior thermal conductivity (approximately 1.18 W m^-1K^-1) to that of pure PDMS and composites with the same filler ratios of randomly distributed MgO fillers. Additionally, the MgO/PDMS composites exhibited adequate electrical insulating properties, with a room-temperature resistivity of 7.92 × 10¹⁵ Ω∙cm.

Synthesis of KH550-Modified Hexagonal Boron Nitride Nanofillers for Improving Thermal Conductivity of Epoxy Nanocomposites

In this work, KH550 (γ-aminopropyl triethoxy silane)-modified hexagonal boron nitride (BN) nanofillers were synthesized through a one-step ball-milling route. Results show that the KH550-modified BN nanofillers synthesized by one-step ball-milling (BM@KH550-BN) exhibit excellent dispersion stability and a high yield of BN nanosheets. Using BM@KH550-BN as fillers for epoxy resin, the thermal conductivity of epoxy nanocomposites increased by 195.7% at 10 wt%, compared to neat epoxy resin. Simultaneously, the storage modulus and glass transition temperature (Tg) of the BM@KH550-BN/epoxy nanocomposite at 10 wt% also increased by 35.6% and 12.4 °C, respectively. The data calculated from the dynamical mechanical analysis show that the BM@KH550-BN nanofillers have a better filler effectiveness and a higher volume fraction of constrained region. The morphology of the fracture surface of the epoxy nanocomposites indicate that the BM@KH550-BN presents a uniform distribution in the epoxy matrix even at 10 wt%. This work guides the convenient preparation of high thermally conductive BN nanofillers, presenting a great application potential in the field of thermally conductive epoxy nanocomposites, which will promote the development of electronic packaging materials.

Thermal conductivity and mechanical performance of hexagonal boron nitride nanosheets-based epoxy adhesives

Thermosets possess diverse physical and chemical properties and thus they are widely used in various applications such as electronic packaging, construction, and automotive industries. However, their poor thermal conductivity and weak mechanical performance jeopardize their continual spread in modern industry. In this study, boron nitride nanosheets (BNNSs) were employed to promote both mechanical and thermal properties of epoxy nanocomposites. BNNSs and their epoxy nanocomposites were fabricated usingin situsolvent ultrasonication andin situpolymerization, respectively. Thermal conductivity was enhanced by 153% increment in epoxy/BNNS nanocomposite at 7 wt% in comparison with neat epoxy. In parallel, Young's modulus, lap shear strength, fracture toughness (K_1C) and energy release rate (G_1C) increased by 69%, 31%, 122% and 118%, respectively at 1 wt% BNNSs. Moreover, fatigue life and strength of lap shear joints were significantly improved upon adding BNNSs. A numerical model of the single lap shear joint was developed to validate the accuracy of the material constants obtained. Epoxy/BNNS nanocomposites exhibited an outstanding mechanical performance as well as high thermal conductivity giving them merits to widen their applications in electronic and automotive industry.

Recent progress in the development of thermal interface materials: a review

Modern electronic devices are characterized by high-power and high-frequency with excessive heat accumulation. Thermal interface materials (TIMs) are of crucial importance for efficient heat dissipation to maintain proper functions and lifetime for these devices. The most promising TIMs are those polymer-based nanocomposites consisting of polymers and low-dimensional materials with high thermal conductivity (TC). This perspective summarizes the recent progress on the thermal transport properties of newly discovered one-dimensional (1D) nanomaterials and two-dimensional (2D) nanomaterials as well as three-dimensional (3D) nanostructures consisting of these 1D and 2D nanomaterials. Moreover, the applications of various nanomaterials in polymer nanocomposites for advanced TIMs are critically reviewed and the mechanism of TC enhancement is analysed. It is hoped that the present review could provide better understanding of the thermal transport properties of recently developed 2D nanomaterials and various 3D nanostructures as well as relevant polymer-based TIMs, shedding more light on the thermal management research.