Self-Supplied Nano-Fusing and Transferring Metal Nanostructures via Surface Oxide Reduction

Transparent Intracellular Sensing Platform with Si Needles for Simultaneous Live Imaging

Vertically ordered Si needles are of particular interest for long-term intracellular recording owing to their capacity to infiltrate living cells with negligible damage and minimal toxicity. Such intracellular recordings could greatly benefit from simultaneous live cell imaging without disrupting their culture, contributing to an in-depth understanding of cellular function and activity. However, the use of standard live imaging techniques, such as inverted and confocal microscopy, is currently impeded by the opacity of Si wafers, typically employed for fabricating vertical Si needles. Here, we introduce a transparent intracellular sensing platform that combines vertical Si needles with a percolated network of Au-Ag nanowires on a transparent elastomeric substrate. This sensing platform meets all prerequisites for simultaneous intracellular recording and imaging, including electrochemical impedance, optical transparency, mechanical compliance, and cell viability. Proof-of-concept demonstrations of this sensing platform include monitoring electrical potentials in cardiomyocyte cells and in three-dimensionally engineered cardiovascular tissue, all while conducting live imaging with inverted and confocal microscopes. This sensing platform holds wide-ranging potential applications for intracellular research across various disciplines such as neuroscience, cardiology, muscle physiology, and drug screening.

Electroplated core-shell nanowire network electrodes for highly efficient organic light-emitting diodes

In this study, we performed metal (Ag, Ni, Cu, or Pd) electroplating of core-shell metallic Ag nanowire (AgNW) networks intended for use as the anode electrode in organic light-emitting diodes (OLEDs) to modify the work function (WF) and conductivity of the AgNW networks. This low-cost and facile electroplating method enabled the precise deposition of metal onto the AgNW surface and at the nanowire (NW) junctions. AgNWs coated onto a transparent glass substrate were immersed in four different metal electroplating baths: those containing AgNO₃ for Ag electroplating, NiSO₄ for Ni electroplating, Cu₂P₂O₇ for Cu electroplating, and PdCl₂ for Pd electroplating. The solvated metal ions (Ag⁺, Ni²⁺, Cu²⁺, and Pd²⁺) in the respective electroplating baths were reduced to the corresponding metals on the AgNW surface in the galvanostatic mode under a constant electric current achieved by linear sweep voltammetry via an external circuit between the AgNW networks (cathode) and a Pt mesh (anode). The amount of electroplated metal was systematically controlled by varying the electroplating time. Scanning electron microscopy images showed that the four different metals (shells) were successfully electroplated on the AgNWs (core), and the nanosize-controlled electroplating process produced metal NWs with varying diameters, conductivities, optical transmittances, and WFs. The metal-electroplated AgNWs were successfully employed as the anode electrodes of the OLEDs. This facile and low-cost method of metal electroplating of AgNWs to increase their WFs and conductivities is a promising development for the fabrication of next-generation OLEDs.

Solution-Processed MoS2 Film with Functional Interfaces via Precursor-Assisted Chemical Welding

Molybdenum disulfide (MoS₂) presents fascinating properties for next-generation applications in diverse fields. However, fully exploiting the best properties of MoS₂ in largescale practical applications still remains a challenge due to lack of proper processing methods. Solution-based processing can be a promising route for scalable production of MoS₂ nanosheets, but the resulting assembled film possesses an enormous number of interfaces that significantly compromise the intrinsic electrical properties. Herein, we demonstrate the solution processing of MoS₂ and subsequent precursor-assisted chemical welding to form defective MoS_2-x at the nanosheet interfaces. The formation of defective MoS_2-x significantly reduces the electrical contact resistances, and thus the chemically welded MoS₂ film exhibits more than 2 orders of magnitude improved electrical conductivity. Furthermore, the chemical welding provides MoS_2-x interface induced additional defect originated functionalities for diverse applications such as broadband photodetection over the near-infrared range and improved electrocatalytic activity for hydrogen evolution reactions. Overall, this precursor-assisted chemical welding strategy can be a facile route to produce high-quality MoS₂ films with low-quality defective MoS_2-x at the interfaces having multifunctionalities in electronics, optoelectronics, and electrocatalysis.

Enhanced bendability of nanostructured metal electrodes: effect of nanoholes and their arrangement

Metallic thin films often exhibit poor mechanical robustness, which makes them unsuitable for use as electrodes in flexible and stretchable electronic devices. This prompted us to investigate the effect of creating a pattern of nanoholes in a metallic thin film to its mechanical and electrical properties. The adoption of nanonetwork structures is shown to confer significantly improved bendability to the films, with a change in electrical resistance of only 21% after 10 000 bending cycles, under a bending strain of 6.3%. In contrast to the planar silver (Ag) films in which large cracks are formed, structures that contain nanoholes act as barriers that block the growth of cracks; consequently, only short cracks are formed in these films and therefore changes in their resistance are much lower. In this paper, we suggest a novel model based on random grain boundaries to simulate the behavior of various nanopattern arrangements when the film is subjected to mechanical stress. Our modeling studies revealed that nanoholes secure the electrical current pathways by effectively blocking crack propagation, and that optimizing orientation, size, and coverage of these nanoholes can further improve the mechanical properties. Although diamond patterns exhibit superior characteristics to those of rectangular ones, their directional dependence is shown to be reduced by adopting randomly dispersed nanostructures. We additionally verified experimentally that an array of holes (rectangular, diamond-shaped, and randomly patterned) significantly affects crack propagation and resistance change.

Efficient metallic nanowire welding using the Eddy current method

In this study, metallic nanowires (M-NWs) such as silver nanowires (AgNWs) and copper nanowires (CuNWs) were welded only at junctions resistively by a novel method using an indirect Eddy current through an inductive power transfer. By applying an inductive power of 45 kHz alternating current power indirectly for 6 s to the M-NW network deposited on polymer substrates, a decrease of sheet resistance up to ∼67.9% for AgNWs and ∼49.9% for CuNWs could be obtained without changing the optical transmittance. For AgNWs, after the welding a decrease of surface roughness could also be observed from 44.5 nm to 26.3 nm, which is similar to the height of a single layer AgNW (22.2 nm) for a bilayer junction. For AgNWs coated on a transparent flexible substrate, after the cyclic bending of 10 000 times, no change of resistance (ΔR/R0) of the AgNWs after the welding was observed and the welded AgNWs were not easily peeled off from the substrate. It is believed that this novel welding method can be applied not only to all kinds of M-NWs on various flexible low-temperature polymer substrates, but also to large areas at a short time and at low cost.

Epitaxial-Growth-Induced Junction Welding of Silver Nanowire Network Electrodes

In this study, we developed a roll-to-roll Ag electroplating process for metallic nanowire electrodes using a galvanostatic mode. Electroplating is a low-cost and facile method for deposition of metal onto a target surface with precise control of both the composition and the thickness. Metallic nanowire networks [silver nanowires (AgNWs) and copper nanowires (CuNWs)] coated onto a polyethylene terephthalate (PET) film were immersed directly in an electroplating bath containing AgNO₃. Solvated silver ions (Ag⁺ ions) were deposited onto the nanowire surface through application of a constant current via an external circuit between the nanowire networks (cathode) and a Ag plate (anode). The amount of electroplated Ag was systematically controlled by changing both the applied current density and the electroplating time, which enabled precise control of the sheet resistance and optical transmittance of the metallic nanowire networks. The optimized Ag-electroplated AgNW (Ag-AgNW) films exhibited a sheet resistance of ∼19 Ω/sq at an optical transmittance of 90% (550 nm). A transmission electron microscopy study confirmed that Ag grew epitaxially on the AgNW surface, but a polycrystalline Ag structure was formed on the CuNW surface. The Ag-electroplated metallic nanowire electrodes were successfully applied to various electronic devices such as organic light-emitting diodes, triboelectric nanogenerators, and a resistive touch panel. The proposed roll-to-roll Ag electroplating process provides a simple, low-cost, and scalable method for the fabrication of enhanced transparent conductive electrode materials for next-generation electronic devices.

Spontaneous and Selective Nanowelding of Silver Nanowires by Electrochemical Ostwald Ripening and High Electrostatic Potential at the Junctions for High-Performance Stretchable Transparent Electrodes

Metal nanowires have been gaining increasing attention as the most promising stretchable transparent electrodes for emerging field of stretchable optoelectronic devices. Nanowelding technology is a major challenge in the fabrication of metal nanowire networks because the optoelectronic performances of metal nanowire networks are mostly limited by the high junction resistance between nanowires. We demonstrate the spontaneous and selective welding of Ag nanowires (AgNWs) by Ag solders via an electrochemical Ostwald ripening process and high electrostatic potential at the junctions of AgNWs. The AgNWs were welded by depositing Ag nanoparticles (AgNPs) on the conducting substrate and then exposing them to water at room temperature. The AgNPs were spontaneously dissolved in water to form Ag⁺ ions, which were then reduced to single-crystal Ag solders selectively at the junctions of the AgNWs. Hence, the welded AgNWs showed higher optoelectronic and stretchable performance compared to that of as-formed AgNWs. These results indicate that electrochemical Ostwald ripening-based welding can be used as a promising method for high-performance metal nanowire electrodes in various next-generation devices such as stretchable solar cells, stretchable displays, organic light-emitting diodes, and skin sensors.

Emerging Novel Metal Electrodes for Photovoltaic Applications

Emerging novel metal electrodes not only serve as the collector of free charge carriers, but also function as light trapping designs in photovoltaics. As a potential alternative to commercial indium tin oxide, transparent electrodes composed of metal nanowire, metal mesh, and ultrathin metal film are intensively investigated and developed for achieving high optical transmittance and electrical conductivity. Moreover, light trapping designs via patterning of the back thick metal electrode into different nanostructures, which can deliver a considerable efficiency improvement of photovoltaic devices, contribute by the plasmon-enhanced light-mattering interactions. Therefore, here the recent works of metal-based transparent electrodes and patterned back electrodes in photovoltaics are reviewed, which may push the future development of this exciting field.

Halide Welding for Silver Nanowire Network Electrode

We developed a method of chemically welding silver nanowires (AgNWs) using an aqueous solution containing sodium halide salts (NaF, NaCl, NaBr, or NaI). The halide welding was performed simply by immersing the as-coated AgNW film into the sodium halide solution, and the resulting material was compared with those obtained using two typical thermal and plasmonic welding techniques. The halide welding dramatically reduced the sheet resistance of the AgNW electrode because of the strong fusion among nanowires at each junction while preserving the optical transmittance. The dramatic decrease in the sheet resistance was attributed to the autocatalytic addition of dissolved silver ions to the nanowire junction. Unlike thermal and plasmonic welding methods, the halide welding could be applied to AgNW films with a variety of deposition densities because the halide ions uniformly contacted the surface or junction regions. The optimized AgNW electrodes exhibited a sheet resistance of 9.3 Ω/sq at an optical transmittance of 92%. The halide welding significantly enhanced the mechanical flexibility of the electrode compared with the as-coated AgNWs. The halide-welded AgNWs were successfully used as source-drain electrodes in a transparent and flexible organic field-effect transistor (OFET). This simple, low-cost, and low-power consumption halide welding technique provides an innovative approach to preparing transparent electrodes for use in next-generation flexible optoelectronic devices.

Low-Temperature Fusible Silver Micro/Nanodendrites-Based Electrically Conductive Composites for Next-Generation Printed Fuse-Links

We systematically investigate the long-neglected low-temperature fusing behavior of silver micro/nanodendrites and demonstrate the feasibility of employing this intriguing property for the printed electronics application, i.e., printed fuse-links. Fuse-links have experienced insignificant changes since they were invented in the 1890s. By introducing silver micro/nanodendrites-based electrically conductive composites (ECCs) as a printed fusible element, coupled with the state-of-the-art printed electronics technology, key performance characteristics of a fuse-link are dramatically improved as compared with the commercially available counterparts, including an expedient fabrication process, lower available rated current (40% of the minimum value of Littelfuse 467 series fuses), shorter response time (only 3.35% of the Littelfuse 2920L030 at 1.5 times of the rated current), milder surface temperature rise (16.89 °C lower than FGMB) and voltage drop (only 24.26% of FGMB) in normal operations, easier to mass produce, and more flexible in product design. This technology may inspire the development of future printed electronic components.

Facilitated embedding of silver nanowires into conformally-coated iCVD polymer films deposited on cloth for robust wearable electronics

We propose that a silver nanowire (AgNW)-embedded conducting film can be monolithically applied onto an arbitrary cloth with strong adhesion and environmental stability. We employ a vapor-phase method, initiated chemical vapor deposition (iCVD), for conformal coating of a scaffold polymer film on the cloth. AgNWs are applied on the surface of iCVD polymer films, and the embedding of AgNWs is completed within only 20 s on heating the polymer-coated cloth to 70 °C. Crosslinking the copolymer at 120 °C renders the AgNW-embedded conducting films on the cloth not only thermally and chemically stable, but also mechanically robust. Moreover, when a hydrophobic encapsulating polymer layer is added on the AgNW-embedded film via iCVD, it substantially improves the stability of the cloth against thermal oxidation under hot and humid conditions, showing applicability of the technology to wearable electronics. With these robust conducting films, we demonstrate the fabrication of a waterproof cloth-based heater and circuit for a seven-segment display, thus, confirming the wide applicability of the technology developed in this study.

Extremely Robust and Patternable Electrodes for Copy-Paper-Based Electronics

We propose a fabrication process for extremely robust and easily patternable silver nanowire (AgNW) electrodes on paper. Using an auxiliary donor layer and a simple laminating process, AgNWs can be easily transferred to copy paper as well as various other substrates using a dry process. Intercalating a polymeric binder between the AgNWs and the substrate through a simple printing technique enhances adhesion, not only guaranteeing high foldability of the electrodes, but also facilitating selective patterning of the AgNWs. Using the proposed process, extremely crease-tolerant electronics based on copy paper can be fabricated, such as a printed circuit board for a 7-segment display, portable heater, and capacitive touch sensor, demonstrating the applicability of the AgNWs-based electrodes to paper electronics.

An Electroactive, Tunable, and Frequency Selective Surface Utilizing Highly Stretchable Dielectric Elastomer Actuators Based on Functionally Antagonistic Aperture Control

An active, frequency selective surface utilizing a silver-nanowire-coated dielectric elastomer with a butterfly-shaped aperture pattern is realized by properly exploiting the electroactive control of two antagonistic functions (stretching vs compression) on a patterned dielectric elastomer actuator.