Highly Thermally Conductive Polymer Composite Originated from Assembly of Boron Nitride at an Oil-Water Interface

Boron Nitride-Polymer Composites with High Thermal Conductivity: Preparation, Functionalization Strategy and Innovative Structural Regulation

The escalating thermal challenges posed by increasing power densities in electronic devices emerge as a critical barrier to maintain their sustained and reliable operation. Addressing this issue requires the strategic development of materials with superior thermal conductivity properties to facilitate progress in high-power electronics development. Thermal conductive polymer composites by incorporating ceramic material renowned for their exceptional thermal conductivity adjustability, insulating properties, and moldability, are emerging as a promising solution to this urgent challenge. Hexagonal boron nitride (h-BN) nanomaterials emerge as highly promising candidates for thermal management applications, owing to their exceptional mechanical properties, superior thermal stability, remarkable thermal conductivity coefficients, minimal thermal expansion characteristics, and outstanding chemical inertness. In this work, the progress of ≈10 years on high thermal conductive boron nitride-filled polymer composites is thoroughly summarized. Moreover, strategies for h-BN and other boron nitride nanomaterials-filled polymer composites at synthesis, functionalization, and innovative structural design are discussed in detail. The main challenges and future development of boron nitride-polymer composites in thermal management are also proposed, which will provide meaningful guidance for the design and practical applications of thermal management materials.

Silicone Composites with Electrically Oriented Boron Nitride Platelets and Carbon Microfibers for Thermal Management of Electronics

This study investigated silicone composites with distributed boron nitride platelets and carbon microfibers that are oriented electrically. The process involved homogenizing and dispersing nano/microparticles in the liquid polymer, aligning the particles with DC and AC electric fields, and curing the composite with IR radiation to trap particles within chains. This innovative concept utilized two fields to align particles, improving the even distribution of carbon microfibers among BN in the chains. Based on SEM images, the chains are uniformly distributed on the surface of the sample, fully formed and mature, but their architecture critically depends on composition. The physical and electrical characteristics of composites were extensively studied with regard to the composition and orientation of particles. The higher the concentration of BN platelets, the greater the enhancement of dielectric permittivity, but the effect decreases gradually after reaching a concentration of 15%. The impact of incorporating carbon microfibers into the dielectric permittivity of composites is clearly beneficial, especially when the BN content surpasses 12%. Thermal conductivity showed a significant improvement in all samples with aligned particles, regardless of their composition. For homogeneous materials, the thermal conductivity is significantly enhanced by the inclusion of carbon microfibers, particularly when the boron nitride content exceeds 12%. The biggest increase happened when carbon microfibers were added at a rate of 2%, while the BN content surpassed 15.5%. The thermal conductivity of composites is greatly improved by adding carbon microfibers when oriented particles are present, even at BN content over 12%. When the BN content surpasses 15.5%, the effect diminishes as the fibers within chains are only partly vertically oriented, with BN platelets prioritizing vertical alignment. The outcomes of this study showed improved results for composites with BN platelets and carbon microfibers compared to prior findings in the literature, all while utilizing a more straightforward approach for processing the polymer matrix and aligning particles. In contrast to current technologies, utilizing homologous materials with uniformly dispersed particles, the presented technology reduces ingredient consumption by 5-10 times due to the arrangement in chains, which enhances heat transfer efficiency in the desired direction. The present technology can be used in a variety of industrial settings, accommodating different ingredients and film thicknesses, and can be customized for various applications in electronics thermal management.

Constructing the Snail Shell-Like Framework in Thermal Interface Materials for Enhanced Through-Plane Thermal Conductivity

Melioration of the through-plane thermal conductivity (TC) of thermal interface materials (TIMs) is a sore need for efficient heat dissipation to handle an overheating concern of high-power-density electronics. Herein, we constructed a snail shell-like thermal conductive framework to facilitate vertical heat conduction in TIMs. With inspiration from spirally growing calcium carbonate platelets of snail shells, a facile double-microrod-assisted curliness method was developed to spirally coil boron nitride nanosheet (BNNS)/aramid nanofiber (ANF) laminates where interconnected BNNSs lie along the horizontal plane. Thus, vertical alignment of BNNSs in the resultant TIM was achieved, exhibiting a through-plane TC enhancement of ∼100% compared to the counterpart with randomly distributed BNNSs at the same BNNS addition (50 wt %). The Foygel's nonlinear model revealed that this unique snail shell-like BNNS framework reduced interfacial thermal resistance by 4 orders of magnitude. Our TIM showed superior interfacial thermal dissipation efficiency, leading to a temperature reduction of 42.6 °C for the LED chip compared to the aforementioned counterpart. Our work paves a valuable way for fabricating high-performance TIMs to ensure reliable operation of electrical devices.

Recent Advances in Fire-Retardant Silicone Rubber Composites

Silicone rubber (SR), as one kind of highly valuable rubber material, has been widely used in many fields, e.g., construction, transportation, the electronics industry, automobiles, aviation, and biology, owing to its attractive properties, including high- and low-temperature resistance, weathering resistance, chemical stability, and electrical isolation, as well as transparency. Unfortunately, the inherent flammability of SR largely restricts its practical application in many fields that have high standard requirements for flame retardancy. Throughout the last decade, a series of flame-retardant strategies have been adopted which enhance the flame retardancy of SR and even enhance its other key properties, such as mechanical properties and thermal stability. This comprehensive review systematically reviewed the recent research advances in flame-retarded SR materials and summarized and introduced the up-to-date design of different types of flame retardants and their effects on flame-retardant properties and other performances of SR. In addition, the related flame-retardant mechanisms of the as-prepared flame-retardant SR materials are analyzed and presented. Moreover, key challenges associated with these various types of FRs are discussed, and future development directions are also proposed.

Universal Strategy for Inorganic Nanoparticle Incorporation into Mesoporous Liquid Crystal Polymer Particles

Developing inorganic-organic composite polymers necessitates a new strategy for effectively controlling shape and optical properties while accommodating guest materials, as conventional polymers primarily act as  carriers that transport inorganic substances. Here, a universal approach is introduced utilizing mesoporous liquid crystal polymer particles (MLPs) to fabricate inorganic-organic composites. By leveraging the liquid crystal phase, morphology and optical properties are precisely controlled through the molecular-level arrangement of the host, here monomers. The controlled host material allows the synthesis of inorganic particles within the matrix or accommodation of presynthesized nano-inorganic particles, all while preserving the intrinsic properties of the host material. This composite material surpasses the functional capabilities of the polymer alone by sequentially integrating one or more inorganic materials, allowing for the incorporation of multiple functionalities within a single polymer particle. Furthermore, this approach effectively mitigates the drawbacks associated with guest materials resulting in a substantial enhancement of composite performance. The presented approach is anticipated to hold immense potential for various applications in optoelectronics, catalysis, and biosensing, addressing the evolving demands of the society.

3D-Printed Polyamide 12/Styrene-Acrylic Copolymer-Boron Nitride (PA12/SA-BN) Composite with Macro and Micro Double Anisotropic Thermally Conductive Structures

Anisotropic thermally conductive composites are very critical for precise thermal management of electronic devices. In this work, in order to prepare a composite with significant anisotropic thermal conductivity, polyamide 12/styrene-acrylic copolymer-boron nitride (PA12/SA-BN) composites with macro and micro double anisotropic structures were fabricated successfully using 3D printing and micro-shear methods. The morphologies and thermally conductive properties of composites were systematically characterized via SEM, XRD, and the laser flash method. Experimental results indicate that the through-plane thermal conductivity of the composite is 4.2 W/(m·K) with only 21.4 wt% BN, which is five times higher than that of the composite with randomly oriented BN. Simulation results show that the macro-anisotropic structure of the composite (caused by the selective distribution of BN) as well as the micro-anisotropic structure (caused by the orientation structure of BN) both play critical roles in spreading heat along the specified direction. Therefore, as-obtained composites with double anisotropic structures possess great potential for the application inefficient and controllable thermal management in various fields.

Phase Change Microcapsules with a Polystyrene/Boron Nitride Nanosheet Hybrid Shell for Enhanced Thermal Management of Electronics

Organic shell material and phase change material (PCM) have low thermal conductivity, which reduces the heat absorption and release rate of microencapsulated phase change materials (MEPCMs). Boron nitride nanosheets (BNNSs) with high thermal conductivity can not only stabilize the oil phase as the Pickering emulsifier but also improve the thermal conductivity of MEPCMs as one of the shell components, thus facilitating the heat conduction in the microcapsule system. Herein, MEPCM with paraffin wax (PW) as the core material and polystyrene (PS) modified by BNNSs as the shell material (PW@PS/BNNS MEPCMs) are synthesized via Pickering emulsion polymerization. The structure of PW@PS/BNNS MEPCMs can be regulated by tuning the PW and BNNS contents, to achieve high latent heat and thermal conductivity. In comparison to pure PW, the thermal conductivity of MEPCMs-5 wt % BNNSs increases by 63.76% at 25 °C. The PW@PS/BNNS powder possesses a latent heat capacity of 166.3 J/g, corresponding to a high encapsulation ratio of 80.77%. These properties endow the prepared MEPCMs with excellent thermal regulation properties. We also propose the formation mechanism of PW@PS/BNNS MEPCMs via Pickering emulsion polymerization for the first time, which will guide the MEPCM fabrication toward a reliable direction.

Pickering emulsions as an alternative to traditional polymers: trends and applications

Pickering emulsions have gained increasing interest because of their unique features, including easy preparation and stability. In contrast to classical emulsions, in Pickering emulsions, the stabilisers are solid micro/nanoparticles that accumulate on the surfaces of liquid phases. In addition to their stability, Pickering emulsions are less toxic and responsive to external stimuli, which make them versatile material that can be flexibly designed for specific applications, e.g., catalysis, pharmaceuticals and new materials. The potential toxicity and adverse impact on the environment of classic emulsions is related to the extractable nature of the water emulsifier. The impacts of some emulsifiers are related to not only their chemical natures but also their stabilities; after base or acid hydrolysis, some emulsifiers can be turned into sulphates and fatty alcohols, which are dangerous to aquatic life. In this paper, recent research on Pickering emulsion preparations is reviewed, with a focus on styrene as one of the main emulsion components. Moreover, the effects of the particle type and morphology and the critical parameters of the emulsion production process on emulsion properties and applications are discussed. Furthermore, the current and prospective applications of Pickering emulsion, such as in lithium-ion batteries and new vaccines, are presented.

Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging

Miniaturized and high-power-density 3D electronic devices pose new challenges on thermal management. Indeed, prompt heat dissipation in electrically insulating packaging is currently limited by the thermal conductivity achieved by thermal interface materials (TIMs) and by their capability to direct the heat toward heat sinks. Here, high thermal conductivity boron nitride (BN)-based composites that are able to conduct heat intentionally toward specific areas by locally orienting magnetically functionalized BN microplatelets are created using magnetically assisted slip casting. The obtained thermal conductivity along the direction of alignment is unusually high, up to 12.1 W m^-1 K^-1 , thanks to the high concentration of 62.6 vol% of BN in the composite, the low concentration in polymeric binder, and the high degree of alignment. The BN composites have a low density of 1.3 g cm^-3 , a high stiffness of 442.3 MPa, and are electrically insulating. Uniquely, the approach is demonstrated with proof-of-concept composites having locally graded orientations of BN microplatelets to direct the heat away from two vertically stacked heat sources. Rationally designing the microstructure of TIMs to direct heat strategically provides a promising solution for efficient thermal management in 3D integrated electronics.

Highly thermally conductive and eco-friendly OH-h-BN/chitosan nanocomposites by constructing a honeycomb thermal network

More than 110,000,000 tons of mismanaged plastics were to be produced in 2020. Polymers are favored in the preparation of thermally conductive materials due to their excellent comprehensive properties. However, most polymers fabricated for thermally conductive materials are difficult to degrade in the natural environment. To alleviate the increasingly severe environmental problems, we reported a novel eco-friendly material with high thermal conductivity, which was composited of chitosan microspheres (CSM) and hydroxyl-functionalized hexagonal boron nitride (OH-h-BN) nanoplatelets. Utilizing their significant difference in scales, the OH-h-BN nanoplatelets were arranged between each CSM. Their overall structure was similar to the honeycomb: CSM were honeycomb cores, and OH-h-BN nanoplatelets were honeycomb network. The routine-structure OH-h-BN/CS nanocomposites were only 0.94 ± 0.02 W·m^-1·K^-1 at 50 wt% in thermal conductivity. However, the OH-h-BN/CSM nanocomposites with honeycomb structure can reach 5.66 ± 0.32 W·m^-1·K^-1 in the same loading, for enhancement of 502% and 1914% than OH-h-BN/CS nanocomposites and pure CS, respectively.

Wall Density-Controlled Thermal Conductive and Mechanical Properties of Three-Dimensional Vertically Aligned Boron Nitride Network-Based Polymeric Composites

Polymeric composites with good thermal conductive and improved mechanical properties are in high demand in the thermal management materials. Construction of a three-dimensional (3D) structure has been proved to be an effective method to obtain polymeric composites with improved through-plane thermal conductivity (TC) for efficient thermal management of electronics. However, the TC enhancement of the obtained polymeric composites is limited, mainly due to poor control of the 3D thermal conductive network. Additionally, achieving high thermal conductive properties and enhanced mechanical properties simultaneously is of great challenge for polymeric composites. In this work, a 3D boron nitride framework (BNF) with a well-defined vertically aligned open structure and designed wall density fabricated by a unidirectional freezing technique was applied. The as-prepared BNF/polyethylene glycol (PBNF) composites exhibit enhanced through-plane TC, excellent thermal transfer capability (ΔT_max = 34 °C), and improved mechanical properties (Young's modulus enhancement up to 356%) simultaneously, making it attractive to thermal management applications. Strong correlation between the TC and mechanical properties of the PBNF composites and the wall density of the BNF scaffolds was found, providing opportunities to tune the TC and mechanical properties through the controlling of wall density. Furthermore, the models between TC and Young's modulus of PBNF composites were established by using the data-driven method "sure independence screening and sparsifying operator", which enables us to predict TC and Young's modulus of the polymeric composites for designing promising composite materials. The design principles and fabrication strategies proposed in this work could be important for developing advanced composite materials.

Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

In this work, polydimethylsiloxane (PDMS)-based composites with high thermal conductivity were fabricated via a three-dimensional hybrid boron nitride@silver nanowires (BN@AgNWs) filler thermal network, and their thermal conductivity was investigated. A new thermal conductive BN@AgNWs hybrid filler was prepared by an in situ growth method. Silver ions with the different concentrations were reduced, and AgNWs crystallized and grew on the surface of BN sheets. PDMS-based composites were fabricated by the BN@AgNWs hybrid filler added. SEM, XPS, and XRD were used to characterize the structure and morphology of BN@AgNWs hybrid fillers. The thermal conductivity performances of PDMS-based composites with different silver concentrates were investigated. The results showed that the thermal conductivity of PDMS-based composite filled with 20 vol% BN@15AgNWs hybrid filler is 0.914 W/(m·K), which is 5.05 times that of pure PDMS and 23% higher than the thermal conductivity of 20 vol% PDMS-based composite with BN filled. The enhanced thermal conductivity mechanism was provided based on the hybrid filler structure. This work offers a new way to design and fabricate the high thermal conductive hybrid filler for thermal management materials.

Salt Template Assisted BN Scaffold Fabrication toward Highly Thermally Conductive Epoxy Composites

With the trend of device miniaturization and higher integration, polymer composites with high thermal conductivity are highly desirable for efficient removal of accumulated heat to maintain high performance of electronics. In this work, epoxy composites embedded with three-dimensional hexagonal boron nitride (BN) scaffold were fabricated. The BN-poly(vinylidene difluoride) (PVDF) scaffold was prepared by the salt template method using PVDF as the adhesive, while the corresponding epoxy composite was manufactured with vacuum-assisted impregnation. The epoxy/BN-PVDF composite exhibits high thermal conductivity with low loading of BN. The thermal conductivity of epoxy/BN-PVDF composite achieved 1.227 W/(m K) with 21 wt % BN, contributed by the constructed BN pathway held together by PVDF adhesive. In addition, PVDF could be further converted into carbon by thermal treatment, further enhancing the thermal conductivity of epoxy/BN-C composites through alleviating the phonon scattering at the interfaces, eventually obtaining thermal conductivity of 1.466 W/(m K). This type of epoxy-based composite with high thermal conductivity is promising to be used as thermal management materials in advanced electronic devices.