A Direct Epitaxial Approach To Achieving Ultrasmall and Ultrabright InGaN Micro Light-Emitting Diodes (μLEDs)

Advanced technologies in InGaN micro-LED fabrication to mitigate the sidewall effect

The size of InGaN micro-LEDs is continuously decreasing to meet the demands of various emerging applications, especially in tiny micro-displays such as AR/VR. However, the conventional pixel definition based on plasma etching significantly damages the mesa sidewalls, leading to a severe reduction in efficiency as the micro-LED size decreases. This seriously impedes the development and application of micro-LEDs. In this work, we comprehensively explain the origin of micro-LED sidewall effects and corresponding physical models. Subsequently, we systematically review recent progress in micro-LED fabrication aiming at suppressing sidewall effects. Furthermore, we discuss advancements in micro-LED fabrication with "damage-free" techniques, which hold the potential to fundamentally address the issue of plasma damage in the micro-LED process. We believe this review will deepen the understanding of micro-LED sidewall effects and provide a better insight into the latest associated fabrication technologies for high-efficient InGaN micro-LEDs.

A dimmable LED light source along the Planckian locus

Multiple channels are designed for dimmable LED light sources with color temperatures ranging from 2,700 to 6,500 K. However, issues such as Delta uv (Duv) values <0, lower brightness, luminous efficacy, and color rendering index (CRI), lower power density, exceeding the standard deviation of color matching (SDCM), unconstant power, poor color consistencies, and high costs persist. We present a three-channel LED light source featuring an integrated chip-on-board (COB) package structure. The channels are separated by a white dam to reduce reabsorption problems and improve color consistencies between different color temperatures. Additionally, the complementary channel M uses layered phosphor excitation for more accurate and efficient spectral compensation during dimming. Ultimately, this solution enables dimming along the Planck curve with constant power, improving CRI, luminous efficacy, and brightness at intermediate temperatures, while being cost-effective and minimizing the impact on initial color temperatures, offering a high-quality dimmable LED option for intelligent applications.

Scalable InGaN nanowire µ-LEDs: paving the way for next-generation display technology

Ever-increasing demand for efficient optoelectronic devices with a small-footprinted on-chip light emitting diode has driven their expansion in self-emissive displays, from micro-electronic displays to large video walls. InGaN nanowires, with features like high electron mobility, tunable emission wavelengths, durability under high current densities, compact size, self-emission, long lifespan, low-power consumption, fast response, and impressive brightness, are emerging as the choice of micro-light emitting diodes (µLEDs). However, challenges persist in achieving high crystal quality and lattice-matching heterostructures due to composition tuning and bandgap issues on substrates with differing crystal structures and high lattice mismatches. Consequently, research is increasingly focused on scalable InGaN nanowire µLEDs representing a transformative advancement in display technology, particularly for next-generation applications such as virtual/augmented reality and high-speed optical interconnects. This study presents recent progress and critical challenges in the development of InGaN nanowire µLEDs, highlighting their performance and potential as the next-generation displays in consumer electronics.

Long-lived excitons in thermally annealed hydrothermal ZnO

Applying thermal annealing to hydrothermal ZnO crystals an enhancement of exciton lifetime from 80 ps to 40 ns was achieved boosting PL quantum efficiency of the UV luminescence up to 70 %. The lifetime improvement is related to the reduced density of carrier traps by a few orders of magnitude as revealed by the reduction of the slow decay tail in pump probe decays coupled with weaker defects-related PL. The diffusion coefficient was determined to be 0.5 cm2/s, providing a large exciton diffusion length of 1.4 μm. The UV PL lifetime drop at the lowest exciton densities was explained by capture to traps. Release of holes from acceptor traps provided delayed exciton luminescence with ∼200 μs day time and 390 meV thermal activation energy. Pump-probe decays provided exciton absorption cross-section of 9 × 10-18 cm2 at 1550 nm wavelength and verified the PL decay times of excitons. Amplitudes and decay times of the microsecond slow decay tails have been correlated with the trap densities and their photoluminescence. A surface recombination velocity of 500 cm/s and the bimolecular free carrier recombination coefficient 0.7 × 10-11 cm3/s were calculated. Therefore, the properly annealed hydrothermally grown ZnO can be a viable and integral part of many functional devices as light-emitting diodes and lasers.

Integration Technology of Micro-LED for Next-Generation Display

Inorganic micro light-emitting diodes (micro-LEDs) based on III-V compound semiconductors have been widely studied for self-emissive displays. From chips to applications, integration technology plays an indispensable role in micro-LED displays. For example, large-scale display relies on the integration of discrete device dies to achieve extended micro-LED array, and full color display requires integration of red, green, and blue micro-LED units on the same substrate. Moreover, the integration with transistors or complementary metal-oxide-semiconductor circuits are necessary to control and drive the micro-LED display system. In this review article, we summarized the 3 main integration technologies for micro-LED displays, which are called transfer integration, bonding integration, and growth integration. An overview of the characteristics of these 3 integration technologies is presented, while various strategies and challenges of integrated micro-LED display system are discussed.

An Ultrahigh Efficiency Excitonic Micro-LED

High efficiency micro-LEDs, with lateral dimensions as small as one micrometer, are desired for next-generation displays, virtual/augmented reality, and ultrahigh-speed optical interconnects. The efficiency of quantum well LEDs, however, is reduced to negligibly small values when scaled to such small dimensions. Here, we show such a fundamental challenge can be overcome by developing nanowire excitonic LEDs. Harnessing the large exciton oscillator strength of quantum-confined nanostructures, we demonstrate a submicron scale green-emitting LED having an external quantum efficiency and wall-plug efficiency of 25.2% and 20.7%, respectively, the highest values reported for any LEDs of this size to our knowledge. We established critical factors for achieving excitonic micro-LEDs, including the epitaxy of nanostructures to achieve strain relaxation, the utilization of semipolar planes to minimize polarization effects, and the formation of nanoscale quantum-confinement to enhance electron-hole wave function overlap. This work provides a viable path to break the efficiency bottleneck of nanoscale optoelectronics.

Ion implantation of tunnel junction as a method for defining the aperture of III-nitride-based micro-light-emitting diodes

We report on III-nitride-based micro-light-emitting diodes (µLEDs) operating at 450 nm wavelength with diameters down to 2 µm. Devices with a standard LED structure followed by a tunnel junction were grown by plasma-assisted molecular beam epitaxy. The emission size of µLEDs was defined by shallow He⁺ implantation of the tunnel junction region. The ion implantation process allows to create flat devices, applicable to further epitaxial regrowth. The shift of current density for the maximum external quantum efficiency as a function of µLEDs diameter was observed. This effect may be a fingerprint of the change in the external efficiency related to the lateral carrier diffusion (limited by holes) in InGaN quantum wells.

A Simple Approach to Achieving Ultrasmall III-Nitride Microlight-Emitting Diodes with Red Emission

The microdisplays for augmented reality and virtual reality require ultrasmall micro light-emitting-diodes (μLEDs) with a dimension of ≤5 μm. Furthermore, the microdisplays also need three kinds of such μLEDs each emitting red, green, and blue emission. Currently, in addition to a great challenge for achieving ultrasmall μLEDs mainly based on III-nitride semiconductors, another fundamental barrier is due to an extreme difficulty in growing III-nitride-based red LEDs. So far, there has not been any effective approach to obtain high indium content InGaN as an active region required for a red LED while maintaining high optical performance. In this paper, we have demonstrated a selective epitaxy growth approach using a template featuring microhole arrays. This allows us to not only obtain the natural formation of ultrasmall μLEDs but also achieve InGaN with enhanced indium content at an elevated growth temperature, at which it is impossible to obtain InGaN-based red LEDs on a standard planar surface. By means of this approach, we have demonstrated red μLEDs (at an emission wavelength of 642 nm) with a dimension of 2 μm, exhibiting a high luminance of 3.5 × 10⁷ cd/m² and a peak external quantum efficiency of 1.75% measured in a wafer form (i.e., without any packaging to enhance an extraction efficiency). In contrast, an LED grown under identical growth conditions but on a standard planar surface shows green emission at 538 nm. This highlights that our approach provides a simple solution that can address the two major challenges mentioned above.

Simple Approach to Mitigate the Emission Wavelength Instability of III-Nitride μLED Arrays

III-nitride semiconductors and their heterojunctions exhibit intrinsic polarization due to the asymmetry of their wurtzite structure, which determines all the fundamental properties of III-nitride optoelectronics. The intrinsic polarization-induced quantum-confined Stark effect leads to an emission wavelength shift with increasing injection current for III-nitride visible LEDs, forming an insurmountable barrier for the fabrication of a full color display. For instance, a yellow LED designed to produce yellow light emits green or blue light at an elevated current, while a green (blue) LED gives off blue (violet) light with increasing current. This color instability becomes a serious issue for a microdisplay such as the displays for augmented reality (AR)/virtual reality (VR) typically utilized at proximity to the eye, where human eyes are sensitive to a tiny change in light color. It is well-known that an optical mode wavelength for a microcavity is insensitive to injection current. In this work, we have demonstrated an approach to epitaxially integrating microLEDs (green microLEDs as an example, one of the key components for a full color microdisplay) and a microcavity. This allows the emission from the microLEDs to be coupled with the microcavity, leading to a negligible emission wavelength shift with increasing injection current. In contrast, identical microLEDs but without a microcavity show a large emission wavelength shift from 560 nm down to 510 nm, measured under identical conditions. This approach provides a simple solution to resolving the 30-year issue in the field of III-nitride optoelectronics.

Ultra-bright green InGaN micro-LEDs with brightness over 10M nits

An investigation of electrical and optical properties of InGaN micro-scale light-emitting diodes (micro-LEDs) emitting at ∼530 nm is carried out, with sizes of 80, 150, and 200 µm. The ITO as a current spreading layer (CSL) provides excellent device performance. Over 10% external quantum efficiency (EQE) and wall-plug efficiency (WPE), and ultra-high brightness (> 10M nits) green micro-LEDs are realized. In addition, it is observed that better current spreading in smaller devices results in higher EQE and brightness. Superior green micro-LEDs can provide an essential guarantee for a variety of applications.

Enhanced light extraction efficiency of an LED package by a surface-mounted amorphous photonic structure

In this study, we propose a low-cost, simple and feasible post-processing approach to improve the light extraction efficiency (LEE) of LED packages. Amorphous photonic structures (APSs) with only short-range order are fabricated from anodic aluminum oxide (AAO) and transferred to intermediate polymer stamp (IPS) by nanoimprint technology. The IPS with APSs is directly mounted onto the surface of an LED package, where the LEE is achieved as 94.6%. The scanning electron microscope (SEM) images of AAO templates and imprinted IPS are analyzed by radial distribution function and diameter histogram. The far-field patterns of APS-mounted LED packages are measured in electroluminescence (EL). The three-dimensional finite-difference time-domain (3D-FDTD) calculations of transmittance of APSs confirm that they improve the light extraction above the critical angle. Two-dimensional Fourier power spectra from SEM images of APSs are also calculated. The LEE enhancement is attributed to that the APSs have short-range order on a length scale comparable to emission wavelength of LED. We provide novel multistage simulations in a simplified FDTD model for the LED package. Finally, we discuss the influence of the morphology of APSs on the LEE of the APS mounted LEDs.

Stretchable Transparent Light-Emitting Diodes Based on InGaN/GaN Quantum Well Microwires and Carbon Nanotube Films

We propose and demonstrate both flexible and stretchable blue light-emitting diodes based on core/shell InGaN/GaN quantum well microwires embedded in polydimethylsiloxane membranes with strain-insensitive transparent electrodes involving single-walled carbon nanotubes. InGaN/GaN core-shell microwires were grown by metal-organic vapor phase epitaxy, encapsulated into a polydimethylsiloxane film, and then released from the growth substrate. The fabricated free-standing membrane of light-emitting diodes with contacts of single-walled carbon nanotube films can stand up to 20% stretching while maintaining efficient operation. Membrane-based LEDs show less than 15% degradation of electroluminescence intensity after 20 cycles of stretching thus opening an avenue for highly deformable inorganic devices.

Optical design of InGaN/GaN nanoLED arrays on a chip: toward: highly resolved illumination

The physical laws of diffraction limit the spatial resolution of optical systems. In contrary to most superresolution microscopy approaches used today, in our novel idea we are aiming to overcome this limit by developing a spatially resolved illumination source based on semiconductor nanoscale light emitting diode (nanoLED) arrays with individual pixel control. We present and discuss the results of optical simulations performed for such nanoLED emitter arrays and analyze the theoretical limits of this approach. As possible designs we study arrays of GaN nanofins and nanorods (obtained by etching nanofin arrays), with InGaN/GaN multi quantum wells embedded as active regions. We find that a suitable choice of the array dimensions leads to a reasonably directed light output and concentration of the optical power in the near field around an activated pixel. As a consequence, the spatial resolution for this type of microscopy should only be limited by the pixel pitch, and no longer by the optical diffraction. Realization of optimized nanoLED arrays has a potential to open new field of chip based superresolution microscopy, making super-high spatial resolution ubiquitously available.

Direct Epitaxial Approach to Achieve a Monolithic On-Chip Integration of a HEMT and a Single Micro-LED with a High-Modulation Bandwidth

Visible light communications (VLC) require III-nitride visible micro-light-emitting diodes (μLEDs) with a high-modulation bandwidth. Such μLEDs need to be driven at a high injection current density on a kA/cm² scale, which is about 2 orders of magnitude higher than those for normal visible LED operation. μLEDs are traditionally fabricated by dry-etching techniques where dry-etching-induced damages are unavoidable, leading to both a substantial reduction in performance and a great challenge to viability at a high injection current density. Furthermore, conventional biasing (which is simply applied across a p-n junction) is good enough for normal LED operation but generates a great challenge for a single μLED, which needs to be modulated at a high injection current density and at a high frequency. In this work, we have proposed a concept for an epitaxial integration and then demonstrated a completely different method that allows us to achieve an epitaxial integration of a single μLED with a diameter of 20 μm and an AlGaN/GaN high-electron-mobility transistor (HEMT), where the emission from a single μLED is modulated by tuning the gate voltage of its HEMT. Furthermore, such a direct epitaxial approach has entirely eliminated any dry-etching-induced damages. As a result, we have demonstrated an epitaxial integration of monolithic on-chip μLED-HEMT with a record modulation bandwidth of 1.2 GHz on industry-compatible c-plane substrates.

Strategically constructed patterned sapphire with silica array to boost substrate performance in GaN-based flip-chip visible light-emitting diodes

A strategically constructed substrate, patterned sapphire with silica array (PSSA), was developed to boost the efficiency of patterned sapphire substrate (PSS) in GaN-based light-emitting diodes (LEDs) application. The light output power of a flip-chip LED on PSSA improved by 16.5% at 120 mA than that of device grown on PSS. The XRD and STEM measurements revealed that the GaN epilayer grown on PSSA had better crystalline quality compared to the epilayer grown on PSS, which was the result of decreased misfit at coalescence boundary in the PSSA case. Moreover, the light extraction efficiency of the flip-chip LED on PSSA was significantly enhanced, benefiting from the small refractive-index contrast between the patterned silica array and air. This small refractive-index contrast also contributed to a more convergent emission pattern for the flip-chip LED on PSSA, as demonstrated by the far-field radiation pattern measurements. The discovery that PSSA could excel at defect suppression and light extraction revealed a new substrate platform for III-nitride optoelectronic devices.

High Modulation Bandwidth of Semipolar (11-22) InGaN/GaN LEDs with Long Wavelength Emission

Visible light communication requires III-nitride LEDs with a high modulation bandwidth but have c-plane limitations. General illumination requires green/yellow III-nitride LEDs with high optical efficiency that are difficult to achieve on c-plane substrates. Micro-LEDs with a low efficiency are used to obtain a high modulation bandwidth. This paper demonstrates a record modulation bandwidth of 540 MHz for our semipolar green LEDs with a broad area. Semipolar yellow and amber LEDs with modulation bandwidths of 350 and 140 MHz, respectively, have also been reported, and are the longest wavelength III-nitride LEDs. These results agree with differential carrier lifetime measurements.

Ultrasmall, Ultracompact and Ultrahigh Efficient InGaN Micro Light Emitting Diodes (μLEDs) with Narrow Spectral Line Width

Augmented reality and visual reality (AR and VR) microdisplays require micro light emitting diodes (μLEDs) with an ultrasmall dimension (≤5 μm), high external quantum efficiency (EQE), and narrow spectral line width. Unfortunately, dry etching which is the most crucial step for the fabrication of μLEDs in current approaches introduces severe damages, which seem to become an insurmountable challenge for achieving ultrasmall μLEDs with high EQE. Furthermore, it is well-known that μLEDs which require InGaN layers as an emitting region naturally exhibit significantly broad spectral line width, which becomes increasingly severe toward long wavelengths such as green. In this paper, we have reported a combination of our selective overgrowth approach developed very recently and epitaxial lattice-matched distributed Bragg reflectors (DBRs) embedded in order to address all these fundamental issues. As a result, our μLEDs with a diameter of 3.6 μm and an interpitch of 2 μm exhibit an ultrahigh EQE of 9% at ∼500 nm. More importantly, the spectral line width of our μLEDs has been significantly reduced down to 25 nm, the narrowest value reported so far for III-nitride green μLEDs.