Novel temperature dependent tensile test of freestanding copper thin film structures

Automated High-Throughput Fatigue Testing of Freestanding Thin Films

Mechanical testing at small length scales has traditionally been resource-intensive due to difficulties with meticulous sample preparation, exacting load alignments, and precision measurements. Microscale fatigue testing can be particularly challenging due to the time-intensive, tedious repetition of single fatigue experiments. To mitigate these challenges, this work presents a new methodology for the high-throughput fatigue testing of thin films at the microscale. This methodology features a microelectromechanical systems-based Si carrier that can support the simultaneous and independent fatigue testing of an array of samples. To demonstrate this new technique, the microscale fatigue behavior of nanocrystalline Al is efficiently characterized via this Si carrier and automated fatigue testing with in situ scanning electron microscopy. This methodology reduces the total testing time by an order of magnitude, and the high-throughput fatigue results highlight the stochastic nature of the microscale fatigue response. This manuscript also discusses how this initial capability can be adapted to accommodate more samples, different materials, new geometries, and other loading modes.

Thin-Film Microtensile-Test Structures for High-Throughput Characterization of Mechanical Properties

A photolithographic process for the rapid fabrication of thin-film tensile-test structures is presented. The process is applicable to various physical vapor deposition techniques and can be used for the combinatorial fabrication of thin-film tensile-test structure materials libraries for the high-throughput characterization of mechanical properties. The functionality of the fabrication process and the feasibility of performing high-quality measurements with these structures are demonstrated with Cu tensile-test structures. In addition, the scalability from unary structures to libraries with compositional variations is demonstrated.

Development of a high-temperature micromechanics stage with a novel temperature measurement approach

The study of mechanical properties of materials at high temperatures at the microstructural length regime requires dedicated setups for testing. Despite the advances in the instrumentation in these setups over the last decade, further optimization is required in order to extend the temperature range well-beyond 600 °C. Particularly, an improvement of the contact temperature measurement is required. A design with a novel approach of temperature measurement with independent tip and sample heating is developed to characterize materials at high temperatures. This design is realized by modifying a displacement controlled room temperature microstraining rig with the addition of two miniature hot stages, one each carrying the sample and indenter tip. The sample reaches temperatures of >600 °C with a 50 W diode laser system. The stages have slots for the working sample as well as a reference sample on both ends for precise temperature measurements, relying on the symmetry of the stage toward the ends. The whole setup is placed inside a custom-made steel chamber, capable of attaining a vacuum of 10^-4 Pa. Alternatively, the apparatus can be operated under environmental conditions by applying various gases. Here, the unique design and its high temperature capabilities will be presented together with the first results of microtension experiments on freestanding copper thin films at 400 °C.

In situ thermomechanical testing methods for micro/nano-scale materials

The advance of micro/nanotechnology in energy-harvesting, micropower, electronic devices, and transducers for automobile and aerospace applications has led to the need for accurate thermomechanical characterization of micro/nano-scale materials to ensure their reliability and performance. This persistent need has driven various efforts to develop innovative experimental techniques that overcome the critical challenges associated with precise mechanical and thermal control of micro/nano-scale specimens during material characterization. Here we review recent progress in the development of thermomechanical testing methods from miniaturized versions of conventional macroscopic test systems to the current state of the art of in situ uniaxial testing capabilities in electron microscopes utilizing either indentation-based microcompression or integrated microsystems. We discuss the major advantages/disadvantages of these methods with respect to specimen size, range of temperature control, ease of experimentation and resolution of the measurements. We also identify key challenges in each method. Finally, we summarize some of the important discoveries that have been made using in situ thermomechanical testing and the exciting research opportunities still to come in micro/nano-scale materials.

The effect of size on the strength of FCC metals at elevated temperatures: annealed copper

As the length scale of sample dimensions is reduced to the micron and sub-micron scales, the strength of various materials has been observed to increase with decreasing size, a fact commonly referred to as the 'sample size effect'. In this work, the influence of temperature on the sample size effect in copper is investigated using in situ microcompression testing at 25, 200 and 400 °C in the SEM on vacuum-annealed copper structures, and the resulting deformed structures were analysed using X-ray μLaue diffraction and scanning electron microscopy. For pillars with sizes between 0.4 and 4 μm, the size effect was measured to be constant with temperature, within the measurement precision, up to half of the melting point of copper. It is expected that the size effect will remain constant with temperature until diffusion-controlled dislocation motion becomes significant at higher temperatures and/or lower strain rates. Furthermore, the annealing treatment of the copper micropillars produced structures which yielded at stresses three times greater than their un-annealed, FIB-machined counterparts.

An ultra-high temperature testing instrument under oxidation environment up to 1800 °C

A new testing instrument was developed to measure the high-temperature constitutive relation and strength of materials under an oxidative environment up to 1800 °C. A high temperature electric resistance furnace was designed to provide a uniform temperature environment for the mechanical testing, and the temperature could vary from room temperature (RT) to 1800 °C. A set of semi-connected grips was designed to reduce the stress. The deformation of the specimen gauge section was measured by a high temperature extensometer. The measured results were acceptable compared with the results from the strain gauge method. Meanwhile, tensile testing of alumina was carried out at RT and 800 °C, and the specimens showed brittle fracture as expected. The obtained Young's modulus was in agreement with the reported value. In addition, tensile experiment of ZrB2-20%SiC ceramic was conducted at 1700 °C and the high-temperature tensile stress-strain curve was first obtained. Large plastic deformation up to 0.46% and the necking phenomenon were observed before the fracture of specimen. This instrument will provide a powerful research tool to study the high temperature mechanical property of materials under oxidation and is benefit for the engineering application of materials in aerospace field.

Elevated temperature, nano-mechanical testing in situ in the scanning electron microscope

A general nano-mechanical test platform capable of performing variable temperature and variable strain rate testing in situ in the scanning electron microscope is described. A variety of test geometries are possible in combination with focused ion beam machining or other fabrication techniques: indentation, micro-compression, cantilever bending, and scratch testing. The system is intrinsically displacement-controlled, which allows it to function directly as a micro-scale thermomechanical test frame. Stable, elevated temperature indentation∕micro-compression requires the indenter tip and the sample to be in thermal equilibrium to prevent thermal displacement drift due to thermal expansion. This is achieved through independent heating and temperature monitoring of both the indenter tip and sample. Furthermore, the apex temperature of the indenter tip is calibrated, which allows it to act as a referenced surface temperature probe during contact. A full description of the system is provided, and the effects of indenter geometry and of radiation on imaging conditions are discussed. The stabilization time and temperature distribution throughout the system as a function of temperature is characterized. The advantages of temperature monitoring and thermal calibration of the indenter tip are illustrated, which include the possibility of local thermal conductivity measurement. Finally, validation results using nanoindentation on fused silica and micro-compression of [100] silicon micro-pillars as a function of temperature up to 500 °C are presented, and procedures and considerations taken for these measurements are discussed. A brittle to ductile transition from fracture to splitting then plastic deformation is directly observed in the SEM for silicon as a function of temperature.