Electromigration and morphological changes in Ag nanostructures

A dynamical model for Brownian molecular motors driven by inelastic electron tunneling

In recent years, several artificial molecular motors driven and controlled by electric currents have been proposed. Similar to Brownian machines, these systems work by turning random inelastic tunneling events into a directional rotation of the molecule. Despite their importance as the ultimate component of future molecular machines, their modeling has not been sufficiently studied. Here, we develop a dynamical model to describe these systems. We illustrate the validity and usefulness of our model by applying it to a well-known molecular motor, showing that the obtained results are consistent with the available experimental data. Moreover, we demonstrate how to use our model to extract some difficult-to-access microscopic parameters. Finally, we include an analysis of the expected effects of current-induced forces (CIFs). Our analysis suggests that, although nonconservative contributions of the CIFs can be important in some scenarios, they do not seem important in the analyzed case. Despite this, the conservative contributions of CIFs could be strong enough to significantly alter the system’s dynamics.

Controllable Melting and Flow of Ag in Self-Formed Amorphous Carbonaceous Shell for Nanointerconnection

Nanointerconnection has been selected as a promising method in the post-Moore era to realize device miniaturization and integration. Even with many advances, the existing nanojoining methods still need further developments to meet the three-dimensional nanostructure construction requirements of the next-generation devices. Here, we proposed an efficient silver (Ag)-filled nanotube fabrication method and realized the controllable melting and ultrafine flow of the encapsulated silver at a subfemtogram (0.83 fg/s) level, which presents broad application prospects in the interconnection of materials in the nanometer or even subnanometer. We coated Ag nanowire with polyvinylpyrrolidone (PVP) to obtain core–shell nanostructures instead of the conventional well-established nanotube filling or direct synthesis technique, thus overcoming obstacles such as low filling rate, discontinuous metalcore, and limited filling length. Electromigration and thermal gradient force were figured out as the dominant forces for the controllable flow of molten silver. The conductive amorphous carbonaceous shell formed by pyrolyzing the insulative PVP layer was also verified by energy dispersive spectroscopy (EDS), which enabled the continued outflow of the internal Ag. Finally, a reconfigurable nanointerconnection experiment was implemented, which opens the way for interconnection error correction in the fabrication of nanoelectronic devices.

Current-induced forces in single-resonance systems

In recent years, there has been an increasing interest in nanoelectromechanical devices, current-driven quantum machines, and the mechanical effects of electric currents on nanoscale conductors. Here, we carry out a thorough study of the current-induced forces and the electronic friction of systems whose electronic effective Hamiltonian can be described by an archetypal model, a single energy level coupled to two reservoirs. Our results can help better understand the general conditions that maximize the performance of different devices modeled as a quantum dot coupled to two electronic reservoirs. Additionally, they can be useful to rationalize the role of current-induced forces in the mechanical deformation of one-dimensional conductors.

TEM Nanostructural Investigation of Ag-Conductive Filaments in Polycrystalline ZnO-Based Resistive Switching Devices

Memristive devices based on a resistive switching mechanism are considered very promising for nonvolatile memory and unconventional computing applications, even though many details of the switching mechanisms are not yet fully understood. Here, we report a nanostructural study by means of high-resolution transmission electron microscopy and spectroscopy techniques of a Ag/ZnO/Pt memristive device. To ease the localization of the filament position for its characterization, we propose to use the guiding effect of regular perturbation arrays obtained by FIB technology to assist the filament formation. HRTEM and EDX were used to identify the composition and crystalline structure of the so-obtained conductive filaments and surrounding regions. It was determined that the conducting paths are composed mainly of monocrystalline Ag, which remains polycrystalline in some circumstances, including the zone where the switching occurs and at secondary filaments created at the grain boundaries of the polycrystalline ZnO matrix. We also observed that the ZnO matrix shows a degraded quality in the switching zone, while it remains unaltered in the rest of the memristive device.

Electromigration-induced directional steps towards the formation of single atomic Ag contacts

Even though there have been many experimental attempts and theoretical approaches to understand the process of electromigration (EM), it has not been quantitatively understood for ultrathin structures and at grain boundaries. Nevertheless, we showed recently that it can be used reliably for the formation of single atomic point contacts after careful pre-structuring of the initial Ag nanostructures. The process of formation of nanocontacts by EM down to a single-atom point contact was investigated for ultrathin (5 nm) Ag structures at 100 K by measuring the conductance as a function of the time during EM. In this paper, we compare the process of thinning by EM of structures with constrictions below the average grain size of Ag layers (15 nm) with that of structures with much larger initial constrictions of around 150 nm having multiple grains at the centre constriction prior to the formation of a point contact. Even though clear morphological differences exist between both types of structures, quantized conductance plateaus showing the formation of single point contacts have been observed for both. Here we put emphasis on the thinning process by EM, just before a point contact is formed. To understand this thinning process, the semi-classical regime before the contact reaches the quantum regime was analyzed in detail. For this purpose, we used experimental conductance histograms in the range between 2G ₀ and 15G ₀ and their corresponding Fourier transforms (FTs). The FT analysis of the conductance histograms exhibits a clear preference for thinning along the [100] direction. Using well-established models, both atom-by-atom steps and ranges of stability, presumably caused by electronic shell effects, can be discriminated. Although the directional motion of atoms during EM leads to specific properties such as the instabilities mentioned, similarities to mechanically opened contacts with respect to cross-sectional stability were found.

Current-Induced Changes of Surface Morphology in Printed Ag Thin Wires

Current-induced changes of surface morphology in printed Ag thin wires were investigated by current stressing tests and numerical simulation. The samples were printed Ag thin wires on a flexible substrate with input and output pads. Different experimentalresults were obtainedthroughchangingthe current density after current supply and the mechanism of those phenomena were investigated by numerical simulations based on the method of atomic flux divergence. Good agreement between the simulations and experimental results was reached. It was found that electromigration was the main factor that caused the change of the surface morphology. The contribution of thermal migration can be ignored, and the Joule heating lead by the supplied current had a very significant accelerating effect on electromigration. Guidelines for effectively changing the Ag thin wire surface through providing predetermined current density was proposed, which were expected to be useful for improving the electrical reliability and lifetime of printed Ag thin wires in flexible electronic devices.

Reliability issues of lead-free solder joints in electronic devices

Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electronic devices originates during the packaging process, mostly due to the failure of solder joints. With the improvement of environmental protection awareness, lead-free solder joints have become a hot issue in recent years. This paper reviews the research progress on the reliability of lead-free solder joints and discusses the influence of temperature, vibration, tin whisker and electromigration on the reliability of solder joints. In addition, the measures to improve the reliability of solder joints are analyzed according to the problems of solder joints themselves, which provides a further theoretical basis for the study of the reliability of solder joints of electronic products in service.