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Pinheiro T, Morais M, Silvestre S, Carlos E, Coelho J, Almeida HV, Barquinha P, Fortunato E, Martins R. Direct Laser Writing: From Materials Synthesis and Conversion to Electronic Device Processing. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024:e2402014. [PMID: 38551106 DOI: 10.1002/adma.202402014] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/06/2024] [Revised: 03/18/2024] [Indexed: 04/25/2024]
Abstract
Direct Laser Writing (DLW) has been increasingly selected as a microfabrication route for efficient, cost-effective, high-resolution material synthesis and conversion. Concurrently, lasers participate in the patterning and assembly of functional geometries in several fields of application, of which electronics stand out. In this review, recent advances and strategies based on DLW for electronics microfabrication are surveyed and outlined, based on laser material growth strategies. First, the main DLW parameters influencing material synthesis and transformation mechanisms are summarized, aimed at selective, tailored writing of conductive and semiconducting materials. Additive and transformative DLW processing mechanisms are discussed, to open space to explore several categories of materials directly synthesized or transformed for electronics microfabrication. These include metallic conductors, metal oxides, transition metal chalcogenides and carbides, laser-induced graphene, and their mixtures. By accessing a wide range of material types, DLW-based electronic applications are explored, including processing components, energy harvesting and storage, sensing, and bioelectronics. The expanded capability of lasers to participate in multiple fabrication steps at different implementation levels, from material engineering to device processing, indicates their future applicability to next-generation electronics, where more accessible, green microfabrication approaches integrate lasers as comprehensive tools.
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Affiliation(s)
- Tomás Pinheiro
- i3N|CENIMAT, Department of Materials Science, NOVA School of Science and Technology and CEMOP/UNINOVA, Campus de Caparica, Caparica, 2829-516, Portugal
| | - Maria Morais
- i3N|CENIMAT, Department of Materials Science, NOVA School of Science and Technology and CEMOP/UNINOVA, Campus de Caparica, Caparica, 2829-516, Portugal
| | - Sara Silvestre
- i3N|CENIMAT, Department of Materials Science, NOVA School of Science and Technology and CEMOP/UNINOVA, Campus de Caparica, Caparica, 2829-516, Portugal
| | - Emanuel Carlos
- i3N|CENIMAT, Department of Materials Science, NOVA School of Science and Technology and CEMOP/UNINOVA, Campus de Caparica, Caparica, 2829-516, Portugal
| | - João Coelho
- i3N|CENIMAT, Department of Materials Science, NOVA School of Science and Technology and CEMOP/UNINOVA, Campus de Caparica, Caparica, 2829-516, Portugal
| | - Henrique V Almeida
- i3N|CENIMAT, Department of Materials Science, NOVA School of Science and Technology and CEMOP/UNINOVA, Campus de Caparica, Caparica, 2829-516, Portugal
| | - Pedro Barquinha
- i3N|CENIMAT, Department of Materials Science, NOVA School of Science and Technology and CEMOP/UNINOVA, Campus de Caparica, Caparica, 2829-516, Portugal
| | - Elvira Fortunato
- i3N|CENIMAT, Department of Materials Science, NOVA School of Science and Technology and CEMOP/UNINOVA, Campus de Caparica, Caparica, 2829-516, Portugal
| | - Rodrigo Martins
- i3N|CENIMAT, Department of Materials Science, NOVA School of Science and Technology and CEMOP/UNINOVA, Campus de Caparica, Caparica, 2829-516, Portugal
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Zhao B, Gao X, Pan J, Liu H, Zhao P. Investigation of Gallium Arsenide Deformation Anisotropy during Nanopolishing via Molecular Dynamics Simulation. MICROMACHINES 2024; 15:110. [PMID: 38258229 PMCID: PMC10821295 DOI: 10.3390/mi15010110] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/09/2023] [Revised: 12/27/2023] [Accepted: 12/28/2023] [Indexed: 01/24/2024]
Abstract
Crystal orientation significantly influences deformation during nanopolishing due to crystal anisotropy. In this work, molecular dynamics (MD) simulations were employed to examine the process of surface generation and subsurface damage. We conducted analyses of surface morphology, mechanical response, and amorphization in various crystal orientations to elucidate the impact of crystal orientation on deformation and amorphization severity. Additionally, we investigated the concentration of residual stress and temperature. This work unveils the underlying deformation mechanism and enhances our comprehension of the anisotropic deformation in gallium arsenide during the nanogrinding process.
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Affiliation(s)
- Bo Zhao
- Center of Ultra-Precision Optoelectronic Instrumentation Engineering, Harbin Institute of Technology, Harbin 150001, China; (B.Z.); (J.P.); (H.L.); (P.Z.)
- Key Lab of Ultra-Precision Intelligent Instrumentation, Ministry of Industry Information Technology, Harbin 150080, China
| | - Xifeng Gao
- Center of Ultra-Precision Optoelectronic Instrumentation Engineering, Harbin Institute of Technology, Harbin 150001, China; (B.Z.); (J.P.); (H.L.); (P.Z.)
- Key Lab of Ultra-Precision Intelligent Instrumentation, Ministry of Industry Information Technology, Harbin 150080, China
| | - Jiansheng Pan
- Center of Ultra-Precision Optoelectronic Instrumentation Engineering, Harbin Institute of Technology, Harbin 150001, China; (B.Z.); (J.P.); (H.L.); (P.Z.)
- Key Lab of Ultra-Precision Intelligent Instrumentation, Ministry of Industry Information Technology, Harbin 150080, China
| | - Huan Liu
- Center of Ultra-Precision Optoelectronic Instrumentation Engineering, Harbin Institute of Technology, Harbin 150001, China; (B.Z.); (J.P.); (H.L.); (P.Z.)
- Key Lab of Ultra-Precision Intelligent Instrumentation, Ministry of Industry Information Technology, Harbin 150080, China
| | - Pengyue Zhao
- Center of Ultra-Precision Optoelectronic Instrumentation Engineering, Harbin Institute of Technology, Harbin 150001, China; (B.Z.); (J.P.); (H.L.); (P.Z.)
- Key Lab of Ultra-Precision Intelligent Instrumentation, Ministry of Industry Information Technology, Harbin 150080, China
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Zeng X, He P, Hu M, Zhao W, Chen H, Liu L, Sun J, Yang J. Copper inks for printed electronics: a review. NANOSCALE 2022; 14:16003-16032. [PMID: 36301077 DOI: 10.1039/d2nr03990g] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
Abstract
Conductive inks have attracted tremendous attention owing to their adaptability and the convenient large-scale fabrication. As a new type of conductive ink, copper-based ink is considered to be one of the best candidate materials for the conductive layer in flexible printed electronics owing to its high conductivity and low price, and suitability for large-scale manufacturing processes. Recently, tremendous progress has been made in the preparation of cooper-based inks for electronic applications, but the antioxidation ability of copper-based nanomaterials within inks or films, that is, long-term reliability upon exposure to water and oxygen, still needs more exploration. In this review, we present a comprehensive overview of copper inks for printed electronics from ink preparation, printing methods and sintering, to antioxidation strategies and electronic applications. The review begins with an overview of the development of copper inks, followed by a demonstration of various preparation methods for copper inks. Then, the diverse printing techniques and post-annealing strategies used to fabricate conductive copper patterns are discussed. In addition, antioxidation strategies utilized to stabilize the mechanical and electrical properties of copper nanomaterials are summarized. Then the diverse applications of copper inks for electronic devices, such as transparent conductive electrodes, sensors, optoelectronic devices, and thin-film transistors, are discussed. Finally, the future development of copper-based inks and the challenges of their application in printed electronics are discussed.
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Affiliation(s)
- Xianghui Zeng
- Hunan Key Laboratory for Super-Microstructure and Ultrafast Process, School of Physics and Electronics, Central South University, Changsha, 410083, Hunan, People's Republic of China.
| | - Pei He
- Hunan Key Laboratory for Super-Microstructure and Ultrafast Process, School of Physics and Electronics, Central South University, Changsha, 410083, Hunan, People's Republic of China.
| | - Minglu Hu
- Hunan Key Laboratory for Super-Microstructure and Ultrafast Process, School of Physics and Electronics, Central South University, Changsha, 410083, Hunan, People's Republic of China.
| | - Weikai Zhao
- Hunan Key Laboratory for Super-Microstructure and Ultrafast Process, School of Physics and Electronics, Central South University, Changsha, 410083, Hunan, People's Republic of China.
| | - Huitong Chen
- Hunan Key Laboratory for Super-Microstructure and Ultrafast Process, School of Physics and Electronics, Central South University, Changsha, 410083, Hunan, People's Republic of China.
| | - Longhui Liu
- Hunan Key Laboratory for Super-Microstructure and Ultrafast Process, School of Physics and Electronics, Central South University, Changsha, 410083, Hunan, People's Republic of China.
| | - Jia Sun
- Hunan Key Laboratory for Super-Microstructure and Ultrafast Process, School of Physics and Electronics, Central South University, Changsha, 410083, Hunan, People's Republic of China.
| | - Junliang Yang
- Hunan Key Laboratory for Super-Microstructure and Ultrafast Process, School of Physics and Electronics, Central South University, Changsha, 410083, Hunan, People's Republic of China.
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Hwang E, Hong J, Yoon J, Hong S. Direct Writing of Functional Layer by Selective Laser Sintering of Nanoparticles for Emerging Applications: A Review. MATERIALS (BASEL, SWITZERLAND) 2022; 15:6006. [PMID: 36079386 PMCID: PMC9457495 DOI: 10.3390/ma15176006] [Citation(s) in RCA: 4] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 08/10/2022] [Revised: 08/24/2022] [Accepted: 08/28/2022] [Indexed: 06/15/2023]
Abstract
Selective laser sintering of nanoparticles enables the direct and rapid formation of a functional layer even on heat-sensitive flexible and stretchable substrates, and is rising as a pioneering fabrication technology for future-oriented applications. To date, laser sintering has been successfully applied to various target nanomaterials including a wide range of metal and metal-oxide nanoparticles, and extensive investigation of relevant experimental schemes have not only reduced the minimum feature size but also have further expanded the scalability of the process. In the beginning, the selective laser sintering process was regarded as an alternative method to conventional manufacturing processes, but recent studies have shown that the unique characteristics of the laser-sintered layer may improve device performance or even enable novel functionalities which were not achievable using conventional fabrication techniques. In this regard, we summarize the current developmental status of the selective laser sintering technique for nanoparticles, affording special attention to recent emerging applications that adopt the laser sintering scheme.
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Conductive coatings based on concentrated silver organosols stabilized with Tergitol NP4/Aerosol OT mixture. Colloids Surf A Physicochem Eng Asp 2022. [DOI: 10.1016/j.colsurfa.2022.129211] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/24/2022]
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