A Reduced-Wire ICE Catheter ASIC With Tx Beamforming and Rx Time-Division Multiplexing

A 1.11 mm2 IVUS SoC With -Range Plane Wave Transmit Beamforming at 40 MHz

Intravascular ultrasound (IVUS) imaging catheters are significant tools for cardiovascular interventions, and their use can be expanded by realizing IVUS imaging guidewires and microcatheters. The miniaturization of these devices creates challenges in SNR due to the need for higher frequencies to provide adequate resolution. An integrated IVUS system with transmit beamforming can mitigate these limitations. This work presents the first practical highly integrated system-on-a-chip (SoC) with plane wave transmit beamforming at 40 MHz for IVUS on guidewire or microcatheters. The front-end circuitry has a 20-channel ultrasound transmitter (Tx) and receiver (Rx) array interfaced with a capacitive micromachined ultrasound transducer (CMUT) array. During each firing, all 20 Tx are excited with the same analog delay with respect to each other, which can be continuously adjusted between 0 and 10 ns in two directions, generating a steerable plane wave in a range of +/-50 for a phased array at 40 MHz. The unit delays are generated via a voltage-controlled delay line (VCDL), which only needs two external controls, one tuning the unit delay and the other determining the steering direction. The SoC is fabricated using a 180-nm high-voltage (HV) CMOS process and features a slender active area of 0.3 mm 3.7 mm. The proposed SoC consumes 31.3 mW during the receiving mode. The beamformer's functionality and the SoC's overall performance were validated through acoustic characterization and imaging experiments.

High-Frequency, 2-mm-Diameter Forward-Viewing 2-D Array for 3-D Intracoronary Blood Flow Imaging

Coronary artery disease (CAD) is one of the leading causes of death globally. Currently, diagnosis and intervention in CAD are typically performed via minimally invasive cardiac catheterization procedures. Using current diagnostic technology, such as angiography and fractional flow reserve (FFR), interventional cardiologists must decide which patients require intervention and which can be deferred; 10% of patients with stable CAD are incorrectly deferred using current diagnostic best practices. By developing a forward-viewing intravascular ultrasound (FV-IVUS) 2-D array capable of simultaneously evaluating morphology, hemodynamics, and plaque composition, physicians would be better able to stratify risk of major adverse cardiac events in patients with intermediate stenosis. For this application, a forward-viewing, 16-MHz 2-D array transducer was designed and fabricated. A 2-mm-diameter aperture consisting of 140 elements, with element dimensions of 98×98×70 μ m ( w×h×t ) and a nominal interelement spacing of 120 μ m, was designed for this application based on simulations. The acoustic stack for this array was developed with a designed center frequency of 16 MHz. A novel via-less interconnect was developed to enable electrical connections to fan-out from a 140-element 2-D array with 120- μ m interelement spacing. The fabricated array transducer had 96/140 functioning elements operating at a center frequency of 16 MHz with a -6-dB fractional bandwidth of 62% ± 7 %. Single-element SNR was 23 ± 3 dB, and the measured electrical crosstalk was - 33 ± 3 dB. In imaging experiments, the measured lateral resolution was 0.231 mm and the measured axial resolution was 0.244 mm at a depth of 5 mm. Finally, the transducer was used to perform 3-D B-mode imaging of a 3-mm-diameter spring and 3-D B-mode and power Doppler imaging of a tissue-mimicking phantom.

Design of Preamplifier for Ultrasound Transducers

In diagnostic ultrasound imaging applications, preamplifiers are used as first-stage analog front-end amplifiers for ultrasound transducers because they can amplify weak acoustic signals generated directly by ultrasound transducers. For emerging diagnostic ultrasound imaging applications, different types of preamplifiers with specific design parameters and circuit topologies have been developed, depending on the types of the ultrasound transducer. In particular, the design parameters of the preamplifier, such as the gain, bandwidth, input- or output-referred noise components, and power consumption, have a tradeoff relationship. Guidelines on the detailed design concept, design parameters, and specific circuit design techniques of the preamplifier used for ultrasound transducers are outlined in this paper, aiming to help circuit designers and academic researchers optimize the performance of ultrasound transducers used in the diagnostic ultrasound imaging applications for research directions.

Application of Low Temperature Processed 0-3 Composite Piezoelectric Thick Films in Flexible, Non-planar, High Frequency Ultrasonic Devices

Low-temperature, flexible, 0-3 composite piezoelectric materials can decrease the size, cost, and complexity of high-frequency acoustic devices on temperature sensitive substrates such as those in catheter based ultrasonic devices and acoustooptic sensors. In this paper, the application of low-temperature 0-3 connected composite thick films in flexible, non-planar, high frequency ultrasonic devices is reported. A flexible high-frequency ultrasound transducer and an acousto-optic radio-frequency (RF) field sensor are demonstrated utilizing PZT-based composite thick films. Flexible composite films have been fabricated with thicknesses between 20-100μm utilizing screen-printing, stencil-printing, and dip-coating techniques. Composite films' piezoelectric d33 coefficient is measured, with results between 35-43 pC/N. Ultrasonic transducers utilizing these films demonstrate broadband acoustic response. A composite transducer is fabricated on flexible polyimide and wrapped around a 3mm catheter. Pulse-echo experiments demonstrate viability of these films as both as an actuator and a sensor in flexible devices. The composite material is further dip-coated onto an optical fiber Bragg grating to form a flexible acousto-optic RF field sensor. The sensor demonstrates RF field sensing in the 20-130 MHz range. The results from these experiments indicate significant potential for future flexible, high frequency ultrasonic devices utilizing low temperature 0-3 composite piezoelectric materials on temperature sensitive substrates.

Integrated Hybrid Sub-Aperture Beamforming and Time-Division Multiplexing for Massive Readout in Ultrasound Imaging

This paper demonstrates hybrid sub-aperture beamforming (SAB) with time-division multiplexing (TDM) for massive interconnect reduction in ultrasound imaging systems. A single-chip front-end system prototype has been fabricated in 180-nm HV BCD technology that combines 5×1 SAB with 8×1 TDM to efficiently reduce the number of receive signal interconnects by a factor of 40. The system includes on-chip high-voltage (HV) pulsers capable of generating unipolar pulses up to 70 V in transmit (TX) mode. The receiver (RX) chain consists of a T/R switch, a variable-gain low-noise amplifier (VG-LNA) with 4-step gain control (15-32 dB) for time-gain compensation followed by a programmable switched-capacitor analog delay-and-sum beamformer. The proof-of-concept prototype operates at a 200-MHz clock frequency and the SAB provides 32-step fine delays with a maximum delay of 310 ns corresponding to better than λ/20 delay quantization at 5 MHz. With these specifications, the SAB is capable of beam steering from 0 ° to 45 ° for a 5-element subarray with 150-micron pitch ( λ/2), providing a near-ideal phased array imaging performance. The sub-aperture beamformer is followed by the TDM system where each of the 8 channels is sampled at a rate of 25 MS/s after an anti-aliasing bandpass filter. The full functionality of the prototype chip is validated through electrical and acoustic measurements on a 1-D capacitive micromachined ultrasonic transducer (CMUT) array designed for intracardiac echocardiography (ICE).

Dependence of Temperature Rise on the Position of Catheters and Implants Power Sources Due to the Heat Transfer into the Blood Flow

This work provides a numerical analysis of heat transfer from medical devices such as catheters and implants to the blood flow by considering the relative position of such power sources to the vessel wall. We have used COMSOL Multiphysics® software to simulate the heat transfer in the blood flow, using the finite element method and Carreau-–Yasuda fluid model (a non-Newtonian model for blood flow). The location of the power source is changed (from the center to near the wall) in the blood vessel with small steps, while the blood flow takes different velocities. The numerical simulations show that when the catheter/implant approaches the vessel wall, the temperature increases linearly for ~90% of the radial displacement from the centerline position to the vessel wall, while for the last 10% of the radial displacement, the temperature increases exponentially. As a result, the temperature is increased significantly, when changing the position of the catheter/implant from the centerline to the area adjacent to the vessel wall.

Circuits on miniaturized ultrasound imaging system-on-a-chip: a review

Trends of medical system move from a traditional in-person visit to virtual healthcare increases demands on point-of-care devices. Because ultrasound (US) is non-invasive, the demands highlight US imaging among other imaging modalities. Thanks to the development of US transducer technology, miniaturized US with application-specific integrated circuits (ASIC) have been researched. For example, applications that require small aperture sizes such as intravascular US (IVUS) and intra-cardiac echocardiography (ICE) require integration of system-on-a-chip (SoC) on the transducer. This paper reviews circuit techniques on the transmitter (TX) and receiver (RX) of the US imaging system. As TX circuits, pulser, T/RX switch, TX beamformer, and power management circuits are discussed. State-of-the-art transducer modeling, pre-amplifier, time-gain compensation, RX beamformer, quadrature sampler, and output driver are introduced as RX circuits.

An RX AFE With Programmable BP Filter and Digitization for Ultrasound Harmonic Imaging

This paper presents a front-end integrated circuit for ultrasound (US) harmonic imaging, interfacing to a one-dimensional capacitive micromachined ultrasonic transducer (CMUT). It contains a complete ultrasound receiving chain, from analog front-end (AFE) to gigabit/s data link. A two-stage self-biased inverter-based transimpedance amplifier (TIA) is proposed in this work to improve tradeoffs between power, noise, and linearity at the first stage. To improve harmonic imaging performance, the design is further equipped with a 4[Formula: see text]-order highly programmable bandpass filter, which has a tunable bandwidth from 2 MHz to 15 MHz. An 8 b 80 MS/s SAR ADC digitizes the signal, which is further encoded and serialized into an LVDS data link, enabling a reduction in the number of output cables for future systems with multiple ADCs. The design is realized in a 40 nm CMOS technology. Electrical measurements show it consumes 2.9 mW for the AFE and 2.1 mW for the ADC and digital blocks. Its overall dynamic range varies from 61 dB to 69 dB, depending on the reception bandwidth. The imaging capability of this design is further demonstrated in a US transmission and reception imaging system. The acoustic measurements prove successful ultrasound harmonic acquisition, where the on-chip bandpass filter can improve the lateral resolution by more than 30%.

Integrated Circuits for Medical Ultrasound Applications: Imaging and Beyond

Medical ultrasound has become a crucial part of modern society and continues to play a vital role in the diagnosis and treatment of illnesses. Over the past decades, the development of medical ultrasound has seen extraordinary progress as a result of the tremendous research advances in microelectronics, transducer technology and signal processing algorithms. However, medical ultrasound still faces many challenges including power-efficient driving of transducers, low-noise recording of ultrasound echoes, effective beamforming in a non-linear, high-attenuation medium (human tissues) and reduced overall form factor. This paper provides a comprehensive review of the design of integrated circuits for medical ultrasound applications. The most important and ubiquitous modules in a medical ultrasound system are addressed, i) transducer driving circuit, ii) low-noise amplifier, iii) beamforming circuit and iv) analog-digital converter. Within each ultrasound module, some representative research highlights are described followed by a comparison of the state-of-the-art. This paper concludes with a discussion and recommendations for future research directions.

Analysis of Negative Capacitance-Based Broadband Impedance Matching for CMUTs

Tight integration of capacitive micromachined ultrasonic transducer (CMUT) arrays with integrated circuits can make active impedance matching feasible for practical imaging devices. In this article, negative capacitance-based impedance matching for CMUTs is investigated. Simple equivalent circuit model-based calculations show the potential of negative capacitance matching for improving the bandwidth along with electrical power transfer and acoustic reflectivity, but the model has limitations especially for acoustic reflectivity evaluation. For more realistic results, an experimentally validated CMUT array model is applied to a small 1-D CMUT array operating in the 5-15 MHz range. The results highlight the difference between electrical power transfer and acoustic reflectivity as well as the tradeoffs in signal-to-noise ratio (SNR). According to the results, ideal negative capacitance termination matched to the CMUT capacitance provides the broadest bandwidth and highest SNR if acoustic or electrical reflections are of no concern. On the other hand, negative capacitance and resistance matching to minimize acoustic reflectivity provides both lower reflection and closer to ideal SNR as compared with electrical power matching. It is observed that acoustic matching also reduces acoustic crosstalk and improves array uniformity. While several challenges for integrated circuit implementation are present, negative capacitance-based impedance matching can be a viable broadband active impedance matching method for CMUTs operating in conventional and collapsed mode as well as other ultrasound transducers with mainly capacitive impedance.

A Wearable Ultrasonic Neurostimulator-Part II: A 2D CMUT Phased Array System With a Flip-Chip Bonded ASIC

A 2D ultrasonic array is the ultimate form of a focused ultrasonic system, which enables electronically focusing beams in a 3D space. A 2D array is also a versatile tool for various applications such as 3D imaging, high-intensity focused ultrasound, particle manipulation, and pattern generation. However, building a 2D system involves complicated technologies: fabricating a 2D transducer array, developing a pitch-matched ASIC, and interconnecting the transducer and the ASIC. Previously, we successfully demonstrated 2D capacitive micromachined ultrasonic transducer (CMUT) arrays using various fabrication technologies. In this paper, we present a 2D ultrasonic transmit phased array based on a 32 × 32 CMUT array flip-chip bonded to a pitch-matched pulser ASIC for ultrasonic neuromodulation. The ASIC consists of 32 × 32 unipolar high-voltage (HV) pulsers, each of which occupies an area of 250 μm × 250 μm. The phase of each pulser output is individually programmable with a resolution of 1/f_C/16, where f_C is less than 10 MHz. This enables the fine granular control of a focus. The ASIC was fabricated in the TSMC 0.18- μm HV BCD process within an area of 9.8 mm × 9.8 mm, followed by a wafer-level solder bumping process. After flip-chip bonding an ASIC and a CMUT array, we identified shorted elements in the CMUT array using the built-in test function in the ASIC, which took approximately 9 minutes to scan the entire 32 × 32 array. A compact-form-factor wireless neural stimulator system-only requiring a connected 15-V DC power supply-was also developed, integrating a power management unit, a clock generator, and a Bluetooth Low-Energy enabled microcontroller. The focusing and steering capability of the system in a 3D space is demonstrated, while achieving a spatial-peak pulse-average intensity ( I_SPPA) of 12.4 and 33.1 W/ cm²; and a 3-dB focal volume of 0.2 and 0.05 mm³-at a depth of 5 mm-at 2 and 3.4 MHz, respectively. We also characterized transmission of ultrasound through a mouse skull and compensated the phase distortion due to the skull by using the programmable phase-delay function in the ASIC, achieving 10% improvement in pressure and a tighter focus. Finally, we demonstrated a ultrasonic arbitrary pattern generation on a 5 mm × 5 mm plane at a depth of 5 mm.

A Wearable Ultrasonic Neurostimulator - Part I: A 1D CMUT Phased Array System for Chronic Implantation in Small Animals

In this work, we present a wireless ultrasonic neurostimulator, aiming at a truly wearable device for brain stimulation in small behaving animals. A 1D 5-MHz capacitive micromachined ultrasonic transducer (CMUT) array is adopted to implement a head-mounted stimulation device. A companion ASIC with integrated 16-channel high-voltage (60-V) pulsers was designed to drive the 16-element CMUT array. The ASIC can generate excitation signals with element-wise programmable phases and amplitudes: 1) programmable sixteen phase delays enable electrical beam focusing and steering, and 2) four scalable amplitude levels, implemented with a symmetric pulse-width-modulation technique, are sufficient to suppress unwanted sidelobes (apodization). The ASIC was fabricated in the TSMC 0.18- μm HV BCD process within a die size of 2.5 × 2.5 mm². To realize a completely wearable system, the system is partitioned into two parts for weight distribution: 1) a head unit (17 mg) with the CMUT array, 2) a backpack unit (19.7 g) that includes electronics such as the ASIC, a power management unit, a wireless module, and a battery. Hydrophone-based acoustic measurements were performed to demonstrate the focusing and beam steering capability of the proposed system. Also, we achieved a peak-to-peak pressure of 2.1 MPa, which corresponds to a spatial peak pulse average intensity ( I_SPPA) of 33.5 W/cm², with a lateral full width at half maximum (FWHM) of 0.6 mm at a depth of 3.5 mm.

Thermal Analysis of Heat Transfer from Catheters and Implantable Devices to the Blood Flow

Implantable devices, ultrasound imaging catheters, and ablation catheters (such as renal denervation catheters) are biomedical instruments that generate heat in the body. The generated heat can be harmful if the body temperature exceeds the limit of almost 315 K. This paper presents a heat-transfer model and analysis, to evaluate the temperature rise in human blood due to the power loss of medical catheters and implantable devices. The dynamic of the heat transfer is modeled for the blood vessel, at different blood flow velocities. The physics and governing equations of the heat transfer from the implanted energy source to the blood and temperature rise are expressed by developing a Non-Newtonian Carreau–Yasuda fluid model. We used a Finite Element method to solve the governing equations of the established model, considering the boundary conditions and average blood flow velocities of 0–1.4 m/s for the flow of the blood passing over the implanted power source. The results revealed a maximum allowable heat flux of 7500 and 15,000 W/m² for the blood flow velocities of 0 and 1.4 m/s, respectively. The rise of temperature around the implant or tip of the catheter is slower and disappeared gradually with the blood flow, which allows a higher level of heat flux to be generated. The results of this analysis are concluded in the equation/correlation T=310+H3000(1+e−7V), to estimate and predict the temperature changes as a function of heat flux, H, and the blood flow velocity, V, at the implant/catheter location.

Overview of Ultrasound Detection Technologies for Photoacoustic Imaging

Ultrasound detection is one of the major components of photoacoustic imaging systems. Advancement in ultrasound transducer technology has a significant impact on the translation of photoacoustic imaging to the clinic. Here, we present an overview on various ultrasound transducer technologies including conventional piezoelectric and micromachined transducers, as well as optical ultrasound detection technology. We explain the core components of each technology, their working principle, and describe their manufacturing process. We then quantitatively compare their performance when they are used in the receive mode of a photoacoustic imaging system.

Advances in Capacitive Micromachined Ultrasonic Transducers

Capacitive micromachined ultrasonic transducer (CMUT) technology has enjoyed rapid development in the last decade. Advancements both in fabrication and integration, coupled with improved modelling, has enabled CMUTs to make their way into mainstream ultrasound imaging systems and find commercial success. In this review paper, we touch upon recent advancements in CMUT technology at all levels of abstraction; modeling, fabrication, integration, and applications. Regarding applications, we discuss future trends for CMUTs and their impact within the broad field of biomedical imaging.