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Xu S, Yang R, Yang Y, Zhang Y. Shape-morphing bioelectronic devices. MATERIALS HORIZONS 2025. [PMID: 40391509 DOI: 10.1039/d5mh00453e] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/21/2025]
Abstract
Shape-morphing bioelectronic devices, which can actively transform their geometric configurations in response to external stimuli (e.g., light, heat, electricity, and magnetic fields), have enabled many unique applications in different areas, ranging from human-machine interfaces to biomedical applications. These devices can not only realize in vivo deformations to execute specific tasks, form conformal contacts with target organs for real-time monitoring, and dynamically reshape their structures to adjust functional properties, but also assist users in daily activities through physical interactions. In this review, we provide a comprehensive overview of recent advances in shape-morphing bioelectronic devices, covering their fundamental working principles, representative deformation modes, and advanced manufacturing methodologies. Then, a broad range of practical applications of shape-morphing bioelectronics are summarized, including electromagnetic devices, optoelectronic devices, biological devices, biomedical devices, and haptic interfaces. Finally, we discuss key challenges and emerging opportunities in this rapidly evolving field, providing insights into future research directions and potential breakthroughs.
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Affiliation(s)
- Shiwei Xu
- Mechano-X Institute, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China.
- State Key Laboratory of Flexible Electronics Technology, Tsinghua University, 100084 Beijing, P. R. China
| | - Ruoxi Yang
- Mechano-X Institute, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China.
- State Key Laboratory of Flexible Electronics Technology, Tsinghua University, 100084 Beijing, P. R. China
| | - Youzhou Yang
- Mechano-X Institute, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China.
- State Key Laboratory of Flexible Electronics Technology, Tsinghua University, 100084 Beijing, P. R. China
| | - Yihui Zhang
- Mechano-X Institute, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China.
- State Key Laboratory of Flexible Electronics Technology, Tsinghua University, 100084 Beijing, P. R. China
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2
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Wang Q, Wang Z, Yang Y, Zhang C, Han M, Wang W, Jin Y. A stretchable frequency reconfigurable antenna controlled by compressive buckling for W-band applications. MICROSYSTEMS & NANOENGINEERING 2025; 11:86. [PMID: 40360479 PMCID: PMC12075831 DOI: 10.1038/s41378-025-00890-x] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 10/28/2024] [Revised: 01/18/2025] [Accepted: 02/07/2025] [Indexed: 05/15/2025]
Abstract
Reconfigurable antennas have attracted significant interest because of their ability to dynamically adjust radiation properties, such as operating frequencies, thereby managing the congested frequency spectrum efficiently and minimizing crosstalk. However, existing approaches utilizing switches or advanced materials are limited by their discrete tunability, high static power consumption, or material degradation for long-term usage. In this study, we present a W-band frequency reconfigurable antenna that undergoes a geometric transformation from a two-dimensional (2D) precursor, selectively bonded to a prestretched elastomeric substrate, into a desired 3D layout through controlled compressive buckling. Modeling the buckling process using combined mechanics-electromagnetic finite element analysis (FEA) allows for the rational design of the antenna with desired strains applied to the substrate. By releasing the substrate at varying compression ratios, the antenna reshapes into different 3D configurations, enabling continuous frequency reconfigurability. Simulation and experimental results demonstrate that the antenna's resonant frequency can be tuned from 77 GHz in its 2D state to 94 GHz in its 3D state in a folded-dipole-like design.
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Affiliation(s)
- Qi Wang
- Peking University Shenzhen Graduate School, Peking University, Shenzhen, China
- School of Integrated Circuits, Peking University, Beijing, China
| | - Zetian Wang
- School of Integrated Circuits, Peking University, Beijing, China
| | - Yang Yang
- Peking University Shenzhen Graduate School, Peking University, Shenzhen, China
- School of Integrated Circuits, Peking University, Beijing, China
| | - Chi Zhang
- School of Integrated Circuits, Peking University, Beijing, China
- National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Beijing, China
- Beijing Advanced Innovation Center for Integrated Circuits, Beijing, China
| | - Mengdi Han
- School of Future Technology, Peking University, Beijing, China.
| | - Wei Wang
- School of Integrated Circuits, Peking University, Beijing, China.
- National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Beijing, China.
- Beijing Advanced Innovation Center for Integrated Circuits, Beijing, China.
| | - Yufeng Jin
- Peking University Shenzhen Graduate School, Peking University, Shenzhen, China.
- School of Integrated Circuits, Peking University, Beijing, China.
- National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Beijing, China.
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3
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Ma Z, Li T, Liu X, Wu J, Luo H, Yang Y. Theoretical Model of the Island Effect in Flexible Electronics under Equal Biaxial Stretching. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2025; 21:e2409632. [PMID: 40190228 PMCID: PMC12067164 DOI: 10.1002/smll.202409632] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 10/17/2024] [Revised: 03/02/2025] [Indexed: 05/13/2025]
Abstract
Island-bridge architecture represents a widely used structural design strategy in the field of stretchable inorganic electronics, where flexible serpentine interconnects function as bridges to accommodate most of the deformation, while the islands residing functional devices exhibit minimal deformation. The mismatch of Young's modulus between the elastic substrate and the rigid islands usually leads to stress concentration, which is named the island effect. This phenomenon can significantly increase the risk of interfacial damage, such as debonding and tearing failure near the island. In this work, the mechanical model of the island effect under equal biaxial stretching is developed based on theoretical analysis, simulation, and experimental measurement. The scaling law of the displacement and strain distributions on the substrate surface illustrates that the ratio of the island radius to the substrate length is the main controlling parameter of the island effect, proved by the experimental and numerical results. The criterion distinguishing whether the island effect problem is axisymmetric is derived from this. Further, the deformation field in periodic array structure is predicted based on the theoretical model, demonstrating its potential for application in flexible electronic devices.
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Affiliation(s)
- Zifei Ma
- Aerospace Information Research InstituteChinese Academy of SciencesBeijing100094P. R. China
- School of Aeronautics and AstronauticsUniversity of Chinese Academy of SciencesBeijing100040P. R. China
| | - Tao Li
- Aerospace Information Research InstituteChinese Academy of SciencesBeijing100094P. R. China
| | - Xiaoyong Liu
- Aerospace Information Research InstituteChinese Academy of SciencesBeijing100094P. R. China
- School of Aeronautics and AstronauticsUniversity of Chinese Academy of SciencesBeijing100040P. R. China
| | - Jun Wu
- Aerospace Information Research InstituteChinese Academy of SciencesBeijing100094P. R. China
| | - Haibo Luo
- Aerospace Information Research InstituteChinese Academy of SciencesBeijing100094P. R. China
- Hainan Research InstituteAerospace Information Research InstituteChinese Academy of SciencesWenchang571300P. R. China
| | - Yanchu Yang
- Aerospace Information Research InstituteChinese Academy of SciencesBeijing100094P. R. China
- School of Aeronautics and AstronauticsUniversity of Chinese Academy of SciencesBeijing100040P. R. China
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4
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An S, Li X, Guo Z, Huang Y, Zhang Y, Jiang H. Energy-efficient dynamic 3D metasurfaces via spatiotemporal jamming interleaved assemblies for tactile interfaces. Nat Commun 2024; 15:7340. [PMID: 39187536 PMCID: PMC11347642 DOI: 10.1038/s41467-024-51865-x] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/12/2024] [Accepted: 08/19/2024] [Indexed: 08/28/2024] Open
Abstract
Inspired by the natural shape-morphing abilities of biological organisms, we introduce a strategy for creating energy-efficient dynamic 3D metasurfaces through spatiotemporal jamming of interleaved assemblies. Our approach, diverging from traditional shape-morphing techniques reliant on continuous energy inputs, utilizes strategically jammed, paper-based interleaved assemblies. By rapidly altering their stiffness at various spatial points and temporal phases during the relaxation of the soft substrate through jamming, we enable the formation of refreshable, intricate 3D shapes with a desirable load-bearing capability. This process, which does not require ongoing energy consumption, ensures energy-efficient and lasting shape displays. Our theoretical model, linking buckling deformation to residual pre-strain, underpins the inverse design process for an array of interleaved assemblies, facilitating the creation of diverse 3D configurations. This metasurface holds notable potential for tactile displays, particularly for the visually impaired, heralding possibilities in visual impaired education, haptic feedback, and virtual/augmented reality applications.
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Affiliation(s)
- Siqi An
- School of Engineering, Westlake University, Hangzhou, Zhejiang, 310030, China
- Westlake Institute for Advanced Study, Hangzhou, Zhejiang, 310024, China
| | - Xiaowen Li
- School of Engineering, Westlake University, Hangzhou, Zhejiang, 310030, China
- Westlake Institute for Advanced Study, Hangzhou, Zhejiang, 310024, China
| | - Zengrong Guo
- School of Engineering, Westlake University, Hangzhou, Zhejiang, 310030, China
| | - Yi Huang
- School of Engineering, Westlake University, Hangzhou, Zhejiang, 310030, China
| | - Yanlin Zhang
- School of Engineering, Westlake University, Hangzhou, Zhejiang, 310030, China
- Westlake Institute for Advanced Study, Hangzhou, Zhejiang, 310024, China
| | - Hanqing Jiang
- School of Engineering, Westlake University, Hangzhou, Zhejiang, 310030, China.
- Westlake Institute for Advanced Study, Hangzhou, Zhejiang, 310024, China.
- Research Center for Industries of the Future, Westlake University, Hangzhou, Zhejiang, 310030, China.
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5
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Bo R, Xu S, Yang Y, Zhang Y. Mechanically-Guided 3D Assembly for Architected Flexible Electronics. Chem Rev 2023; 123:11137-11189. [PMID: 37676059 PMCID: PMC10540141 DOI: 10.1021/acs.chemrev.3c00335] [Citation(s) in RCA: 31] [Impact Index Per Article: 15.5] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/22/2023] [Indexed: 09/08/2023]
Abstract
Architected flexible electronic devices with rationally designed 3D geometries have found essential applications in biology, medicine, therapeutics, sensing/imaging, energy, robotics, and daily healthcare. Mechanically-guided 3D assembly methods, exploiting mechanics principles of materials and structures to transform planar electronic devices fabricated using mature semiconductor techniques into 3D architected ones, are promising routes to such architected flexible electronic devices. Here, we comprehensively review mechanically-guided 3D assembly methods for architected flexible electronics. Mainstream methods of mechanically-guided 3D assembly are classified and discussed on the basis of their fundamental deformation modes (i.e., rolling, folding, curving, and buckling). Diverse 3D interconnects and device forms are then summarized, which correspond to the two key components of an architected flexible electronic device. Afterward, structure-induced functionalities are highlighted to provide guidelines for function-driven structural designs of flexible electronics, followed by a collective summary of their resulting applications. Finally, conclusions and outlooks are given, covering routes to achieve extreme deformations and dimensions, inverse design methods, and encapsulation strategies of architected 3D flexible electronics, as well as perspectives on future applications.
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Affiliation(s)
- Renheng Bo
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Shiwei Xu
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Youzhou Yang
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Yihui Zhang
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
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6
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Ahn J, Ha JH, Jeong Y, Jung Y, Choi J, Gu J, Hwang SH, Kang M, Ko J, Cho S, Han H, Kang K, Park J, Jeon S, Jeong JH, Park I. Nanoscale three-dimensional fabrication based on mechanically guided assembly. Nat Commun 2023; 14:833. [PMID: 36788240 PMCID: PMC9929216 DOI: 10.1038/s41467-023-36302-9] [Citation(s) in RCA: 7] [Impact Index Per Article: 3.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 09/07/2022] [Accepted: 01/25/2023] [Indexed: 02/16/2023] Open
Abstract
The growing demand for complex three-dimensional (3D) micro-/nanostructures has inspired the development of the corresponding manufacturing techniques. Among these techniques, 3D fabrication based on mechanically guided assembly offers the advantages of broad material compatibility, high designability, and structural reversibility under strain but is not applicable for nanoscale device printing because of the bottleneck at nanofabrication and design technique. Herein, a configuration-designable nanoscale 3D fabrication is suggested through a robust nanotransfer methodology and design of substrate's mechanical characteristics. Covalent bonding-based two-dimensional nanotransfer allowing for nanostructure printing on elastomer substrates is used to address fabrication problems, while the feasibility of configuration design through the modulation of substrate's mechanical characteristics is examined using analytical calculations and numerical simulations, allowing printing of various 3D nanostructures. The printed nanostructures exhibit strain-independent electrical properties and are therefore used to fabricate stretchable H2 and NO2 sensors with high performances stable under external strains of 30%.
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Affiliation(s)
- Junseong Ahn
- grid.37172.300000 0001 2292 0500Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141 Republic of Korea ,grid.410901.d0000 0001 2325 3578Department of Nano Manufacturing Technology, Korea Institute of Machinery and Materials (KIMM), Daejeon, 34103 Republic of Korea
| | - Ji-Hwan Ha
- grid.37172.300000 0001 2292 0500Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141 Republic of Korea ,grid.410901.d0000 0001 2325 3578Department of Nano Manufacturing Technology, Korea Institute of Machinery and Materials (KIMM), Daejeon, 34103 Republic of Korea
| | - Yongrok Jeong
- grid.37172.300000 0001 2292 0500Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141 Republic of Korea ,grid.410901.d0000 0001 2325 3578Department of Nano Manufacturing Technology, Korea Institute of Machinery and Materials (KIMM), Daejeon, 34103 Republic of Korea
| | - Young Jung
- grid.37172.300000 0001 2292 0500Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141 Republic of Korea
| | - Jungrak Choi
- grid.37172.300000 0001 2292 0500Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141 Republic of Korea
| | - Jimin Gu
- grid.37172.300000 0001 2292 0500Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141 Republic of Korea
| | - Soon Hyoung Hwang
- grid.410901.d0000 0001 2325 3578Department of Nano Manufacturing Technology, Korea Institute of Machinery and Materials (KIMM), Daejeon, 34103 Republic of Korea
| | - Mingu Kang
- grid.37172.300000 0001 2292 0500Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141 Republic of Korea
| | - Jiwoo Ko
- grid.37172.300000 0001 2292 0500Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141 Republic of Korea ,grid.410901.d0000 0001 2325 3578Department of Nano Manufacturing Technology, Korea Institute of Machinery and Materials (KIMM), Daejeon, 34103 Republic of Korea
| | - Seokjoo Cho
- grid.37172.300000 0001 2292 0500Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141 Republic of Korea
| | - Hyeonseok Han
- grid.37172.300000 0001 2292 0500Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141 Republic of Korea
| | - Kyungnam Kang
- grid.37172.300000 0001 2292 0500Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141 Republic of Korea
| | - Jaeho Park
- grid.37172.300000 0001 2292 0500Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141 Republic of Korea
| | - Sohee Jeon
- grid.410901.d0000 0001 2325 3578Department of Nano Manufacturing Technology, Korea Institute of Machinery and Materials (KIMM), Daejeon, 34103 Republic of Korea
| | - Jun-Ho Jeong
- Department of Nano Manufacturing Technology, Korea Institute of Machinery and Materials (KIMM), Daejeon, 34103, Republic of Korea.
| | - Inkyu Park
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Republic of Korea.
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7
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Zhang L, Zhang Z, Weisbecker H, Yin H, Liu Y, Han T, Guo Z, Berry M, Yang B, Guo X, Adams J, Xie Z, Bai W. 3D morphable systems via deterministic microfolding for vibrational sensing, robotic implants, and reconfigurable telecommunication. SCIENCE ADVANCES 2022; 8:eade0838. [PMID: 36542721 PMCID: PMC9770994 DOI: 10.1126/sciadv.ade0838] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 07/23/2022] [Accepted: 11/07/2022] [Indexed: 06/17/2023]
Abstract
DNA and proteins fold in three dimensions (3D) to enable functions that sustain life. Emulation of such folding schemes for functional materials can unleash enormous potential in advancing a wide range of technologies, especially in robotics, medicine, and telecommunication. Here, we report a microfolding strategy that enables formation of 3D morphable microelectronic systems integrated with various functional materials, including monocrystalline silicon, metallic nanomembranes, and polymers. By predesigning folding hosts and configuring folding pathways, 3D microelectronic systems in freestanding forms can transform across various complex configurations with modulated functionalities. Nearly all transitional states of 3D microelectronic systems achieved via the microfolding assembly can be easily accessed and modulated in situ, offering functional versatility and adaptability. Advanced morphable microelectronic systems including a reconfigurable microantenna for customizable telecommunication, a 3D vibration sensor for hand-tremor monitoring, and a bloomable robot for cardiac mapping demonstrate broad utility of these assembly schemes to realize advanced functionalities.
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Affiliation(s)
- Lin Zhang
- Department of Applied Physical Sciences, University of North Carolina, Chapel Hill, NC 27514, USA
| | - Zongwen Zhang
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, DUT-BSU Joint Institute, Dalian University, Dalian 116024, P.R. China
- Ningbo Institute of Dalian University of Technology, Ningbo 315016, P.R. China
| | - Hannah Weisbecker
- Department of Biology, University of North Carolina, Chapel Hill, NC 27514, USA
| | - Haifeng Yin
- MCAllister Heart Institute Core, University of North Carolina, Chapel Hill, NC 27514, USA
| | - Yihan Liu
- Department of Applied Physical Sciences, University of North Carolina, Chapel Hill, NC 27514, USA
| | - Tianhong Han
- Joint Department of Biomedical Engineering, North Carolina State University, Raleigh, NC 27606, USA
| | - Ziheng Guo
- Department of Chemistry, University of North Carolina, Chapel Hill, NC 27514, USA
| | - Matt Berry
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC 27606, USA
| | - Binbin Yang
- Department of Electrical and Computer Engineering, North Carolina Agricultural and Technical State University, Greensboro, NC 27411, USA
| | - Xu Guo
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, DUT-BSU Joint Institute, Dalian University, Dalian 116024, P.R. China
- Ningbo Institute of Dalian University of Technology, Ningbo 315016, P.R. China
| | - Jacob Adams
- Department of Electrical and Computer Engineering, North Carolina State University, Raleigh, NC 27606, USA
| | - Zhaoqian Xie
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, DUT-BSU Joint Institute, Dalian University, Dalian 116024, P.R. China
- Ningbo Institute of Dalian University of Technology, Ningbo 315016, P.R. China
| | - Wubin Bai
- Department of Applied Physical Sciences, University of North Carolina, Chapel Hill, NC 27514, USA
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8
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Xia N, Zhu G, Wang X, Dong Y, Zhang L. Multicomponent and multifunctional integrated miniature soft robots. SOFT MATTER 2022; 18:7464-7485. [PMID: 36189642 DOI: 10.1039/d2sm00891b] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
Abstract
Miniature soft robots with elaborate structures and programmable physical properties could conduct micromanipulation with high precision as well as access confined and tortuous spaces, which promise benefits in medical tasks and environmental monitoring. To improve the functionalities and adaptability of miniature soft robots, a variety of integrated design and fabrication strategies have been proposed for the development of miniaturized soft robotic systems integrated with multicomponents and multifunctionalities. Combining the latest advancement in fabrication technologies, intelligent materials and active control methods enable these integrated robotic systems to adapt to increasingly complex application scenarios including precision medicine, intelligent electronics, and environmental and proprioceptive sensing. Herein, this review delivers an overview of various integration strategies applicable for miniature soft robotic systems, including semiconductor and microelectronic techniques, modular assembly based on self-healing and welding, modular assembly based on bonding agents, laser machining techniques, template assisted methods with modular material design, and 3D printing techniques. Emerging applications of the integrated miniature soft robots and perspectives for the future design of small-scale intelligent robots are discussed.
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Affiliation(s)
- Neng Xia
- Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong, Hong Kong, China.
| | - Guangda Zhu
- Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong, Hong Kong, China.
| | - Xin Wang
- Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong, Hong Kong, China.
| | - Yue Dong
- Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong, Hong Kong, China.
| | - Li Zhang
- Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong, Hong Kong, China.
- Chow Yuk Ho Technology Center for Innovative Medicine, The Chinese University of Hong Kong, Hong Kong, China
- CUHK T Stone Robotics Institute, The Chinese University of Hong Kong, Hong Kong, China
- Department of Surgery, The Chinese University of Hong Kong, Hong Kong, China
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9
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High-throughput fabrication of soft magneto-origami machines. Nat Commun 2022; 13:4177. [PMID: 35853940 PMCID: PMC9296529 DOI: 10.1038/s41467-022-31900-5] [Citation(s) in RCA: 27] [Impact Index Per Article: 9.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/26/2021] [Accepted: 07/07/2022] [Indexed: 11/08/2022] Open
Abstract
Soft magneto-active machines capable of magnetically controllable shape-morphing and locomotion have diverse promising applications such as untethered biomedical robots. However, existing soft magneto-active machines often have simple structures with limited functionalities and do not grant high-throughput production due to the convoluted fabrication technology. Here, we propose a facile fabrication strategy that transforms 2D magnetic sheets into 3D soft magneto-active machines with customized geometries by incorporating origami folding. Based on automated roll-to-roll processing, this approach allows for the high-throughput fabrication of soft magneto-origami machines with a variety of characteristics, including large-magnitude deploying, sequential folding into predesigned shapes, and multivariant actuation modes (e.g., contraction, bending, rotation, and rolling locomotion). We leverage these abilities to demonstrate a few potential applications: an electronic robot capable of on-demand deploying and wireless charging, a mechanical 8-3 encoder, a quadruped robot for cargo-release tasks, and a magneto-origami arts/craft. Our work contributes for the high-throughput fabrication of soft magneto-active machines with multi-functionalities.
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10
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Shi Y, Shen Z. Recent Advances in Flexible RF MEMS. MICROMACHINES 2022; 13:mi13071088. [PMID: 35888905 PMCID: PMC9315774 DOI: 10.3390/mi13071088] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 06/11/2022] [Revised: 07/01/2022] [Accepted: 07/03/2022] [Indexed: 12/04/2022]
Abstract
Microelectromechanical systems (MEMS) that are based on flexible substrates are widely used in flexible, reconfigurable radio frequency (RF) systems, such as RF MEMS switches, phase shifters, reconfigurable antennas, phased array antennas and resonators, etc. When attempting to accommodate flexible deformation with the movable structures of MEMS, flexible RF MEMS are far more difficult to structurally design and fabricate than rigid MEMS devices or other types of flexible electronics. In this review, we survey flexible RF MEMS with different functions, their flexible film materials and their fabrication process technologies. In addition, a fabrication process for reconfigurable three-dimensional (3D) RF devices based on mechanically guided assembly is introduced. The review is very helpful to understand the overall advances in flexible RF MEMS, and serves the purpose of providing a reference source for innovative researchers working in this field.
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Affiliation(s)
- Yingli Shi
- School of Materials and Energy, University of Electronic Science and Technology of China (USETC), Chengdu 610054, China;
| | - Zhigang Shen
- Beijing Key Laboratory for Powder Technology Research and Development, Beihang University (BUAA), Beijing 100191, China
- Correspondence:
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11
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Han M, Guo X, Chen X, Liang C, Zhao H, Zhang Q, Bai W, Zhang F, Wei H, Wu C, Cui Q, Yao S, Sun B, Yang Y, Yang Q, Ma Y, Xue Z, Kwak JW, Jin T, Tu Q, Song E, Tian Z, Mei Y, Fang D, Zhang H, Huang Y, Zhang Y, Rogers JA. Submillimeter-scale multimaterial terrestrial robots. Sci Robot 2022; 7:eabn0602. [PMID: 35613299 DOI: 10.1126/scirobotics.abn0602] [Citation(s) in RCA: 40] [Impact Index Per Article: 13.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/11/2022]
Abstract
Robots with submillimeter dimensions are of interest for applications that range from tools for minimally invasive surgical procedures in clinical medicine to vehicles for manipulating cells/tissues in biology research. The limited classes of structures and materials that can be used in such robots, however, create challenges in achieving desired performance parameters and modes of operation. Here, we introduce approaches in manufacturing and actuation that address these constraints to enable untethered, terrestrial robots with complex, three-dimensional (3D) geometries and heterogeneous material construction. The manufacturing procedure exploits controlled mechanical buckling to create 3D multimaterial structures in layouts that range from arrays of filaments and origami constructs to biomimetic configurations and others. A balance of forces associated with a one-way shape memory alloy and the elastic resilience of an encapsulating shell provides the basis for reversible deformations of these structures. Modes of locomotion and manipulation span from bending, twisting, and expansion upon global heating to linear/curvilinear crawling, walking, turning, and jumping upon laser-induced local thermal actuation. Photonic structures such as retroreflectors and colorimetric sensing materials support simple forms of wireless monitoring and localization. These collective advances in materials, manufacturing, actuation, and sensing add to a growing body of capabilities in this emerging field of technology.
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Affiliation(s)
- Mengdi Han
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
| | - Xiaogang Guo
- Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China.,Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Xuexian Chen
- National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
| | - Cunman Liang
- Department of Electronic Engineering, The Chinese University of Hong Kong, New Territories, Hong Kong 999077, China
| | - Hangbo Zhao
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.,Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA 90089, USA
| | - Qihui Zhang
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Wubin Bai
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Fan Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Heming Wei
- Key Laboratory of Specialty Fiber Optics and Optical Access Networks, Joint International Research Laboratory of Specialty Fiber Optics and Advanced Communication, Shanghai University, Shanghai 200444, China
| | - Changsheng Wu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Qinghong Cui
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
| | - Shenglian Yao
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.,School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Bohan Sun
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.,Department of Mechanical Engineering, Johns Hopkins University, Baltimore, MD 21218, USA
| | - Yiyuan Yang
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Quansan Yang
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Yuhang Ma
- School of Chemical Engineering and Technology, Tianjin University, Tianjin 300072, China
| | - Zhaoguo Xue
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Jean Won Kwak
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Tianqi Jin
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Qing Tu
- Department of Materials Science and Engineering, Texas A&M University, College Station, TX 77843, USA
| | - Enming Song
- Shanghai Frontiers Science Research Base of Intelligent Optoelectronics and Perception, Institute of Optoelectronics, Fudan University, Shanghai 200433, China
| | - Ziao Tian
- State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China
| | - Yongfeng Mei
- Department of Materials Science, Fudan University, Shanghai 200433, China
| | - Daining Fang
- Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China
| | - Haixia Zhang
- National Key Laboratory of Nano/Micro Fabrication Technology, Institute of Microelectronics, Peking University, Beijing 100871, China
| | - Yonggang Huang
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Neurological Surgery, Northwestern University, Evanston, IL 60208, USA.,Department of Chemistry, Northwestern University, Evanston, IL 60208, USA.,Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208, USA
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12
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Li K, Shuai Y, Cheng X, Luan H, Liu S, Yang C, Xue Z, Huang Y, Zhang Y. Island Effect in Stretchable Inorganic Electronics. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2022; 18:e2107879. [PMID: 35307953 DOI: 10.1002/smll.202107879] [Citation(s) in RCA: 11] [Impact Index Per Article: 3.7] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/19/2021] [Revised: 02/28/2022] [Indexed: 06/14/2023]
Abstract
Island-bridge architectures represent a widely used structural design in stretchable inorganic electronics, where deformable interconnects that form the bridge provide system stretchability, and functional components that reside on the islands undergo negligible deformations. These device systems usually experience a common strain concentration phenomenon, i.e., "island effect", because of the modulus mismatch between the soft elastomer substrate and its on-top rigid components. Such an island effect can significantly raise the surrounding local strain, therefore increasing the risk of material failure for the interconnects in the vicinity of the islands. In this work, a systematic study of such an island effect through combined theoretical analysis, numerical simulations and experimental measurements is presented. To relieve the island effect, a buffer layer strategy is proposed as a generic route to enhanced stretchabilities of deformable interconnects. Both experimental and numerical results illustrate the applicability of this strategy to 2D serpentine and 3D helical interconnects, as evidenced by the increased stretchabilities (e.g., by 1.5 times with a simple buffer layer, and 2 times with a ring buffer layer, both for serpentine interconnects). The application of the patterned buffer layer strategy in a stretchable light emitting diodes system suggests promising potentials for uses in other functional device systems.
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Affiliation(s)
- Kan Li
- State Key Laboratory of Digital Manufacture Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
| | - Yumeng Shuai
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Xu Cheng
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Haiwen Luan
- Departments of Mechanical Engineering, Civil and Environmental Engineering, and Materials Science and Engineering and Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
| | - Siyi Liu
- Center for Mechanics of Solids, Structures and Materials, Department of Aerospace Engineering and Engineering Mechanics, University of Texas at Austin, Austin, TX, 78712, USA
| | - Ce Yang
- Department of Mechanical Engineering, Tsinghua University, Beijing, 100084, P. R. China
| | - Zhaoguo Xue
- Institute of Solid Mechanics, Beihang University (BUAA), Beijing, 100191, P. R. China
| | - Yonggang Huang
- Departments of Mechanical Engineering, Civil and Environmental Engineering, and Materials Science and Engineering and Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
| | - Yihui Zhang
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
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13
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Song H, Luo G, Ji Z, Bo R, Xue Z, Yan D, Zhang F, Bai K, Liu J, Cheng X, Pang W, Shen Z, Zhang Y. Highly-integrated, miniaturized, stretchable electronic systems based on stacked multilayer network materials. SCIENCE ADVANCES 2022; 8:eabm3785. [PMID: 35294232 PMCID: PMC8926335 DOI: 10.1126/sciadv.abm3785] [Citation(s) in RCA: 67] [Impact Index Per Article: 22.3] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Indexed: 05/07/2023]
Abstract
Elastic stretchability and function density represent two key figures of merits for stretchable inorganic electronics. Various design strategies have been reported to provide both high levels of stretchability and function density, but the function densities are mostly below 80%. While the stacked device layout can overcome this limitation, the soft elastomers used in previous studies could highly restrict the deformation of stretchable interconnects. Here, we introduce stacked multilayer network materials as a general platform to incorporate individual components and stretchable interconnects, without posing any essential constraint to their deformations. Quantitative analyses show a substantial enhancement (e.g., by ~7.5 times) of elastic stretchability of serpentine interconnects as compared to that based on stacked soft elastomers. The proposed strategy allows demonstration of a miniaturized electronic system (11 mm by 10 mm), with a moderate elastic stretchability (~20%) and an unprecedented areal coverage (~110%), which can serve as compass display, somatosensory mouse, and physiological-signal monitor.
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Affiliation(s)
- Honglie Song
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Guoquan Luo
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
- National Key Laboratory of Science and Technology on Advanced Composite in Special Environments, Harbin Institute of Technology, Harbin 150080, P. R. China
| | - Ziyao Ji
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Renheng Bo
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Zhaoguo Xue
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Dongjia Yan
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Fan Zhang
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Ke Bai
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Jianxing Liu
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Xu Cheng
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Wenbo Pang
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Zhangming Shen
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Yihui Zhang
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
- Corresponding author.
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14
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Zhao H, Cheng X, Wu C, Liu TL, Zhao Q, Li S, Ni X, Yao S, Han M, Huang Y, Zhang Y, Rogers JA. Mechanically Guided Hierarchical Assembly of 3D Mesostructures. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2109416. [PMID: 35067974 DOI: 10.1002/adma.202109416] [Citation(s) in RCA: 13] [Impact Index Per Article: 4.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/19/2021] [Revised: 01/01/2022] [Indexed: 06/14/2023]
Abstract
3D, hierarchical micro/nanostructures formed with advanced functional materials are of growing interest due to their broad potential utility in electronics, robotics, battery technology, and biomedical engineering. Among various strategies in 3D micro/nanofabrication, a set of methods based on compressive buckling offers wide-ranging material compatibility, fabrication scalability, and precise process control. Previously reports on this type of approach rely on a single, planar prestretched elastomeric platform to transform thin-film precursors with 2D layouts into 3D architectures. The simple planar configuration of bonding sites between these precursors and their assembly substrates prevents the realization of certain types of complex 3D geometries. In this paper, a set of hierarchical assembly concepts is reported that leverage multiple layers of prestretched elastomeric substrates to induce not only compressive buckling of 2D precursors bonded to them but also of themselves, thereby creating 3D mesostructures mounted at multiple levels of 3D frameworks with complex, elaborate configurations. Control over strains used in these processes provides reversible access to multiple different 3D layouts in a given structure. Examples to demonstrate these ideas through both experimental and computational results span vertically aligned helices to closed 3D cages, selected for their relevance to 3D conformal bio-interfaces and multifunctional microsystems.
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Affiliation(s)
- Hangbo Zhao
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA, 90089, USA
| | - Xu Cheng
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
| | - Changsheng Wu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Tzu-Li Liu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Qinai Zhao
- Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA, 90089, USA
| | - Shuo Li
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Xinchen Ni
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Shenglian Yao
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Beijing Advanced Innovation Center for Materials Genome Engineering, School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, 100083, China
| | - Mengdi Han
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
| | - Yonggang Huang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Chemistry, Northwestern University, Evanston, IL, 60208, USA
- Department of Neurological Surgery, Northwestern University, Evanston, IL, 60208, USA
- Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, 60208, USA
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15
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Ling Y, Pang W, Liu J, Page M, Xu Y, Zhao G, Stalla D, Xie J, Zhang Y, Yan Z. Bioinspired elastomer composites with programmed mechanical and electrical anisotropies. Nat Commun 2022; 13:524. [PMID: 35082331 PMCID: PMC8791960 DOI: 10.1038/s41467-022-28185-z] [Citation(s) in RCA: 11] [Impact Index Per Article: 3.7] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/29/2021] [Accepted: 01/04/2022] [Indexed: 12/26/2022] Open
Abstract
Concepts that draw inspiration from soft biological tissues have enabled significant advances in creating artificial materials for a range of applications, such as dry adhesives, tissue engineering, biointegrated electronics, artificial muscles, and soft robots. Many biological tissues, represented by muscles, exhibit directionally dependent mechanical and electrical properties. However, equipping synthetic materials with tissue-like mechanical and electrical anisotropies remains challenging. Here, we present the bioinspired concepts, design principles, numerical modeling, and experimental demonstrations of soft elastomer composites with programmed mechanical and electrical anisotropies, as well as their integrations with active functionalities. Mechanically assembled, 3D structures of polyimide serve as skeletons to offer anisotropic, nonlinear mechanical properties, and crumpled conductive surfaces provide anisotropic electrical properties, which can be used to construct bioelectronic devices. Finite element analyses quantitatively capture the key aspects that govern mechanical anisotropies of elastomer composites, providing a powerful design tool. Incorporation of 3D skeletons of thermally responsive polycaprolactone into elastomer composites allows development of an active artificial material that can mimic adaptive mechanical behaviors of skeleton muscles at relaxation and contraction states. Furthermore, the fabrication process of anisotropic elastomer composites is compatible with dielectric elastomer actuators, indicating potential applications in humanoid artificial muscles and soft robots.
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Affiliation(s)
- Yun Ling
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - Wenbo Pang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084, Beijing, China.,Center for Flexible Electronics Technology, Tsinghua University, 100084, Beijing, China
| | - Jianxing Liu
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084, Beijing, China.,Center for Flexible Electronics Technology, Tsinghua University, 100084, Beijing, China
| | - Margaret Page
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - Yadong Xu
- Department of Biomedical, Biological and Chemical Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - Ganggang Zhao
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - David Stalla
- Electron Microscopy Core, University of Missouri, Columbia, MO, 65211, USA
| | - Jingwei Xie
- Department of Surgery-Transplant and Mary and Dick Holland Regenerative Medicine Program, College of Medicine, University of Nebraska Medical Center, Omaha, NE, 68130, USA
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084, Beijing, China. .,Center for Flexible Electronics Technology, Tsinghua University, 100084, Beijing, China.
| | - Zheng Yan
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA. .,Department of Biomedical, Biological and Chemical Engineering, University of Missouri, Columbia, MO, 65211, USA.
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16
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Wang H, Zhao Z, Liu P, Guo X. Laser-Induced Graphene Based Flexible Electronic Devices. BIOSENSORS 2022; 12:55. [PMID: 35200316 PMCID: PMC8869335 DOI: 10.3390/bios12020055] [Citation(s) in RCA: 32] [Impact Index Per Article: 10.7] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/28/2021] [Revised: 01/17/2022] [Accepted: 01/17/2022] [Indexed: 05/05/2023]
Abstract
Since it was reported in 2014, laser-induced graphene (LIG) has received growing attention for its fast speed, non-mask, and low-cost customizable preparation, and has shown its potential in the fields of wearable electronics and biological sensors that require high flexibility and versatility. Laser-induced graphene has been successfully prepared on various substrates with contents from various carbon sources, e.g., from organic films, plants, textiles, and papers. This paper reviews the recent progress on the state-of-the-art preparations and applications of LIG including mechanical sensors, temperature and humidity sensors, electrochemical sensors, electrophysiological sensors, heaters, and actuators. The achievements of LIG based devices for detecting diverse bio-signal, serving as monitoring human motions, energy storage, and heaters are highlighted here, referring to the advantages of LIG in flexible designability, excellent electrical conductivity, and diverse choice of substrates. Finally, we provide some perspectives on the remaining challenges and opportunities of LIG.
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Affiliation(s)
| | | | | | - Xiaogang Guo
- Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China; (H.W.); (Z.Z.); (P.L.)
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17
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Qi J, Chen Z, Jiang P, Hu W, Wang Y, Zhao Z, Cao X, Zhang S, Tao R, Li Y, Fang D. Recent Progress in Active Mechanical Metamaterials and Construction Principles. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2022; 9:e2102662. [PMID: 34716676 PMCID: PMC8728820 DOI: 10.1002/advs.202102662] [Citation(s) in RCA: 44] [Impact Index Per Article: 14.7] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/27/2021] [Revised: 08/31/2021] [Indexed: 05/03/2023]
Abstract
Active mechanical metamaterials (AMMs) (or smart mechanical metamaterials) that combine the configurations of mechanical metamaterials and the active control of stimuli-responsive materials have been widely investigated in recent decades. The elaborate artificial microstructures of mechanical metamaterials and the stimulus response characteristics of smart materials both contribute to AMMs, making them achieve excellent properties beyond the conventional metamaterials. The micro and macro structures of the AMMs are designed based on structural construction principles such as, phase transition, strain mismatch, and mechanical instability. Considering the controllability and efficiency of the stimuli-responsive materials, physical fields such as, the temperature, chemicals, light, electric current, magnetic field, and pressure have been adopted as the external stimuli in practice. In this paper, the frontier works and the latest progress in AMMs from the aspects of the mechanics and materials are reviewed. The functions and engineering applications of the AMMs are also discussed. Finally, existing issues and future perspectives in this field are briefly described. This review is expected to provide the basis and inspiration for the follow-up research on AMMs.
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Affiliation(s)
- Jixiang Qi
- State Key Laboratory of Explosion Science and TechnologyBeijing Institute of TechnologyBeijing100081China
- Beijing Key Laboratory of Lightweight Multi‐functional Composite Materials and StructuresInstitute of Advanced Structure TechnologyBeijing Institute of TechnologyBeijing100081China
| | - Zihao Chen
- State Key Laboratory of Explosion Science and TechnologyBeijing Institute of TechnologyBeijing100081China
- Beijing Key Laboratory of Lightweight Multi‐functional Composite Materials and StructuresInstitute of Advanced Structure TechnologyBeijing Institute of TechnologyBeijing100081China
| | - Peng Jiang
- State Key Laboratory of Explosion Science and TechnologyBeijing Institute of TechnologyBeijing100081China
- Beijing Key Laboratory of Lightweight Multi‐functional Composite Materials and StructuresInstitute of Advanced Structure TechnologyBeijing Institute of TechnologyBeijing100081China
| | - Wenxia Hu
- Beijing Key Laboratory of Lightweight Multi‐functional Composite Materials and StructuresInstitute of Advanced Structure TechnologyBeijing Institute of TechnologyBeijing100081China
| | - Yonghuan Wang
- State Key Laboratory of Explosion Science and TechnologyBeijing Institute of TechnologyBeijing100081China
- Beijing Key Laboratory of Lightweight Multi‐functional Composite Materials and StructuresInstitute of Advanced Structure TechnologyBeijing Institute of TechnologyBeijing100081China
| | - Zeang Zhao
- Beijing Key Laboratory of Lightweight Multi‐functional Composite Materials and StructuresInstitute of Advanced Structure TechnologyBeijing Institute of TechnologyBeijing100081China
| | - Xiaofei Cao
- State Key Laboratory of Explosion Science and TechnologyBeijing Institute of TechnologyBeijing100081China
- Beijing Key Laboratory of Lightweight Multi‐functional Composite Materials and StructuresInstitute of Advanced Structure TechnologyBeijing Institute of TechnologyBeijing100081China
| | - Shushan Zhang
- State Key Laboratory of Explosion Science and TechnologyBeijing Institute of TechnologyBeijing100081China
- Beijing Key Laboratory of Lightweight Multi‐functional Composite Materials and StructuresInstitute of Advanced Structure TechnologyBeijing Institute of TechnologyBeijing100081China
| | - Ran Tao
- Beijing Key Laboratory of Lightweight Multi‐functional Composite Materials and StructuresInstitute of Advanced Structure TechnologyBeijing Institute of TechnologyBeijing100081China
| | - Ying Li
- State Key Laboratory of Explosion Science and TechnologyBeijing Institute of TechnologyBeijing100081China
- Beijing Key Laboratory of Lightweight Multi‐functional Composite Materials and StructuresInstitute of Advanced Structure TechnologyBeijing Institute of TechnologyBeijing100081China
| | - Daining Fang
- Beijing Key Laboratory of Lightweight Multi‐functional Composite Materials and StructuresInstitute of Advanced Structure TechnologyBeijing Institute of TechnologyBeijing100081China
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18
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Han D, Zhang L, Chen X. Mechanical modulation of multifunctional responses in three-dimensional terahertz metamaterials. OPTICS EXPRESS 2021; 29:32853-32864. [PMID: 34809108 DOI: 10.1364/oe.437459] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/12/2021] [Accepted: 09/18/2021] [Indexed: 06/13/2023]
Abstract
Reconfigurable metamaterials have attracted a surge of attention for their formidable capability to dynamically manipulate the electromagnetic wave. Among the multifarious modulation methods, mechanical deformation is widely adopted to tune the electromagnetic response of the stereotype metamaterial owing to its straightforward and continuous controllability on the metamaterial structure. However, previous morphologic reconfigurations of metamaterials are typically confined in planar deformation that renders limited tunable functionalities. Here we have proposed a novel concept of out-of-plane deformation to broaden the functionalities of mechanically reconfigurable metamaterials via introducing a cross-shaped metamaterial. Our results show that the out-of-plane mechanical modulation dramatically enhances the magnetic response of the pristine metamaterial. Furthermore, by uncrossing the bars of cross-shaped meta-atoms, a L-shaped metamaterial is proposed to verify the effectiveness of such a mechanical method on the handedness switching via changing mechanical loading-paths. More importantly, the differential transmission for circularly polarized incidences can be continuously modulated from -0.45 to 0.45, and the polarization states of the transmission wave can be dynamically manipulated under the linearly polarized illumination. Our proposed mechanical modulation principle might open a novel avenue toward the three-dimensional reconfigurable metamaterials and shows their ample applications in the areas of chiroptical control, tunable polarization rotator and converter.
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19
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Chen Z, Kong S, He Y, Yi S, Liu G, Mao Z, Huo M, Chan CH, Lu J. Soft, Bistable Actuators for Reconfigurable 3D Electronics. ACS APPLIED MATERIALS & INTERFACES 2021; 13:41968-41977. [PMID: 34427444 DOI: 10.1021/acsami.1c08722] [Citation(s) in RCA: 5] [Impact Index Per Article: 1.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/13/2023]
Abstract
Existing strategies for reconfigurable three-dimensional (3D) electronics are greatly constrained by either the complicated driven mechanisms or harsh demands for conductive materials. Developing a simple and robust strategy for 3D electronics reconstruction and function extension remains a challenge. Here, we propose a solvent-driven bistable actuator, which acts as a substrate to reconstruct the combined 3D electronic device. Extraction of silicon oil from a hybrid poly(dimethylsiloxane) (PDMS) circle sheet buckles the dish to a bistable structure. The ultraviolet (UV)/ozone treatment on one surface of the PDMS structure introduces an oxidized layer, yielding a bilayered, solvent-driven bistable smart actuator. The snap-back stimulus to the oxidized layer differs from the snap-through stimulus. Experimental and numerical studies reveal the fundamental regulations for buckling configurations and the bistable behavior of the actuator. The prepared bistable actuator drives the bonded kirigami polyimide (PI) sheets to diverse 3D structures from the original bending configuration, reversibly. A frequency-reconfigurable electrically small monopole antenna is presented as a demonstration, which paves a way for the applications of this actuator in the field of reconfigurable 3D electronics.
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Affiliation(s)
- Zhou Chen
- Centre for Advanced Structural Materials, City University of Hong Kong Shenzhen Research Institute, Greater Bay Joint Division, Shenyang National Laboratory for Materials Science, Shenzhen 518000, China
- Hong Kong Branch of National Precious Metals Material Engineering Research Centre, City University of Hong Kong, Hong Kong 999077, China
- Laboratory of Nanomaterials & Nanomechanics, City University of Hong Kong, Hong Kong 999077, China
- Department of Mechanical Engineering, City University of Hong Kong, Hong Kong 999077, China
- CityU-Shenzhen Futian Research Institute, Shenzhen 518000, China
| | - Shangcheng Kong
- State Key Laboratory of Terahertz and Millimeter Waves, Department of Electrical Engineering, City University of Hong Kong, Hong Kong 999077, China
| | - Yunhu He
- Centre for Advanced Structural Materials, City University of Hong Kong Shenzhen Research Institute, Greater Bay Joint Division, Shenyang National Laboratory for Materials Science, Shenzhen 518000, China
- Hong Kong Branch of National Precious Metals Material Engineering Research Centre, City University of Hong Kong, Hong Kong 999077, China
- Laboratory of Nanomaterials & Nanomechanics, City University of Hong Kong, Hong Kong 999077, China
- Department of Mechanical Engineering, City University of Hong Kong, Hong Kong 999077, China
| | - Shenghui Yi
- Centre for Advanced Structural Materials, City University of Hong Kong Shenzhen Research Institute, Greater Bay Joint Division, Shenyang National Laboratory for Materials Science, Shenzhen 518000, China
| | - Guo Liu
- Centre for Advanced Structural Materials, City University of Hong Kong Shenzhen Research Institute, Greater Bay Joint Division, Shenyang National Laboratory for Materials Science, Shenzhen 518000, China
- Hong Kong Branch of National Precious Metals Material Engineering Research Centre, City University of Hong Kong, Hong Kong 999077, China
- Laboratory of Nanomaterials & Nanomechanics, City University of Hong Kong, Hong Kong 999077, China
- Department of Mechanical Engineering, City University of Hong Kong, Hong Kong 999077, China
| | - Zhengyi Mao
- Centre for Advanced Structural Materials, City University of Hong Kong Shenzhen Research Institute, Greater Bay Joint Division, Shenyang National Laboratory for Materials Science, Shenzhen 518000, China
- Hong Kong Branch of National Precious Metals Material Engineering Research Centre, City University of Hong Kong, Hong Kong 999077, China
- Laboratory of Nanomaterials & Nanomechanics, City University of Hong Kong, Hong Kong 999077, China
- Department of Mechanical Engineering, City University of Hong Kong, Hong Kong 999077, China
| | - Mengke Huo
- Centre for Advanced Structural Materials, City University of Hong Kong Shenzhen Research Institute, Greater Bay Joint Division, Shenyang National Laboratory for Materials Science, Shenzhen 518000, China
- Hong Kong Branch of National Precious Metals Material Engineering Research Centre, City University of Hong Kong, Hong Kong 999077, China
- Laboratory of Nanomaterials & Nanomechanics, City University of Hong Kong, Hong Kong 999077, China
- Department of Mechanical Engineering, City University of Hong Kong, Hong Kong 999077, China
| | - Chi Hou Chan
- State Key Laboratory of Terahertz and Millimeter Waves, Department of Electrical Engineering, City University of Hong Kong, Hong Kong 999077, China
| | - Jian Lu
- Centre for Advanced Structural Materials, City University of Hong Kong Shenzhen Research Institute, Greater Bay Joint Division, Shenyang National Laboratory for Materials Science, Shenzhen 518000, China
- Hong Kong Branch of National Precious Metals Material Engineering Research Centre, City University of Hong Kong, Hong Kong 999077, China
- Laboratory of Nanomaterials & Nanomechanics, City University of Hong Kong, Hong Kong 999077, China
- Department of Mechanical Engineering, City University of Hong Kong, Hong Kong 999077, China
- CityU-Shenzhen Futian Research Institute, Shenzhen 518000, China
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20
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Cheng X, Zhang F, Bo R, Shen Z, Pang W, Jin T, Song H, Xue Z, Zhang Y. An Anti-Fatigue Design Strategy for 3D Ribbon-Shaped Flexible Electronics. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2021; 33:e2102684. [PMID: 34342056 DOI: 10.1002/adma.202102684] [Citation(s) in RCA: 18] [Impact Index Per Article: 4.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/08/2021] [Revised: 06/03/2021] [Indexed: 06/13/2023]
Abstract
Three-dimensional (3D) flexible electronics represent an emerging area of intensive attention in recent years, owing to their broad-ranging applications in wearable electronics, flexible robots, tissue/cell scaffolds, among others. The widely adopted 3D conductive mesostructures in the functional device systems would inevitably undergo repetitive out-of-plane compressions during practical operations, and thus, anti-fatigue design strategies are of great significance to improve the reliability of 3D flexible electronics. Previous studies mainly focused on the fatigue failure behavior of planar ribbon-shaped geometries, while anti-fatigue design strategies and predictive failure criteria addressing 3D ribbon-shaped mesostructures are still lacking. This work demonstrates an anti-fatigue strategy to significantly prolong the fatigue life of 3D ribbon-shaped flexible electronics by switching the metal-dominated failure to desired polymer-dominated failure. Combined in situ measurements and computational studies allow the establishment of a failure criterion capable of accurately predicting fatigue lives under out-of-plane compressions, thereby providing useful guidelines for the design of anti-fatigue mesostructures with diverse 3D geometries. Two mechanically reliable 3D devices, including a resistance-type vibration sensor and a janus sensor capable of decoupled temperature measurements, serve as two demonstrative examples to highlight potential applications in long-term health monitoring and human-like robotic perception, respectively.
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Affiliation(s)
- Xu Cheng
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Fan Zhang
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Renheng Bo
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Zhangming Shen
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Wenbo Pang
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Tianqi Jin
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Honglie Song
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Zhaoguo Xue
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Yihui Zhang
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
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21
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Cheng X, Liu Z, Jin T, Zhang F, Zhang H, Zhang Y. Bioinspired design and assembly of a multilayer cage-shaped sensor capable of multistage load bearing and collapse prevention. NANOTECHNOLOGY 2021; 32:155506. [PMID: 33348323 DOI: 10.1088/1361-6528/abd581] [Citation(s) in RCA: 6] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/12/2023]
Abstract
Flexible bioinspired mesostructures and electronic devices have recently attracted intense attention because of their widespread application in microelectromechanical systems (MEMS), reconfigurable electronics, health-monitoring systems, etc. Among various geometric constructions, 3D flexible bioinspired architectures are of particular interest, since they can provide new functions and capabilities, compared to their 2D counterparts. However, 3D electronic device systems usually undergo complicated mechanical loading in practical operation, resulting in complex deformation modes and elusive failure mechanisms. The development of mechanically robust flexible 3D electronics that can undergo extreme compression without irreversible collapse or fracture remains a challenge. Here, inspired by the multilayer mesostructure of Enhydra lutris fur, we introduce the design and assembly of multilayer cage architectures capable of multistage load bearing and collapse prevention under large out-of-plane compression. Combined in situ experiments and mechanical modeling show that the multistage mechanical responses of the developed bionic architectures can be fine-tuned by tailoring the microstructural geometries. The integration of functional layers of gold and piezoelectric polymer allows the development of a flexible multifunctional sensor that can simultaneously achieve the dynamic sensing of compressive forces and temperatures. The demonstrated capabilities and performances of fast response speed, tunable measurement range, excellent flexibility, and reliability suggest potential uses in MEMS, robotics and biointegrated electronics.
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Affiliation(s)
- Xu Cheng
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, People's Republic of China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, People's Republic of China
| | - Zhi Liu
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, People's Republic of China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, People's Republic of China
| | - Tianqi Jin
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, People's Republic of China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, People's Republic of China
| | - Fan Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, People's Republic of China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, People's Republic of China
| | - Hang Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, People's Republic of China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, People's Republic of China
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, People's Republic of China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, People's Republic of China
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, People's Republic of China
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22
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Zhang F, Li S, Shen Z, Cheng X, Xue Z, Zhang H, Song H, Bai K, Yan D, Wang H, Zhang Y, Huang Y. Rapidly deployable and morphable 3D mesostructures with applications in multimodal biomedical devices. Proc Natl Acad Sci U S A 2021; 118:e2026414118. [PMID: 33836614 PMCID: PMC7980465 DOI: 10.1073/pnas.2026414118] [Citation(s) in RCA: 20] [Impact Index Per Article: 5.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/19/2023] Open
Abstract
Structures that significantly and rapidly change their shapes and sizes upon external stimuli have widespread applications in a diversity of areas. The ability to miniaturize these deployable and morphable structures is essential for applications in fields that require high-spatial resolution or minimal invasiveness, such as biomechanics sensing, surgery, and biopsy. Despite intensive studies on the actuation mechanisms and material/structure strategies, it remains challenging to realize deployable and morphable structures in high-performance inorganic materials at small scales (e.g., several millimeters, comparable to the feature size of many biological tissues). The difficulty in integrating actuation materials increases as the size scales down, and many types of actuation forces become too small compared to the structure rigidity at millimeter scales. Here, we present schemes of electromagnetic actuation and design strategies to overcome this challenge, by exploiting the mechanics-guided three-dimensional (3D) assembly to enable integration of current-carrying metallic or magnetic films into millimeter-scale structures that generate controlled Lorentz forces or magnetic forces under an external magnetic field. Tailored designs guided by quantitative modeling and developed scaling laws allow formation of low-rigidity 3D architectures that deform significantly, reversibly, and rapidly by remotely controlled electromagnetic actuation. Reconfigurable mesostructures with multiple stable states can be also achieved, in which distinct 3D configurations are maintained after removal of the magnetic field. Demonstration of a functional device that combines the deep and shallow sensing for simultaneous measurements of thermal conductivities in bilayer films suggests the promising potential of the proposed strategy toward multimodal sensing of biomedical signals.
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Affiliation(s)
- Fan Zhang
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Shupeng Li
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60201
| | - Zhangming Shen
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Xu Cheng
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Zhaoguo Xue
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Hang Zhang
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Honglie Song
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Ke Bai
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Dongjia Yan
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Heling Wang
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208;
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60201
| | - Yihui Zhang
- Key Laboratory of Applied Mechanics of Ministry of Education, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China;
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Yonggang Huang
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208;
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60201
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23
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Deng H, Sattari K, Xie Y, Liao P, Yan Z, Lin J. Laser reprogramming magnetic anisotropy in soft composites for reconfigurable 3D shaping. Nat Commun 2020; 11:6325. [PMID: 33303761 PMCID: PMC7730436 DOI: 10.1038/s41467-020-20229-6] [Citation(s) in RCA: 65] [Impact Index Per Article: 13.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 08/10/2020] [Accepted: 11/19/2020] [Indexed: 02/08/2023] Open
Abstract
Responsive soft materials capable of exhibiting various three-dimensional (3D) shapes under the same stimulus are desirable for promising applications including adaptive and reconfigurable soft robots. Here, we report a laser rewritable magnetic composite film, whose responsive shape-morphing behaviors induced by a magnetic field can be digitally and repeatedly reprogrammed by a facile method of direct laser writing. The composite film is made from an elastomer and magnetic particles encapsulated by a phase change polymer. Once the phase change polymer is temporarily melted by transient laser heating, the orientation of the magnetic particles can be re-aligned upon change of a programming magnetic field. By the digital laser writing on selective areas, magnetic anisotropies can be encoded in the composite film and then reprogrammed by repeating the same procedure, thus leading to multimodal 3D shaping under the same actuation magnetic field. Furthermore, we demonstrated their functional applications in assembling multistate 3D structures driven by the magnetic force-induced buckling, fabricating multistate electrical switches for electronics, and constructing reconfigurable magnetic soft robots with locomotion modes of peristalsis, crawling, and rolling. Responsive soft materials which can exhibit various three-dimensional (3D) shapes under the same stimulus are desirable for applications in adaptive and reconfigurable soft robots. Here, the authors report a laser rewritable magnetic composite film, whose responsive shape-morphing behaviors induced by a magnetic field can be digitally and repeatedly reprogrammed by a facile method of direct laser writing.
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Affiliation(s)
- Heng Deng
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - Kianoosh Sattari
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - Yunchao Xie
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - Ping Liao
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - Zheng Yan
- Department of Biomedical, Biological, and Chemical Engineering, University of Missouri, Columbia, MO, 65211, USA
| | - Jian Lin
- Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, MO, 65211, USA. .,Department of Electrical Engineering and Computer Science, University of Missouri, Columbia, MO, 65211, USA. .,Department of Physics and Astronomy, University of Missouri, Columbia, MO, 65211, USA.
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