1
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Li S, Lu D, Li S, Liu J, Xu Y, Yan Y, Rodriguez JZ, Bai H, Avila R, Kang S, Ni X, Luan H, Guo H, Bai W, Wu C, Zhou X, Hu Z, Pet MA, Hammill CW, MacEwan MR, Ray WZ, Huang Y, Rogers JA. Bioresorbable, wireless, passive sensors for continuous pH measurements and early detection of gastric leakage. Sci Adv 2024; 10:eadj0268. [PMID: 38640247 PMCID: PMC11029800 DOI: 10.1126/sciadv.adj0268] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/01/2023] [Accepted: 03/18/2024] [Indexed: 04/21/2024]
Abstract
Continuous monitoring of biomarkers at locations adjacent to targeted internal organs can provide actionable information about postoperative status beyond conventional diagnostic methods. As an example, changes in pH in the intra-abdominal space after gastric surgeries can serve as direct indicators of potentially life-threatening leakage events, in contrast to symptomatic reactions that may delay treatment. Here, we report a bioresorbable, wireless, passive sensor that addresses this clinical need, designed to locally monitor pH for early detection of gastric leakage. A pH-responsive hydrogel serves as a transducer that couples to a mechanically optimized inductor-capacitor circuit for wireless readout. This platform enables real-time monitoring of pH with fast response time (within 1 hour) over a clinically relevant period (up to 7 days) and timely detection of simulated gastric leaks in animal models. These concepts have broad potential applications for temporary sensing of relevant biomarkers during critical risk periods following diverse types of surgeries.
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Affiliation(s)
- Shuo Li
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Di Lu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- School of Microelectronics, University of Science and Technology of China, Hefei, Anhui 230026, China
| | - Shupeng Li
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Jiaqi Liu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Yameng Xu
- The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA
| | - Ying Yan
- Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO 63110, USA
| | - Jorge Zárate Rodriguez
- Department of Surgery, Washington University School of Medicine, St. Louis, MO 63110, USA
| | - Hedan Bai
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Raudel Avila
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Shuming Kang
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Xinchen Ni
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Hexia Guo
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Wubin Bai
- Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC 27599, USA
| | - Changsheng Wu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore
| | - Xuhao Zhou
- Department of Chemistry, Northwestern University, Evanston, IL 60208, USA
| | - Ziying Hu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Mitchell A. Pet
- Department of Surgery, Washington University School of Medicine, St. Louis, MO 63110, USA
| | - Chet W. Hammill
- Department of Surgery, Washington University School of Medicine, St. Louis, MO 63110, USA
| | - Matthew R. MacEwan
- Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO 63110, USA
| | - Wilson Z. Ray
- Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO 63110, USA
| | - Yonggang Huang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
| | - John A. Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA
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2
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Liu J, Liu N, Xu Y, Wu M, Zhang H, Wang Y, Yan Y, Hill A, Song R, Xu Z, Park M, Wu Y, Ciatti JL, Gu J, Luan H, Zhang Y, Yang T, Ahn HY, Li S, Ray WZ, Franz CK, MacEwan MR, Huang Y, Hammill CW, Wang H, Rogers JA. Bioresorbable shape-adaptive structures for ultrasonic monitoring of deep-tissue homeostasis. Science 2024; 383:1096-1103. [PMID: 38452063 DOI: 10.1126/science.adk9880] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 09/21/2023] [Accepted: 01/12/2024] [Indexed: 03/09/2024]
Abstract
Monitoring homeostasis is an essential aspect of obtaining pathophysiological insights for treating patients. Accurate, timely assessments of homeostatic dysregulation in deep tissues typically require expensive imaging techniques or invasive biopsies. We introduce a bioresorbable shape-adaptive materials structure that enables real-time monitoring of deep-tissue homeostasis using conventional ultrasound instruments. Collections of small bioresorbable metal disks distributed within thin, pH-responsive hydrogels, deployed by surgical implantation or syringe injection, allow ultrasound-based measurements of spatiotemporal changes in pH for early assessments of anastomotic leaks after gastrointestinal surgeries, and their bioresorption after a recovery period eliminates the need for surgical extraction. Demonstrations in small and large animal models illustrate capabilities in monitoring leakage from the small intestine, the stomach, and the pancreas.
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Affiliation(s)
- Jiaqi Liu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Naijia Liu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Yameng Xu
- The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA
- Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO 63110, USA
| | - Mingzheng Wu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Haohui Zhang
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Yue Wang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Ying Yan
- Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO 63110, USA
| | - Angela Hill
- Department of Surgery, Washington University School of Medicine, St. Louis, MO 63110, USA
| | - Ruihao Song
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Chemical and Biological Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Zijie Xu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Minsu Park
- Department of Polymer Science and Engineering, Dankook University, Yongin 16890, Republic of Korea
| | - Yunyun Wu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Joanna L Ciatti
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Jianyu Gu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Yamin Zhang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Tianyu Yang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Hak-Young Ahn
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Shupeng Li
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Wilson Z Ray
- Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO 63110, USA
| | - Colin K Franz
- Regenerative Neurorehabilitation Laboratory, Shirley Ryan AbilityLab, Chicago, IL 60611, USA
- Department of Physical Medicine and Rehabilitation, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA
- The Ken and Ruth Davee Department of Neurology, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA
| | - Matthew R MacEwan
- Department of Neurosurgery, Washington University School of Medicine, St. Louis, MO 63110, USA
| | - Yonggang Huang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Chet W Hammill
- Department of Surgery, Washington University School of Medicine, St. Louis, MO 63110, USA
| | - Heling Wang
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
- Institute of Flexible Electronics Technology of THU Zhejiang, Jiaxing 314000, China
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA
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3
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Kim JT, Yoon HJ, Cheng S, Liu F, Kang S, Paudel S, Cho D, Luan H, Lee M, Jeong G, Park J, Huang YT, Lee SE, Cho M, Lee G, Han M, Kim BH, Yan J, Park Y, Jung S, Chamorro LP, Rogers JA. Functional bio-inspired hybrid fliers with separated ring and leading edge vortices. PNAS Nexus 2024; 3:pgae110. [PMID: 38516273 PMCID: PMC10957237 DOI: 10.1093/pnasnexus/pgae110] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 11/01/2023] [Accepted: 02/29/2024] [Indexed: 03/23/2024]
Abstract
Recent advances in passive flying systems inspired by wind-dispersed seeds contribute to increasing interest in their use for remote sensing applications across large spatial domains in the Lagrangian frame of reference. These concepts create possibilities for developing and studying structures with performance characteristics and operating mechanisms that lie beyond those found in nature. Here, we demonstrate a hybrid flier system, fabricated through a process of controlled buckling, to yield unusual geometries optimized for flight. Specifically, these constructs simultaneously exploit distinct fluid phenomena, including separated vortex rings from features that resemble those of dandelion seeds and the leading-edge vortices derived from behaviors of maple seeds. Advanced experimental measurements and computational simulations of the aerodynamics and induced flow physics of these hybrid fliers establish a concise, scalable analytical framework for understanding their flight mechanisms. Demonstrations with functional payloads in various forms, including bioresorbable, colorimetric, gas-sensing, and light-emitting platforms, illustrate examples with diverse capabilities in sensing and tracking.
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Affiliation(s)
- Jin-Tae Kim
- Department of Mechanical Engineering, Pohang University of Science and Technology, Pohang 37673, Republic of Korea
| | - Hong-Joon Yoon
- Department of Electronic Engineering, Gachon University, Gyeonggi-do 13120, Republic of Korea
| | - Shyuan Cheng
- Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL 61801, USA
| | - Fei Liu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Soohyeon Kang
- Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL 61801, USA
| | - Shashwot Paudel
- Department of Civil and Environmental Engineering, University of Illinois, Urbana, IL 61801, USA
| | - Donghwi Cho
- Advanced Materials Division, Korea Research Institute of Chemical Technology, Daejeon 34114, Republic of Korea
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Minkyu Lee
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Gooyoon Jeong
- Department of Advanced Materials Engineering for Information and Electronics, Integrated Education Institute for Frontier Science & Technology (BK21 Four), Kyung Hee University, Yongin-si, 17104, Republic of Korea
| | - Jaehong Park
- Department of Chemical and Biomolecular Engineering, University of Illinois, Urbana, IL 61801, USA
| | - Yu-Ting Huang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Su Eon Lee
- Department of Robotics and Mechatronics Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, Republic of Korea
| | - Min Cho
- Department of Chemical and Biomolecular Engineering, University of Illinois, Urbana, IL 61801, USA
| | - Geonhee Lee
- Advanced Materials Division, Korea Research Institute of Chemical Technology, Daejeon 34114, Republic of Korea
| | - Mengdi Han
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100091, China
| | - Bong Hoon Kim
- Department of Robotics and Mechatronics Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, Republic of Korea
| | - Jinhui Yan
- Department of Civil and Environmental Engineering, University of Illinois, Urbana, IL 61801, USA
| | - Yoonseok Park
- Department of Advanced Materials Engineering for Information and Electronics, Integrated Education Institute for Frontier Science & Technology (BK21 Four), Kyung Hee University, Yongin-si, 17104, Republic of Korea
| | - Sunghwan Jung
- Department of Biological and Environmental Engineering, Cornell University, Ithaca, NY 14853, USA
| | - Leonardo P Chamorro
- Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL 61801, USA
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
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4
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Ryu H, Song JW, Luan H, Sim Y, Kwak SS, Jang H, Jo YJ, Yoon HJ, Jeong H, Shin J, Park DY, Kwon K, Ameer GA, Rogers JA. Materials and Device Designs for Wireless Monitoring of Temperature and Thermal Transport Properties of Wound Beds during Healing. Adv Healthc Mater 2024; 13:e2302797. [PMID: 37983897 DOI: 10.1002/adhm.202302797] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 08/23/2023] [Revised: 11/02/2023] [Indexed: 11/22/2023]
Abstract
Chronic wounds represent a major health risk for diabetic patients. Regeneration of such wounds requires regular medical treatments over periods that can extend for several months or more. Schemes for monitoring the healing process can provide important feedback to the patient and caregiver. Although qualitative indicators such as malodor or fever can provide some indirect information, quantitative measurements of the wound bed have the potential to yield important insights. The work presented here introduces materials and engineering designs for a wireless system that captures spatio-temporal temperature and thermal transport information across the wound continuously throughout the healing process. Systematic experimental and computational studies establish the materials aspects and basic capabilities of this technology. In vivo studies reveal that both the temperature and the changes in this quantity offer information on wound status, with indications of initial exothermic reactions and mechanisms of scar tissue formation. Bioresorbable materials serve as the foundations for versions of this device that create possibilities for monitoring on and within the wound site, in a way that bypasses the risks of physical removal.
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Affiliation(s)
- Hanjun Ryu
- Department of Advanced Materials Engineering, Chung-Ang University, Anseong, 17546, Republic of Korea
- Department of Intelligence Energy and Industry, Chung-Ang University, Seoul, 06974, Republic of Korea
| | - Joseph W Song
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Center for Advanced Regenerative Engineering, Northwestern University, Evanston, IL, 60208, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Mechanical and Aerospace Engineering, University of California, San Diego, La Jolla, CA, 92093, USA
| | - Youngmin Sim
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea
| | - Sung Soo Kwak
- Center for Bionics of Biomedical Research Institute, Korea Institute of Science and Technology, Seoul, 02456, Republic of Korea
| | - Hokyung Jang
- Science Corp. 1010 Atlantic Ave. 100, Alameda, CA, 94501, USA
| | - Young Jin Jo
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Hong-Joon Yoon
- Department of Electronic Engineering, Gachon University, Seongnam, 13120, Republic of Korea
| | - Hyoyoung Jeong
- Department of Electrical and Computer Engineering, University of California, Davis, Davis, CA, 95616, USA
| | - Jaeho Shin
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Do Yun Park
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea
| | - Kyeongha Kwon
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea
| | - Guillermo Antonio Ameer
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Center for Advanced Regenerative Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Chemistry of Life Processes Institute, Northwestern University, Evanston, IL, 60208, USA
- International Institute for Nanotechnology, Northwestern University, Evanston, IL, 60208, USA
- Simpson Querrey Institute for Bionanotechnology, Evanston, IL, 60208, USA
| | - John A Rogers
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Center for Advanced Regenerative Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Chemistry of Life Processes Institute, Northwestern University, Evanston, IL, 60208, USA
- International Institute for Nanotechnology, Northwestern University, Evanston, IL, 60208, USA
- Simpson Querrey Institute for Bionanotechnology, Evanston, IL, 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Evanston, IL, 60208, USA
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5
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Ouyang W, Lu W, Zhang Y, Liu Y, Kim JU, Shen H, Wu Y, Luan H, Kilner K, Lee SP, Lu Y, Yang Y, Wang J, Yu Y, Wegener AJ, Moreno JA, Xie Z, Wu Y, Won SM, Kwon K, Wu C, Bai W, Guo H, Liu TL, Bai H, Monti G, Zhu J, Madhvapathy SR, Trueb J, Stanslaski M, Higbee-Dempsey EM, Stepien I, Ghoreishi-Haack N, Haney CR, Kim TI, Huang Y, Ghaffari R, Banks AR, Jhou TC, Good CH, Rogers JA. A wireless and battery-less implant for multimodal closed-loop neuromodulation in small animals. Nat Biomed Eng 2023; 7:1252-1269. [PMID: 37106153 DOI: 10.1038/s41551-023-01029-x] [Citation(s) in RCA: 14] [Impact Index Per Article: 14.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/18/2022] [Accepted: 03/26/2023] [Indexed: 04/29/2023]
Abstract
Fully implantable wireless systems for the recording and modulation of neural circuits that do not require physical tethers or batteries allow for studies that demand the use of unconstrained and freely behaving animals in isolation or in social groups. Moreover, feedback-control algorithms that can be executed within such devices without the need for remote computing eliminate virtual tethers and any associated latencies. Here we report a wireless and battery-less technology of this type, implanted subdermally along the back of freely moving small animals, for the autonomous recording of electroencephalograms, electromyograms and body temperature, and for closed-loop neuromodulation via optogenetics and pharmacology. The device incorporates a system-on-a-chip with Bluetooth Low Energy for data transmission and a compressed deep-learning module for autonomous operation, that offers neurorecording capabilities matching those of gold-standard wired systems. We also show the use of the implant in studies of sleep-wake regulation and for the programmable closed-loop pharmacological suppression of epileptic seizures via feedback from electroencephalography. The technology can support a broader range of applications in neuroscience and in biomedical research with small animals.
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Affiliation(s)
- Wei Ouyang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Wei Lu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Yamin Zhang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Yiming Liu
- Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, USA
| | - Jong Uk Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
- School of Chemical Engineering, Sungkyunkwan University, Suwon, Republic of Korea
| | - Haixu Shen
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Yunyun Wu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | | | - Stephen P Lee
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
- Neurolux Inc., Northfield, IL, USA
| | - Yinsheng Lu
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Yiyuan Yang
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA
| | - Jin Wang
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | | | - Amy J Wegener
- US Army Research Laboratory, Aberdeen Proving Ground, MD, USA
- US Army Medical Research Institute of Chemical Defense, Aberdeen Proving Ground, MD, USA
| | - Justin A Moreno
- US Army Research Laboratory, Aberdeen Proving Ground, MD, USA
- US Army Medical Research Institute of Chemical Defense, Aberdeen Proving Ground, MD, USA
- SURVICE Engineering, Belcamp, MD, USA
| | - Zhaoqian Xie
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA
| | - Yixin Wu
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Sang Min Won
- Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea
| | - Kyeongha Kwon
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea
| | - Changsheng Wu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Wubin Bai
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
- Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, USA
| | - Hexia Guo
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Tzu-Li Liu
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA
| | - Hedan Bai
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Giuditta Monti
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA
| | - Jason Zhu
- Department of Chemical and Biological Engineering, Northwestern University, Evanston, IL, USA
- Department of Chemistry, Northwestern University, Evanston, IL, USA
| | - Surabhi R Madhvapathy
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Jacob Trueb
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | | | | | - Iwona Stepien
- Developmental Therapeutics Core, Northwestern University, Evanston, IL, USA
| | | | - Chad R Haney
- Center for Advanced Molecular Imaging, Northwestern University, Evanston, IL, USA
| | - Tae-Il Kim
- School of Chemical Engineering, Sungkyunkwan University, Suwon, Republic of Korea
- Biomedical Institute for Convergence at SKKU (BICS), Sungkyunkwan University (SKKU), Suwon, Republic of Korea
| | - Yonggang Huang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA
| | - Roozbeh Ghaffari
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
- Neurolux Inc., Northfield, IL, USA
| | - Anthony R Banks
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
- Neurolux Inc., Northfield, IL, USA
| | - Thomas C Jhou
- Department of Neurosciences, Medical University of South Carolina, Charleston, SC, USA.
| | - Cameron H Good
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
- Neurolux Inc., Northfield, IL, USA.
- US Army Research Laboratory, Aberdeen Proving Ground, MD, USA.
- US Army Medical Research Institute of Chemical Defense, Aberdeen Proving Ground, MD, USA.
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA.
- Department of Chemistry, Northwestern University, Evanston, IL, USA.
- Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Evanston, IL, USA.
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6
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Kim Y, Yang Y, Zhang X, Li Z, Vázquez-Guardado A, Park I, Wang J, Efimov AI, Dou Z, Wang Y, Park J, Luan H, Ni X, Kim YS, Baek J, Park JJ, Xie Z, Zhao H, Gazzola M, Rogers JA, Bashir R. Remote control of muscle-driven miniature robots with battery-free wireless optoelectronics. Sci Robot 2023; 8:eadd1053. [PMID: 36652505 DOI: 10.1126/scirobotics.add1053] [Citation(s) in RCA: 6] [Impact Index Per Article: 6.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/19/2023]
Abstract
Bioengineering approaches that combine living cellular components with three-dimensional scaffolds to generate motion can be used to develop a new generation of miniature robots. Integrating on-board electronics and remote control in these biological machines will enable various applications across engineering, biology, and medicine. Here, we present hybrid bioelectronic robots equipped with battery-free and microinorganic light-emitting diodes for wireless control and real-time communication. Centimeter-scale walking robots were computationally designed and optimized to host on-board optoelectronics with independent stimulation of multiple optogenetic skeletal muscles, achieving remote command of walking, turning, plowing, and transport functions both at individual and collective levels. This work paves the way toward a class of biohybrid machines able to combine biological actuation and sensing with on-board computing.
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Affiliation(s)
- Yongdeok Kim
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.,Nick J. Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Yiyuan Yang
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA
| | - Xiaotian Zhang
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Zhengwei Li
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.,Department of Biomedical Engineering, University of Houston, Houston, TX 77204, USA.,Department of Biomedical Sciences, University of Houston, Houston, TX 77204, USA
| | | | - Insu Park
- Nick J. Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Jiaojiao Wang
- Nick J. Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.,Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Andrew I Efimov
- Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Zhi Dou
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Yue Wang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.,Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Junehu Park
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Xinchen Ni
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Yun Seong Kim
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Janice Baek
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.,Nick J. Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Joshua Jaehyung Park
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Zhaoqian Xie
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, DUT-BSU Joint Institute, Dalian University of Technology, Dalian 116024, China
| | - Hangbo Zhao
- Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA 90089, USA
| | - Mattia Gazzola
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.,National Center for Supercomputing Applications, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.,Carl R. Woese Institute for Genomic Biology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - John A Rogers
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA.,Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.,Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA
| | - Rashid Bashir
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.,Nick J. Holonyak Micro and Nanotechnology Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.,Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.,Department of Bioengineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.,Carl R. Woese Institute for Genomic Biology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.,Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
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7
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Yoon HJ, Lee G, Kim JT, Yoo JY, Luan H, Cheng S, Kang S, Huynh HLT, Kim H, Park J, Kim J, Kwak SS, Ryu H, Kim J, Choi YS, Ahn HY, Choi J, Oh S, Jung YH, Park M, Bai W, Huang Y, Chamorro LP, Park Y, Rogers JA. Biodegradable, three-dimensional colorimetric fliers for environmental monitoring. Sci Adv 2022; 8:eade3201. [PMID: 36563148 PMCID: PMC9788784 DOI: 10.1126/sciadv.ade3201] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 08/09/2022] [Accepted: 11/16/2022] [Indexed: 06/17/2023]
Abstract
Recently reported winged microelectronic systems offer passive flight mechanisms as a dispersal strategy for purposes in environmental monitoring, population surveillance, pathogen tracking, and other applications. Initial studies indicate potential for technologies of this type, but advances in structural and responsive materials and in aerodynamically optimized geometries are necessary to improve the functionality and expand the modes of operation. Here, we introduce environmentally degradable materials as the basis of 3D fliers that allow remote, colorimetric assessments of multiple environmental parameters-pH, heavy metal concentrations, and ultraviolet exposure, along with humidity levels and temperature. Experimental and theoretical investigations of the aerodynamics of these systems reveal design considerations that include not only the geometries of the structures but also their mass distributions across a range of bioinspired designs. Preliminary field studies that rely on drones for deployment and for remote colorimetric analysis by machine learning interpretation of digital images illustrate scenarios for practical use.
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Affiliation(s)
- Hong-Joon Yoon
- Department of Electronic Engineering, Gachon University, Seongnam-si, Gyeonggi-do 13120, Republic of Korea
| | - Geumbee Lee
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Jin-Tae Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Jae-Young Yoo
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Shyuan Cheng
- Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL 61801, USA
| | - Soohyeon Kang
- Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL 61801, USA
| | - Huong Le Thien Huynh
- Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Hyeonsu Kim
- Department of Chemical and Biomolecular Engineering, University of Illinois, Urbana, IL 61801, USA
| | - Jaehong Park
- Department of Chemical and Biomolecular Engineering, University of Illinois, Urbana, IL 61801, USA
| | - Joohee Kim
- Center for Bionics of Biomedical Research Institute, Korea Institute of Science and Technology, Seoul 02792, Republic of Korea
| | - Sung Soo Kwak
- Center for Bionics of Biomedical Research Institute, Korea Institute of Science and Technology, Seoul 02792, Republic of Korea
| | - Hanjun Ryu
- Department of Advanced Materials Engineering, Chung-Ang University, 4726 Seodong-daero, Daedeok-myeon, Anseong-si, Gyeonggi-do 17546, Republic of Korea
| | - Jihye Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Yeon Sik Choi
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Yonsei University, 50 Yonsei-ro, Seodaemun-gu, Seoul 03722, Republic of Korea
| | - Hak-Young Ahn
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Junhwan Choi
- Department of Chemical Engineering, Dankook University, Yongin 16890, Republic of Korea
| | - Seyong Oh
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Yei Hwan Jung
- Department of Electronic Engineering, Hanyang University, Seoul, Republic of Korea
| | - Minsu Park
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Wubin Bai
- Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC 27514, USA
| | - Yonggang Huang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Leonardo P. Chamorro
- Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL 61801, USA
| | - Yoonseok Park
- Department of Advanced Materials Engineering for Information and Electronics, Kyung Hee University, Yongin 17104, Republic of Korea
| | - John A. Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Neurological Surgery, Northwestern University, Evanston, IL 60208, USA
- Feinberg School of Medicine, Northwestern University, Evanston, IL 60208, USA
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8
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Ji B, Wang T, Li M, Shi L, You X, Sun F, Luan H. Localized Surface Hydrophilicity Tailoring of Polyimide Film for Flexible Electronics Manufacturing Using an Atmospheric Pressure Ar/H 2O Microplasma Jet. Micromachines (Basel) 2022; 13:1853. [PMID: 36363874 PMCID: PMC9696727 DOI: 10.3390/mi13111853] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 10/02/2022] [Revised: 10/26/2022] [Accepted: 10/26/2022] [Indexed: 06/16/2023]
Abstract
The poor hydrophilicity of polyimide (PI) films limits their applications in flexible electronics, such as in wearable and implantable bio-MEMS devices. In this paper, an atmospheric pressure Ar/H2O microplasma jet (μAPPJ) with a nozzle diameter of 100 μm was utilized to site-selectively tune the surface hydrophilicity of a PI film. The electrical and optical characteristics of the μAPPJ were firstly investigated, and the results showed that multi-spikes occurred during the plasma discharge and that diverse reactive species, such as O atoms and OH radicals, were generated in the plasma plume. The physical and chemical properties of pristine and microplasma-modified PI surfaces were characterized by the water contact angle (WCA), atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS). The wettability of the PI surface was significantly enhanced after microplasma modification, and the WCA could be adjusted by varying the applied voltage, water vapor content, plasma treatment time and storage time. The AFM images indicated that the surface roughness increased after the plasma treatment, which partially contributed to an improvement in the surface hydrophilicity. The XPS results showed a reduction in the C content and an increase in the O content, and abundant hydrophilic polar oxygen-containing functional groups were also grafted onto the PI film surface. Finally, the interaction mechanism between the PI molecular chains and the microplasma is discussed. The breaking of C-N and C-O bonds and the grafting of OH radicals were the key pathways to dominate the reaction process.
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Affiliation(s)
- Bowen Ji
- Unmanned System Research Institute, Northwestern Polytechnical University, Xi’an 710072, China
- Collaborative Innovation Center, Northwestern Polytechnical University, Shanghai 201108, China
| | - Tao Wang
- School of Mechanical Engineering, Anhui University of Technology, Ma’anshan 243032, China
| | - Meng Li
- School of Mechanical Engineering, Anhui University of Technology, Ma’anshan 243032, China
| | - Liping Shi
- School of Mechanical Engineering, Anhui University of Technology, Ma’anshan 243032, China
| | - Xiaoli You
- Unmanned System Research Institute, Northwestern Polytechnical University, Xi’an 710072, China
- Collaborative Innovation Center, Northwestern Polytechnical University, Shanghai 201108, China
| | - Fanqi Sun
- Unmanned System Research Institute, Northwestern Polytechnical University, Xi’an 710072, China
- Collaborative Innovation Center, Northwestern Polytechnical University, Shanghai 201108, China
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60201, USA
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9
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Ni X, Luan H, Kim JT, Rogge SI, Bai Y, Kwak JW, Liu S, Yang DS, Li S, Li S, Li Z, Zhang Y, Wu C, Ni X, Huang Y, Wang H, Rogers JA. Soft shape-programmable surfaces by fast electromagnetic actuation of liquid metal networks. Nat Commun 2022; 13:5576. [PMID: 36151092 PMCID: PMC9508113 DOI: 10.1038/s41467-022-31092-y] [Citation(s) in RCA: 10] [Impact Index Per Article: 5.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/19/2022] [Accepted: 06/01/2022] [Indexed: 11/15/2022] Open
Abstract
Low modulus materials that can shape-morph into different three-dimensional (3D) configurations in response to external stimuli have wide-ranging applications in flexible/stretchable electronics, surgical instruments, soft machines and soft robotics. This paper reports a shape-programmable system that exploits liquid metal microfluidic networks embedded in an elastomer matrix, with electromagnetic forms of actuation, to achieve a unique set of properties. Specifically, this materials structure is capable of fast, continuous morphing into a diverse set of continuous, complex 3D surfaces starting from a two-dimensional (2D) planar configuration, with fully reversible operation. Computational, multi-physics modeling methods and advanced 3D imaging techniques enable rapid, real-time transformations between target shapes. The liquid-solid phase transition of the liquid metal allows for shape fixation and reprogramming on demand. An unusual vibration insensitive, dynamic 3D display screen serves as an application example of this type of morphable surface. Low modulus materials that can change shape in response to external stimuli are promising for a wide range of applications. The authors here introduce a shape-reprogrammable construct, based on liquid metal microfluidic networks and electromagnetic actuation, that supports a unique collection of capabilities.
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Affiliation(s)
- Xinchen Ni
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Jin-Tae Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Sam I Rogge
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Yun Bai
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.,Department of Mechanical Engineering and Materials Science, Duke University, Durham, NC, USA
| | - Jean Won Kwak
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA
| | - Shangliangzi Liu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Da Som Yang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Shuo Li
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Shupeng Li
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA
| | - Zhengwei Li
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Yamin Zhang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Changsheng Wu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Xiaoyue Ni
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA. .,Department of Mechanical Engineering and Materials Science, Duke University, Durham, NC, USA. .,Department of Biostatistics and Bioinformatics, Duke University, Durham, NC, USA.
| | - Yonggang Huang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA. .,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. .,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. .,Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
| | - Heling Wang
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. .,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. .,Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA. .,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. .,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. .,Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA. .,Department of Neurological Surgery, Northwestern University, Evanston, IL, USA. .,Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, USA. .,Department of Chemistry, Northwestern University, Evanston, IL, USA.
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10
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Taylor JM, Luan H, Lewis JA, Rogers JA, Nuzzo RG, Braun PV. Biomimetic and Biologically Compliant Soft Architectures via 3D and 4D Assembly Methods: A Perspective. Adv Mater 2022; 34:e2108391. [PMID: 35233865 DOI: 10.1002/adma.202108391] [Citation(s) in RCA: 17] [Impact Index Per Article: 8.5] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/19/2021] [Revised: 01/08/2022] [Indexed: 06/14/2023]
Abstract
Recent progress in soft material chemistry and enabling methods of 3D and 4D fabrication-emerging programmable material designs and associated assembly methods for the construction of complex functional structures-is highlighted. The underlying advances in this science allow the creation of soft material architectures with properties and shapes that programmably vary with time. The ability to control composition from the molecular to the macroscale is highlighted-most notably through examples that focus on biomimetic and biologically compliant soft materials. Such advances, when coupled with the ability to program material structure and properties across multiple scales via microfabrication, 3D printing, or other assembly techniques, give rise to responsive (4D) architectures. The challenges and prospects for progress in this emerging field in terms of its capacities for integrating chemistry, form, and function are described in the context of exemplary soft material systems demonstrating important but heretofore difficult-to-realize biomimetic and biologically compliant behaviors.
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Affiliation(s)
- Jay M Taylor
- Department of Materials Science and Engineering, Materials Research Laboratory, Beckman Institute for Advanced Science and Technology, University of Illinois Urbana-Champaign, 104 South Goodwin Ave., Urbana, IL, 61801, USA
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Jennifer A Lewis
- John A. Paulson School of Engineering and Applied Sciences Wyss Institute for Biologically Inspired Engineering, Harvard University, 29 Oxford Street, Cambridge, MA, 02138, USA
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Departments of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical and Computer Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Ralph G Nuzzo
- Department of Chemistry, University of Illinois Urbana-Champaign, 600 S Mathews Avenue, Urbana, IL, 61801, USA
- Surface and Corrosion Science, School of Engineering Sciences in Chemistry, Biotechnology and Health, KTH Royal Institute of Technology, Drottning Kristinasväg 51, Stockholm, 10044, Sweden
| | - Paul V Braun
- Department of Materials Science and Engineering, Materials Research Laboratory, Beckman Institute for Advanced Science and Technology, University of Illinois Urbana-Champaign, 104 South Goodwin Ave., Urbana, IL, 61801, USA
- Department of Chemistry, University of Illinois Urbana-Champaign, 600 S Mathews Avenue, Urbana, IL, 61801, USA
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11
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Li K, Shuai Y, Cheng X, Luan H, Liu S, Yang C, Xue Z, Huang Y, Zhang Y. Island Effect in Stretchable Inorganic Electronics. Small 2022; 18:e2107879. [PMID: 35307953 DOI: 10.1002/smll.202107879] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/19/2021] [Revised: 02/28/2022] [Indexed: 06/14/2023]
Abstract
Island-bridge architectures represent a widely used structural design in stretchable inorganic electronics, where deformable interconnects that form the bridge provide system stretchability, and functional components that reside on the islands undergo negligible deformations. These device systems usually experience a common strain concentration phenomenon, i.e., "island effect", because of the modulus mismatch between the soft elastomer substrate and its on-top rigid components. Such an island effect can significantly raise the surrounding local strain, therefore increasing the risk of material failure for the interconnects in the vicinity of the islands. In this work, a systematic study of such an island effect through combined theoretical analysis, numerical simulations and experimental measurements is presented. To relieve the island effect, a buffer layer strategy is proposed as a generic route to enhanced stretchabilities of deformable interconnects. Both experimental and numerical results illustrate the applicability of this strategy to 2D serpentine and 3D helical interconnects, as evidenced by the increased stretchabilities (e.g., by 1.5 times with a simple buffer layer, and 2 times with a ring buffer layer, both for serpentine interconnects). The application of the patterned buffer layer strategy in a stretchable light emitting diodes system suggests promising potentials for uses in other functional device systems.
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Affiliation(s)
- Kan Li
- State Key Laboratory of Digital Manufacture Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, P. R. China
| | - Yumeng Shuai
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Xu Cheng
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Haiwen Luan
- Departments of Mechanical Engineering, Civil and Environmental Engineering, and Materials Science and Engineering and Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
| | - Siyi Liu
- Center for Mechanics of Solids, Structures and Materials, Department of Aerospace Engineering and Engineering Mechanics, University of Texas at Austin, Austin, TX, 78712, USA
| | - Ce Yang
- Department of Mechanical Engineering, Tsinghua University, Beijing, 100084, P. R. China
| | - Zhaoguo Xue
- Institute of Solid Mechanics, Beihang University (BUAA), Beijing, 100191, P. R. China
| | - Yonggang Huang
- Departments of Mechanical Engineering, Civil and Environmental Engineering, and Materials Science and Engineering and Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
| | - Yihui Zhang
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
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12
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Kim J, Wu Y, Luan H, Yang DS, Cho D, Kwak SS, Liu S, Ryu H, Ghaffari R, Rogers JA. A Skin-Interfaced, Miniaturized Microfluidic Analysis and Delivery System for Colorimetric Measurements of Nutrients in Sweat and Supply of Vitamins Through the Skin. Adv Sci (Weinh) 2022; 9:e2103331. [PMID: 34747140 PMCID: PMC8805554 DOI: 10.1002/advs.202103331] [Citation(s) in RCA: 37] [Impact Index Per Article: 18.5] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/01/2021] [Revised: 09/27/2021] [Indexed: 06/01/2023]
Abstract
Nutrients play critical roles in maintaining core physiological functions and in preventing diseases. Technologies for delivering these nutrients and for monitoring their concentrations can help to ensure proper nutritional balance. Eccrine sweat is a potentially attractive class of biofluid for monitoring purposes due to the ability to capture sweat easily and noninvasively from nearly any region of the body using skin-integrated microfluidic technologies. Here, a miniaturized system of this type is presented that allows simple, rapid colorimetric assessments of the concentrations of multiple essential nutrients in sweat, simultaneously and without any supporting electronics - vitamin C, calcium, zinc, and iron. A transdermal patch integrated directly with the microfluidics supports passive, sustained delivery of these species to the body throughout a period of wear. Comparisons of measurement results to those from traditional lab analysis methods demonstrate the accuracy and reliability of this platform. On-body tests with human subjects reveal correlations between the time dynamics of concentrations of these nutrients in sweat and those of the corresponding concentrations in blood. Studies conducted before and after consuming certain foods and beverages highlight practical capabilities in monitoring nutritional balance, with strong potential to serve as a basis for guiding personalized dietary choices.
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Affiliation(s)
- Joohee Kim
- Center for Bio‐Integrated ElectronicsNorthwestern UniversityEvanstonIL60208USA
- Querrey Simpson Institute for BioelectronicsNorthwestern UniversityEvanstonIL60208USA
| | - Yixin Wu
- Center for Bio‐Integrated ElectronicsNorthwestern UniversityEvanstonIL60208USA
- Querrey Simpson Institute for BioelectronicsNorthwestern UniversityEvanstonIL60208USA
- Department of Materials Science and EngineeringNorthwestern UniversityEvanstonIL60208USA
| | - Haiwen Luan
- Center for Bio‐Integrated ElectronicsNorthwestern UniversityEvanstonIL60208USA
- Querrey Simpson Institute for BioelectronicsNorthwestern UniversityEvanstonIL60208USA
| | - Da Som Yang
- Center for Bio‐Integrated ElectronicsNorthwestern UniversityEvanstonIL60208USA
- Querrey Simpson Institute for BioelectronicsNorthwestern UniversityEvanstonIL60208USA
| | - Donghwi Cho
- Center for Bio‐Integrated ElectronicsNorthwestern UniversityEvanstonIL60208USA
- Querrey Simpson Institute for BioelectronicsNorthwestern UniversityEvanstonIL60208USA
| | - Sung Soo Kwak
- Center for Bio‐Integrated ElectronicsNorthwestern UniversityEvanstonIL60208USA
- Querrey Simpson Institute for BioelectronicsNorthwestern UniversityEvanstonIL60208USA
- Center for Bionics of Biomedical Research InstituteKorea Institute of Science and TechnologySeoul02792Korea
| | - Shanliangzi Liu
- Center for Bio‐Integrated ElectronicsNorthwestern UniversityEvanstonIL60208USA
- Querrey Simpson Institute for BioelectronicsNorthwestern UniversityEvanstonIL60208USA
| | - Hanjun Ryu
- Center for Bio‐Integrated ElectronicsNorthwestern UniversityEvanstonIL60208USA
- Querrey Simpson Institute for BioelectronicsNorthwestern UniversityEvanstonIL60208USA
| | - Roozbeh Ghaffari
- Center for Bio‐Integrated ElectronicsNorthwestern UniversityEvanstonIL60208USA
- Querrey Simpson Institute for BioelectronicsNorthwestern UniversityEvanstonIL60208USA
- Department of Biomedical EngineeringNorthwestern UniversityEvanstonIL60208USA
| | - John A. Rogers
- Center for Bio‐Integrated ElectronicsNorthwestern UniversityEvanstonIL60208USA
- Querrey Simpson Institute for BioelectronicsNorthwestern UniversityEvanstonIL60208USA
- Department of Materials Science and EngineeringNorthwestern UniversityEvanstonIL60208USA
- Department of Biomedical EngineeringNorthwestern UniversityEvanstonIL60208USA
- Department of Mechanical EngineeringNorthwestern UniversityEvanstonIL60208USA
- Department of Neurological SurgeryFeinberg School of MedicineNorthwestern UniversityChicagoIL60611USA
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13
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Yang Q, Wei T, Yin RT, Wu M, Xu Y, Koo J, Choi YS, Xie Z, Chen SW, Kandela I, Yao S, Deng Y, Avila R, Liu TL, Bai W, Yang Y, Han M, Zhang Q, Haney CR, Benjamin Lee K, Aras K, Wang T, Seo MH, Luan H, Lee SM, Brikha A, Ghoreishi-Haack N, Tran L, Stepien I, Aird F, Waters EA, Yu X, Banks A, Trachiotis GD, Torkelson JM, Huang Y, Kozorovitskiy Y, Efimov IR, Rogers JA. Photocurable bioresorbable adhesives as functional interfaces between flexible bioelectronic devices and soft biological tissues. Nat Mater 2021; 20:1559-1570. [PMID: 34326506 PMCID: PMC8551016 DOI: 10.1038/s41563-021-01051-x] [Citation(s) in RCA: 70] [Impact Index Per Article: 23.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/11/2020] [Accepted: 06/11/2021] [Indexed: 05/07/2023]
Abstract
Flexible electronic/optoelectronic systems that can intimately integrate onto the surfaces of vital organ systems have the potential to offer revolutionary diagnostic and therapeutic capabilities relevant to a wide spectrum of diseases and disorders. The critical interfaces between such technologies and living tissues must provide soft mechanical coupling and efficient optical/electrical/chemical exchange. Here, we introduce a functional adhesive bioelectronic-tissue interface material, in the forms of mechanically compliant, electrically conductive, and optically transparent encapsulating coatings, interfacial layers or supporting matrices. These materials strongly bond both to the surfaces of the devices and to those of different internal organs, with stable adhesion for several days to months, in chemistries that can be tailored to bioresorb at controlled rates. Experimental demonstrations in live animal models include device applications that range from battery-free optoelectronic systems for deep-brain optogenetics and subdermal phototherapy to wireless millimetre-scale pacemakers and flexible multielectrode epicardial arrays. These advances have immediate applicability across nearly all types of bioelectronic/optoelectronic system currently used in animal model studies, and they also have the potential for future treatment of life-threatening diseases and disorders in humans.
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Affiliation(s)
- Quansan Yang
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA
| | - Tong Wei
- Department of Chemical and Biological Engineering, Northwestern University, Evanston, IL, USA
| | - Rose T Yin
- Department of Biomedical Engineering, The George Washington University, Washington, DC, USA
| | - Mingzheng Wu
- Department of Neurobiology, Northwestern University, Evanston, IL, USA
| | - Yameng Xu
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
- The Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO, USA
| | - Jahyun Koo
- School of Biomedical Engineering, Korea University, Seoul, Republic of Korea
| | - Yeon Sik Choi
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Zhaoqian Xie
- State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian, China
- Department of Engineering Mechanics, Dalian University of Technology, Dalian, China
- Ningbo Institute of Dalian University of Technology, Ningbo, China
| | - Sheena W Chen
- Department of Surgery, The George Washington University, Washington, DC, USA
| | - Irawati Kandela
- Developmental Therapeutics Core, Northwestern University, Evanston, IL, USA
- Chemistry Life Processes Institute, Northwestern University, Evanston, IL, USA
| | - Shenglian Yao
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing, China
| | - Yujun Deng
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA
- State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, China
| | - Raudel Avila
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA
| | - Tzu-Li Liu
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA
| | - Wubin Bai
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
- Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, USA
| | - Yiyuan Yang
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA
| | - Mengdi Han
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Qihui Zhang
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Chad R Haney
- Chemistry Life Processes Institute, Northwestern University, Evanston, IL, USA
- Center for Advanced Molecular Imaging, Northwestern University, Evanston, IL, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA
| | - K Benjamin Lee
- Department of Surgery, The George Washington University, Washington, DC, USA
| | - Kedar Aras
- Department of Biomedical Engineering, The George Washington University, Washington, DC, USA
| | - Tong Wang
- Department of Chemical and Biological Engineering, Northwestern University, Evanston, IL, USA
| | - Min-Ho Seo
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
- School of Biomedical Convergence Engineering, College of Information & Biomedical Engineering, Pusan National University, Pusan, Republic of Korea
| | - Haiwen Luan
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA
| | - Seung Min Lee
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Anlil Brikha
- Chemistry Life Processes Institute, Northwestern University, Evanston, IL, USA
- Center for Advanced Molecular Imaging, Northwestern University, Evanston, IL, USA
| | | | - Lori Tran
- Developmental Therapeutics Core, Northwestern University, Evanston, IL, USA
- Chemistry Life Processes Institute, Northwestern University, Evanston, IL, USA
| | - Iwona Stepien
- Developmental Therapeutics Core, Northwestern University, Evanston, IL, USA
- Chemistry Life Processes Institute, Northwestern University, Evanston, IL, USA
| | - Fraser Aird
- Chemistry Life Processes Institute, Northwestern University, Evanston, IL, USA
| | - Emily A Waters
- Chemistry Life Processes Institute, Northwestern University, Evanston, IL, USA
- Center for Advanced Molecular Imaging, Northwestern University, Evanston, IL, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA
| | - Xinge Yu
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Anthony Banks
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Gregory D Trachiotis
- Department of Biomedical Engineering, The George Washington University, Washington, DC, USA
- DC Veterans Affairs Medical Center, The George Washington University, Washington, DC, USA
| | - John M Torkelson
- Department of Chemical and Biological Engineering, Northwestern University, Evanston, IL, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Yonggang Huang
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
- Departments of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA
| | - Yevgenia Kozorovitskiy
- Department of Neurobiology, Northwestern University, Evanston, IL, USA.
- Chemistry Life Processes Institute, Northwestern University, Evanston, IL, USA.
| | - Igor R Efimov
- Department of Biomedical Engineering, The George Washington University, Washington, DC, USA.
| | - John A Rogers
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA.
- Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, USA.
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14
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Luan H, Zhang Q, Liu TL, Wang X, Zhao S, Wang H, Yao S, Xue Y, Kwak JW, Bai W, Xu Y, Han M, Li K, Li Z, Ni X, Ye J, Choi D, Yang Q, Kim JH, Li S, Chen S, Wu C, Lu D, Chang JK, Xie Z, Huang Y, Rogers JA. Complex 3D microfluidic architectures formed by mechanically guided compressive buckling. Sci Adv 2021; 7:eabj3686. [PMID: 34669471 PMCID: PMC8528415 DOI: 10.1126/sciadv.abj3686] [Citation(s) in RCA: 25] [Impact Index Per Article: 8.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/06/2023]
Abstract
Microfluidic technologies have wide-ranging applications in chemical analysis systems, drug delivery platforms, and artificial vascular networks. This latter area is particularly relevant to 3D cell cultures, engineered tissues, and artificial organs, where volumetric capabilities in fluid distribution are essential. Existing schemes for fabricating 3D microfluidic structures are constrained in realizing desired layout designs, producing physiologically relevant microvascular structures, and/or integrating active electronic/optoelectronic/microelectromechanical components for sensing and actuation. This paper presents a guided assembly approach that bypasses these limitations to yield complex 3D microvascular structures from 2D precursors that exploit the full sophistication of 2D fabrication methods. The capabilities extend to feature sizes <5 μm, in extended arrays and with various embedded sensors and actuators, across wide ranges of overall dimensions, in a parallel, high-throughput process. Examples include 3D microvascular networks with sophisticated layouts, deterministically designed and constructed to expand the geometries and operating features of artificial vascular networks.
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Affiliation(s)
- Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Qihui Zhang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Tzu-Li Liu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Ohio State University, Columbus, OH 43210, USA
| | - Xueju Wang
- Department of Materials Science and Engineering, University of Connecticut, Storrs, CT 06269, USA
| | - Shiwei Zhao
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
- School of Aeronautic Science and Engineering, Beihang University, Beijing 100191, China
| | - Heling Wang
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Shenglian Yao
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Beijing Advanced Innovation Center for Materials Genome Engineering, School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
| | - Yeguang Xue
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Jean Won Kwak
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Wubin Bai
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Applied Physical Sciences, University of North Carolina, Chapel Hill, NC 27514, USA
| | - Yameng Xu
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- Institute of Materials Science and Engineering, Washington University in St. Louis, St. Louis, MO 63130, USA
| | - Mengdi Han
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
| | - Kan Li
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Engineering, University of Cambridge, Cambridge CB2 1PZ, UK
| | - Zhengwei Li
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Xinchen Ni
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Jilong Ye
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- State Key Laboratory of Tribology, Center for Nano and Micro Mechanics, Tsinghua University, Beijing 100084, China
| | - Dongwhi Choi
- Department of Mechanical Engineering (Integrated Engineering Program), Kyung Hee University, Yongin, Gyeonggi 17104, Republic of Korea
| | - Quansan Yang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Jae-Hwan Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
- Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Shuo Li
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Shulin Chen
- Department of Materials Science and Engineering, Ohio State University, Columbus, OH 43210, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Changsheng Wu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Di Lu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Jan-Kai Chang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Wearifi Inc., Evanston, IL 60201, USA
| | - Zhaoqian Xie
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, Liaoning 116024, China
- Ningbo Institute of Dalian University of Technology, Ningbo, Zhejiang 315016, China
| | - Yonggang Huang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- Corresponding author. (Y.H.); (J.A.R.)
| | - John A. Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA
- Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Chemistry, Weinberg College of Arts and Sciences, Northwestern University, Evanston, IL 60208, USA
- Corresponding author. (Y.H.); (J.A.R.)
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15
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Wang P, Luo CH, Song Y, Cao LF, Luan H, Zheng SP, Zhu DJ, Tian G. Pericardial adipose tissue-derived leptin promotes myocardial apoptosis in high fat diet-induced obese rats through JAK2/ROS/NKA signaling pathway. Eur Heart J 2021. [DOI: 10.1093/eurheartj/ehab724.3226] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Journal Information] [Submit a Manuscript] [Subscribe] [Scholar Register] [Indexed: 11/13/2022] Open
Abstract
Abstract
Background
Pathophysiologic mechanisms underlying cardiac structural and functional changes in obesity are complex and linked to adipocytokines released from pericardial adipose tissue (PAT) and cardiomyocyte apoptosis. Although leptin is involved in various pathological conditions, its role in paracrine action of pericardial adipose tissue on myocardial apoptosis remains unknown.
Purpose
This study was designed to investigate the role of PAT-derived leptin on myocardial apoptosis in high fat diet-induced obese rats.
Methods and results
Hearts were isolated from lean or high fat diet-induced obese Wistar rats for myocardial remodeling studies. Obese rats had abnormal myocardial structure, diastolic dysfunction, greatly elevated cardiac apoptosis and increased oxidative stress level. Enzyme-linked immunosorbent assay (ELISA) detected significantly higher than circulating leptin level in PAT of obese, but not lean rats. Western blot and immunohistochemical analyses demonstrated increased leptin receptor density in obese heart. H9c2 rat cardiomyoblasts after exposed to PAT-conditioned medium of obese rats exhibited pronounced reactive oxygen species (ROS)-mediated apoptosis, which was partially reversed by leptin antagonist. Moreover, leptin derived from PAT of obese rats inhibited Na+/K+-ATPase activity of H9c2 cells through stimulating ROS, thereby activating calcium-dependent apoptosis. Pretreatment with specific inhibitors revealed that JAK2/STAT3 and PI3K/Akt signaling pathways was involved in the leptin-induced myocardial apoptosis.
Conclusion
PAT-derived leptin induces myocardial apoptosis in high fat diet-induced obese rats via activating JAK2/STAT3/ROS signaling pathway and inhibiting its downstream Na+/K+-ATPase activity.
Funding Acknowledgement
Type of funding sources: Foundation. Main funding source(s): Nature Science Foundation of ChinaKey Projects of Shaanxi Science and Technology Research and Development Plan
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Affiliation(s)
- P Wang
- the First Affiliated Hospital of Xi an Jiaotong University, Cardiovascular department, Xi'an, China
| | - C H Luo
- the First Affiliated Hospital of Xi an Jiaotong University, Cardiovascular department, Xi'an, China
| | - Y Song
- the First Affiliated Hospital of Xi an Jiaotong University, Cardiovascular department, Xi'an, China
| | - L F Cao
- the First Affiliated Hospital of Xi an Jiaotong University, Cardiovascular department, Xi'an, China
| | - H Luan
- the First Affiliated Hospital of Xi an Jiaotong University, Cardiovascular department, Xi'an, China
| | - S P Zheng
- the First Affiliated Hospital of Xi an Jiaotong University, Cardiovascular department, Xi'an, China
| | - D J Zhu
- the First Affiliated Hospital of Xi an Jiaotong University, Cardiovascular department, Xi'an, China
| | - G Tian
- the First Affiliated Hospital of Xi an Jiaotong University, Cardiovascular department, Xi'an, China
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16
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Wu C, Rwei AY, Lee JY, Ouyang W, Jacobson L, Shen H, Luan H, Xu Y, Park JB, Kwak SS, Ni X, Bai W, Franklin D, Li S, Liu Y, Ni X, Westman AM, MacEwan MR, Rogers JA, Pet MA. A Wireless Near-Infrared Spectroscopy Device for Flap Monitoring: Proof of Concept in a Porcine Musculocutaneous Flap Model. J Reconstr Microsurg 2021; 38:96-105. [PMID: 34404105 DOI: 10.1055/s-0041-1732426] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/20/2022]
Abstract
BACKGROUND Current near-infrared spectroscopy (NIRS)-based systems for continuous flap monitoring are highly sensitive for detecting malperfusion. However, the clinical utility and user experience are limited by the wired connection between the sensor and bedside console. This wire leads to instability of the flap-sensor interface and may cause false alarms. METHODS We present a novel wearable wireless NIRS sensor for continuous fasciocutaneous free flap monitoring. This waterproof silicone-encapsulated Bluetooth-enabled device contains two light-emitting diodes and two photodetectors in addition to a battery sufficient for 5 days of uninterrupted function. This novel device was compared with a ViOptix T.Ox monitor in a porcine rectus abdominus myocutaneous flap model of arterial and venous occlusions. RESULTS Devices were tested in four flaps using three animals. Both devices produced very similar tissue oxygen saturation (StO2) tracings throughout the vascular clamping events, with obvious and parallel changes occurring on arterial clamping, arterial release, venous clamping, and venous release. Small interdevice variations in absolute StO2 value readings and magnitude of change were observed. The normalized cross-correlation at zero lag describing correspondence between the novel NIRS and T.Ox devices was >0.99 in each trial. CONCLUSION The wireless NIRS flap monitor is capable of detecting StO2 changes resultant from arterial vascular occlusive events. In this porcine flap model, the functionality of this novel sensor closely mirrored that of the T.Ox wired platform. This device is waterproof, highly adhesive, skin conforming, and has sufficient battery life to function for 5 days. Clinical testing is necessary to determine if this wireless functionality translates into fewer false-positive alarms and a better user experience.
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Affiliation(s)
- Changsheng Wu
- Department of Materials Science and Engineering, Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, Illinois
| | - Alina Y Rwei
- Department of Materials Science and Engineering, Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, Illinois.,Department of Chemical Engineering, Delft University of Technology, Delft, The Netherlands
| | - Jong Yoon Lee
- Department of Materials Science and Engineering, Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, Illinois.,Sibel Inc., Evanston, Illinois
| | - Wei Ouyang
- Department of Materials Science and Engineering, Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, Illinois
| | - Lauren Jacobson
- Division of Plastic and Reconstructive Surgery, Department of Surgery, School of Medicine, Washington University, St. Louis, Missouri
| | - Haixu Shen
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois
| | - Haiwen Luan
- Department of Materials Science and Engineering, Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, Illinois
| | - Yameng Xu
- Department of Neurosurgery, School of Medicine, Washington University, St. Louis, Missouri
| | | | - Sung Soo Kwak
- Department of Materials Science and Engineering, Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, Illinois
| | - Xiaoyue Ni
- Department of Materials Science and Engineering, Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, Illinois
| | - Wubin Bai
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois
| | - Daniel Franklin
- Department of Materials Science and Engineering, Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, Illinois
| | - Shuo Li
- Department of Materials Science and Engineering, Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, Illinois
| | - Yiming Liu
- Department of Electrical and Computer Engineering, Northwestern University, Evanston, Illinois
| | - Xinchen Ni
- Department of Materials Science and Engineering, Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, Illinois
| | - Amanda M Westman
- Division of Plastic and Reconstructive Surgery, Department of Surgery, School of Medicine, Washington University, St. Louis, Missouri
| | - Matthew R MacEwan
- Department of Neurosurgery, School of Medicine, Washington University, St. Louis, Missouri
| | - John A Rogers
- Department of Materials Science and Engineering, Querrey Simpson Institute for Bioelectronics, Northwestern University, Chicago, Illinois.,Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois.,Department of Electrical and Computer Engineering, Northwestern University, Evanston, Illinois.,Department of Mechanical Engineering, Northwestern University, Evanston, Illinois.,Department of Biomedical Engineering, Northwestern University, Evanston, Illinois.,Department of Chemistry, Northwestern University, Evanston, Illinois.,Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, Illinois
| | - Mitchell A Pet
- Division of Plastic and Reconstructive Surgery, Department of Surgery, School of Medicine, Washington University, St. Louis, Missouri
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17
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Song E, Xie Z, Bai W, Luan H, Ji B, Ning X, Xia Y, Baek JM, Lee Y, Avila R, Chen HY, Kim JH, Madhvapathy S, Yao K, Li D, Zhou J, Han M, Won SM, Zhang X, Myers DJ, Mei Y, Guo X, Xu S, Chang JK, Yu X, Huang Y, Rogers JA. Miniaturized electromechanical devices for the characterization of the biomechanics of deep tissue. Nat Biomed Eng 2021; 5:759-771. [PMID: 34045731 DOI: 10.1038/s41551-021-00723-y] [Citation(s) in RCA: 38] [Impact Index Per Article: 12.7] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 12/23/2020] [Accepted: 04/08/2021] [Indexed: 02/02/2023]
Abstract
Evaluating the biomechanics of soft tissues at depths well below their surface, and at high precision and in real time, would open up diagnostic opportunities. Here, we report the development and application of miniaturized electromagnetic devices, each integrating a vibratory actuator and a soft strain-sensing sheet, for dynamically measuring the Young's modulus of skin and of other soft tissues at depths of approximately 1-8 mm, depending on the particular design of the sensor. We experimentally and computationally established the operational principles of the devices and evaluated their performance with a range of synthetic and biological materials and with human skin in healthy volunteers. Arrays of devices can be used to spatially map elastic moduli and to profile the modulus depth-wise. As an example of practical medical utility, we show that the devices can be used to accurately locate lesions associated with psoriasis. Compact electronic devices for the rapid and precise mechanical characterization of living tissues could be used to monitor and diagnose a range of health disorders.
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Affiliation(s)
- Enming Song
- Institute of Optoelectronics, Fudan University, Shanghai, China.,Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Zhaoqian Xie
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.,Ningbo Institute of Dalian University of Technology, Ningbo, China
| | - Wubin Bai
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.,Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, USA
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Bowen Ji
- Unmanned System Research Institute, Northwestern Polytechnical University, Xi'an, China
| | - Xin Ning
- Department of Aerospace Engineering, The Pennsylvania State University, University Park, PA, USA
| | - Yu Xia
- Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Janice Mihyun Baek
- Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Yujin Lee
- Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Raudel Avila
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA
| | - Huang-Yu Chen
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Jae-Hwan Kim
- Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Surabhi Madhvapathy
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Kuanming Yao
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Dengfeng Li
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Jingkun Zhou
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Mengdi Han
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA
| | - Sang Min Won
- Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea
| | - Xinyuan Zhang
- Department of Materials Science, State Key Laboratory of ASIC and Systems, Fudan University, Shanghai, China
| | - Daniel J Myers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.,Department of Dermatology, Feinberg School of Medicine, Northwestern University, Chicago, IL, USA
| | - Yongfeng Mei
- Department of Materials Science, State Key Laboratory of ASIC and Systems, Fudan University, Shanghai, China
| | - Xu Guo
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.,Ningbo Institute of Dalian University of Technology, Ningbo, China
| | - Shuai Xu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.,Department of Dermatology, Feinberg School of Medicine, Northwestern University, Chicago, IL, USA
| | - Jan-Kai Chang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
| | - Xinge Yu
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
| | - Yonggang Huang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA. .,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. .,Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA. .,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA. .,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. .,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. .,Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA. .,Department of Neurological Surgery, Northwestern University, Evanston, IL, USA.
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18
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Ryu H, Park Y, Luan H, Dalgin G, Jeffris K, Yoon HJ, Chung TS, Kim JU, Kwak SS, Lee G, Jeong H, Kim J, Bai W, Kim J, Jung YH, Tryba AK, Song JW, Huang Y, Philipson LH, Finan JD, Rogers JA. Transparent, Compliant 3D Mesostructures for Precise Evaluation of Mechanical Characteristics of Organoids. Adv Mater 2021; 33:e2100026. [PMID: 33984170 PMCID: PMC8719419 DOI: 10.1002/adma.202100026] [Citation(s) in RCA: 15] [Impact Index Per Article: 5.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/03/2021] [Revised: 03/06/2021] [Indexed: 05/14/2023]
Abstract
Recently developed methods for transforming 2D patterns of thin-film materials into 3D mesostructures create many interesting opportunities in microsystems design. A growing area of interest is in multifunctional thermal, electrical, chemical, and optical interfaces to biological tissues, particularly 3D multicellular, millimeter-scale constructs, such as spheroids, assembloids, and organoids. Herein, examples of 3D mechanical interfaces are presented, in which thin ribbons of parylene-C form the basis of transparent, highly compliant frameworks that can be reversibly opened and closed to capture, envelop, and mechanically restrain fragile 3D tissues in a gentle, nondestructive manner, for precise measurements of viscoelastic properties using techniques in nanoindentation. Finite element analysis serves as a design tool to guide selection of geometries and material parameters for shape-matching 3D architectures tailored to organoids of interest. These computational approaches also quantitate all aspects of deformations during the processes of opening and closing the structures and of forces imparted by them onto the surfaces of enclosed soft tissues. Studies of cerebral organoids by nanoindentation show effective Young's moduli in the range from 1.5 to 2.5 kPa depending on the age of the organoid. This collection of results suggests broad utility of compliant 3D mesostructures in noninvasive mechanical measurements of millimeter-scale, soft biological tissues.
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Affiliation(s)
- Hanjun Ryu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Yoonseok Park
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Gokhan Dalgin
- Section of Adult and Pediatric Endocrinology, Diabetes and Metabolism, Kovler Diabetes Center, The University of Chicago, Chicago, IL, 60637, USA
| | - Kira Jeffris
- Department of Mechanical and Industrial Engineering, University of Illinois at Chicago, Chicago, IL, 60607, USA
| | - Hong-Joon Yoon
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Ted S Chung
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Jong Uk Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Sung Soo Kwak
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Geumbee Lee
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Hyoyoung Jeong
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Jihye Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Wubin Bai
- Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, 27599, USA
| | - Joohee Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Yei Hwan Jung
- Department of Electronic Engineering Hanyang University, Seoul, 04763, Republic of Korea
| | - Andrew K Tryba
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Section of Pediatric Neurology, Department of Pediatrics, The University of Chicago, Chicago, IL, 60637, USA
| | - Joseph W Song
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
| | - Yonggang Huang
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Louis H Philipson
- Department of Medicine and Kovler Diabetes Center, The University of Chicago, Chicago, IL, 60637, USA
| | - John D Finan
- Department of Mechanical and Industrial Engineering, University of Illinois at Chicago, Chicago, IL, 60607, USA
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Chemistry, Northwestern University, Evanston, IL, 60208, USA
- Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, 60208, USA
- Departments of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA
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19
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Jeong H, Lee JY, Lee K, Kang YJ, Kim JT, Avila R, Tzavelis A, Kim J, Ryu H, Kwak SS, Kim JU, Banks A, Jang H, Chang JK, Li S, Mummidisetty CK, Park Y, Nappi S, Chun KS, Lee YJ, Kwon K, Ni X, Chung HU, Luan H, Kim JH, Wu C, Xu S, Banks A, Jayaraman A, Huang Y, Rogers JA. Differential cardiopulmonary monitoring system for artifact-canceled physiological tracking of athletes, workers, and COVID-19 patients. Sci Adv 2021; 7:eabg3092. [PMID: 33980495 PMCID: PMC8115927 DOI: 10.1126/sciadv.abg3092] [Citation(s) in RCA: 12] [Impact Index Per Article: 4.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/23/2020] [Accepted: 03/22/2021] [Indexed: 05/27/2023]
Abstract
Soft, skin-integrated electronic sensors can provide continuous measurements of diverse physiological parameters, with broad relevance to the future of human health care. Motion artifacts can, however, corrupt the recorded signals, particularly those associated with mechanical signatures of cardiopulmonary processes. Design strategies introduced here address this limitation through differential operation of a matched, time-synchronized pair of high-bandwidth accelerometers located on parts of the anatomy that exhibit strong spatial gradients in motion characteristics. When mounted at a location that spans the suprasternal notch and the sternal manubrium, these dual-sensing devices allow measurements of heart rate and sounds, respiratory activities, body temperature, body orientation, and activity level, along with swallowing, coughing, talking, and related processes, without sensitivity to ambient conditions during routine daily activities, vigorous exercises, intense manual labor, and even swimming. Deployments on patients with COVID-19 allow clinical-grade ambulatory monitoring of the key symptoms of the disease even during rehabilitation protocols.
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Affiliation(s)
- Hyoyoung Jeong
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Jong Yoon Lee
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Sibel Health, Niles, IL 60714, USA
| | - KunHyuck Lee
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Youn J Kang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Jin-Tae Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Raudel Avila
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Andreas Tzavelis
- Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Joohee Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Hanjun Ryu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Sung Soo Kwak
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea
| | - Jong Uk Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- School of Chemical Engineering, SKKU, Suwon 16419, Republic of Korea
| | - Aaron Banks
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Hokyung Jang
- Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI 53706, USA
| | | | - Shupeng Li
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Chaithanya K Mummidisetty
- Max Nader Center for Rehabilitation Technologies and Outcomes Research, Shirley Ryan AbilityLab, Chicago, IL 60611, USA
| | - Yoonseok Park
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Simone Nappi
- Department of Civil Engineering and Computer Science Engineering, University of Rome Tor Vergata, Via del Politecnico, 1, 00133, Rome, Italy
| | - Keum San Chun
- Electrical and Computer Engineering, Cockrell School of Engineering, The University of Texas at Austin, Austin, TX 78712, USA
| | - Young Joong Lee
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Kyeongha Kwon
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, Republic of Korea
| | - Xiaoyue Ni
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering and Materials Science, Duke University, Durham, NC 27708, USA
| | | | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Jae-Hwan Kim
- Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Changsheng Wu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Shuai Xu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Sibel Health, Niles, IL 60714, USA
- Department of Dermatology, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA
| | - Anthony Banks
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Wearifi Inc., Evanston, IL 60201, USA
| | - Arun Jayaraman
- Max Nader Center for Rehabilitation Technologies and Outcomes Research, Shirley Ryan AbilityLab, Chicago, IL 60611, USA
- Departments of Physical Medicine and Rehabilitation and Physical Therapy and Human Movement Sciences, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA
| | - Yonggang Huang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
- Departments of Electrical and Computer Engineering and Chemistry, Northwestern University, Evanston, IL 60208, USA
- Department of Neurological Surgery, Northwestern University, Evanston, IL 60208, USA
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20
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Park Y, Franz CK, Ryu H, Luan H, Cotton KY, Kim JU, Chung TS, Zhao S, Vazquez-Guardado A, Yang DS, Li K, Avila R, Phillips JK, Quezada MJ, Jang H, Kwak SS, Won SM, Kwon K, Jeong H, Bandodkar AJ, Han M, Zhao H, Osher GR, Wang H, Lee K, Zhang Y, Huang Y, Finan JD, Rogers JA. Three-dimensional, multifunctional neural interfaces for cortical spheroids and engineered assembloids. Sci Adv 2021; 7:7/12/eabf9153. [PMID: 33731359 PMCID: PMC7968849 DOI: 10.1126/sciadv.abf9153] [Citation(s) in RCA: 90] [Impact Index Per Article: 30.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/27/2020] [Accepted: 01/27/2021] [Indexed: 05/23/2023]
Abstract
Three-dimensional (3D), submillimeter-scale constructs of neural cells, known as cortical spheroids, are of rapidly growing importance in biological research because these systems reproduce complex features of the brain in vitro. Despite their great potential for studies of neurodevelopment and neurological disease modeling, 3D living objects cannot be studied easily using conventional approaches to neuromodulation, sensing, and manipulation. Here, we introduce classes of microfabricated 3D frameworks as compliant, multifunctional neural interfaces to spheroids and to assembloids. Electrical, optical, chemical, and thermal interfaces to cortical spheroids demonstrate some of the capabilities. Complex architectures and high-resolution features highlight the design versatility. Detailed studies of the spreading of coordinated bursting events across the surface of an isolated cortical spheroid and of the cascade of processes associated with formation and regrowth of bridging tissues across a pair of such spheroids represent two of the many opportunities in basic neuroscience research enabled by these platforms.
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Affiliation(s)
- Yoonseok Park
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Colin K Franz
- Regenerative Neurorehabilitation Laboratory, Shirley Ryan AbilityLab, Chicago, IL 60611, USA
- Department of Physical Medicine and Rehabilitation, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA
- The Ken&Ruth Davee Department of Neurology, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA
| | - Hanjun Ryu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Kristen Y Cotton
- Regenerative Neurorehabilitation Laboratory, Shirley Ryan AbilityLab, Chicago, IL 60611, USA
| | - Jong Uk Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea
| | - Ted S Chung
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Shiwei Zhao
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- School of Aeronautic Science and Engineering, Beihang University, Beijing 100191, P. R. China
| | - Abraham Vazquez-Guardado
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Da Som Yang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Kan Li
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Engineering, University of Cambridge, Cambridge CB2 1PZ, UK
| | - Raudel Avila
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Jack K Phillips
- Department of Neurosurgery, NorthShore University HealthSystem, Evanston, IL 60201, USA
- Department of Biomedical Engineering, University of Wisconsin-Madison, Madison, WI 53715, USA
| | - Maria J Quezada
- Regenerative Neurorehabilitation Laboratory, Shirley Ryan AbilityLab, Chicago, IL 60611, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Hokyung Jang
- Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI 53706, USA
| | - Sung Soo Kwak
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea
| | - Sang Min Won
- Department of Electrical and Computer Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea
| | - Kyeongha Kwon
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, Republic of Korea
| | - Hyoyoung Jeong
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Amay J Bandodkar
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Mengdi Han
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
| | - Hangbo Zhao
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA 90089, USA
| | - Gabrielle R Osher
- Department of Neurosurgery, NorthShore University HealthSystem, Evanston, IL 60201, USA
| | - Heling Wang
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - KunHyuck Lee
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics; Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Yonggang Huang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - John D Finan
- Department of Neurosurgery, NorthShore University HealthSystem, Evanston, IL 60201, USA.
- Department of Mechanical and Industrial Engineering, University of Illinois at Chicago, Chicago, IL 60607, USA
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Chemistry, Northwestern University, Evanston, IL 60208, USA
- Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA
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21
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Bai W, Irie M, Liu Z, Luan H, Franklin D, Nandoliya K, Guo H, Zang H, Weng Y, Lu D, Wu D, Wu Y, Song J, Han M, Song E, Yang Y, Chen X, Zhao H, Lu W, Monti G, Stepien I, Kandela I, Haney CR, Wu C, Won SM, Ryu H, Rwei A, Shen H, Kim J, Yoon HJ, Ouyang W, Liu Y, Suen E, Chen HY, Okina J, Liang J, Huang Y, Ameer GA, Zhou W, Rogers JA. Bioresorbable Multilayer Photonic Cavities as Temporary Implants for Tether-Free Measurements of Regional Tissue Temperatures. BME Front 2021; 2021:8653218. [PMID: 37849909 PMCID: PMC10521677 DOI: 10.34133/2021/8653218] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 08/17/2020] [Accepted: 11/18/2020] [Indexed: 10/19/2023] Open
Abstract
Objective and Impact Statement. Real-time monitoring of the temperatures of regional tissue microenvironments can serve as the diagnostic basis for treating various health conditions and diseases. Introduction. Traditional thermal sensors allow measurements at surfaces or at near-surface regions of the skin or of certain body cavities. Evaluations at depth require implanted devices connected to external readout electronics via physical interfaces that lead to risks for infection and movement constraints for the patient. Also, surgical extraction procedures after a period of need can introduce additional risks and costs. Methods. Here, we report a wireless, bioresorbable class of temperature sensor that exploits multilayer photonic cavities, for continuous optical measurements of regional, deep-tissue microenvironments over a timeframe of interest followed by complete clearance via natural body processes. Results. The designs decouple the influence of detection angle from temperature on the reflection spectra, to enable high accuracy in sensing, as supported by in vitro experiments and optical simulations. Studies with devices implanted into subcutaneous tissues of both awake, freely moving and asleep animal models illustrate the applicability of this technology for in vivo measurements. Conclusion. The results demonstrate the use of bioresorbable materials in advanced photonic structures with unique capabilities in tracking of thermal signatures of tissue microenvironments, with potential relevance to human healthcare.
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Affiliation(s)
- Wubin Bai
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
| | - Masahiro Irie
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
| | - Zhonghe Liu
- Department of Electrical Engineering, University of Texas at Arlington, Arlington, TX 76019, USA
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, Illinois 60208, USA
| | - Daniel Franklin
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
| | - Khizar Nandoliya
- Department of Chemistry, Northwestern University, Evanston, Illinois 60208, USA
| | - Hexia Guo
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
| | - Hao Zang
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
| | - Yang Weng
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
| | - Di Lu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
| | - Di Wu
- Department of Biomedical Engineering, Northwestern University, Evanston, Illinois 60208, USA
| | - Yixin Wu
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
| | - Joseph Song
- Department of Biomedical Engineering, Northwestern University, Evanston, Illinois 60208, USA
| | - Mengdi Han
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
| | - Enming Song
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
- Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Yiyuan Yang
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
| | - Xuexian Chen
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
- Academy for Advanced Interdisciplinary Studies, Peking University, Beijing, China
| | - Hangbo Zhao
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
- Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, CA 90089, USA
| | - Wei Lu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
| | - Giuditta Monti
- Department of Biomedical Engineering, Northwestern University, Evanston, Illinois 60208, USA
| | - Iwona Stepien
- The Center for Developmental Therapeutics, Northwestern University, Evanston, Illinois 60208, USA
| | - Irawati Kandela
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
| | - Chad R. Haney
- Department of Biomedical Engineering, Northwestern University, Evanston, Illinois 60208, USA
- Center for Advanced Molecular Imaging, Northwestern University, Evanston, Illinois 60208, USA
| | - Changsheng Wu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
| | - Sang Min Won
- Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea
| | - Hanjun Ryu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
| | - Alina Rwei
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
| | - Haixu Shen
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
| | - Jihye Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
- School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea
| | - Hong-Joon Yoon
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
- School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea
| | - Wei Ouyang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
| | - Yihan Liu
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
| | - Emily Suen
- Department of Neurobiology, Northwestern University, Evanston, Illinois 60208, USA
| | - Huang-yu Chen
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
| | - Jerry Okina
- Department of Chemical Engineering, Northwestern University, Evanston, Illinois 60208, USA
| | - Jushen Liang
- Department of Chemical Engineering, Northwestern University, Evanston, Illinois 60208, USA
| | - Yonggang Huang
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, Illinois 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, Illinois 60208, USA
| | - Guillermo A. Ameer
- Department of Biomedical Engineering, Northwestern University, Evanston, Illinois 60208, USA
- Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, Illinois 60208, USA
- Northwestern Medicine, Feinberg School of Medicine, Northwestern University, Evanston, Illinois 60208, USA
- Center for Advanced Regenerative Engineering, Northwestern University, Evanston, Illinois 60208, USA
| | - Weidong Zhou
- Department of Electrical Engineering, University of Texas at Arlington, Arlington, TX 76019, USA
| | - John A. Rogers
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, Illinois 60208, USA
- Department of Chemistry, Northwestern University, Evanston, Illinois 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, Illinois 60208, USA
- Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, Illinois 60208, USA
- Northwestern Medicine, Feinberg School of Medicine, Northwestern University, Evanston, Illinois 60208, USA
- Center for Advanced Regenerative Engineering, Northwestern University, Evanston, Illinois 60208, USA
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22
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Park Y, Kwon K, Kwak SS, Yang DS, Kwak JW, Luan H, Chung TS, Chun KS, Kim JU, Jang H, Ryu H, Jeong H, Won SM, Kang YJ, Zhang M, Pontes D, Kampmeier BR, Seo SH, Zhao J, Jung I, Huang Y, Xu S, Rogers JA. Wireless, skin-interfaced sensors for compression therapy. Sci Adv 2020; 6:6/49/eabe1655. [PMID: 33277263 PMCID: PMC7821894 DOI: 10.1126/sciadv.abe1655] [Citation(s) in RCA: 13] [Impact Index Per Article: 3.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/04/2020] [Accepted: 10/20/2020] [Indexed: 05/23/2023]
Abstract
Therapeutic compression garments (TCGs) are key tools for the management of a wide range of vascular lower extremity conditions. Proper use of TCGs involves application of a minimum and consistent pressure across the lower extremities for extended periods of time. Slight changes in the characteristics of the fabric and the mechanical properties of the tissues lead to requirements for frequent measurements and corresponding adjustments of the applied pressure. Existing sensors are not sufficiently small, thin, or flexible for practical use in this context, and they also demand cumbersome, hard-wired interfaces for data acquisition. Here, we introduce a flexible, wireless monitoring system for tracking both temperature and pressure at the interface between the skin and the TCGs. Detailed studies of the materials and engineering aspects of these devices, together with clinical pilot trials on a range of patients with different pathologies, establish the technical foundations and measurement capabilities.
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Affiliation(s)
- Yoonseok Park
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Kyeongha Kwon
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, Republic of Korea
| | - Sung Soo Kwak
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
- School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea
| | - Da Som Yang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Jean Won Kwak
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Ted S Chung
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Keum San Chun
- Electrical and Computer Engineering, The University of Texas at Austin, Austin, TX 78712, USA
| | - Jong Uk Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea
| | - Hokyung Jang
- Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI 53706, USA
| | - Hanjun Ryu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Hyoyoung Jeong
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Sang Min Won
- Department of Electrical and Computer Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea
| | - Youn J Kang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Michael Zhang
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - David Pontes
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Brianna R Kampmeier
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Seon Hee Seo
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Nano Hybrid Technology Research Center, Creative and Fundamental Research Division, Korea Electrotechnology Research Institute (KERI), Changwon 51543, Republic of Korea
| | - Jeffrey Zhao
- Department of Dermatology, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA
| | - Inhwa Jung
- Department of Mechanical Engineering, Kyung Hee University, Yongin 17104, Republic of Korea
| | - Yonggang Huang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Shuai Xu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
- Department of Dermatology, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA
| | - John A Rogers
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA.
- Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL 60611, USA
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23
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Lim S, Luan H, Zhao S, Lee Y, Zhang Y, Huang Y, Rogers JA, Ahn JH. Assembly of Foldable 3D Microstructures Using Graphene Hinges. Adv Mater 2020; 32:e2001303. [PMID: 32462694 DOI: 10.1002/adma.202001303] [Citation(s) in RCA: 6] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/24/2020] [Revised: 04/23/2020] [Accepted: 04/24/2020] [Indexed: 06/11/2023]
Abstract
Origami/kirigami-inspired 3D assembly approaches have recently attracted attention for a variety of applications, such as advanced optoelectronic devices and biomedical sensors. The results reported here describe an approach to construct classes of multiple foldable 3D microstructures that involve deformations that typical conductive materials, such as conventional metal films, cannot tolerate. Atomically thin graphene sheets serve as folding hinges during a process of 2D to 3D conversion via a deterministic buckling process. The exceptional mechanical properties of graphene enable the controlled, geometric transformation of a 2D precursor bonded at selective sites on a prestretched elastomer into folded 3D microstructures, in a reversible manner without adverse effects on the electrical properties. Experimental and computational investigations of the folding mechanisms for such types of 3D objects reveal the underlying physics and the dependence of the process on the thickness of the graphene/supporting films that define the hinges.
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Affiliation(s)
- Seungyun Lim
- School of Electrical and Electronic Engineering, Yonsei University, Seoul, 03722, Republic of Korea
| | - Haiwen Luan
- Departments of Mechanical Engineering, Civil and Environmental Engineering, Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Shiwei Zhao
- Departments of Mechanical Engineering, Civil and Environmental Engineering, Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
- School of Aeronautic Science and Engineering, Beihang University, Beijing, 100191, P. R. China
| | - Yongjun Lee
- School of Electrical and Electronic Engineering, Yonsei University, Seoul, 03722, Republic of Korea
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Yonggang Huang
- Departments of Mechanical Engineering, Civil and Environmental Engineering, Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Departments of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Electrical and Computer Engineering, Mechanical Engineering, Chemistry, Northwestern University, Evanston, IL, 60208, USA
| | - Jong-Hyun Ahn
- School of Electrical and Electronic Engineering, Yonsei University, Seoul, 03722, Republic of Korea
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24
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Park JK, Nan K, Luan H, Zheng N, Zhao S, Zhang H, Cheng X, Wang H, Li K, Xie T, Huang Y, Zhang Y, Kim S, Rogers JA. Remotely Triggered Assembly of 3D Mesostructures Through Shape-Memory Effects. Adv Mater 2019; 31:e1905715. [PMID: 31721341 DOI: 10.1002/adma.201905715] [Citation(s) in RCA: 25] [Impact Index Per Article: 5.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 09/02/2019] [Revised: 10/12/2019] [Indexed: 06/10/2023]
Abstract
3D structures that incorporate high-performance electronic materials and allow for remote, on-demand 3D shape reconfiguration are of interest for applications that range from ingestible medical devices and microrobotics to tunable optoelectronics. Here, materials and design approaches are introduced for assembly of such systems via controlled mechanical buckling of 2D precursors built on shape-memory polymer (SMP) substrates. The temporary shape fixing and recovery of SMPs, governed by thermomechanical loading, provide deterministic control over the assembly and reconfiguration processes, including a range of mechanical manipulations facilitated by the elastic and highly stretchable properties of the materials. Experimental demonstrations include 3D mesostructures of various geometries and length scales, as well as 3D aquatic platforms that can change trajectories and release small objects on demand. The results create many opportunities for advanced, programmable 3D microsystem technologies.
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Affiliation(s)
- Jun Kyu Park
- Department of Mechanical Sciences and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA
| | - Kewang Nan
- Department of Mechanical Sciences and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA
- Department of Bioengineering, Harvard University, Cambridge, MA, 02138, USA
| | - Haiwen Luan
- Center for Bio-Integrated Electronics, Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Ning Zheng
- State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou, 310027, P. R. China
| | - Shiwei Zhao
- Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
- School of Aeronautic Science and Engineering, Beihang University, Beijing, 100191, P. R. China
| | - Hang Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Xu Cheng
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Heling Wang
- Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Kan Li
- Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Engineering, University of Cambridge, Cambridge, CB2 1PZ, UK
| | - Tao Xie
- State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou, 310027, P. R. China
| | - Yonggang Huang
- Center for Bio-Integrated Electronics, Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, P. R. China
| | - Seok Kim
- Department of Mechanical Sciences and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA
| | - John A Rogers
- Departments of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
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25
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Yu X, Xie Z, Yu Y, Lee J, Vazquez-Guardado A, Luan H, Ruban J, Ning X, Akhtar A, Li D, Ji B, Liu Y, Sun R, Cao J, Huo Q, Zhong Y, Lee C, Kim S, Gutruf P, Zhang C, Xue Y, Guo Q, Chempakasseril A, Tian P, Lu W, Jeong J, Yu Y, Cornman J, Tan C, Kim B, Lee K, Feng X, Huang Y, Rogers JA. Skin-integrated wireless haptic interfaces for virtual and augmented reality. Nature 2019; 575:473-479. [PMID: 31748722 DOI: 10.1038/s41586-019-1687-0] [Citation(s) in RCA: 243] [Impact Index Per Article: 48.6] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/09/2019] [Accepted: 09/02/2019] [Indexed: 11/09/2022]
Abstract
Traditional technologies for virtual reality (VR) and augmented reality (AR) create human experiences through visual and auditory stimuli that replicate sensations associated with the physical world. The most widespread VR and AR systems use head-mounted displays, accelerometers and loudspeakers as the basis for three-dimensional, computer-generated environments that can exist in isolation or as overlays on actual scenery. In comparison to the eyes and the ears, the skin is a relatively underexplored sensory interface for VR and AR technology that could, nevertheless, greatly enhance experiences at a qualitative level, with direct relevance in areas such as communications, entertainment and medicine1,2. Here we present a wireless, battery-free platform of electronic systems and haptic (that is, touch-based) interfaces capable of softly laminating onto the curved surfaces of the skin to communicate information via spatio-temporally programmable patterns of localized mechanical vibrations. We describe the materials, device structures, power delivery strategies and communication schemes that serve as the foundations for such platforms. The resulting technology creates many opportunities for use where the skin provides an electronically programmable communication and sensory input channel to the body, as demonstrated through applications in social media and personal engagement, prosthetic control and feedback, and gaming and entertainment.
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Affiliation(s)
- Xinge Yu
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Zhaoqian Xie
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.,Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.,Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Yang Yu
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,School of Materials Science and Engineering, Tsinghua University, Beijing, China
| | | | - Abraham Vazquez-Guardado
- Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
| | - Haiwen Luan
- Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
| | | | - Xin Ning
- Department of Aerospace Engineering, Pennsylvania State University, University Park, PA, USA
| | | | - Dengfeng Li
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Bowen Ji
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.,Department of Micro/Nano Electronics, Shanghai Jiao Tong University, Shanghai, China
| | - Yiming Liu
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Rujie Sun
- Bristol Composites Institute, University of Bristol, Bristol, UK
| | | | - Qingze Huo
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Yishan Zhong
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - ChanMi Lee
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - SeungYeop Kim
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Philipp Gutruf
- Department of Biomedical Engineering, University of Arizona, Tucson, AZ, USA
| | - Changxing Zhang
- AML, Department of Engineering Mechanics, Interdisciplinary Research Center for Flexible Electronics Technology, Tsinghua University, Beijing, China
| | - Yeguang Xue
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Qinglei Guo
- School of Microelectronics, Shandong University, Jinan, China
| | - Aditya Chempakasseril
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Peilin Tian
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Wei Lu
- Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
| | | | | | | | | | - BongHoon Kim
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.,Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
| | - KunHyuk Lee
- Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA
| | - Xue Feng
- AML, Department of Engineering Mechanics, Interdisciplinary Research Center for Flexible Electronics Technology, Tsinghua University, Beijing, China
| | - Yonggang Huang
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA. .,Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. .,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. .,Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA.
| | - John A Rogers
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA. .,Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA. .,Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA. .,Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA. .,Simpson Querrey Institute, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, USA. .,Department of Biomedical Engineering, Northwestern University, Evanston, IL, USA. .,Department of Neurological Surgery, Feinberg Medical School, Northwestern University, Evanston, IL, USA. .,Department of Chemistry, Northwestern University, Evanston, IL, USA. .,Department of Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, USA.
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26
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Luan H, Cheng X, Wang A, Zhao S, Bai K, Wang H, Pang W, Xie Z, Li K, Zhang F, Xue Y, Huang Y, Zhang Y. Design and Fabrication of Heterogeneous, Deformable Substrates for the Mechanically Guided 3D Assembly. ACS Appl Mater Interfaces 2019; 11:3482-3492. [PMID: 30584766 DOI: 10.1021/acsami.8b19187] [Citation(s) in RCA: 4] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/09/2023]
Abstract
Development of schemes to form complex three-dimensional (3D) mesostructures in functional materials is a topic of broad interest, thanks to the ubiquitous applications across a diversity of technologies. Recently established schemes in the mechanically guided 3D assembly allow deterministic transformation of two-dimensional structures into sophisticated 3D architectures by controlled compressive buckling resulted from strain release of prestretched elastomer substrates. Existing studies mostly exploited supporting substrates made of homogeneous elastomeric material with uniform thickness, which produces relatively uniform strain field to drive the 3D assembly, thus posing limitations to the geometric diversity of resultant 3D mesostructures. To offer nonuniform strains with desired spatial distributions in the 3D assembly, this paper introduces a versatile set of concepts in the design of engineered substrates with heterogeneous integration of materials of different moduli. Such heterogeneous, deformable substrates can achieve large strain gradients and efficient strain isolation/magnification, which are difficult to realize using the previously reported strategies. Theoretical and experimental studies on the underlying mechanics offer a viable route to the design of heterogeneous, deformable substrates to yield favorable strain fields. A broad collection of 3D mesostructures and associated heterogeneous substrates is fabricated and demonstrated, including examples that resemble windmills, scorpions, and manta rays and those that have application potentials in tunable inductors and vibrational microsystems.
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Affiliation(s)
| | - Xu Cheng
- Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics , Tsinghua University , Beijing 100084 , P. R. China
| | - Ao Wang
- Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics , Tsinghua University , Beijing 100084 , P. R. China
| | - Shiwei Zhao
- School of Aeronautic Science and Engineering , Beihang University , Beijing 100191 , P. R. China
| | - Ke Bai
- Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics , Tsinghua University , Beijing 100084 , P. R. China
| | | | - Wenbo Pang
- Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics , Tsinghua University , Beijing 100084 , P. R. China
| | | | | | - Fan Zhang
- Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics , Tsinghua University , Beijing 100084 , P. R. China
| | | | | | - Yihui Zhang
- Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics , Tsinghua University , Beijing 100084 , P. R. China
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27
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Nan K, Wang H, Ning X, Miller KA, Wei C, Liu Y, Li H, Xue Y, Xie Z, Luan H, Zhang Y, Huang Y, Rogers JA, Braun PV. Soft Three-Dimensional Microscale Vibratory Platforms for Characterization of Nano-Thin Polymer Films. ACS Nano 2019; 13:449-457. [PMID: 30457837 DOI: 10.1021/acsnano.8b06736] [Citation(s) in RCA: 3] [Impact Index Per Article: 0.6] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/09/2023]
Abstract
Vibrational resonances of microelectromechanical systems (MEMS) can serve as means for assessing physical properties of ultrathin coatings in sensors and analytical platforms. Most such technologies exist in largely two-dimensional configurations with a limited total number of accessible vibration modes and modal displacements, thereby placing constraints on design options and operational capabilities. This study presents a set of concepts in three-dimensional (3D) microscale platforms with vibrational resonances excited by Lorentz-force actuation for purposes of measuring properties of thin-film coatings. Nanoscale films including photodefinable epoxy, cresol novolak resin, and polymer brush with thicknesses as small as 270 nm serve as the test vehicles for demonstrating the advantages of these 3D MEMS for detection of multiple physical properties, such as modulus and density, within a single polymer sample. The stability and reusability of the structure are demonstrated through multiple measurements of polymer samples using a single platform, and via integration with thermal actuators, the temperature-dependent physical properties of polymer films are assessed. Numerical modeling also suggests the potential for characterization of anisotropic mechanical properties in single or multilayer films. The findings establish unusual opportunities for interrogation of the physical properties of polymers through advanced MEMS design.
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Affiliation(s)
- Kewang Nan
- Department of Mechanical Science and Engineering , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States
| | - Heling Wang
- Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, and Center for Bio-Integrated Electronics , Northwestern University , Evanston , Illinois 60208 , United States
| | - Xin Ning
- Department of Aerospace Engineering , Pennsylvania State University , State College , Pennsylvania 16802 , United States
| | - Kali A Miller
- Department of Chemistry , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States
| | - Chen Wei
- Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, and Center for Bio-Integrated Electronics , Northwestern University , Evanston , Illinois 60208 , United States
| | - Yunpeng Liu
- Department of Mechanical Science and Engineering , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States
| | - Haibo Li
- Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, and Center for Bio-Integrated Electronics , Northwestern University , Evanston , Illinois 60208 , United States
- School of Naval Architecture, Ocean and Civil Engineering (State Key Laboratory of Ocean Engineering) , Shanghai Jiaotong University , Shanghai 200000 , China
| | - Yeguang Xue
- Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, and Center for Bio-Integrated Electronics , Northwestern University , Evanston , Illinois 60208 , United States
| | - Zhaoqian Xie
- Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, and Center for Bio-Integrated Electronics , Northwestern University , Evanston , Illinois 60208 , United States
| | - Haiwen Luan
- Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, and Center for Bio-Integrated Electronics , Northwestern University , Evanston , Illinois 60208 , United States
| | - Yihui Zhang
- Center for Flexible Electronics Technology and Center for Mechanics and Materials; AML, Department of Engineering Mechanics , Tsinghua University , Beijing 100084 , China
| | - Yonggang Huang
- Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, and Center for Bio-Integrated Electronics , Northwestern University , Evanston , Illinois 60208 , United States
| | - John A Rogers
- Center for Bio-Integrated Electronics, Department of Materials Science and Engineering, Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering, and Computer Science, and Neurological Surgery, Simpson Querrey Institute for Nano/biotechnology, McCormick School of Engineering, and Feinberg School of Medicine , Northwestern University , Evanston , Illinois 60208 , United States
| | - Paul V Braun
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, and Beckman Institute for Advanced Science and Technology , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States
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28
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Wang X, Guo X, Ye J, Zheng N, Kohli P, Choi D, Zhang Y, Xie Z, Zhang Q, Luan H, Nan K, Kim BH, Xu Y, Shan X, Bai W, Sun R, Wang Z, Jang H, Zhang F, Ma Y, Xu Z, Feng X, Xie T, Huang Y, Zhang Y, Rogers JA. Freestanding 3D Mesostructures, Functional Devices, and Shape-Programmable Systems Based on Mechanically Induced Assembly with Shape Memory Polymers. Adv Mater 2019; 31:e1805615. [PMID: 30370605 DOI: 10.1002/adma.201805615] [Citation(s) in RCA: 22] [Impact Index Per Article: 4.4] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/29/2018] [Revised: 10/02/2018] [Indexed: 05/23/2023]
Abstract
Capabilities for controlled formation of sophisticated 3D micro/nanostructures in advanced materials have foundational implications across a broad range of fields. Recently developed methods use stress release in prestrained elastomeric substrates as a driving force for assembling 3D structures and functional microdevices from 2D precursors. A limitation of this approach is that releasing these structures from their substrate returns them to their original 2D layouts due to the elastic recovery of the constituent materials. Here, a concept in which shape memory polymers serve as a means to achieve freestanding 3D architectures from the same basic approach is introduced, with demonstrated ability to realize lateral dimensions, characteristic feature sizes, and thicknesses as small as ≈500, 10, and 5 µm simultaneously, and the potential to scale to much larger or smaller dimensions. Wireless electronic devices illustrate the capacity to integrate other materials and functional components into these 3D frameworks. Quantitative mechanics modeling and experimental measurements illustrate not only shape fixation but also capabilities that allow for structure recovery and shape programmability, as a form of 4D structural control. These ideas provide opportunities in fields ranging from micro-electromechanical systems and microrobotics, to smart intravascular stents, tissue scaffolds, and many others.
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Affiliation(s)
- Xueju Wang
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Mechanical and Aerospace Engineering, University of Missouri-Columbia, Columbia, MO, 65211, USA
| | - Xiaogang Guo
- Center for Mechanics and Materials, Center for Flexible Electronics Technology, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
| | - Jilong Ye
- Center for Nano and Micro Mechanics, Tsinghua University, Beijing, 100084, P. R. China
| | - Ning Zheng
- State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou, 310027, P. R. China
| | - Punit Kohli
- Department of Chemistry and Biochemistry, Southern Illinois University, Carbondale, IL, 62901, USA
| | - Dongwhi Choi
- Department of Mechanical Engineering, Kyung Hee University, Yongin, 17104, South Korea
| | - Yi Zhang
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Biomedical, Biological and Chemical Engineering, University of Missouri-Columbia, Columbia, MO, 65211, USA
| | - Zhaoqian Xie
- Departments of Civil and Environmental Engineering Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Qihui Zhang
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
| | - Haiwen Luan
- Departments of Civil and Environmental Engineering Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Kewang Nan
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA
| | - Bong Hoon Kim
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
| | - Yameng Xu
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
| | - Xiwei Shan
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA
| | - Wubin Bai
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
| | - Rujie Sun
- Bristol Composites Institute (ACCIS), University of Bristol, Bristol, BS8 1TR, UK
| | - Zizheng Wang
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, 61801, USA
| | - Hokyung Jang
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
| | - Fan Zhang
- Center for Mechanics and Materials, Center for Flexible Electronics Technology, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
| | - Yinji Ma
- Center for Mechanics and Materials, Center for Flexible Electronics Technology, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
| | - Zheng Xu
- Center for Mechanics and Materials, Center for Flexible Electronics Technology, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
- The State Key Laboratory for Manufacturing and Systems Engineering, School of Mechanical Engineering, Xi'an Jiaotong University, Xi'an, 710049, P. R. China
| | - Xue Feng
- Center for Mechanics and Materials, Center for Flexible Electronics Technology, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
| | - Tao Xie
- State Key Laboratory of Chemical Engineering, College of Chemical and Biological Engineering, Zhejiang University, Hangzhou, 310027, P. R. China
| | - Yonggang Huang
- Departments of Civil and Environmental Engineering Mechanical Engineering, and Materials Science and Engineering, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
| | - Yihui Zhang
- Center for Mechanics and Materials, Center for Flexible Electronics Technology, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, P. R. China
| | - John A Rogers
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Materials Science and Engineering Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, 60208, USA
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29
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Nan K, Kang SD, Li K, Yu KJ, Zhu F, Wang J, Dunn AC, Zhou C, Xie Z, Agne MT, Wang H, Luan H, Zhang Y, Huang Y, Snyder GJ, Rogers JA. Compliant and stretchable thermoelectric coils for energy harvesting in miniature flexible devices. Sci Adv 2018; 4:eaau5849. [PMID: 30406207 PMCID: PMC6214638 DOI: 10.1126/sciadv.aau5849] [Citation(s) in RCA: 78] [Impact Index Per Article: 13.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/26/2018] [Accepted: 10/02/2018] [Indexed: 05/17/2023]
Abstract
With accelerating trends in miniaturization of semiconductor devices, techniques for energy harvesting become increasingly important, especially in wearable technologies and sensors for the internet of things. Although thermoelectric systems have many attractive attributes in this context, maintaining large temperature differences across the device terminals and achieving low-thermal impedance interfaces to the surrounding environment become increasingly difficult to achieve as the characteristic dimensions decrease. Here, we propose and demonstrate an architectural solution to this problem, where thin-film active materials integrate into compliant, open three-dimensional (3D) forms. This approach not only enables efficient thermal impedance matching but also multiplies the heat flow through the harvester, thereby increasing the efficiencies for power conversion. Interconnected arrays of 3D thermoelectric coils built using microscale ribbons of monocrystalline silicon as the active material demonstrate these concepts. Quantitative measurements and simulations establish the basic operating principles and the key design features. The results suggest a scalable strategy for deploying hard thermoelectric thin-film materials in harvesters that can integrate effectively with soft materials systems, including those of the human body.
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Affiliation(s)
- Kewang Nan
- University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Stephen Dongmin Kang
- California Institute of Technology, Pasadena, CA 91125, USA
- Northwestern University, Evanston, IL 60208, USA
| | - Kan Li
- Northwestern University, Evanston, IL 60208, USA
| | - Ki Jun Yu
- Yonsei University, Seoul 03722, Republic of Korea
| | - Feng Zhu
- Northwestern University, Evanston, IL 60208, USA
- Wuhan University of Technology, Wuhan 430070, China
| | - Juntong Wang
- University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Alison C. Dunn
- University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Chaoqun Zhou
- University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Zhaoqian Xie
- Northwestern University, Evanston, IL 60208, USA
| | | | - Heling Wang
- Northwestern University, Evanston, IL 60208, USA
| | - Haiwen Luan
- Northwestern University, Evanston, IL 60208, USA
| | | | - Yonggang Huang
- Northwestern University, Evanston, IL 60208, USA
- Corresponding author. (Y.H.); (G.J.S.); (J.A.R.)
| | - G. Jeffrey Snyder
- Northwestern University, Evanston, IL 60208, USA
- Corresponding author. (Y.H.); (G.J.S.); (J.A.R.)
| | - John A. Rogers
- University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
- Northwestern University, Evanston, IL 60208, USA
- Corresponding author. (Y.H.); (G.J.S.); (J.A.R.)
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30
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Ning X, Yu X, Wang H, Sun R, Corman RE, Li H, Lee CM, Xue Y, Chempakasseril A, Yao Y, Zhang Z, Luan H, Wang Z, Xia W, Feng X, Ewoldt RH, Huang Y, Zhang Y, Rogers JA. Mechanically active materials in three-dimensional mesostructures. Sci Adv 2018; 4:eaat8313. [PMID: 30225368 PMCID: PMC6140627 DOI: 10.1126/sciadv.aat8313] [Citation(s) in RCA: 30] [Impact Index Per Article: 5.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/22/2018] [Accepted: 08/01/2018] [Indexed: 05/12/2023]
Abstract
Complex, three-dimensional (3D) mesostructures that incorporate advanced, mechanically active materials are of broad, growing interest for their potential use in many emerging systems. The technology implications range from precision-sensing microelectromechanical systems, to tissue scaffolds that exploit the principles of mechanobiology, to mechanical energy harvesters that support broad bandwidth operation. The work presented here introduces strategies in guided assembly and heterogeneous materials integration as routes to complex, 3D microscale mechanical frameworks that incorporate multiple, independently addressable piezoelectric thin-film actuators for vibratory excitation and precise control. The approach combines transfer printing as a scheme for materials integration with structural buckling as a means for 2D-to-3D geometric transformation, for designs that range from simple, symmetric layouts to complex, hierarchical configurations, on planar or curvilinear surfaces. Systematic experimental and computational studies reveal the underlying characteristics and capabilities, including selective excitation of targeted vibrational modes for simultaneous measurements of viscosity and density of surrounding fluids. The results serve as the foundations for unusual classes of mechanically active 3D mesostructures with unique functions relevant to biosensing, mechanobiology, energy harvesting, and others.
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Affiliation(s)
- Xin Ning
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Xinge Yu
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Heling Wang
- Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Rujie Sun
- Advanced Composites Centre for Innovation and Science, University of Bristol, Bristol BS8 1TR, UK
| | - R. E. Corman
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Haibo Li
- Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Chan Mi Lee
- Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Yeguang Xue
- Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Aditya Chempakasseril
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Yao Yao
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Ziqi Zhang
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Haiwen Luan
- Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Zizheng Wang
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
| | - Wei Xia
- State Key Laboratory for Strength and Vibration of Mechanical Structures, Xi’an Jiaotong University, Xi’an, Shaanxi 710049, China
| | - Xue Feng
- Center for Mechanics and Materials, Center for Flexible Electronics Technology, and Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
| | - Randy H. Ewoldt
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Yonggang Huang
- Departments of Civil and Environmental Engineering and Mechanical Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Yihui Zhang
- Center for Mechanics and Materials, Center for Flexible Electronics Technology, and Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
- Corresponding author. (J.A.R.); (Y.Z.)
| | - John A. Rogers
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
- Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL 60208, USA
- Department of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Northwestern University, Evanston, IL 60208, USA
- Corresponding author. (J.A.R.); (Y.Z.)
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31
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Liu Y, Tian L, Raj MS, Cotton M, Ma Y, Ma S, McGrane B, Pendharkar AV, Dahaleh N, Olson L, Luan H, Block O, Suleski B, Zhou Y, Jayaraman C, Koski T, Aranyosi AJ, Wright JA, Jayaraman A, Huang Y, Ghaffari R, Kliot M, Rogers JA. Intraoperative monitoring of neuromuscular function with soft, skin-mounted wireless devices. NPJ Digit Med 2018; 1. [PMID: 30882044 PMCID: PMC6419749 DOI: 10.1038/s41746-018-0023-7] [Citation(s) in RCA: 14] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/13/2022] Open
Abstract
Peripheral nerves are often vulnerable to damage during surgeries, with risks of significant pain, loss of motor function, and reduced quality of life for the patient. Intraoperative methods for monitoring nerve activity are effective, but conventional systems rely on bench-top data acquisition tools with hard–wired connections to electrode leads that must be placed percutaneously inside target muscle tissue. These approaches are time and skill intensive and therefore costly to an extent that precludes their use in many important scenarios. Here we report a soft, skin-mounted monitoring system that measures, stores, and wirelessly transmits electrical signals and physical movement associated with muscle activity, continuously and in real-time during neurosurgical procedures on the peripheral, spinal, and cranial nerves. Surface electromyography and motion measurements can be performed non-invasively in this manner on nearly any muscle location, thereby offering many important advantages in usability and cost, with signal fidelity that matches that of the current clinical standard of care for decision making. These results could significantly improve accessibility of intraoperative monitoring across a broad range of neurosurgical procedures, with associated enhancements in patient outcomes. A small skin-mounted biosensing device accurately and non-invasively monitors neuromuscular activity in real-time during surgery. With many surgical procedures there is a risk of nerve damage. Although this is often temporary, in some cases it can significantly affect patients’ quality of life. Existing monitoring systems that rely on the accurate placement of needle electrodes into target nerves are cumbersome and expensive. The device developed by a team led by John Rogers, at Northwestern University, and Michel Kliot, at Stanford University, can easily be accommodated to any part of the body to monitor muscle activity in response to nerve impulses and stimulation during surgery. Furthermore, it can wirelessly transmit signals of comparable quality to needle-based systems. These devices could not only increase the use of intraoperative monitoring in hospitals but also contribute to make surgery safer.
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Affiliation(s)
- Yuhao Liu
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Limei Tian
- Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | | | - Matthew Cotton
- Department of Neurosurgery, Northwestern Memorial Hospital, Chicago, IL 60611, USA
| | - Yinji Ma
- Department of Engineering Mechanics, AML, Center for Mechanics and Materials, Tsinghua University, 100084 Beijing, China.,Department of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Siyi Ma
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | | | - Arjun V Pendharkar
- Department of Neurosurgery, Stanford University School of Medicine, Stanford, CA 94305, USA
| | - Nader Dahaleh
- Department of Neurosurgery, Northwestern Memorial Hospital, Chicago, IL 60611, USA
| | | | - Haiwen Luan
- Department of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Orin Block
- Department of Neurosurgery, Northwestern Memorial Hospital, Chicago, IL 60611, USA
| | | | - Yadong Zhou
- Department of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.,Department of Engineering Mechanics, Southeast University, 210096 Nanjing, China
| | - Chandrasekaran Jayaraman
- Max Nader Lab for Rehabilitation Technologies and Outcomes Research, Center for Bionic Medicine, Rehabilitation Institute of Chicago, Chicago, IL 60611, USA.,Departments of Physical Medicine & Rehabilitation and Medical Social Sciences, Northwestern University, Chicago, IL, USA
| | - Tyler Koski
- Department of Neurosurgery, Northwestern Memorial Hospital, Chicago, IL 60611, USA
| | | | | | - Arun Jayaraman
- Max Nader Lab for Rehabilitation Technologies and Outcomes Research, Center for Bionic Medicine, Rehabilitation Institute of Chicago, Chicago, IL 60611, USA.,Departments of Physical Medicine & Rehabilitation and Medical Social Sciences, Northwestern University, Chicago, IL, USA
| | - Yonggang Huang
- Department of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA.,Center for Bio-Integrated Electronics, Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Neurological Surgery, Simpson Querrey Institute for Nano/Biotechnology, McCormick School of Engineering, Feinberg School of Medicine, Northwestern University, Evanston, IL 60208, USA
| | - Roozbeh Ghaffari
- MC10 Inc., Lexington, MA 02421, USA.,Center for Bio-Integrated Electronics, Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Neurological Surgery, Simpson Querrey Institute for Nano/Biotechnology, McCormick School of Engineering, Feinberg School of Medicine, Northwestern University, Evanston, IL 60208, USA
| | - Michel Kliot
- Department of Neurosurgery, Northwestern Memorial Hospital, Chicago, IL 60611, USA.,Department of Neurosurgery, Stanford University School of Medicine, Stanford, CA 94305, USA
| | - John A Rogers
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA.,Center for Bio-Integrated Electronics, Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Neurological Surgery, Simpson Querrey Institute for Nano/Biotechnology, McCormick School of Engineering, Feinberg School of Medicine, Northwestern University, Evanston, IL 60208, USA
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32
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Fu H, Nan K, Bai W, Huang W, Bai K, Lu L, Zhou C, Liu Y, Liu F, Wang J, Han M, Yan Z, Luan H, Zhang Y, Zhang Y, Zhao J, Cheng X, Li M, Lee JW, Liu Y, Fang D, Li X, Huang Y, Zhang Y, Rogers JA. Morphable 3D mesostructures and microelectronic devices by multistable buckling mechanics. Nat Mater 2018; 17:268-276. [PMID: 29379201 PMCID: PMC5877475 DOI: 10.1038/s41563-017-0011-3] [Citation(s) in RCA: 139] [Impact Index Per Article: 23.2] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/04/2017] [Accepted: 12/11/2017] [Indexed: 05/18/2023]
Abstract
Three-dimensional (3D) structures capable of reversible transformations in their geometrical layouts have important applications across a broad range of areas. Most morphable 3D systems rely on concepts inspired by origami/kirigami or techniques of 3D printing with responsive materials. The development of schemes that can simultaneously apply across a wide range of size scales and with classes of advanced materials found in state-of-the-art microsystem technologies remains challenging. Here, we introduce a set of concepts for morphable 3D mesostructures in diverse materials and fully formed planar devices spanning length scales from micrometres to millimetres. The approaches rely on elastomer platforms deformed in different time sequences to elastically alter the 3D geometries of supported mesostructures via nonlinear mechanical buckling. Over 20 examples have been experimentally and theoretically investigated, including mesostructures that can be reshaped between different geometries as well as those that can morph into three or more distinct states. An adaptive radiofrequency circuit and a concealable electromagnetic device provide examples of functionally reconfigurable microelectronic devices.
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Affiliation(s)
- Haoran Fu
- Center for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China
| | - Kewang Nan
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Wubin Bai
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Wen Huang
- Department of Electrical and Computer Engineering Micro and Nanotechnology Laboratory International Institute for Carbon-Neutral Energy Research (I2CNER), University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Ke Bai
- Center for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China
| | - Luyao Lu
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Chaoqun Zhou
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Yunpeng Liu
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Fei Liu
- Center for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China
| | - Juntong Wang
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Mengdi Han
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing, China
| | - Zheng Yan
- Department of Chemical Engineering and Department of Mechanical & Aerospace Engineering, University of Missouri, Columbia, MO, USA
| | - Haiwen Luan
- Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL, USA
| | - Yijie Zhang
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Yutong Zhang
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Jianing Zhao
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Xu Cheng
- Center for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China
| | - Moyang Li
- Department of Electrical and Computer Engineering Micro and Nanotechnology Laboratory International Institute for Carbon-Neutral Energy Research (I2CNER), University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Jung Woo Lee
- Department of Materials Science and Engineering, Pusan National University, Busan, Republic of Korea
| | - Yuan Liu
- Center for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China
| | - Daining Fang
- Institute of Advanced Structure Technology; Beijing Key Laboratory of Lightweight Multi-functional Composite Materials and Structures, Beijing Institute of Technology, Beijing, China
| | - Xiuling Li
- Department of Electrical and Computer Engineering Micro and Nanotechnology Laboratory International Institute for Carbon-Neutral Energy Research (I2CNER), University of Illinois at Urbana-Champaign, Urbana, IL, USA
| | - Yonggang Huang
- Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
| | - Yihui Zhang
- Center for Mechanics and Materials; Center for Flexible Electronics Technology; AML, Department of Engineering Mechanics, Tsinghua University, Beijing, China.
| | - John A Rogers
- Departments of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science; Center for Bio-Integrated Electronics; and Simpson Querrey Institute for BioNanotechnology, Northwestern University, Evanston, IL, USA.
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33
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Wang H, Ning X, Li H, Luan H, Xue Y, Yu X, Fan Z, Li L, Rogers JA, Zhang Y, Huang Y. Vibration of Mechanically-Assembled 3D Microstructures Formed by Compressive Buckling. J Mech Phys Solids 2018; 112:187-208. [PMID: 29713095 PMCID: PMC5918305 DOI: 10.1016/j.jmps.2017.12.002] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/12/2023]
Abstract
Micro-electromechanical systems (MEMS) that rely on structural vibrations have many important applications, ranging from oscillators and actuators, to energy harvesters and vehicles for measurement of mechanical properties. Conventional MEMS, however, mostly utilize two-dimensional (2D) vibrational modes, thereby imposing certain limitations that are not present in 3D designs (e.g., multi-directional energy harvesting). 3D vibrational microplatforms assembled through the techniques of controlled compressive buckling are promising because of their complex 3D architectures and the ability to tune their vibrational behaviour (e.g., natural frequencies and modes) by reversibly changing their dimensions by deforming their soft, elastomeric substrates. A clear understanding of such strain-dependent vibration behaviour is essential for their practical applications. Here, we present a study on the linear and nonlinear vibration of such 3D mesostructures through analytical modeling, finite element analysis (FEA) and experiment. An analytical solution is obtained for the vibration mode and linear natural frequency of a buckled ribbon, indicating a mode change as the static deflection amplitude increases. The model also yields a scaling law for linear natural frequency that can be extended to general, complex 3D geometries, as validated by FEA and experiment. In the regime of nonlinear vibration, FEA suggests that an increase of amplitude of external loading represents an effective means to enhance the bandwidth. The results also uncover a reduced nonlinearity of vibration as the static deflection amplitude of the 3D structures increases. The developed analytical model can be used in the development of new 3D vibrational microplatforms, for example, to enable simultaneous measurement of diverse mechanical properties (density, modulus, viscosity etc.) of thin films and biomaterials.
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Affiliation(s)
- Heling Wang
- Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
| | - Xin Ning
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Haibo Li
- Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
| | - Haiwen Luan
- Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
| | - Yeguang Xue
- Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
| | - Xinge Yu
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Zhichao Fan
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
- Center for Mechanics and Materials and Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
| | - Luming Li
- Man-machine-Environment Engineering Institute, Department of Aeronautics & Astronautics Engineering, Tsinghua University, Beijing 100084, China
| | - John A. Rogers
- Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Neurological Surgery, Center for Bio-Integrated Electronics, Simpson Querrey Institute for BioNanotechnology, McCormick School of Engineering and Feinberg School of Medicine, Northwestern University, Evanston, Illinois 60208, USA
| | - Yihui Zhang
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
- Center for Mechanics and Materials and Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China
- To whom correspondence should be addressed: (Y.Z.); (Y.H.)
| | - Yonggang Huang
- Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, USA
- To whom correspondence should be addressed: (Y.Z.); (Y.H.)
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Lee YK, Yu KJ, Song E, Farimani AB, Vitale F, Xie Z, Yoon Y, Kim Y, Richardson A, Luan H, Wu Y, Xie X, Lucas TH, Crawford K, Mei Y, Feng X, Huang Y, Litt B, Aluru NR, Yin L, Rogers JA. Dissolution of Monocrystalline Silicon Nanomembranes and Their Use as Encapsulation Layers and Electrical Interfaces in Water-Soluble Electronics. ACS Nano 2017; 11:12562-12572. [PMID: 29178798 PMCID: PMC5830089 DOI: 10.1021/acsnano.7b06697] [Citation(s) in RCA: 46] [Impact Index Per Article: 6.6] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/19/2023]
Abstract
The chemistry that governs the dissolution of device-grade, monocrystalline silicon nanomembranes into benign end products by hydrolysis serves as the foundation for fully eco/biodegradable classes of high-performance electronics. This paper examines these processes in aqueous solutions with chemical compositions relevant to groundwater and biofluids. The results show that the presence of Si(OH)4 and proteins in these solutions can slow the rates of dissolution and that ion-specific effects associated with Ca2+ can significantly increase these rates. This information allows for effective use of silicon nanomembranes not only as active layers in eco/biodegradable electronics but also as water barriers capable of providing perfect encapsulation until their disappearance by dissolution. The time scales for this encapsulation can be controlled by introduction of dopants into the Si and by addition of oxide layers on the exposed surfaces.The former possibility also allows the doped silicon to serve as an electrical interface for measuring biopotentials, as demonstrated in fully bioresorbable platforms for in vivo neural recordings. This collection of findings is important for further engineering development of water-soluble classes of silicon electronics.
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Affiliation(s)
| | | | - Enming Song
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USADepartment of Materials Science, Fudan University, Shanghai 200433, China
| | | | - Flavia Vitale
- Department of Neurology, Department of Physical Medicine and Rehabilitation, Center for Neuroengineering and Therapeutics, Perelman School of Medicine University of Pennsylvania, Philadelphia, PA 19104, USA
| | - Zhaoqian Xie
- Department of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA AML, Department of Engineering Mechanics, Center for Mechanics and Materials Tsinghua University, Beijing 100084, China
| | - Younghee Yoon
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Yerim Kim
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Andrew Richardson
- Department of Neurosurgery, Center for Neuroengineering and Therapeutics, Perelman School of Medicine, University of Pennsylvania, Philadelphia, PA 19104, USA
| | - Haiwen Luan
- Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Yixin Wu
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208 USASchool of Materials Science and Engineering, Tsinghua University, Beijing 100084 China
| | - Xu Xie
- Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, IL 61801 USA
| | - Timothy H. Lucas
- Department of Neurosurgery, Center for Neuroengineering and Therapeutics, Perelman School of Medicine, University of Pennsylvania, Philadelphia, PA 19104, USA
| | - Kaitlyn Crawford
- Materials Science and Engineering, University of Central Florida, Florida 32816 USA
| | - Yongfeng Mei
- Department of Materials Science, Fudan University, Shanghai 200433, China
| | - Xue Feng
- AML, Department of Engineering Mechanics, Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China
| | - Yonggang Huang
- Department of Civil and Environmental Engineering, Mechanical Engineering, Materials Science and Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Brian Litt
- Department of Neurology, Center for Neuroengineering and Therapeutics, Perelman School of Medicine, Department of Bioengineering, School of Engineering and Applied Sciences, Penn Center for Health, Devices & Technology, University of Pennsylvania, Philadelphia, PA 19104, USA
| | - Narayana R. Aluru
- Mechanical Science and Engineering, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA
| | - Lan Yin
- Corresponding Author: To whom correspondence should be addressed. John A. Rogers (), Lan Yin ()
| | - John A. Rogers
- Corresponding Author: To whom correspondence should be addressed. John A. Rogers (), Lan Yin ()
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Lee YK, Yu KJ, Kim Y, Yoon Y, Xie Z, Song E, Luan H, Feng X, Huang Y, Rogers JA. Kinetics and Chemistry of Hydrolysis of Ultrathin, Thermally Grown Layers of Silicon Oxide as Biofluid Barriers in Flexible Electronic Systems. ACS Appl Mater Interfaces 2017; 9:42633-42638. [PMID: 29178781 PMCID: PMC6800003 DOI: 10.1021/acsami.7b15302] [Citation(s) in RCA: 15] [Impact Index Per Article: 2.1] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/21/2023]
Abstract
Flexible electronic systems for bioimplants that offer long-term (multidecade) stability and safety in operation require thin, biocompatible layers that can prevent biofluid penetration. Recent work shows that ultrathin films of silicon dioxide thermally grown (TG-SiO2) on device-grade silicon wafers and then released as transferrable barriers offer a remarkable set of attributes in this context. This paper examines the chemical stability of these materials in aqueous solutions with different combinations of chemistries that are present in biofluids. Systematic measurements reveal the dependence of the dissolution rate of TG-SiO2 on concentrations of cations (Na+, K+, Mg2+, Ca2+) and anions (Cl-, HPO42-) at near-neutral pH. Certain results are consistent with previous studies on bulk samples of quartz and nanoparticles of amorphous silica; others reveal significant catalyzing effects associated with divalent cations at high pH and with specific anions at high ionic strength. In particular, Ca2+ and HPO42- greatly enhance and silicic acid greatly reduces the rates. These findings establish foundational data of relevance to predicting lifetimes of implantable devices that use TG-SiO2 as biofluid barriers, and of other classes of systems, such as environmental monitors, where encapsulation against water penetration is important.
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Affiliation(s)
- Yoon Kyeung Lee
- Department of Chemistry, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign, Urbana, Illinois 61801, United States
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign, Urbana, Illinois 61801, United States
| | - Ki Jun Yu
- Department of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
| | - Yerim Kim
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign, Urbana, Illinois 61801, United States
| | - Younghee Yoon
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign, Urbana, Illinois 61801, United States
| | - Zhaoqian Xie
- Department of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, McCormick School of Engineering, and Feinberg School of Medicine, Northwestern University, Evanston, Illinois 60208, United States
- AML, Department of Engineering Mechanics, Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China
| | - Enming Song
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana–Champaign, Urbana, Illinois 61801, United States
- Department of Materials Science, Fudan University, Shanghai 200433, P.R. China
| | - Haiwen Luan
- Department of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, McCormick School of Engineering, and Feinberg School of Medicine, Northwestern University, Evanston, Illinois 60208, United States
| | - Xue Feng
- AML, Department of Engineering Mechanics, Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China
| | - Yonggang Huang
- Department of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, McCormick School of Engineering, and Feinberg School of Medicine, Northwestern University, Evanston, Illinois 60208, United States
| | - John A. Rogers
- Center for Bio-Integrated Electronics, Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, and Neurological Surgery, Simpson Querrey Institute for Nano/biotechnology, McCormick School of Engineering, and Feinberg School of Medicine, Northwestern University, Evanston, Illinois 60208, United States
- Corresponding Author
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36
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Fu H, Nan K, Froeter P, Huang W, Liu Y, Wang Y, Wang J, Yan Z, Luan H, Guo X, Zhang Y, Jiang C, Li L, Dunn AC, Li X, Huang Y, Zhang Y, Rogers JA. Mechanically-Guided Deterministic Assembly of 3D Mesostructures Assisted by Residual Stresses. Small 2017; 13:10.1002/smll.201700151. [PMID: 28489315 PMCID: PMC5559729 DOI: 10.1002/smll.201700151] [Citation(s) in RCA: 5] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/12/2017] [Revised: 02/20/2017] [Indexed: 06/07/2023]
Abstract
Formation of 3D mesostructures in advanced functional materials is of growing interest due to the widespread envisioned applications of devices that exploit 3D architectures. Mechanically guided assembly based on compressive buckling of 2D precursors represents a promising method, with applicability to a diverse set of geometries and materials, including inorganic semiconductors, metals, polymers, and their heterogeneous combinations. This paper introduces ideas that extend the levels of control and the range of 3D layouts that are achievable in this manner. Here, thin, patterned layers with well-defined residual stresses influence the process of 2D to 3D geometric transformation. Systematic studies through combined analytical modeling, numerical simulations, and experimental observations demonstrate the effectiveness of the proposed strategy through ≈20 example cases with a broad range of complex 3D topologies. The results elucidate the ability of these stressed layers to alter the energy landscape associated with the transformation process and, specifically, the energy barriers that separate different stable modes in the final 3D configurations. A demonstration in a mechanically tunable microbalance illustrates the utility of these ideas in a simple structure designed for mass measurement.
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Affiliation(s)
| | | | - Paul Froeter
- Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Wen Huang
- Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Yuan Liu
- Center for Mechanics and Materials, AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084 (P.R. China)
| | - Yiqi Wang
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Juntong Wang
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Zheng Yan
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Haiwen Luan
- Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208 (USA)
| | - Xiaogang Guo
- Center for Mechanics and Materials, AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084 (P.R. China)
| | - Yijie Zhang
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Changqing Jiang
- Man-machine-Environment Engineering Institute, Department of Aeronautics & Astronautics Engineering, Tsinghua University, Beijing 100084 (P.R. China)
| | - Luming Li
- Man-machine-Environment Engineering Institute, Department of Aeronautics & Astronautics Engineering, Tsinghua University, Beijing 100084 (P.R. China)
| | - Alison C. Dunn
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Xiuling Li
- Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Yonggang Huang
- Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208 (USA)
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Ning X, Wang H, Yu X, Soares JANT, Yan Z, Nan K, Velarde G, Xue Y, Sun R, Dong Q, Luan H, Lee CM, Chempakasseril A, Han M, Wang Y, Li L, Huang Y, Zhang Y, Rogers J. Three-Dimensional Multiscale, Multistable, and Geometrically Diverse Microstructures with Tunable Vibrational Dynamics Assembled by Compressive Buckling. Adv Funct Mater 2017; 27:1605914. [PMID: 29456464 PMCID: PMC5813837 DOI: 10.1002/adfm.201605914] [Citation(s) in RCA: 10] [Impact Index Per Article: 1.4] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/22/2023]
Abstract
Microelectromechanical systems remain an area of significant interest in fundamental and applied research due to their wide ranging applications. Most device designs, however, are largely two-dimensional and constrained to only a few simple geometries. Achieving tunable resonant frequencies or broad operational bandwidths requires complex components and/or fabrication processes. The work presented here reports unusual classes of three-dimensional (3D) micromechanical systems in the form of vibratory platforms assembled by controlled compressive buckling. Such 3D structures can be fabricated across a broad range of length scales and from various materials, including soft polymers, monocrystalline silicon, and their composites, resulting in a wide scope of achievable resonant frequencies and mechanical behaviors. Platforms designed with multistable mechanical responses and vibrationally de-coupled constituent elements offer improved bandwidth and frequency tunability. Furthermore, the resonant frequencies can be controlled through deformations of an underlying elastomeric substrate. Systematic experimental and computational studies include structures with diverse geometries, ranging from tables, cages, rings, ring-crosses, ring-disks, two-floor ribbons, flowers, umbrellas, triple-cantilever platforms, and asymmetric circular helices, to multilayer constructions. These ideas form the foundations for engineering designs that complement those supported by conventional, microelectromechanical systems, with capabilities that could be useful in systems for biosensing, energy harvesting and others.
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Affiliation(s)
- Xin Ning
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Heling Wang
- Departments of Civil and Environmental Engineering, and Mechanical Engineering, Northwestern University, Evanston, Illinois 60208 (USA)
| | - Xinge Yu
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Julio A N T Soares
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Zheng Yan
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Kewang Nan
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Gabriel Velarde
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Yeguang Xue
- Departments of Civil and Environmental Engineering, and Mechanical Engineering, Northwestern University, Evanston, Illinois 60208 (USA)
| | - Rujie Sun
- Advanced Composites Centre for Innovation and Science, University of Bristol, Bristol, BS8 1TR (UK)
| | - Qiyi Dong
- Department of Industrial and Enterprise Systems Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Haiwen Luan
- Departments of Civil and Environmental Engineering, and Mechanical Engineering, Northwestern University, Evanston, Illinois 60208 (USA)
| | - Chan Mi Lee
- Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Aditya Chempakasseril
- Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Mengdi Han
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing 100871 (P.R. China)
| | - Yiqi Wang
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Luming Li
- Man-machine-Environment Engineering Institute, Department of Aeronautics & Astronautics Engineering, School of Aerospace Engineering, Tsinghua University, Beijing 100084 (P.R. China)
| | - Yonggang Huang
- Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208 (USA)
| | - Yihui Zhang
- Center for Mechanics and Materials, AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084 (P.R. China)
| | - John Rogers
- Department of Materials Science and Engineering, Biomedical Engineering, Neurological Surgery, Chemistry, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute and Feinberg Medical School, Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208 (USA)
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38
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Nan K, Luan H, Yan Z, Ning X, Wang Y, Wang A, Wang J, Han M, Chang M, Li K, Zhang Y, Huang W, Xue Y, Huang Y, Zhang Y, Rogers JA. Engineered elastomer substrates for guided assembly of complex 3D mesostructures by spatially nonuniform compressive buckling. Adv Funct Mater 2017; 27:1604281. [PMID: 28970775 PMCID: PMC5621772 DOI: 10.1002/adfm.201604281] [Citation(s) in RCA: 11] [Impact Index Per Article: 1.6] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 04/14/2023]
Abstract
Approaches capable of creating three-dimensional (3D) mesostructures in advanced materials (device-grade semiconductors, electroactive polymers etc.) are of increasing interest in modern materials research. A versatile set of approaches exploits transformation of planar precursors into 3D architectures through the action of compressive forces associated with release of prestrain in a supporting elastomer substrate. Although a diverse set of 3D structures can be realized in nearly any class of material in this way, all previously reported demonstrations lack the ability to vary the degree of compression imparted to different regions of the 2D precursor, thus constraining the diversity of 3D geometries. This paper presents a set of ideas in materials and mechanics in which elastomeric substrates with engineered distributions of thickness yield desired strain distributions for targeted control over resultant 3D mesostructures geometries. This approach is compatible with a broad range of advanced functional materials from device-grade semiconductors to commercially available thin films, over length scales from tens of microns to several millimeters. A wide range of 3D structures can be produced in this way, some of which have direct relevance to applications in tunable optics and stretchable electronics.
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Affiliation(s)
- Kewang Nan
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Haiwen Luan
- Departments of Mechanical Engineering, and Civil and Environmental Engineering, Northwestern University, Evanston, Illinois 60208 (USA)
| | - Zheng Yan
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Xin Ning
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Yiqi Wang
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Ao Wang
- Departments of Mechanical Engineering, and Civil and Environmental Engineering, Northwestern University, Evanston, Illinois 60208 (USA), Department of Engineering Mechanics, Tsinghua University, Beijing 100084 (P.R. China)
| | - Juntong Wang
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Mengdi Han
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing 100871 (P. R. China)
| | - Matthew Chang
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Kan Li
- Departments of Mechanical Engineering, and Civil and Environmental Engineering, Northwestern University, Evanston, Illinois 60208 (USA)
| | - Yutong Zhang
- Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Wen Huang
- Department of Electrical and Computer Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Yeguang Xue
- Departments of Mechanical Engineering, and Civil and Environmental Engineering, Northwestern University, Evanston, Illinois 60208 (USA)
| | - Yonggang Huang
- Departments of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208 (USA)
| | - Yihui Zhang
- Center for Mechanics and Materials, AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084 (P.R. China)
| | - John A Rogers
- Department of Materials Science and Engineering, Chemistry, Mechanical Science and Engineering, Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
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39
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Ma Q, Cheng H, Jang KI, Luan H, Hwang KC, Rogers JA, Huang Y, Zhang Y. A nonlinear mechanics model of bio-inspired hierarchical lattice materials consisting of horseshoe microstructures. J Mech Phys Solids 2016; 90:179-202. [PMID: 27087704 PMCID: PMC4831080 DOI: 10.1016/j.jmps.2016.02.012] [Citation(s) in RCA: 47] [Impact Index Per Article: 5.9] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/04/2023]
Abstract
Development of advanced synthetic materials that can mimic the mechanical properties of non-mineralized soft biological materials has important implications in a wide range of technologies. Hierarchical lattice materials constructed with horseshoe microstructures belong to this class of bio-inspired synthetic materials, where the mechanical responses can be tailored to match the nonlinear J-shaped stress-strain curves of human skins. The underlying relations between the J-shaped stress-strain curves and their microstructure geometry are essential in designing such systems for targeted applications. Here, a theoretical model of this type of hierarchical lattice material is developed by combining a finite deformation constitutive relation of the building block (i.e., horseshoe microstructure), with the analyses of equilibrium and deformation compatibility in the periodical lattices. The nonlinear J-shaped stress-strain curves and Poisson ratios predicted by this model agree very well with results of finite element analyses (FEA) and experiment. Based on this model, analytic solutions were obtained for some key mechanical quantities, e.g., elastic modulus, Poisson ratio, peak modulus, and critical strain around which the tangent modulus increases rapidly. A negative Poisson effect is revealed in the hierarchical lattice with triangular topology, as opposed to a positive Poisson effect in hierarchical lattices with Kagome and honeycomb topologies. The lattice topology is also found to have a strong influence on the stress-strain curve. For the three isotropic lattice topologies (triangular, Kagome and honeycomb), the hierarchical triangular lattice material renders the sharpest transition in the stress-strain curve and relative high stretchability, given the same porosity and arc angle of horseshoe microstructure. Furthermore, a demonstrative example illustrates the utility of the developed model in the rapid optimization of hierarchical lattice materials for reproducing the desired stress-strain curves of human skins. This study provides theoretical guidelines for future designs of soft bio-mimetic materials with hierarchical lattice constructions.
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Affiliation(s)
- Qiang Ma
- Center for Mechanics and Materials, AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
| | - Huanyu Cheng
- Department of Engineering Science and Mechanics, The Pennsylvania State University, University Park, Pennsylvania 16802, USA
| | - Kyung-In Jang
- Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Haiwen Luan
- Department of Civil and Environmental Engineering; Department of Mechanical Engineering; Department of Materials Science and Engineering; Center for Engineering and Health; Skin Disease Research Center; Northwestern University, Evanston, IL 60208, USA
| | - Keh-Chih Hwang
- Center for Mechanics and Materials, AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
| | - John A. Rogers
- Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Yonggang Huang
- Department of Civil and Environmental Engineering; Department of Mechanical Engineering; Department of Materials Science and Engineering; Center for Engineering and Health; Skin Disease Research Center; Northwestern University, Evanston, IL 60208, USA
| | - Yihui Zhang
- Center for Mechanics and Materials, AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- To whom correspondence should be addressed:
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40
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Yan Z, Zhang F, Wang J, Liu F, Guo X, Nan K, Lin Q, Gao M, Xiao D, Shi Y, Qiu Y, Luan H, Kim JH, Wang Y, Luo H, Han M, Huang Y, Zhang Y, Rogers JA. Controlled mechanical buckling for origami-inspired construction of 3D microstructures in advanced materials. Adv Funct Mater 2016; 26:2629-2639. [PMID: 27499727 PMCID: PMC4972027 DOI: 10.1002/adfm.201504901] [Citation(s) in RCA: 101] [Impact Index Per Article: 12.6] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/17/2023]
Abstract
Origami is a topic of rapidly growing interest in both the scientific and engineering research communities due to its promising potential in a broad range of applications. Previous assembly approaches of origami structures at the micro/nanoscale are constrained by the applicable classes of materials, topologies and/or capability of control over the transformation. Here, we introduce an approach that exploits controlled mechanical buckling for autonomic origami assembly of 3D structures across material classes from soft polymers to brittle inorganic semiconductors, and length scales from nanometers to centimeters. This approach relies on a spatial variation of thickness in the initial 2D structures as an effective strategy to produce engineered folding creases during the compressive buckling process. The elastic nature of the assembly scheme enables active, deterministic control over intermediate states in the 2D to 3D transformation in a continuous and reversible manner. Demonstrations include a broad set of 3D structures formed through unidirectional, bidirectional, and even hierarchical folding, with examples ranging from half cylindrical columns and fish scales, to cubic boxes, pyramids, starfish, paper fans, skew tooth structures, and to amusing system-level examples of soccer balls, model houses, cars, and multi-floor textured buildings.
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Affiliation(s)
- Zheng Yan
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Fan Zhang
- Center for Mechanics and Materials, AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084 (P.R. China)
| | - Jiechen Wang
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Fei Liu
- Center for Mechanics and Materials, AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084 (P.R. China)
| | - Xuelin Guo
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Kewang Nan
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Qing Lin
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Mingye Gao
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Dongqing Xiao
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Yan Shi
- Center for Mechanics and Materials, AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084 (P.R. China)
| | - Yitao Qiu
- Department of Automotive Engineering, Tsinghua University, Beijing 100084 (P.R. China)
| | - Haiwen Luan
- Departments of Civil and Environmental Engineering, and Mechanical Engineering, Center for Engineering and Health, and Skin Disease Research Center, Northwestern University, Evanston, Illinois 60208 (USA)
| | - Jung Hwan Kim
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Yiqi Wang
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
| | - Hongying Luo
- Departments of Civil and Environmental Engineering, and Mechanical Engineering, Center for Engineering and Health, and Skin Disease Research Center, Northwestern University, Evanston, Illinois 60208 (USA). School of Aerospace Engineering and Applied Mechanics, Tongji University, Shanghai 200092 (P. R. China)
| | - Mengdi Han
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, Beijing 100871 (P. R. China)
| | - Yonggang Huang
- Departments of Civil and Environmental Engineering, and Mechanical Engineering, Center for Engineering and Health, and Skin Disease Research Center, Northwestern University, Evanston, Illinois 60208 (USA)
| | - Yihui Zhang
- Center for Mechanics and Materials, AML, Department of Engineering Mechanics, Tsinghua University Beijing 100084 (P.R. China)
| | - John A. Rogers
- Department of Materials Science and Engineering, Chemistry, Mechanical Science and Engineering, Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology, and Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801 (USA)
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41
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Xu Y, Xu Y, Luan H, Jiang Y, Tian X, Zhang S. Cardioprotection against experimental myocardial ischemic injury using cornin. Braz J Med Biol Res 2016; 49:e5039. [PMID: 26871971 PMCID: PMC4742973 DOI: 10.1590/1414-431x20155039] [Citation(s) in RCA: 6] [Impact Index Per Article: 0.8] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/13/2015] [Accepted: 10/13/2015] [Indexed: 02/03/2023] Open
Abstract
Phosphorylated-cyclic adenosine monophosphate response element-binding protein (Phospho-CREB) has an important role in the pathogenesis of myocardial ischemia. We isolated the iridoid glycoside cornin from the fruit of Verbena officinalis L, investigated its effects against myocardial ischemia and reperfusion (I/R) injury in vivo, and elucidated its potential mechanism in vitro. Effects of cornin on cell viability, as well as expression of phospho-CREB and phospho-Akt in hypoxic H9c2 cells in vitro, and myocardial I/R injury in vivo, were investigated. Cornin attenuated hypoxia-induced cytotoxicity significantly in H9c2 cells in a concentration-dependent manner. Treatment of H9c2 cells with cornin (10 µM) blocked the reduction of expression of phospho-CREB and phospho-Akt in a hypoxic condition. Treatment of rats with cornin (30 mg/kg, iv) protected them from myocardial I/R injury as indicated by a decrease in infarct volume, improvement in hemodynamics, and reduction of severity of myocardial damage. Cornin treatment also attenuated the reduction of expression of phospho-CREB and phospho-Akt in ischemic myocardial tissue. These data suggest that cornin exerts protective effects due to an increase in expression of phospho-CREB and phospho-Akt.
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Affiliation(s)
- Y Xu
- School of Pharmaceutical Sciences, Binzhou Medical University, Yantai, China
| | - Y Xu
- School of Pharmaceutical Sciences, Binzhou Medical University, Yantai, China
| | - H Luan
- School of Pharmaceutical Sciences, Binzhou Medical University, Yantai, China
| | - Y Jiang
- School of Pharmaceutical Sciences, Binzhou Medical University, Yantai, China
| | - X Tian
- School of Pharmaceutical Sciences, Binzhou Medical University, Yantai, China
| | - S Zhang
- School of Pharmaceutical Sciences, Binzhou Medical University, Yantai, China
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42
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Jang KI, Chung HU, Xu S, Lee CH, Luan H, Jeong J, Cheng H, Kim GT, Han SY, Lee JW, Kim J, Cho M, Miao F, Yang Y, Jung HN, Flavin M, Liu H, Kong GW, Yu KJ, Rhee SI, Chung J, Kim B, Kwak JW, Yun MH, Kim JY, Song YM, Paik U, Zhang Y, Huang Y, Rogers JA. Soft network composite materials with deterministic and bio-inspired designs. Nat Commun 2015; 6:6566. [PMID: 25782446 PMCID: PMC4383007 DOI: 10.1038/ncomms7566] [Citation(s) in RCA: 160] [Impact Index Per Article: 17.8] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/28/2014] [Accepted: 02/06/2015] [Indexed: 12/11/2022] Open
Abstract
Hard and soft structural composites found in biology provide inspiration for the design of advanced synthetic materials. Many examples of bio-inspired hard materials can be found in the literature; far less attention has been devoted to soft systems. Here we introduce deterministic routes to low-modulus thin film materials with stress/strain responses that can be tailored precisely to match the non-linear properties of biological tissues, with application opportunities that range from soft biomedical devices to constructs for tissue engineering. The approach combines a low-modulus matrix with an open, stretchable network as a structural reinforcement that can yield classes of composites with a wide range of desired mechanical responses, including anisotropic, spatially heterogeneous, hierarchical and self-similar designs. Demonstrative application examples in thin, skin-mounted electrophysiological sensors with mechanics precisely matched to the human epidermis and in soft, hydrogel-based vehicles for triggered drug release suggest their broad potential uses in biomedical devices.
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Affiliation(s)
- Kyung-In Jang
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Ha Uk Chung
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Sheng Xu
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Chi Hwan Lee
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Haiwen Luan
- Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, Illinois 60208, USA
| | - Jaewoong Jeong
- Department of Electrical, Computer and Energy Engineering, University of Colorado, Boulder, Colorado 80309, USA
| | - Huanyu Cheng
- Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, Illinois 60208, USA
| | - Gwang-Tae Kim
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Sang Youn Han
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
- Samsung Display Co. Display R&D Center, Yongin-city, Gyeongki-do 446–711, Republic of Korea
| | - Jung Woo Lee
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
- Department of Material Science and Engineering, Department of Energy Engineering, Hanyang University, Seoul 133-791, Republic of Korea
| | - Jeonghyun Kim
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
- Department of Material Science and Engineering, Department of Energy Engineering, Hanyang University, Seoul 133-791, Republic of Korea
| | - Moongee Cho
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Fuxing Miao
- Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, Illinois 60208, USA
- Department of Mechanical Engineering and Mechanics, Ningbo University, Ningbo 315211, China
| | - Yiyuan Yang
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Han Na Jung
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Matthew Flavin
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Howard Liu
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Gil Woo Kong
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Ki Jun Yu
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Sang Il Rhee
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Jeahoon Chung
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Byunggik Kim
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Jean Won Kwak
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
| | - Myoung Hee Yun
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
- School of Energy and Chemical Engineering, Ulsan National Institute Science and Technology (UNIST), Ulsan 689-798, Republic of Korea
| | - Jin Young Kim
- School of Energy and Chemical Engineering, Ulsan National Institute Science and Technology (UNIST), Ulsan 689-798, Republic of Korea
| | - Young Min Song
- Department of Electronic Engineering, Biomedical Research Institute, Pusan National University, Geumjeong-gu, Busan 609-735, Republic of Korea
| | - Ungyu Paik
- Department of Material Science and Engineering, Department of Energy Engineering, Hanyang University, Seoul 133-791, Republic of Korea
| | - Yihui Zhang
- Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, Illinois 60208, USA
- Center for Mechanics and Materials, Tsinghua University, Beijing 100084, China
| | - Yonggang Huang
- Department of Civil and Environmental Engineering, Department of Mechanical Engineering, Center for Engineering and Health and Skin Disease Research Center, Northwestern University, Evanston, Illinois 60208, USA
| | - John A. Rogers
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois, Urbana-Champaign, Urbana, Illinois 61801, USA
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Su Y, Wang S, Huang Y, Luan H, Dong W, Fan JA, Yang Q, Rogers JA, Huang Y. Elasticity of fractal inspired interconnects. Small 2015; 11:367-373. [PMID: 25183293 DOI: 10.1002/smll.201401181] [Citation(s) in RCA: 19] [Impact Index Per Article: 2.1] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/29/2014] [Revised: 06/23/2014] [Indexed: 06/03/2023]
Abstract
The use of fractal-inspired geometric designs in electrical interconnects represents an important approach to simultaneously achieve large stretchability and high aerial coverage of active devices for stretchable electronics. The elastic stiffness of fractal interconnects is determined analytically in this paper. Specifically, the elastic energy and the tensile stiffness for an order n fractal interconnect of arbitrary shape are obtained, and are verified by the finite element analysis and experiments.
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Affiliation(s)
- Yewang Su
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, Illinois, 60208, USA; Department of Mechanical Engineering Center for Engineering and Health, Skin Disease Research Center Northwestern University, Evanston, Illinois, 60208, USA; Center for Mechanics and Materials, Tsinghua University, Beijing, 100084, China
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Kang Z, Zhu H, Luan H, Han F, Jiang W. Curculigoside A induces angiogenesis through VCAM-1/Egr-3/CREB/VEGF signaling pathway. Neuroscience 2014; 267:232-40. [DOI: 10.1016/j.neuroscience.2014.02.050] [Citation(s) in RCA: 21] [Impact Index Per Article: 2.1] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/20/2014] [Revised: 02/25/2014] [Accepted: 02/27/2014] [Indexed: 12/25/2022]
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45
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Mo D, Huang J, Jia X, Luan H, Rozelle S, Swinnen J. Checking into China's cow hotels: Have policies following the milk scandal changed the structure of the dairy sector? J Dairy Sci 2012; 95:2282-98. [DOI: 10.3168/jds.2011-4720] [Citation(s) in RCA: 28] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/12/2011] [Accepted: 12/31/2011] [Indexed: 11/19/2022]
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46
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Zhou LP, Luan H, Dong XH, Jin GJ, Man DL, Shang H. Vascular endothelial growth factor gene polymorphisms and colorectal cancer risk: a meta-analysis. Genet Mol Res 2011; 10:3674-88. [PMID: 22058001 DOI: 10.4238/2011.october.31.13] [Citation(s) in RCA: 15] [Impact Index Per Article: 1.2] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/28/2023]
Abstract
Vascular endothelial growth factor (VEGF) is an endothelial cell-specific mitogen involved in a number of pathologic processes, including angiogenesis, tumor growth and metastasis. Polymorphisms of the VEGF gene have been associated with susceptibility to colorectal cancer (CRC). However, the specific association still remains controversial. We made a meta-analysis of the association between VEGF gene polymorphisms and CRC risk. Only eight case-control studies were retrieved, with a total of 2337 CRC patients and 2032 healthy controls. Six VEGF gene polymorphisms were addressed in all studies included, +936C>T (rs3025039), -2578C>A (rs699947), -1154G>A (rs1570360), -634G>C (rs2010963), -460C>T (rs833061), and +405C>G (rs2010963). There was a significant association between -2578C>A polymorphism and susceptibility to CRC in the comparison of C allele carriers (CC + CA) versus AA (odds ratio = 0.77, 95% confidence interval = 0.62-0.96, P = 0.02). No association was found between +936C>T, -1154G>A, -634G>C, -460C>T, and +405C>G with susceptibility to CRC. We conclude that the C allele carrier (CC + CA) of VEGF -2578C>A polymorphism appears to be a protective factor for CRC.
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Affiliation(s)
- L P Zhou
- Department of Laboratory Medicine, The First Affiliated Hospital of China Medical University, Shenyang, China
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47
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Brown ET, Luan H, Gdowski MJ, Gdowski GT. Head movements produced during linear translations in unexpected directions. Annu Int Conf IEEE Eng Med Biol Soc 2010; 2009:7261-4. [PMID: 19965099 DOI: 10.1109/iembs.2009.5334734] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.1] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/06/2022]
Abstract
Passive translation of the body in space elicits a complex combination of directionally-specific torques that are exerted on the neck. The inertial torques that are produced by linear translation are counteracted by linear vestibular and proprioceptive reflexes that maintain head stability. A novel experimental apparatus was used in this study to translate human subjects in a random and unpredictable direction in order to quantify the head's 3-D movement with respect to the direction of translation. Head movements were found to be produced in systematic patterns as a function of stimulus direction. Roll and yaw head movements were produced in proportion to the magnitude of the lateral component of the translation. Pitch head movements were proportionate to the magnitude of the fore-aft component of the translation. One surprising observation was that head movements produced during lateral translations were, on average, 17% smaller than those produced during fore-aft translations. This suggests that linear vestibular reflexes that stabilize the head may be directionally-specific and more active during lateral whole body translations.
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Affiliation(s)
- E T Brown
- Dept. Biomed. Eng., Univ. Rochester, Rochester, NY 14642, USA.
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48
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Abstract
The vestibular nerve sends signals to the brain that code the movement and position of the head in space. These signals are used for a variety of functions, including the control of reflex and voluntary movements and the construction of a sense of self-motion. In order to carry out these functions, sensory vestibular signals need to be transformed in a variety of ways. Transformations are thought to occur at an early stage of sensory processing in the brain, and in many cases are apparent in the responses of neurons in the vestibular nuclei that receive direct inputs from the vestibular nerve. Several specific examples of sensory transformation in the vestibular nuclei are presented, and current hypotheses about the mechanisms that are used to produce the transformations are discussed.
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Affiliation(s)
- R McCrea
- Department of Neurobiology, Pharmacology and Physiology, University of Chicago, Illinois 60637, USA.
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49
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Kitama T, Ishida M, Luan H, Kawasaki T, Sato Y. Difference between horizontal and vertical optokinetic nystagmus in cats at upright position. Jpn J Physiol 2001; 51:463-74. [PMID: 11564283 DOI: 10.2170/jjphysiol.51.463] [Citation(s) in RCA: 4] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/05/2022]
Abstract
UNLABELLED The slow-phase velocity (SPV) of optokinetic nystagmus (OKN) and optokinetic after nystagmus (OKAN) in response to a velocity step of surround rotation in the horizontal direction is composed of the rapid and slow components in the cat: a rapid rise, a slow rise to a steady state, a rapid fall, and a slow decline to 0 deg/s. The rapid and slow components are attributed to the direct pathway and velocity storage neuronal mechanisms, respectively. The difference between horizontal and vertical OKN has been reported in the monkey at the upright position, but the slow and rapid components have not been distinguished. The present study compared horizontal OKN-OKAN with vertical OKN-OKAN in the cat at the upright position, distinguishing the rapid and slow components. Constant velocity rotation of a random dot pattern at a velocity of 5 to 160 deg/s was used for optokinetic stimulation. THE RESULTS First, the amplitude of the rapid rise was relatively small in all SPV directions and all stimulus velocities investigated, with a slight upward-SPV preference to the downward-SPV (maximum 6.4, 6.0, and 3.4 deg/s in horizontal, upward, and downward SPV directions, respectively). Second, the steady state velocity was large during horizontal OKN (maximum 69.0 deg/s), small during upward-SPV OKN (12.9 deg/s), and missing (SPV is negligibly small and irregular) during downward-SPV OKN, indicating a large directional difference of OKN. Third, the acceleration of the slow rise decreased with the stimulus velocity at higher stimulus velocities >20 deg/s during both horizontal and upward-SPV OKN, suggesting strong nonlinearity in the velocity charge system. Fourth, the decay time course of the OKAN was described by the time constant of the exponential function, and the time constant was longer during horizontal (mean, 8.3 s at a stimulus velocity of 20 deg/s) than during upward-SPV (5.4 s) OKAN, suggesting that the velocity discharge system is relatively linear compared with the velocity charge system. It is concluded that horizontal OKN-OKAN is much larger than vertical OKN-OKAN in the cat at the upright position, and this directional difference is caused mainly by the directional difference in the velocity storage mechanism, but not in the direct pathway mechanism.
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Affiliation(s)
- T Kitama
- Department of Physiology, Yamanashi Medical University, Tamaho, Yamanashi, 409-3898, Japan.
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50
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Brayman AA, Strickler PL, Luan H, Barned SL, Raeman CH, Cox C, Miller MW. Hemolysis of 40% hematocrit, Albunex-supplemented human erythrocytes by pulsed ultrasound: frequency, acoustic pressure and pulse length dependence. Ultrasound Med Biol 1997; 23:1237-1250. [PMID: 9372572 DOI: 10.1016/s0301-5629(97)00126-9] [Citation(s) in RCA: 19] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/22/2023]
Abstract
The dependence of hemolysis produced by pulsed ultrasound on ultrasound frequency, acoustic pressure and pulse length was explored. Human erythrocytes (40% hematocrit; in Albunex-supplemented autologous plasma) were exposed (60 s) to 20 or 200 microns pulses of ultrasound at frequencies of 1.02, 2.24 or 3.46 MHz and at peak negative pressures [P-] ranging from 0.0 to approximately 3.0 MPa in 0.5 MPa increments. The duty factor was 0.01. At each frequency, hemolysis increased with increasing acoustic pressure and depended weakly on pulse duration. At relatively high acoustic pressures, hemolysis depended strongly on ultrasound frequency; at lower pressures, the frequency dependence was weaker. The potential clinical significance of ultrasonic hemolysis is discussed.
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Affiliation(s)
- A A Brayman
- Department of Obstetrics and Gynecology, University of Rochester, NY 14642, USA.
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