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Ryu H, Park Y, Luan H, Dalgin G, Jeffris K, Yoon HJ, Chung TS, Kim JU, Kwak SS, Lee G, Jeong H, Kim J, Bai W, Kim J, Jung YH, Tryba AK, Song JW, Huang Y, Philipson LH, Finan JD, Rogers JA. Transparent, Compliant 3D Mesostructures for Precise Evaluation of Mechanical Characteristics of Organoids. Adv Mater 2021; 33:e2100026. [PMID: 33984170 PMCID: PMC8719419 DOI: 10.1002/adma.202100026] [Citation(s) in RCA: 15] [Impact Index Per Article: 5.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/03/2021] [Revised: 03/06/2021] [Indexed: 05/14/2023]
Abstract
Recently developed methods for transforming 2D patterns of thin-film materials into 3D mesostructures create many interesting opportunities in microsystems design. A growing area of interest is in multifunctional thermal, electrical, chemical, and optical interfaces to biological tissues, particularly 3D multicellular, millimeter-scale constructs, such as spheroids, assembloids, and organoids. Herein, examples of 3D mechanical interfaces are presented, in which thin ribbons of parylene-C form the basis of transparent, highly compliant frameworks that can be reversibly opened and closed to capture, envelop, and mechanically restrain fragile 3D tissues in a gentle, nondestructive manner, for precise measurements of viscoelastic properties using techniques in nanoindentation. Finite element analysis serves as a design tool to guide selection of geometries and material parameters for shape-matching 3D architectures tailored to organoids of interest. These computational approaches also quantitate all aspects of deformations during the processes of opening and closing the structures and of forces imparted by them onto the surfaces of enclosed soft tissues. Studies of cerebral organoids by nanoindentation show effective Young's moduli in the range from 1.5 to 2.5 kPa depending on the age of the organoid. This collection of results suggests broad utility of compliant 3D mesostructures in noninvasive mechanical measurements of millimeter-scale, soft biological tissues.
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Affiliation(s)
- Hanjun Ryu
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Yoonseok Park
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Haiwen Luan
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Gokhan Dalgin
- Section of Adult and Pediatric Endocrinology, Diabetes and Metabolism, Kovler Diabetes Center, The University of Chicago, Chicago, IL, 60637, USA
| | - Kira Jeffris
- Department of Mechanical and Industrial Engineering, University of Illinois at Chicago, Chicago, IL, 60607, USA
| | - Hong-Joon Yoon
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Ted S Chung
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Jong Uk Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Sung Soo Kwak
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Geumbee Lee
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Hyoyoung Jeong
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Jihye Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- School of Advanced Materials Science and Engineering, Sungkyunkwan University (SKKU), Suwon, 16419, Republic of Korea
| | - Wubin Bai
- Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, 27599, USA
| | - Joohee Kim
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
| | - Yei Hwan Jung
- Department of Electronic Engineering Hanyang University, Seoul, 04763, Republic of Korea
| | - Andrew K Tryba
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Section of Pediatric Neurology, Department of Pediatrics, The University of Chicago, Chicago, IL, 60637, USA
| | - Joseph W Song
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, IL, 60208, USA
| | - Yonggang Huang
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Louis H Philipson
- Department of Medicine and Kovler Diabetes Center, The University of Chicago, Chicago, IL, 60637, USA
| | - John D Finan
- Department of Mechanical and Industrial Engineering, University of Illinois at Chicago, Chicago, IL, 60607, USA
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Biomedical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Materials Science and Engineering, Northwestern University, Evanston, IL, 60208, USA
- Department of Chemistry, Northwestern University, Evanston, IL, 60208, USA
- Department of Electrical and Computer Engineering, Northwestern University, Evanston, IL, 60208, USA
- Departments of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, IL, 60611, USA
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Huang J, Ware HOT, Hai R, Shao G, Sun C. Conformal Geometry and Multimaterial Additive Manufacturing through Freeform Transformation of Building Layers. Adv Mater 2021; 33:e2005672. [PMID: 33533141 PMCID: PMC8245009 DOI: 10.1002/adma.202005672] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/20/2020] [Revised: 11/09/2020] [Indexed: 06/12/2023]
Abstract
3D printing, formally known as additive manufacturing, creates complex geometries via layer-by-layer addition of materials. While 3D printing has been historically perceived as the static addition of build layers, 3D printing is now considered as a dynamic assembly process. In this context, here a new 3D printing process is reported that executes full degree-of-freedom (DOF) transformation (translating, rotating, and scaling) of each individual building layer while utilizing continuous fabrication techniques. Transforming individual building layers within the sequential layered manufacturing process enables dynamic transformation of the 3D printed parts on-the-fly, eliminating the time-consuming redesign steps. Preserving the locality of the transformation to each layer further enables the discrete conformal transformation, allowing objects such as vascular scaffolds to be optimally fabricated to properly fit within specific patient anatomy obtained from the magnetic resonance imaging (MRI) measurements. Finally, exploiting the freedom to control the orientation of each individual building layer, multimaterials, multiaxis 3D printing capability are further established for integrating functional modules made of dissimilar materials in 3D printed devices. This final capability is demonstrated through 3D printing a soft pneumatic gripper via heterogenous integration of rigid base and soft actuating limbs.
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Affiliation(s)
- Jigang Huang
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208-3111, USA
| | - Henry Oliver T Ware
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208-3111, USA
| | - Rihan Hai
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208-3111, USA
| | - Guangbin Shao
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208-3111, USA
| | - Cheng Sun
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208-3111, USA
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