Gold Inks for Inkjet Printing on Photo Paper: Complementary Characterisation

Systematic Investigation of Novel, Controlled Low-Temperature Sintering Processes for Inkjet Printed Silver Nanoparticle Ink

Functional inks enable manufacturing of flexible electronic devices by means of printing technology. Silver nanoparticle (Ag NP) ink is widely used for printing conductive components. A sintering process is required to obtain sufficient conductivity. Thermal sintering is the most commonly used method, but the heat must be carefully applied to avoid damaging low-temperature substrates such as polymer films. In this work, two alternative sintering methods, damp heat sintering and water sintering are systematically investigated for inkjet-printed Ag tracks on polymer substrates. Both methods allow sintering polyvinyl pyrrolidone (PVP) capped Ag NPs at 85°C. In this way, the resistance is significantly reduced to only 1.7 times that of the samples on polyimide sintered in an oven at 250°C. The microstructure of sintered Ag NPs is analyzed. Taking the states of the capping layer under different conditions into account, the explanation of the sintering mechanism of Ag NPs at low temperatures is presented. Overall, both damp heat sintering and water sintering are viable options for achieving high conductivity of printed Ag tracks. They can broaden the range of substrates available for flexible electronic device fabrication while mitigating substrate damage risks. The choice between them depends on the specific application and the substrate used.

Investigation and Prediction of Nano-Silver Line Quality upon Various Process Parameters in Inkjet Printing Process Based on an Experimental Method

As an emerging additive manufacturing technology, inkjet printing has been increasingly applied in microelectronics field. However, due to the impacting and rebounding behaviors of conductive ink droplets impinging onto flat substrates, it is challenging to fabricate conductive lines with desired quality, such as suitable line width and line thickness, and matching resistance when it is used for interconnecting multifarious electronic components if there is not a proper configuration of operating parameters. To address this research gap, this article aims to investigate the effect of process parameters on the quality of conductive lines, including the platform temperature, printing speed, number of layers, and delay time (droplet interarrival time), are selected to conduct a full factorial experiment. First, the approximate parameter ranges for ensuring the continuity of conductive lines are determined. Second, this study analyzes the interactive effect among process parameters on line quality. Third, an artificial neural network (ANN) is constructed to predict the quality of printed lines. Results show that the line width does not increase with an increased number of layers, while the line thickness shows an increasing trend. The low resistance and high aspect ratio of printed line are achieved by printing 5 layers with the platform temperature of 70°C, the delay time of 12.2 ms, and the printing speed of 1139.39 mm/min. Moreover, the ANN model can be used to predict line width and line thickness with excellent performance, except for the resistance due to the irregular line edge. This study provides a useful guide for the selection of appropriate printing parameters to realize a diverse range of quality properties for 3D printed conductive lines in integrated circuits.

Low-power laser manufacturing of copper tracks on 3D printed geometry using liquid polyimide coating

Silver nanoparticle photoreduction synthesis by direct laser writing is a process that enables copper micro-track production on very specific polymers. However, some important 3D printing polymers, such as acrylonitrile butadiene styrene (ABS) and acrylates, do not accept this treatment on their surface. This work presents an approach to produce copper microcircuitry on 3D substrates from these materials by using direct laser writing at low power (32 mW CW diode laser). We show that by coating a thin layer of polyimide (PI) on a 3D-printed geometry, followed by a sequence of chemical treatments and low-power laser-induced photoreduction, copper tracks can be produced using silver as catalyst. The surface chemistry of the layer through the different stages of the process is monitored by FTIR and X-ray photoelectron spectroscopy. The copper tracks are selectively grown on the laser-patterned areas by electroless copper deposition, with conductivity (1.2 ± 0.7) × 10⁷ S m^-1 and a width as small as 28 μm. The patterns can be written on 3D structures and even inside cavities. The technique is demonstrated by integrating different circuits, including a LED circuit on 3D printed photopolymer acrylate and a perovskite solar cell on an ABS 3D curved geometry.

Optimisation of a Side Inlet for H2 Entry into an Ultrasonic Spray Pyrolysis Device

An ultrasonic spray pyrolysis (USP) device consists of an evaporation and two reaction zones of equal length, into which an aerosol with a precursor compound enters, and where nanoparticles are formed in the final stage. As part of this research, we simulated the geometry of a side inlet, where the reaction gas (H2) enters into the reaction tube of the device by using numerical methods. Mixing with the carrier gas (N2) occurs at the entry of the H2. In the initial part, we performed a theoretical calculation with a numerical simulation using ANSYS CFX, while the geometries of the basic and studied models were prepared with Solidworks. The inlet geometry of the H2 included a study of the position and radius of the inlet with respect to the reaction tube of the USP device, as well as a study of the angle and diameter of the inlet. In the simulation, we chose the typical flows of both gases (N2, H2) in the range of 5 L/min to 15 L/min. The results show that the best geometry is with the H2 side inlet at the bottom, which the existing USP device does not allow for. Subsequently, temperature was included in the numerical simulation of the basic geometry with selected gas flows; 150 °C was considered in the evaporation zone and 400 °C was considered in the other two zones—as is the case for Au nanoparticle synthesis. In the final part, we performed an experiment on a USP device by selecting for the input parameters those that, theoretically, were the most appropriate—a constant flow of H2 5 L/min and three different N2 flows (5 L/min, 10 L/min, and 15 L/min). The results of this study show that numerical simulations are a suitable tool for studying the H2 flow in a UPS device, as the obtained results are comparable to the results of experimental tests that showed that an increased flow of N2 can prevent the backflow of H2 effectively, and that a redesign of the inlet geometry is needed to ensure proper mixing. Thus, numerical simulations using the ANSYS CFX package can be used to evaluate the optimal geometry for an H2 side inlet properly, so as to reconstruct the current and improve future USP devices.

Photo-Sintered Silver Thin Films by a High-Power UV-LED Module for Flexible Electronic Applications

In recent printed electronics technology, a photo-sintering technique using intense pulsed light (IPL) source has attracted attention, instead of conventional a thermal sintering process with long time and high temperature. The key principle of the photo-sintering process is the selective heating of a thin film with large light absorption coefficients, while a transparent substrate does not heat by the IPL source. Most research on photo-sintering has used a xenon flash lamp as a light source. However, the xenon flash lamp requires instantaneous high power and is unsuitable for large area applications. In this work, we developed a new photo-sintering system using a high-power ultraviolet light emitting diode (UV-LED) module. A LED light source has many merits such as low power consumption and potential large-scale application. The silver nanoparticles ink was inkjet-printed on a polyethylene terephthalate (PET) and photo-sintered by the UV-LED module with the wavelength of 365 and 385 nm. The electrical resistivity as low as 5.44 × 10-6 Ω·cm (just about three times compared to value of bulk silver) was achieved at optimized photo-sintering conditions (wavelength of 365 nm and light intensity of 300 mW/cm2).