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Kwon K, Lee YJ, Chung S, Lee J, Na Y, Kwon Y, Shin B, Bateman A, Lee J, Guess M, Sohn JW, Lee J, Yeo WH. Full Body-Worn Textile-Integrated Nanomaterials and Soft Electronics for Real-Time Continuous Motion Recognition Using Cloud Computing. ACS APPLIED MATERIALS & INTERFACES 2025; 17:7977-7988. [PMID: 39851169 PMCID: PMC11803620 DOI: 10.1021/acsami.4c17369] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/09/2024] [Revised: 01/12/2025] [Accepted: 01/14/2025] [Indexed: 01/26/2025]
Abstract
Recognizing human body motions opens possibilities for real-time observation of users' daily activities, revolutionizing continuous human healthcare and rehabilitation. While some wearable sensors show their capabilities in detecting movements, no prior work could detect full-body motions with wireless devices. Here, we introduce a soft electronic textile-integrated system, including nanomaterials and flexible sensors, which enables real-time detection of various full-body movements using the combination of a wireless sensor suit and deep-learning-based cloud computing. This system includes an array of a nanomembrane, laser-induced graphene strain sensors, and flexible electronics integrated with textiles for wireless detection of different body motions and workouts. With multiple human subjects, we demonstrate the system's performance in real-time prediction of eight different activities, including resting, walking, running, squatting, walking upstairs, walking downstairs, push-ups, and jump roping, with an accuracy of 95.3%. The class of technologies, integrated as full body-worn textile electronics and interactive pairing with smartwatches and portable devices, can be used in real-world applications such as ambulatory health monitoring via conjunction with smartwatches and feedback-enabled customized rehabilitation workouts.
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Affiliation(s)
- Kangkyu Kwon
- School
of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- Center
for Wearable Intelligent Systems and Healthcare, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Yoon Jae Lee
- School
of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- Center
for Wearable Intelligent Systems and Healthcare, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Suyeong Chung
- Center
for Wearable Intelligent Systems and Healthcare, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- Department
of Aeronautics, Department of Mechanical and Electronic Convergence
Engineering, Kumoh National Institute of
Technology, Gumi 39177, Republic
of Korea
| | - Jimin Lee
- Center
for Wearable Intelligent Systems and Healthcare, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- George
W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Yewon Na
- Center
for Wearable Intelligent Systems and Healthcare, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- George
W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Youngjin Kwon
- Center
for Wearable Intelligent Systems and Healthcare, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- George
W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Beomjune Shin
- Center
for Wearable Intelligent Systems and Healthcare, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- George
W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Allison Bateman
- Center
for Wearable Intelligent Systems and Healthcare, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- George
W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Jaeho Lee
- Center
for Wearable Intelligent Systems and Healthcare, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- George
W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Matthew Guess
- Center
for Wearable Intelligent Systems and Healthcare, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- George
W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Jung Woo Sohn
- School
of Mechanical System Engineering, Kumoh
National Institute of Technology, Gumi 39177, Republic of Korea
| | - Jinwoo Lee
- Department
of Mechanical, Robotics, and Energy Engineering, Dongguk University, Seoul 04620, Republic
of Korea
| | - Woon-Hong Yeo
- Center
for Wearable Intelligent Systems and Healthcare, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- George
W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- Wallace
H. Coulter Department of Biomedical Engineering, Parker H. Petit Institute
for Bioengineering and Biosciences, Neural Engineering Center, Institute
for Materials, Institute for Robotics and Intelligent Machines, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
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Malode SJ, Alshehri MA, Shetti NP. Revolutionizing human healthcare with wearable sensors for monitoring human strain. Colloids Surf B Biointerfaces 2025; 246:114384. [PMID: 39579495 DOI: 10.1016/j.colsurfb.2024.114384] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/03/2024] [Revised: 11/12/2024] [Accepted: 11/14/2024] [Indexed: 11/25/2024]
Abstract
With the rapid advancements in wearable sensor technology, healthcare is witnessing a transformative shift towards personalized and continuous monitoring. Wearable sensors designed for tracking human strain offer promising applications in rehabilitation, athletic performance, occupational health, and early disease detection. Recent advancements in the field have centered on the design optimization and miniaturization of wearable biosensors. Wireless communication technologies have facilitated the simultaneous, non-invasive detection of multiple analytes with high sensitivity and selectivity through wearable biosensors, significantly enhancing diagnostic accuracy. This review meticulously chronicles noteworthy advancements in wearable sensors tailored for healthcare and biomedical applications, spanning the current market landscape, challenges faced, and prospective trends, including multifunctional smart wearable sensors and integrated decision-support systems. The domain of flexible electronics has witnessed substantial progress over the past decade, particularly in flexible strain sensors, which are crucial for contemporary wearable and implantable devices. These innovations have broadened the scope of applications in human health monitoring and diagnostics. Continuous advancements in novel materials and device architectural methodologies aim to expand the utility of these sensors while meeting the increasingly stringent demands for enhanced sensing performance. This review explores the diverse array of wearable sensors-from piezoelectric, piezoresistive, and capacitive sensors to advanced optical and bioimpedance sensors-each distinguished by unique material properties and functionalities. We analyzed these technologies' sensitivity, accuracy, and response time, which were crucial for reliably capturing strain metrics in dynamic, real-world conditions. Quantitative performance comparisons across various sensor types highlighted their relative effectiveness, strengths, and limitations regarding detection precision, durability, and user comfort. Additionally, we discussed the current challenges in wearable sensor design, including energy efficiency, data transmission, and integration with machine learning models for enhanced data interpretation. Ultimately, this review emphasized the revolutionary potential of wearable strain sensors in advancing preventative healthcare and enabling proactive health management, ushering in an era where real-time health insights could lead to more timely interventions and improved health outcomes.
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Affiliation(s)
- Shweta J Malode
- Center for Energy and Environment, School of Advanced Sciences, KLE Technological University, Vidyanagar, Hubballi, Karnataka 580031, India.
| | | | - Nagaraj P Shetti
- Center for Energy and Environment, School of Advanced Sciences, KLE Technological University, Vidyanagar, Hubballi, Karnataka 580031, India.
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Zhang J, Zou X, Li Z, Chan CPY, Lai KWC. Liquid-Metal-Based Multichannel Strain Sensor for Sign Language Gesture Classification Using Machine Learning. ACS APPLIED MATERIALS & INTERFACES 2025; 17:6957-6968. [PMID: 39764604 DOI: 10.1021/acsami.4c19102] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 01/31/2025]
Abstract
Liquid metals are highly conductive like metallic materials and have excellent deformability due to their liquid state, making them rather promising for flexible and stretchable wearable sensors. However, patterning liquid metals on soft substrates has been a challenge due to high surface tension. In this paper, a new method is proposed to overcome the difficulties in fabricating liquid-state strain sensors. The method involves adding nickel powder particles to the liquid metal to maintain the liquid metal's fluidity while lowering the surface tension so that the liquid metal can be easily patterned on a soft substrate using magnets. With the addition of 12 wt % nickel powder (40 μm) to the liquid metal, a gauge factor of 5.17 can be achieved at 300% strain. In addition, by the integration of multiple strain sensors in a smart glove to monitor 14 joints of the human hand, 10 sign language gestures can be recognized by comparing the results of five different machine learning models, among which the quadratic discriminative analysis model can be accomplished with an accuracy rate of 100%. The magnetically patterned nickel-containing liquid-metal strain sensors proposed in this study have a wide range of applications in intelligent soft robots and human-machine interfaces.
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Affiliation(s)
- Jing Zhang
- Centre for Robotics and Automation, Department of Biomedical Engineering, City University of Hong Kong, Hong Kong 999077, China
| | - Xiaoyang Zou
- Centre for Robotics and Automation, Department of Biomedical Engineering, City University of Hong Kong, Hong Kong 999077, China
| | - Ziqi Li
- Centre for Robotics and Automation, Department of Biomedical Engineering, City University of Hong Kong, Hong Kong 999077, China
| | - Colin Pak Yu Chan
- Centre for Robotics and Automation, Department of Biomedical Engineering, City University of Hong Kong, Hong Kong 999077, China
| | - King Wai Chiu Lai
- Centre for Robotics and Automation, Department of Biomedical Engineering, City University of Hong Kong, Hong Kong 999077, China
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Yue W, Guo Y, Lee JC, Ganbold E, Wu JK, Li Y, Wang C, Kim HS, Shin YK, Liang JG, Kim ES, Kim NY. Advancements in Passive Wireless Sensing Systems in Monitoring Harsh Environment and Healthcare Applications. NANO-MICRO LETTERS 2025; 17:106. [PMID: 39779609 PMCID: PMC11712043 DOI: 10.1007/s40820-024-01599-8] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 09/02/2024] [Accepted: 11/19/2024] [Indexed: 01/11/2025]
Abstract
Recent advancements in passive wireless sensor technology have significantly extended the application scope of sensing, particularly in challenging environments for monitoring industry and healthcare applications. These systems are equipped with battery-free operation, wireless connectivity, and are designed to be both miniaturized and lightweight. Such features enable the safe, real-time monitoring of industrial environments and support high-precision physiological measurements in confined internal body spaces and on wearable epidermal devices. Despite the exploration into diverse application environments, the development of a systematic and comprehensive research framework for system architecture remains elusive, which hampers further optimization of these systems. This review, therefore, begins with an examination of application scenarios, progresses to evaluate current system architectures, and discusses the function of each component-specifically, the passive sensor module, the wireless communication model, and the readout module-within the context of key implementations in target sensing systems. Furthermore, we present case studies that demonstrate the feasibility of proposed classified components for sensing scenarios, derived from this systematic approach. By outlining a research trajectory for the application of passive wireless systems in sensing technologies, this paper aims to establish a foundation for more advanced, user-friendly applications.
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Affiliation(s)
- Wei Yue
- RFIC Bio Centre, Kwangwoon University, Seoul, 01897, South Korea
- Department of Electronics Engineering, Kwangwoon University, Seoul, 01897, South Korea
| | - Yunjian Guo
- RFIC Bio Centre, Kwangwoon University, Seoul, 01897, South Korea
- Department of Electronic Convergence Engineering, Kwangwoon University, Seoul, 01897, South Korea
| | - Jong-Chul Lee
- RFIC Bio Centre, Kwangwoon University, Seoul, 01897, South Korea
- Department of Electronic Convergence Engineering, Kwangwoon University, Seoul, 01897, South Korea
| | - Enkhzaya Ganbold
- RFIC Bio Centre, Kwangwoon University, Seoul, 01897, South Korea
- Department of Electronics Engineering, Kwangwoon University, Seoul, 01897, South Korea
| | - Jia-Kang Wu
- RFIC Bio Centre, Kwangwoon University, Seoul, 01897, South Korea
- Department of Electronic Engineering, Jiangnan University, Wuxi, 214122, People's Republic of China
| | - Yang Li
- RFIC Bio Centre, Kwangwoon University, Seoul, 01897, South Korea
- School of Microelectronics, Shandong University, Jinan, 250101, People's Republic of China
| | - Cong Wang
- RFIC Bio Centre, Kwangwoon University, Seoul, 01897, South Korea
- School of Electronics and Information Engineering, Harbin Institute of Technology, Harbin, 150001, People's Republic of China
| | - Hyun Soo Kim
- RFIC Bio Centre, Kwangwoon University, Seoul, 01897, South Korea
- Department of Electronics Engineering, Kwangwoon University, Seoul, 01897, South Korea
| | - Young-Kee Shin
- RFIC Bio Centre, Kwangwoon University, Seoul, 01897, South Korea.
- Laboratory of Molecular Pathology and Cancer Genomics, Department of Molecular Medicine and Biopharmaceutical Sciences, Graduate School of Convergence Science and Technology, Seoul National University, Seoul, 08826, South Korea.
| | - Jun-Ge Liang
- RFIC Bio Centre, Kwangwoon University, Seoul, 01897, South Korea.
- Department of Electronic Engineering, Jiangnan University, Wuxi, 214122, People's Republic of China.
| | - Eun-Seong Kim
- RFIC Bio Centre, Kwangwoon University, Seoul, 01897, South Korea.
| | - Nam-Young Kim
- RFIC Bio Centre, Kwangwoon University, Seoul, 01897, South Korea.
- Department of Electronics Engineering, Kwangwoon University, Seoul, 01897, South Korea.
- Laboratory of Molecular Pathology and Cancer Genomics, Department of Molecular Medicine and Biopharmaceutical Sciences, Graduate School of Convergence Science and Technology, Seoul National University, Seoul, 08826, South Korea.
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5
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Zhang H, Zhang Y. Rational Design of Flexible Mechanical Force Sensors for Healthcare and Diagnosis. MATERIALS (BASEL, SWITZERLAND) 2023; 17:123. [PMID: 38203977 PMCID: PMC10780056 DOI: 10.3390/ma17010123] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/21/2023] [Revised: 12/13/2023] [Accepted: 12/22/2023] [Indexed: 01/12/2024]
Abstract
Over the past decade, there has been a significant surge in interest in flexible mechanical force sensing devices and systems. Tremendous efforts have been devoted to the development of flexible mechanical force sensors for daily healthcare and medical diagnosis, driven by the increasing demand for wearable/portable devices in long-term healthcare and precision medicine. In this review, we summarize recent advances in diverse categories of flexible mechanical force sensors, covering piezoresistive, capacitive, piezoelectric, triboelectric, magnetoelastic, and other force sensors. This review focuses on their working principles, design strategies and applications in healthcare and diagnosis, with an emphasis on the interplay among the sensor architecture, performance, and application scenario. Finally, we provide perspectives on the remaining challenges and opportunities in this field, with particular discussions on problem-driven force sensor designs, as well as developments of novel sensor architectures and intelligent mechanical force sensing systems.
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Affiliation(s)
- Hang Zhang
- School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore;
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
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6
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Zhang J, Wang X, Yang Z, Wang J, Cao J, Chen Q, Yu S, Zhang J, Guo T, Li H, Huang X. Enabling High-Performance Pressure and Proximity Dual-Mode Sensing with EGaIn/Ag/ZnO Egg-Shell Ternary Composite Particles. ACS APPLIED MATERIALS & INTERFACES 2023; 15:58623-58630. [PMID: 38055862 DOI: 10.1021/acsami.3c14627] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 12/08/2023]
Abstract
Eutectic gallium-indium alloy (EGaIn) is a biocompatible liquid metal, promising for wearable electronics. Through functionalization and formation of composites, EGaIn-based materials have shown potential in multifunctional sensing devices. Here, egg-shell EGaIn/Ag/ZnO ternary composite particles were prepared through an ultrasound-assisted displacement reaction combined with room-temperature hydrolysis. The composite was further constructed as a wearable sensor capable of both pressure and proximity detection. For pressure sensing, due to the decrease in the Young's modulus of the egg-shell structure and the presence of the electrical double layers between Ag and ZnO, which enriched surface charges, the sensor showed excellent sensitivity at low pressures (2.17 KPa-1, <0.4 KPa) and thus the ability to sense body movements. For proximity sensing, the composite sensor was able to detect approaching objects that were up to 20 cm away. By combining and fitting the sensing curves for both the touchless and touching modes, the extracted parameters were used to create fingerprints for different objects, demonstrating the great potential of our sensor in the differentiation and identification of unknown objects for future robotics and artificial intelligence.
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Affiliation(s)
- Jinhao Zhang
- Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China
| | - Xin Wang
- Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China
| | - Zhiwei Yang
- Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China
| | - Jian Wang
- Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China
| | - Jiacheng Cao
- Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an 710072, China
| | - Qian Chen
- Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an 710072, China
| | - Shilong Yu
- Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China
| | - Jian Zhang
- Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China
| | - Tianwen Guo
- College of Computer and Information Engineering, Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China
| | - Hai Li
- Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China
| | - Xiao Huang
- Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China
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Wu S, Moody K, Kollipara A, Zhu Y. Highly Sensitive, Stretchable, and Robust Strain Sensor Based on Crack Propagation and Opening. ACS APPLIED MATERIALS & INTERFACES 2023; 15:1798-1807. [PMID: 36548931 PMCID: PMC10403976 DOI: 10.1021/acsami.2c16741] [Citation(s) in RCA: 5] [Impact Index Per Article: 2.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/17/2023]
Abstract
Soft and stretchable strain sensors have been attracting significant attention. However, the trade-off between the sensitivity (gauge factor) and the sensing range has been a major challenge. In this work, we report a soft stretchable resistive strain sensor with an unusual combination of high sensitivity, large sensing range, and high robustness. The sensor is made of a silver nanowire network embedded below the surface of an elastomeric matrix (e.g., poly(dimethylsiloxane)). Periodic mechanical cuts are applied to the top surface of the sensor, changing the current flow from uniformly across the sensor to along the conducting path defined by the open cracks. Both experiment and finite element analysis are conducted to study the effect of the slit depth, slit length, and pitch between the slits. The stretchable strain sensor can be integrated into wearable systems for monitoring physiological functions and body motions associated with different levels of strain, such as blood pressure and lower back health. Finally, a soft three-dimensional (3D) touch sensor that tracks both normal and shear stresses is developed for human-machine interfaces and tactile sensing for robotics.
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Affiliation(s)
- Shuang Wu
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina27695, United States
| | - Katherine Moody
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina27695, United States
| | - Abhiroop Kollipara
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina27695, United States
| | - Yong Zhu
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina27695, United States
- Department of Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina27695, United States
- Joint Department of Biomedical Engineering, University of North Carolina-Chapel Hill and NC State University, Chapel Hill, North Carolina27599, United States
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Jia S, Gao H, Xue Z, Meng X. Recent Advances in Multifunctional Wearable Sensors and Systems: Design, Fabrication, and Applications. BIOSENSORS 2022; 12:bios12111057. [PMID: 36421175 PMCID: PMC9688294 DOI: 10.3390/bios12111057] [Citation(s) in RCA: 10] [Impact Index Per Article: 3.3] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/21/2022] [Revised: 11/14/2022] [Accepted: 11/18/2022] [Indexed: 05/24/2023]
Abstract
Multifunctional wearable sensors and systems are of growing interest over the past decades because of real-time health monitoring and disease diagnosis capability. Owing to the tremendous efforts of scientists, wearable sensors and systems with attractive advantages such as flexibility, comfort, and long-term stability have been developed, which are widely used in temperature monitoring, pulse wave detection, gait pattern analysis, etc. Due to the complexity of human physiological signals, it is necessary to measure multiple physiological information simultaneously to evaluate human health comprehensively. This review summarizes the recent advances in multifunctional wearable sensors, including single sensors with various functions, planar integrated sensors, three-dimensional assembled sensors, and stacked integrated sensors. The design strategy, manufacturing method, and potential application of each type of sensor are discussed. Finally, we offer an outlook on future developments and provide perspectives on the remaining challenges and opportunities of wearable multifunctional sensing technology.
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Four-Level Micro-Via Technology (4LµV) for ASIC Integration in Active Flexible Sensor Arrays. SENSORS 2022; 22:s22134723. [PMID: 35808220 PMCID: PMC9269613 DOI: 10.3390/s22134723] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 05/22/2022] [Revised: 06/16/2022] [Accepted: 06/20/2022] [Indexed: 02/04/2023]
Abstract
Systems-in-foil with multi-sensor arrays require extensive wiring with large numbers of data lines. This prevents scalability of the arrays and thus limits the applications. To enable multiplexing and thus reducing the external connections down to few digital data links and a power supply, active circuits in the form of ASICs must be integrated into the foils. However, this requires reliable multilayer wiring of the sensors and contacts for chip integration. As an elegant solution to this, a new manufacturing process for multilayer wiring in polyimide-based sensor foils has been developed that also allows ASIC chips to be soldered. The electrical four-level micro-via connections and the contact pads are generated by galvanic copper deposition after all other process steps, including stacking and curing of polyimide layers, are completed. Compared to layer by layer via technology, the processing time is considerably reduced. Because copper plating of vias and solderable copper contact pads happens as the final step, the risk of copper oxidation during polyimide curing is completely eliminated. The entire fabrication process is demonstrated for six strain sensor nodes connected to a surface-mounted ASIC as a detecting unit for sensing spatially resolved bending states. Each sensor node is a full-bridge configuration consisting of four strain gauges distributed across interconnected layers. The sensor foil allows bending of +/−120° without damage. This technology can be used in future for all kinds of complex flexible systems-in-foil, in particular for large arrays of sensors.
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CNT/Graphite/SBS Conductive Fibers for Strain Sensing in Wearable Telerehabilitation Devices. SENSORS 2022; 22:s22030800. [PMID: 35161545 PMCID: PMC8839551 DOI: 10.3390/s22030800] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 11/26/2021] [Revised: 01/09/2022] [Accepted: 01/18/2022] [Indexed: 02/06/2023]
Abstract
Rapid growth of personal electronics with concurrent research into telerehabilitation solutions discovers opportunities to redefine the future of orthopedic rehabilitation. After joint injury or operation, convalescence includes free active range of movement exercises, such as joints bending and straightening under medical supervision. Flexion detection through wearable textile sensors provides numerous potential benefits such as: (1) reduced cost; (2) continuous monitoring; (3) remote telerehabilitation; (4) gamification; and (5) detection of risk-inducing activities in daily routine. To address this issue, novel piezoresistive multi-walled carbon nanotubes/graphite/styrene–butadiene–styrene copolymer (CNT/Gr/SBS) fiber was developed. The extrusion process allowed adjustable diameter fiber production, while being a scalable, industrially adapted method of manufacturing textile electronics. Composite fibers were highly stretchable, withstanding strains up to 285%, and exhibited exceptional piezoresistive parameters with a gauge factor of 91.64 for 0–100% strain range and 2955 for the full scope. Considering the composite’s flexibility and sensitivity during a series of cyclic loading, it was concluded that developed Gr/CNT/SBS fibers were suitable for application in wearable piezoresistive sensors for telerehabilitation application.
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Qu X, Zhao Y, Chen Z, Wang S, Ren Y, Wang Q, Shao J, Wang W, Dong X. Thermoresponsive Lignin-Reinforced Poly(Ionic Liquid) Hydrogel Wireless Strain Sensor. RESEARCH (WASHINGTON, D.C.) 2021; 2021:9845482. [PMID: 34957404 PMCID: PMC8674648 DOI: 10.34133/2021/9845482] [Citation(s) in RCA: 8] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 09/29/2021] [Accepted: 11/14/2021] [Indexed: 11/30/2022]
Abstract
To meet critical requirements on flexible electronic devices, multifunctionalized flexible sensors with excellent electromechanical performance and temperature perception are required. Herein, lignin-reinforced thermoresponsive poly(ionic liquid) hydrogel is prepared through an ultrasound-assisted synthesized method. Benefitting from the electrostatic interaction between lignin and ionic liquid, the hydrogel displays high stretchability (over 1425%), excellent toughness (over 132 kPa), and impressive stress loading-unloading cyclic stability. The hydrogel strain sensor presents excellent electromechanical performance with a high gauge factor (1.37) and rapid response rate (198 ms), which lays the foundation for human body movement detection and smart input. Moreover, owing to the thermal-sensitive feature of poly(ionic liquid), the as-prepared hydrogel displays remarkable thermal response sensitivity (0.217°C-1) in body temperature range and low limit of detection, which can be applied as a body shell temperature indicator. Particularly, the hydrogel can detect dual stimuli of strain and temperature and identify each signal individually, showing the specific application in human-machine interaction and artificial intelligence. By integrating the hydrogel strain sensor into a wireless sensation system, remote motion capture and gesture identification is realized in real-time.
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Affiliation(s)
- Xinyu Qu
- Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), School of Physical and Mathematical Sciences, Nanjing Tech University (NanjingTech), Nanjing 211816, China
| | - Ye Zhao
- Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), School of Physical and Mathematical Sciences, Nanjing Tech University (NanjingTech), Nanjing 211816, China
| | - Zi'ang Chen
- Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), School of Physical and Mathematical Sciences, Nanjing Tech University (NanjingTech), Nanjing 211816, China
| | - Siying Wang
- Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), School of Physical and Mathematical Sciences, Nanjing Tech University (NanjingTech), Nanjing 211816, China
| | - Yanfang Ren
- School of Physical Science and Information Technology, Liaocheng University, Liaocheng 252059, China
| | - Qian Wang
- Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), School of Physical and Mathematical Sciences, Nanjing Tech University (NanjingTech), Nanjing 211816, China
| | - Jinjun Shao
- Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), School of Physical and Mathematical Sciences, Nanjing Tech University (NanjingTech), Nanjing 211816, China
| | - Wenjun Wang
- School of Physical Science and Information Technology, Liaocheng University, Liaocheng 252059, China
| | - Xiaochen Dong
- Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), School of Physical and Mathematical Sciences, Nanjing Tech University (NanjingTech), Nanjing 211816, China
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Ren Z, Xu J, Le X, Lee C. Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G. MICROMACHINES 2021; 12:946. [PMID: 34442568 PMCID: PMC8398582 DOI: 10.3390/mi12080946] [Citation(s) in RCA: 14] [Impact Index Per Article: 3.5] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 06/29/2021] [Revised: 07/29/2021] [Accepted: 07/29/2021] [Indexed: 12/16/2022]
Abstract
Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications of the thin films obtained by wafer bonding technology in the fields of electronics, optical devices, on-chip integrated mid-infrared sensors, and wearable sensors. The fabrication of silicon-on-insulator (SOI) wafers based on the Smart CutTM process, heterogeneous integrations of wide-bandgap semiconductors, infrared materials, and electro-optical crystals via wafer bonding technology for thin-film transfer are orderly presented. Furthermore, device design and fabrication progress based on the platforms mentioned above is highlighted in this work. They demonstrate that the transferred films can satisfy high-performance power electronics, molecular sensors, and high-speed modulators for the next generation applications beyond 5G. Moreover, flexible composite structures prepared by the wafer bonding and de-bonding methods towards wearable electronics are reported. Finally, the outlooks and conclusions about the further development of heterogeneous structures that need to be achieved by the wafer bonding technology are discussed.
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Affiliation(s)
- Zhihao Ren
- Department of Electrical & Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117576, Singapore; (Z.R.); (J.X.); (X.L.)
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, 5 Engineering Drive 1, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
| | - Jikai Xu
- Department of Electrical & Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117576, Singapore; (Z.R.); (J.X.); (X.L.)
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, 5 Engineering Drive 1, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
| | - Xianhao Le
- Department of Electrical & Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117576, Singapore; (Z.R.); (J.X.); (X.L.)
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, 5 Engineering Drive 1, Singapore 117608, Singapore
| | - Chengkuo Lee
- Department of Electrical & Computer Engineering, National University of Singapore, 4 Engineering Drive 3, Singapore 117576, Singapore; (Z.R.); (J.X.); (X.L.)
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, 5 Engineering Drive 1, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
- NUS Graduate School for Integrative Science and Engineering, National University of Singapore, Singapore 117456, Singapore
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