Direct Wiring of Liquid Metal on an Ultrasoft Substrate Using a Polyvinyl Alcohol Lift-off Method

Room-Temperature Liquid Metals for Flexible Electronic Devices

Room-temperature gallium-based liquid metals (RT-GaLMs) have garnered significant interest recently owing to their extraordinary combination of fluidity, conductivity, stretchability, self-healing performance, and biocompatibility. They are ideal materials for the manufacture of flexible electronics. By changing the composition and oxidation of RT-GaLMs, physicochemical characteristics of the liquid metal can be adjusted, especially the regulation of rheological, wetting, and adhesion properties. This review highlights the advancements in the liquid metals used in flexible electronics. Meanwhile related characteristics of RT-GaLMs and underlying principles governing their processing and applications for flexible electronics are elucidated. Finally, the diverse applications of RT-GaLMs in self-healing circuits, flexible sensors, energy harvesting devices, and epidermal electronics, are explored. Additionally, the challenges hindering the progress of RT-GaLMs are discussed, while proposing future research directions and potential applications in this emerging field. By presenting a concise and critical analysis, this paper contributes to the advancement of RT-GaLMs as an advanced material applicable for the new generation of flexible electronics.

Ultrasonic-Enabled Nondestructive and Substrate-Independent Liquid Metal Ink Sintering

Printing or patterning particle-based liquid metal (LM) ink is a good strategy to overcome poor wettability of LM for its circuits' preparation in flexible and printed electronics. Subsequently, a crucial step is to recover conductivity of LM circuits consisting of insulating LM micro/nano-particles. However, most widely used mechanical sintering methods based on hard contact such as pressing, may not be able to contact the LM patterns' whole surface conformally, leading to insufficient sintering in some areas. Hard contact may also break delicate shapes of the printed patterns. Hereby, an ultrasonic-assisted sintering strategy that can not only preserve original morphology of the LM circuits but also sinter circuits on various substrates of complex surface topography is proposed. The influencing factors of the ultrasonic sintering are investigated empirically and interpreted with theoretical understanding by simulation. LM circuits encapsulated inside soft elastomer are successfully sintered, proving feasibility in constructing stretchable or flexible electronics. By using water as energy transmission medium, remote sintering without any direct contact with substrate is achieved, which greatly protect LM circuits from mechanical damage. In virtue of such remote and non-contact manipulation manner, the ultrasonic sintering strategy would greatly advance the fabrication and application scenarios of LM electronics.

Bio-Inspired Homogeneous Conductive Hydrogel with Flexibility and Adhesiveness for Information Transmission and Sign Language Recognition

The wearable electronic technique is increasingly becoming an effective approach to overcoming the communication obstacles between signers and non-signers. However, the efficacy of conducting hydrogels currently proposed as flexible sensor devices is hindered by their poor processability and matrix mismatch, which frequently results in adhesion failure at the combined interfaces and deterioration of mechanical and electrochemical performance. Herein, we propose a hydrogel composed of a rigid matrix in which the hydrophobic and aggregated polyaniline was homogeneously embedded, while quaternate-functionalized nucleobase moieties endowed the flexible network with adhesiveness. Accordingly, the resulting hydrogel with chitosan-graft-polyaniline (chi-g-PANI) copolymers exhibited a promising conductivity (4.8 S·m^-1) because of the uniformly dispersed polyaniline components and a high strain strength (0.84 MPa) because of the chain entanglement of chitosan after soaking. In addition, the modified adenine molecules not only realized synchronization in improving the stretchability (up to 1303%) and exhibiting a skin-like elastic modulus (≈184 kPa), but also provided a durable interfacial contact with various materials. The hydrogel was further fabricated into a strain-monitoring sensor for information encryption and sign language transmission based on its sensing stability and strain sensitivity of up to 2.77. The developed wearable sign language interpreting system provides an innovative strategy to assist auditory or speech-impaired people in communicating with non-signers using visual-gestural patterns including body movements and facial expressions.

Self-assembling bilayer wiring with highly conductive liquid metal and insulative ion gel layers

Ga-based liquid metals (LMs) are expected to be suitable for wiring highly deformable devices because of their high electrical conductivity and stable resistance to extreme deformation. Injection and printed wiring, and wiring using LM-polymer composites are the most popular LM wiring approaches. However, additional processing is required to package the wiring after LM patterning, branch and interrupt wiring shape, and ensure adequate conductivity, which results in unnecessary wiring shape changes and increased complexity of the wiring methods. In this study, we propose an LM-polymer composite comprising LM particles and ion gel as a flexible matrix material with low viscosity and specific gravity before curing. Moreover, the casting method is used for wire patterning, and the material is cured at room temperature to ensure that the upper insulative layer of the ion gel self-assembles simultaneously with the formation of LM wiring in the lower layer. High conductivity and low resistance change rate of the formed wiring during deformation are achieved without an activation process. This ion gel-LM bilayer wiring can be used for three-dimensional wiring by stacking. Furthermore, circuits fabricated using ion gel-LM bilayer wiring exhibit stable operation. Therefore, the proposed method can significantly promote the development of flexible electronic devices.

Liquid Metal Patterning and Unique Properties for Next-Generation Soft Electronics

Room-temperature liquid metal (LM)-based electronics is expected to bring advancements in future soft electronics owing to its conductivity, conformability, stretchability, and biocompatibility. However, various difficulties arise when patterning LM because of its rheological features such as fluidity and surface tension. Numerous attempts are made to overcome these difficulties, resulting in various LM-patterning methods. An appropriate choice of patterning method based on comprehensive understanding is necessary to fully utilize the unique properties. Therefore, the authors aim to provide thorough knowledge about patterning methods and unique properties for LM-based future soft electronics. First, essential considerations for LM-patterning are investigated. Then, LM-patterning methods-serial-patterning, parallel-patterning, intermetallic bond-assisted patterning, and molding/microfluidic injection-are categorized and investigated. Finally, perspectives on LM-based soft electronics with unique properties are provided. They include outstanding features of LM such as conformability, biocompatibility, permeability, restorability, and recyclability. Also, they include perspectives on future LM-based soft electronics in various areas such as radio frequency electronics, soft robots, and heterogeneous catalyst. LM-based soft devices are expected to permeate the daily lives if patterning methods and the aforementioned features are analyzed and utilized.