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Machiels J, Appeltans R, Bauer DK, Segers E, Henckens Z, Van Rompaey W, Adons D, Peeters R, Geiβler M, Kuehnoel K, Tempel L, Weissbach T, Hübler AC, Verma A, Ferraris E, Deferme W, Buntinx M. Screen Printed Antennas on Fiber-Based Substrates for Sustainable HF RFID Assisted E-Fulfilment Smart Packaging. Materials (Basel) 2021; 14:ma14195500. [PMID: 34639912 PMCID: PMC8509514 DOI: 10.3390/ma14195500] [Citation(s) in RCA: 6] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 06/29/2021] [Revised: 09/17/2021] [Accepted: 09/18/2021] [Indexed: 11/16/2022]
Abstract
Intelligent packaging is an emerging technology, aiming to improve the standard communication function of packaging. Radio frequency identification (RFID) assisted smart packaging is of high interest, but the uptake is limited as the market needs cost-efficient and sustainable applications. The integration of screen printed antennas and RFID chips as smart labels in reusable cardboard packaging could offer a solution. Although paper is an interesting and recyclable material, printing on this substrate is challenging as the ink conductivity is highly influenced by the paper properties. In this study, the best paper/functional silver ink combinations were first selected out of 76 paper substrates based on the paper surface roughness, air permeance, sheet resistance and SEM characterization. Next, a flexible high frequency RFID chip (13.56 MHz) was connected on top of screen printed antennas with a conductive adhesive. Functional RFID labels were integrated in cardboard packaging and its potential application as reusable smart box for third party logistics was tested. In parallel, a web-based software application mimicking its functional abilities in the logistic cycle was developed. This multidisciplinary approach to developing an easy-scalable screen printed antenna and RFID-assisted smart packaging application is a good example for future implementation of hybrid electronics in sustainable smart packaging.
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Affiliation(s)
- Jarne Machiels
- Materials and Packaging Research & Services, Institute for Materials Research (IMO-IMOMEC), Hasselt University, Wetenschapspark 27, B-3590 Diepenbeek, Belgium; (J.M.); (E.S.); (Z.H.); (W.V.R.); (D.A.); (R.P.)
- Functional Materials Engineering, Institute for Materials Research (IMO), Hasselt University, Wetenschapspark 1, B-3590 Diepenbeek, Belgium;
- IMEC vzw, Division IMOMEC, Wetenschapspark 1, B-3590 Diepenbeek, Belgium
| | | | - Dieter Klaus Bauer
- Fraunhofer Institute for Process Engineering and Packaging IVV, Giggenhauser Str. 35, 85354 Freising, Germany;
| | - Elien Segers
- Materials and Packaging Research & Services, Institute for Materials Research (IMO-IMOMEC), Hasselt University, Wetenschapspark 27, B-3590 Diepenbeek, Belgium; (J.M.); (E.S.); (Z.H.); (W.V.R.); (D.A.); (R.P.)
- Functional Materials Engineering, Institute for Materials Research (IMO), Hasselt University, Wetenschapspark 1, B-3590 Diepenbeek, Belgium;
| | - Zander Henckens
- Materials and Packaging Research & Services, Institute for Materials Research (IMO-IMOMEC), Hasselt University, Wetenschapspark 27, B-3590 Diepenbeek, Belgium; (J.M.); (E.S.); (Z.H.); (W.V.R.); (D.A.); (R.P.)
- Functional Materials Engineering, Institute for Materials Research (IMO), Hasselt University, Wetenschapspark 1, B-3590 Diepenbeek, Belgium;
| | - Wouter Van Rompaey
- Materials and Packaging Research & Services, Institute for Materials Research (IMO-IMOMEC), Hasselt University, Wetenschapspark 27, B-3590 Diepenbeek, Belgium; (J.M.); (E.S.); (Z.H.); (W.V.R.); (D.A.); (R.P.)
- Functional Materials Engineering, Institute for Materials Research (IMO), Hasselt University, Wetenschapspark 1, B-3590 Diepenbeek, Belgium;
| | - Dimitri Adons
- Materials and Packaging Research & Services, Institute for Materials Research (IMO-IMOMEC), Hasselt University, Wetenschapspark 27, B-3590 Diepenbeek, Belgium; (J.M.); (E.S.); (Z.H.); (W.V.R.); (D.A.); (R.P.)
| | - Roos Peeters
- Materials and Packaging Research & Services, Institute for Materials Research (IMO-IMOMEC), Hasselt University, Wetenschapspark 27, B-3590 Diepenbeek, Belgium; (J.M.); (E.S.); (Z.H.); (W.V.R.); (D.A.); (R.P.)
| | - Marie Geiβler
- Papiertechnische Stiftung (PTS), Pirnaer Straβe 37, 01809 Heidenau, Germany; (M.G.); (K.K.); (L.T.)
| | - Katrin Kuehnoel
- Papiertechnische Stiftung (PTS), Pirnaer Straβe 37, 01809 Heidenau, Germany; (M.G.); (K.K.); (L.T.)
| | - Lydia Tempel
- Papiertechnische Stiftung (PTS), Pirnaer Straβe 37, 01809 Heidenau, Germany; (M.G.); (K.K.); (L.T.)
| | - Thomas Weissbach
- Institute for Print and Media Technology, Technische Universität Chemnitz, Reichenhainer Str. 70, 09126 Chemnitz, Germany; (T.W.); (A.C.H.)
| | - Arved Carl Hübler
- Institute for Print and Media Technology, Technische Universität Chemnitz, Reichenhainer Str. 70, 09126 Chemnitz, Germany; (T.W.); (A.C.H.)
| | - Akash Verma
- Manufacturing Processes and Systems, Department of Mechanical Engineering, KU Leuven, J. D. Nayerlaan 5, B-2860 Sint-Katelijne Waver, Belgium; (A.V.); (E.F.)
| | - Eleonora Ferraris
- Manufacturing Processes and Systems, Department of Mechanical Engineering, KU Leuven, J. D. Nayerlaan 5, B-2860 Sint-Katelijne Waver, Belgium; (A.V.); (E.F.)
| | - Wim Deferme
- Functional Materials Engineering, Institute for Materials Research (IMO), Hasselt University, Wetenschapspark 1, B-3590 Diepenbeek, Belgium;
- IMEC vzw, Division IMOMEC, Wetenschapspark 1, B-3590 Diepenbeek, Belgium
| | - Mieke Buntinx
- Materials and Packaging Research & Services, Institute for Materials Research (IMO-IMOMEC), Hasselt University, Wetenschapspark 27, B-3590 Diepenbeek, Belgium; (J.M.); (E.S.); (Z.H.); (W.V.R.); (D.A.); (R.P.)
- IMEC vzw, Division IMOMEC, Wetenschapspark 1, B-3590 Diepenbeek, Belgium
- Correspondence: ; Tel.: +32-11-292155
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