Combinatorial optimization by weight annealing in memristive hopfield networks

The increasing utility of specialized circuits and growing applications of optimization call for the development of efficient hardware accelerator for solving optimization problems. Hopfield neural network is a promising approach for solving combinatorial optimization problems due to the recent demonstrations of efficient mixed-signal implementation based on emerging non-volatile memory devices. Such mixed-signal accelerators also enable very efficient implementation of various annealing techniques, which are essential for finding optimal solutions. Here we propose a “weight annealing” approach, whose main idea is to ease convergence to the global minima by keeping the network close to its ground state. This is achieved by initially setting all synaptic weights to zero, thus ensuring a quick transition of the Hopfield network to its trivial global minima state and then gradually introducing weights during the annealing process. The extensive numerical simulations show that our approach leads to a better, on average, solutions for several representative combinatorial problems compared to prior Hopfield neural network solvers with chaotic or stochastic annealing. As a proof of concept, a 13-node graph partitioning problem and a 7-node maximum-weight independent set problem are solved experimentally using mixed-signal circuits based on, correspondingly, a 20 × 20 analog-grade TiO₂ memristive crossbar and a 12 × 10 eFlash memory array.

Roadmap on emerging hardware and technology for machine learning

Recent progress in artificial intelligence is largely attributed to the rapid development of machine learning, especially in the algorithm and neural network models. However, it is the performance of the hardware, in particular the energy efficiency of a computing system that sets the fundamental limit of the capability of machine learning. Data-centric computing requires a revolution in hardware systems, since traditional digital computers based on transistors and the von Neumann architecture were not purposely designed for neuromorphic computing. A hardware platform based on emerging devices and new architecture is the hope for future computing with dramatically improved throughput and energy efficiency. Building such a system, nevertheless, faces a number of challenges, ranging from materials selection, device optimization, circuit fabrication and system integration, to name a few. The aim of this Roadmap is to present a snapshot of emerging hardware technologies that are potentially beneficial for machine learning, providing the Nanotechnology readers with a perspective of challenges and opportunities in this burgeoning field.

High-Performance Mixed-Signal Neurocomputing With Nanoscale Floating-Gate Memory Cell Arrays

Potential advantages of analog- and mixed-signal nanoelectronic circuits, based on floating-gate devices with adjustable conductance, for neuromorphic computing had been realized long time ago. However, practical realizations of this approach suffered from using rudimentary floating-gate cells of relatively large area. Here, we report a prototype $28\times28$ binary-input, ten-output, three-layer neuromorphic network based on arrays of highly optimized embedded nonvolatile floating-gate cells, redesigned from a commercial 180-nm nor flash memory. All active blocks of the circuit, including 101 780 floating-gate cells, have a total area below 1 mm2. The network has shown a 94.7% classification fidelity on the common Modified National Institute of Standards and Technology benchmark, close to the 96.2% obtained in simulation. The classification of one pattern takes a sub-1- $\mu \text{s}$ time and a sub-20-nJ energy-both numbers much better than in the best reported digital implementations of the same task. Estimates show that a straightforward optimization of the hardware and its transfer to the already available 55-nm technology may increase this advantage to more than $10^{2}\times $ in speed and $10^{4}\times $ in energy efficiency.

Stateful characterization of resistive switching TiO2 with electron beam induced currents

Metal oxide resistive switches are increasingly important as possible artificial synapses in next-generation neuromorphic networks. Nevertheless, there is still no codified set of tools for studying properties of the devices. To this end, we demonstrate electron beam-induced current measurements as a powerful method to monitor the development of local resistive switching in TiO₂-based devices. By comparing beam energy-dependent electron beam-induced currents with Monte Carlo simulations of the energy absorption in different device layers, it is possible to deconstruct the origins of filament image formation and relate this to both morphological changes and the state of the switch. By clarifying the contrast mechanisms in electron beam-induced current microscopy, it is possible to gain new insights into the scaling of the resistive switching phenomenon and observe the formation of a current leakage region around the switching filament. Additionally, analysis of symmetric device structures reveals propagating polarization domains.

Oxide-based memristors hold promise for artificial neuromorphic computing, yet the detail of the switching mechanism—filament formation—remains largely unknown. Hoskins et al. provide nanoscale imaging of this process using electron beam induced current microscopy and relate it to resistive states.

A multiply-add engine with monolithically integrated 3D memristor crossbar/CMOS hybrid circuit

Silicon (Si) based complementary metal-oxide semiconductor (CMOS) technology has been the driving force of the information-technology revolution. However, scaling of CMOS technology as per Moore’s law has reached a serious bottleneck. Among the emerging technologies memristive devices can be promising for both memory as well as computing applications. Hybrid CMOS/memristor circuits with CMOL (CMOS + “Molecular”) architecture have been proposed to combine the extremely high density of the memristive devices with the robustness of CMOS technology, leading to terabit-scale memory and extremely efficient computing paradigm. In this work, we demonstrate a hybrid 3D CMOL circuit with 2 layers of memristive crossbars monolithically integrated on a pre-fabricated CMOS substrate. The integrated crossbars can be fully operated through the underlying CMOS circuitry. The memristive devices in both layers exhibit analog switching behavior with controlled tunability and stable multi-level operation. We perform dot-product operations with the 2D and 3D memristive crossbars to demonstrate the applicability of such 3D CMOL hybrid circuits as a multiply-add engine. To the best of our knowledge this is the first demonstration of a functional 3D CMOL hybrid circuit.

Modeling and Experimental Demonstration of a Hopfield Network Analog-to-Digital Converter with Hybrid CMOS/Memristor Circuits

The purpose of this work was to demonstrate the feasibility of building recurrent artificial neural networks with hybrid complementary metal oxide semiconductor (CMOS)/memristor circuits. To do so, we modeled a Hopfield network implementing an analog-to-digital converter (ADC) with up to 8 bits of precision. Major shortcomings affecting the ADC's precision, such as the non-ideal behavior of CMOS circuitry and the specific limitations of memristors, were investigated and an effective solution was proposed, capitalizing on the in-field programmability of memristors. The theoretical work was validated experimentally by demonstrating the successful operation of a 4-bit ADC circuit implemented with discrete Pt/TiO2- x /Pt memristors and CMOS integrated circuit components.

Memristive devices for computing

Memristive devices are electrical resistance switches that can retain a state of internal resistance based on the history of applied voltage and current. These devices can store and process information, and offer several key performance characteristics that exceed conventional integrated circuit technology. An important class of memristive devices are two-terminal resistance switches based on ionic motion, which are built from a simple conductor/insulator/conductor thin-film stack. These devices were originally conceived in the late 1960s and recent progress has led to fast, low-energy, high-endurance devices that can be scaled down to less than 10 nm and stacked in three dimensions. However, the underlying device mechanisms remain unclear, which is a significant barrier to their widespread application. Here, we review recent progress in the development and understanding of memristive devices. We also examine the performance requirements for computing with memristive devices and detail how the outstanding challenges could be met.

High precision tuning of state for memristive devices by adaptable variation-tolerant algorithm

Using memristive properties common for titanium dioxide thin film devices, we designed a simple write algorithm to tune device conductance at a specific bias point to 1% relative accuracy (which is roughly equivalent to seven-bit precision) within its dynamic range even in the presence of large variations in switching behavior. The high precision state is nonvolatile and the results are likely to be sustained for nanoscale memristive devices because of the inherent filamentary nature of the resistive switching. The proposed functionality of memristive devices is especially attractive for analog computing with low precision data. As one representative example we demonstrate hybrid circuitry consisting of an integrated circuit summing amplifier and two memristive devices to perform the analog multiply-and-add (dot-product) computation, which is a typical bottleneck operation in information processing.

The switching location of a bipolar memristor: chemical, thermal and structural mapping

Memristors are memory resistors promising a rapid integration into future memory technologies. However, progress is still critically limited by a lack of understanding of the physical processes occurring at the nanoscale. Here we correlate device electrical characteristics with local atomic structure, chemistry and temperature. We resolved a single conducting channel that is made up of a reduced phase of the as-deposited titanium oxide. Moreover, we observed sufficient Joule heating to induce a crystallization of the oxide surrounding the channel, with a peculiar pattern that finite element simulations correlated with the existence of a hot spot close to the bottom electrode, thus identifying the switching location. This work reports direct observations in all three dimensions of the internal structure of titanium oxide memristors.

Memristor-CMOS hybrid integrated circuits for reconfigurable logic

Hybrid reconfigurable logic circuits were fabricated by integrating memristor-based crossbars onto a foundry-built CMOS (complementary metal-oxide-semiconductor) platform using nanoimprint lithography, as well as materials and processes that were compatible with the CMOS. Titanium dioxide thin-film memristors served as the configuration bits and switches in a data routing network and were connected to gate-level CMOS components that acted as logic elements, in a manner similar to a field programmable gate array. We analyzed the chips using a purpose-built testing system, and demonstrated the ability to configure individual devices, use them to wire up various logic gates and a flip-flop, and then reconfigure devices.

Coupled ionic and electronic transport model of thin-film semiconductor memristive behavior

The memristor, the fourth passive circuit element, was predicted theoretically nearly 40 years ago, but we just recently demonstrated both an intentional material system and an analytical model that exhibited the properties of such a device. Here we provide a more physical model based on numerical solutions of coupled drift-diffusion equations for electrons and ions with appropriate boundary conditions. We simulate the dynamics of a two-terminal memristive device based on a semiconductor thin film with mobile dopants that are partially compensated by a small amount of immobile acceptors. We examine the mobile ion distributions, zero-bias potentials, and current-voltage characteristics of the model for both steady-state bias conditions and for dynamical switching to obtain physical insight into the transport processes responsible for memristive behavior in semiconductor films.

Defect-tolerant architectures for nanoelectronic crossbar memories

We have calculated the maximum useful bit density that may be achieved by the synergy of bad bit exclusion and advanced (BCH) error correcting codes in prospective crossbar nanoelectronic memories, as a function of defective memory cell fraction. While our calculations are based on a particular ("CMOL") memory topology, with naturally segmented nanowires and an area-distributed nano/CMOS interface, for realistic parameters our results are also applicable to "global" crossbar memories with peripheral interfaces. The results indicate that the crossbar memories with a nano/CMOS pitch ratio close to 1/3 (which is typical for the current, initial stage of the nanoelectronics development) may overcome purely semiconductor memories in useful bit density if the fraction of nanodevice defects (stuck-on-faults) is below approximately 15%, even under rather tough, 30 ns upper bound on the total access time. Moreover, as the technology matures, and the pitch ratio approaches an order of magnitude, the crossbar memories may be far superior to the densest semiconductor memories by providing, e.g., a 1 Tbit/cm2 density even for a plausible defect fraction of 2%. These highly encouraging results are much better than those reported in literature earlier, including our own early work, mostly due to more advanced error correcting codes.