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Zhang W, Lederman JC, Ferreira de Lima T, Zhang J, Bilodeau S, Hudson L, Tait A, Shastri BJ, Prucnal PR. A system-on-chip microwave photonic processor solves dynamic RF interference in real time with picosecond latency. Light Sci Appl 2024; 13:14. [PMID: 38195653 PMCID: PMC10776583 DOI: 10.1038/s41377-023-01362-5] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/10/2023] [Revised: 12/12/2023] [Accepted: 12/15/2023] [Indexed: 01/11/2024]
Abstract
Radio-frequency interference is a growing concern as wireless technology advances, with potentially life-threatening consequences like interference between radar altimeters and 5 G cellular networks. Mobile transceivers mix signals with varying ratios over time, posing challenges for conventional digital signal processing (DSP) due to its high latency. These challenges will worsen as future wireless technologies adopt higher carrier frequencies and data rates. However, conventional DSPs, already on the brink of their clock frequency limit, are expected to offer only marginal speed advancements. This paper introduces a photonic processor to address dynamic interference through blind source separation (BSS). Our system-on-chip processor employs a fully integrated photonic signal pathway in the analogue domain, enabling rapid demixing of received mixtures and recovering the signal-of-interest in under 15 picoseconds. This reduction in latency surpasses electronic counterparts by more than three orders of magnitude. To complement the photonic processor, electronic peripherals based on field-programmable gate array (FPGA) assess the effectiveness of demixing and continuously update demixing weights at a rate of up to 305 Hz. This compact setup features precise dithering weight control, impedance-controlled circuit board and optical fibre packaging, suitable for handheld and mobile scenarios. We experimentally demonstrate the processor's ability to suppress transmission errors and maintain signal-to-noise ratios in two scenarios, radar altimeters and mobile communications. This work pioneers the real-time adaptability of integrated silicon photonics, enabling online learning and weight adjustments, and showcasing practical operational applications for photonic processing.
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Affiliation(s)
- Weipeng Zhang
- Department of Electrical and Computer Engineering, Princeton University, Princeton, 08544, NJ, USA.
| | - Joshua C Lederman
- Department of Electrical and Computer Engineering, Princeton University, Princeton, 08544, NJ, USA
| | | | - Jiawei Zhang
- Department of Electrical and Computer Engineering, Princeton University, Princeton, 08544, NJ, USA
| | - Simon Bilodeau
- Department of Electrical and Computer Engineering, Princeton University, Princeton, 08544, NJ, USA
| | - Leila Hudson
- Department of Electrical and Computer Engineering, Princeton University, Princeton, 08544, NJ, USA
| | - Alexander Tait
- Department of Electrical and Computer Engineering, Queen's University, Kingston, K7L 3N6, Ontario, Canada
| | - Bhavin J Shastri
- Department of Physics, Engineering Physics and Astronomy, Queen's University, Kingston, K7L 3N6, Ontario, Canada
| | - Paul R Prucnal
- Department of Electrical and Computer Engineering, Princeton University, Princeton, 08544, NJ, USA.
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Lederman JC, Zhang W, de Lima TF, Blow EC, Bilodeau S, Shastri BJ, Prucnal PR. Real-time photonic blind interference cancellation. Nat Commun 2023; 14:8197. [PMID: 38081807 PMCID: PMC10713617 DOI: 10.1038/s41467-023-43982-w] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/06/2023] [Accepted: 11/24/2023] [Indexed: 02/28/2024] Open
Abstract
mmWave devices can broadcast multiple spatially-separated data streams simultaneously in order to increase data transfer rates. Data transfer can, however, be compromised by interference. Photonic blind interference cancellation systems offer a power-efficient means of mitigating interference, but previous demonstrations of such systems have been limited by high latencies and the need for regular calibration. Here, we demonstrate real-time photonic blind interference cancellation using an FPGA-photonic system executing a zero-calibration control algorithm. Our system offers a greater than 200-fold reduction in latency compared to previous work, enabling sub-second cancellation weight identification. We further investigate key trade-offs between system latency, power consumption, and success rate, and we validate sub-Nyquist sampling for blind interference cancellation. We estimate that photonic interference cancellation can reduce the power required for digitization and signal recovery by greater than 74 times compared to the digital electronic alternative.
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Affiliation(s)
- Joshua C Lederman
- Department of Electrical and Computer Engineering, Princeton University, Princeton, NJ, 08544, USA.
| | - Weipeng Zhang
- Department of Electrical and Computer Engineering, Princeton University, Princeton, NJ, 08544, USA
| | - Thomas Ferreira de Lima
- Department of Electrical and Computer Engineering, Princeton University, Princeton, NJ, 08544, USA
- NEC Laboratories America, Princeton, NJ, 08540, USA
| | - Eric C Blow
- Department of Electrical and Computer Engineering, Princeton University, Princeton, NJ, 08544, USA
- NEC Laboratories America, Princeton, NJ, 08540, USA
| | - Simon Bilodeau
- Department of Electrical and Computer Engineering, Princeton University, Princeton, NJ, 08544, USA
| | - Bhavin J Shastri
- Department of Physics, Engineering Physics & Astronomy, Queen's University, Kingston, ON, K7L 3N6, Canada
| | - Paul R Prucnal
- Department of Electrical and Computer Engineering, Princeton University, Princeton, NJ, 08544, USA
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Berggren K, Xia Q, Likharev KK, Strukov DB, Jiang H, Mikolajick T, Querlioz D, Salinga M, Erickson JR, Pi S, Xiong F, Lin P, Li C, Chen Y, Xiong S, Hoskins BD, Daniels MW, Madhavan A, Liddle JA, McClelland JJ, Yang Y, Rupp J, Nonnenmann SS, Cheng KT, Gong N, Lastras-Montaño MA, Talin AA, Salleo A, Shastri BJ, de Lima TF, Prucnal P, Tait AN, Shen Y, Meng H, Roques-Carmes C, Cheng Z, Bhaskaran H, Jariwala D, Wang H, Shainline JM, Segall K, Yang JJ, Roy K, Datta S, Raychowdhury A. Roadmap on emerging hardware and technology for machine learning. Nanotechnology 2021; 32:012002. [PMID: 32679577 DOI: 10.1088/1361-6528/aba70f] [Citation(s) in RCA: 29] [Impact Index Per Article: 9.7] [Reference Citation Analysis] [What about the content of this article? (0)] [Affiliation(s)] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/11/2023]
Abstract
Recent progress in artificial intelligence is largely attributed to the rapid development of machine learning, especially in the algorithm and neural network models. However, it is the performance of the hardware, in particular the energy efficiency of a computing system that sets the fundamental limit of the capability of machine learning. Data-centric computing requires a revolution in hardware systems, since traditional digital computers based on transistors and the von Neumann architecture were not purposely designed for neuromorphic computing. A hardware platform based on emerging devices and new architecture is the hope for future computing with dramatically improved throughput and energy efficiency. Building such a system, nevertheless, faces a number of challenges, ranging from materials selection, device optimization, circuit fabrication and system integration, to name a few. The aim of this Roadmap is to present a snapshot of emerging hardware technologies that are potentially beneficial for machine learning, providing the Nanotechnology readers with a perspective of challenges and opportunities in this burgeoning field.
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Affiliation(s)
- Karl Berggren
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, United States of America
| | - Qiangfei Xia
- Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, MA, United States of America
| | | | - Dmitri B Strukov
- Department of Electrical and Computer Engineering, University of California at Santa Barbara, Santa Barbara, CA 93106, United States of America
| | - Hao Jiang
- School of Engineering & Applied Science Yale University, CT, United States of America
| | | | | | - Martin Salinga
- Institut für Materialphysik, Westfälische Wilhelms-Universität Münster, Germany
| | - John R Erickson
- Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA 15261, United States of America
| | - Shuang Pi
- Lam Research, Fremont, CA, United States of America
| | - Feng Xiong
- Department of Electrical and Computer Engineering, University of Pittsburgh, Pittsburgh, PA 15261, United States of America
| | - Peng Lin
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, United States of America
| | - Can Li
- Department of Electrical and Electronic Engineering, The University of Hong Kong, Hong Kong SAR, China
| | - Yu Chen
- School of information science and technology, Fudan University, Shanghai, People's Republic of China
| | - Shisheng Xiong
- School of information science and technology, Fudan University, Shanghai, People's Republic of China
| | - Brian D Hoskins
- Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, United States of America
| | - Matthew W Daniels
- Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, United States of America
| | - Advait Madhavan
- Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, United States of America
- Institute for Research in Electronics and Applied Physics, University of Maryland, College Park, MD, United States of America
| | - James A Liddle
- Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, United States of America
| | - Jabez J McClelland
- Physical Measurements Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899, United States of America
| | - Yuchao Yang
- School of Electronics Engineering and Computer Science, Peking University, Beijing, People's Republic of China
| | - Jennifer Rupp
- Department of Materials Science and Engineering and Department of Electrical Engineering & Computer Science, Massachusetts Institute of Technology, Cambridge, MA 02139, United States of America
- Electrochemical Materials, ETHZ Department of Materials, Hönggerbergring 64, Zürich 8093, Switzerland
| | - Stephen S Nonnenmann
- Department of Mechanical & Industrial Engineering, University of Massachusetts-Amherst, MA, United States of America
| | - Kwang-Ting Cheng
- School of Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong, People's Republic of China
| | - Nanbo Gong
- IBM T J Watson Research Center, Yorktown Heights, NY 10598, United States of America
| | - Miguel Angel Lastras-Montaño
- Instituto de Investigación en Comunicación Óptica, Facultad de Ciencias, Universidad Autónoma de San Luis Potosí, México
| | - A Alec Talin
- Sandia National Laboratories, Livermore, CA 94551, United States of America
| | - Alberto Salleo
- Department of Materials Science and Engineering, Stanford University, Stanford, California, United States of America
| | - Bhavin J Shastri
- Department of Physics, Engineering Physics & Astronomy, Queen's University, Kingston ON KL7 3N6, Canada
| | - Thomas Ferreira de Lima
- Department of Electrical Engineering, Princeton University, Princeton, NJ 08544, United States of America
| | - Paul Prucnal
- Department of Electrical Engineering, Princeton University, Princeton, NJ 08544, United States of America
| | - Alexander N Tait
- Physical Measurement Laboratory, National Institute of Standards and Technology (NIST), Boulder, CO 80305, United States of America
| | - Yichen Shen
- Lightelligence, 268 Summer Street, Boston, MA 02210, United States of America
| | - Huaiyu Meng
- Lightelligence, 268 Summer Street, Boston, MA 02210, United States of America
| | - Charles Roques-Carmes
- Research Laboratory of Electronics, Massachusetts Institute of Technology, Cambridge, MA 02139, United States of America
| | - Zengguang Cheng
- Department of Materials, University of Oxford, Oxford OX1 3PH, United Kingdom
- State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, People's Republic of China
| | - Harish Bhaskaran
- Department of Materials, University of Oxford, Oxford OX1 3PH, United Kingdom
| | - Deep Jariwala
- Department of Electrical and Systems Engineering, University of Pennsylvania, Philadelphia PA 19104, United States of America
| | - Han Wang
- University of Southern California, Los Angeles, CA 90089, United States of America
| | - Jeffrey M Shainline
- Physical Measurement Laboratory, National Institute of Standards and Technology (NIST), Boulder, CO 80305, United States of America
| | - Kenneth Segall
- Department of Physics and Astronomy, Colgate University, NY 13346, United States of America
| | - J Joshua Yang
- Department of Electrical and Computer Engineering, University of Massachusetts, Amherst, MA, United States of America
| | - Kaushik Roy
- School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47907, United States of America
| | - Suman Datta
- University of Notre Dame, Notre Dame, IN 46556, United States of America
| | - Arijit Raychowdhury
- Georgia Institute of Technology, Atlanta, GA 30332, United States of America
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