Influence of Diamond Wire Saw Processing Parameters on the Sawn Surface Characteristics of Silicon Nitride Ceramics

For the slicing of superhard silicon nitride ceramics, diamond wire sawing technology has great potential for application, and its slicing surface characteristics are an important indicator of cutting quality. In this paper, the sawing experiments of silicon nitride ceramics were carried out within the range of industrial processing parameters of diamond wire sawing (saw wire speed: 800-1600 m/min, workpiece feed speed 0.1-0.4 mm/min). The effects of cutting parameters on the surface morphology, surface roughness and waviness of the as-sawn slices were analyzed. The results show that within the range of sawing parameters for industrial applications, the material on the diamond wire as-sawn surface of silicon nitride ceramics is removed mainly in a brittle mode, with the slice morphology showing brittle pits and regularly distributed wire marks in the 20-55 μm scale range. The surface roughness of the slices along the workpiece feed direction ranges from 0.27 to 0.38 μm and decreases with increasing saw wire speed and decreasing feed rate. The surface waviness ranges from 0.09 to 0.21 μm, which is in good agreement with the changing trend of the sliced-surface roughness. The results of the study provide an experimental reference for promoting the engineering application of diamond wire sawing technology to the processing of silicon nitride ceramic slices.

Effects of Grinding Parameters on the Processing Temperature, Crack Propagation and Residual Stress in Silicon Nitride Ceramics

The surface/subsurface damage of engineering ceramics after machining has a great influence on the service performance of parts. In order to obtain a high grinding surface quality of engineering ceramics, and take silicon nitride ceramic as a research object, a series of grinding experiments were carried out. The effects of grinding parameters on longitudinal crack propagation depth and the surface residual stress of silicon nitride ceramics were analyzed by grinding experiments, and the residual stress at the location of crack propagation was obtained. The variation in the grinding temperature under different grinding parameters was explored. The influences of the grinding temperature on crack propagation depth and surface residual stress were clarified, the distribution of residual stress along the depth direction was discussed, and the relationship between the residual stress and crack propagation was revealed. The results show that the residual compressive stress on the surface of silicon nitride ceramics decreases with the increase in the depth of crack propagation and the degree of surface brittle spalling. The residual stress at the location of the crack propagation was residual tensile stress. The crack propagation depth increased with the increase in the residual tensile stress. The research provides a reference for the realization of high-quality surfaces in the grinding of silicon nitride ceramics.