Robotic-assisted wire saw resection of high-position rib tumors: a single-center experience

Background

Rib tumors are typically curable through rib resection, associated with an excellent prognosis. Although transthoracic robotic first rib resection for thoracic outlet syndrome (TOS) has been previously documented, this paper presents our experience and technique in conducting robotic-assisted wire saw resections for high-position rib tumors.

Methods

From January 2019 to May 2022, five patients diagnosed with high-position rib tumors underwent robotic-assisted wire saw resections. For our entire portal approach, we employed two 8-mm working ports, a 12-mm camera port, and a 12-mm assistant port. Data regarding the short-term and clinical long-term treatment effects were collected.

Results

The median operation time was 124.2 minutes (range, 87-185 minutes), with no observed complications. The average intraoperative blood loss was 185 mL (range, 85-410 mL). Chest tubes were typically removed between 1 and 3 days post-operation. The average hospital stay post-surgery was 2.8 days, with a range of 2-5 days. We observed no relevant intraoperative or postoperative complications. No recurrence was reported during routine follow-ups 12 months post-surgery.

Conclusions

Our findings indicate that the technique of robotic-assisted wire saw resection for high-position rib tumors is both feasible and reliable. This provides valuable insights for surgeons to consider robotic-assisted resection for high-position rib tumors.

Mini-drone assisted tree canopy sampling: a low-cost and high-precision solution

The collection of tree canopy samples in forest ecosystems has been challenging for researchers and managers during the past decades. Various methods, including pole pruner, tree climber, shooter, throw-line launcher, hydraulic lift (e.g., tower crane) and UAV (unmanned aerial vehicle)-based devices, have been used, however, they are limited by sampling height restrictions, safety hazards to a climber, low retrieving accuracy, high equipment costs, and transportation inconvenience. This study proposed a novel method for collecting tree canopy samples using a portable mini-drone. The mini-drone is operated to pull a traction line across the target branch, drag the retrieving rope to the selected cutting point of the branch, and carry the equipped wire saw or chain saw to cut the canopy sample off. Through on-site testing and field trials, this method was feasible for lower- and middle-canopy sampling (up to 30 meters tall) across most temperate broad-leaved and coniferous tree species. This technique would have great potential in plantation and old-growth forests. Adopting this low-cost mini-drone technique, researchers can collect tree canopy samples safely and efficiently, leading to improvements in relevant physiological and ecological studies focusing on functional traits of branches, leaves, and seeds.

Experimental Study on the Influence of Wire-Saw Wear on Cutting Force and Silicon Wafer Surface

Hard and brittle materials such as monocrystalline silicon still occupy an important position in the semiconductor industry, but hard and brittle materials are difficult to process because of their physical properties. Fixed-diamond abrasive wire-saw cutting is the most widely used method for slicing hard and brittle materials. The diamond abrasive particles on the wire saw wear to a certain extent, which affects the cutting force and wafer surface quality in the cutting process. In this experiment, keeping all the given parameters unchanged, a square silicon ingot is cut repeatedly with a consolidated diamond abrasive wire saw until the wire saw breaks. The experimental results show that the cutting force decreases with the increase in cutting times in the stable grinding stage. The wear of abrasive particles starts at the edges and corners, and the macro failure mode of the wire saw is fatigue fracture. The fluctuation of the wafer surface profile gradually decreases. The surface roughness of wafer is steady during the wear steady stage, and the large damage pits on the wafer surface are reduced in the whole process of cutting.