Ultrahigh Thermal Conductivity of Interface Materials by Silver-Functionalized Carbon Nanotube Phonon Conduits

Breaking the Activity-and-Selectivity Seesaw while Enhancing Heat Management via the Lattice Effect of a Single-Atom Alloy

When single-atom catalysts are oriented toward practical applications, in addition to balancing the seesaw between activity and selectivity, the capability of thermal management also merits attention. Herein, we proposed a facility approach that, based on active Pd in the state of a single atom, tunes the guest Cu size to simultaneously enhance the effect of d-electron domination and the heat transfer behavior in microregions. Along with the Cu size in an order of magnitude increase, more delocalized electrons were generated and transferred to isolated Pd sites, with the d band center shifting from 1.438 to 1.052 eV, closer to the Fermi level. Simultaneously, more long-range ordered lattices are much favorable for transferring in situ generated thermally phonons with the diffusivity surging from 12.36 to 103.49 mm2/s. The optimized Pd1Cu-SAA catalyst exhibited state-of-the-art performance in acetylene hydrogenation, achieving full conversion at 140 °C, with 95.3% selectivity and good stability in the test period.

Synthesis of Silver Nanoparticle/Multi-Walled Carbon Nanotube Composites and Their Application in Electronic Pastes

Silver nanoparticle-coated multi-walled carbon nanotube (Ag/MWNT) composites were prepared using a chemical plating method that effectively controls the overgrowth of silver nanoparticles, ensuring uniform particle size. Functionalization of the carbon nanotube surface with numerous functional groups facilitates the binding of silver ions to multi-walled carbon nanotubes (MWNTs). This process results in Ag/MWNT composites with a uniform distribution of silver nanoparticles, prepared through reduction via the silver mirror reaction. The impact of dispersants and reducing agents on the silver coating of carbon nanotubes was studied. The results revealed the formation of negatively charged functional groups (-COOH, -OH, -C=O, and -NH2) on the nanotube surface. These groups acted as nucleation sites for the formation of silver nanoparticles. These groups acted as nucleation sites for the formation of silver nanoparticles. Simultaneously, the Ag/MWNT composites demonstrated effective dispersion within the matrix, improving the electrical conductivity of the electronic paste by 32.1% and 33.1%. This improvement was attributed to the forming of a conductive pathway within the silver-modified composite. Ag/MWNT composites within the paste system improved interfacial contact between fillers and the matrix, enhancing their potential applications in thermal interface materials.

Graphene-based polymer composites in thermal management: materials, structures and applications

Graphene, with its high thermal conductivity (k), excellent mechanical properties, and thermal stability, is an ideal filler for developing advanced high k and heat dissipation materials. However, creating graphene-based polymer nanocomposites (GPNs) with high k remains a significant challenge to meet the demand for efficient heat dissipation. Here, the effects of graphene material and structure on thermal properties are investigated from both microscopic and macroscopic perspectives. Initially, it briefly introduces the influence of graphene structural parameters on its intrinsic k, along with summarizing methods to adjust these parameters. Various techniques for establishing different thermal conductivity pathways at the macroscopic scale (including filler hybridization, 3D networks, horizontal alignment, and vertical alignment) are reviewed, along with their respective advantages and disadvantages. Furthermore, we discuss the applications of GPNs as thermal interface materials (TIMs), phase change materials (PCMs), and smart responsive thermal management materials in the field of thermal management. Finally, the current challenges and future perspectives of GPN research are discussed. This review offers researchers a comprehensive overview of recent advancements in GPNs for thermal management and guidance for developing the next generation of thermally conductive polymer composites.

Core-Shell Engineered Fillers Overcome the Electrical-Thermal Conductance Trade-Off

The rapid development of modern electronic devices increasingly requires thermal management materials with controllable electrical properties, ranging from conductive and dielectric to insulating, to meet the needs of diverse applications. However, highly thermally conductive materials usually have a high electrical conductivity. Intrinsically highly thermally conductive, but electrically insulating materials are still limited to a few kinds of materials. To overcome the electrical-thermal conductance trade-off, here, we report a facile Pechini-based method to prepare multiple core (metal)/shell (metal oxide) engineered fillers, such as aluminum-oxide-coated and beryllium-oxide-coated Ag microspheres. In contrast to the previous in situ growth method which mainly focused on small-sized spheres with specific coating materials, our method combined with ultrafast joule heating treatment is more versatile and robust for varied-sized, especially large-sized core-shell fillers. Through size compounding, the as-synthesized core-shell-filled epoxy composites exhibit high isotropic thermal conductivity (∼3.8 W m-1 K-1) while maintaining high electrical resistivity (∼1012 Ω cm) and good flowability, showing better heat dissipation properties than commercial thermally conductive packaging materials. The successful preparation of these core-shell fillers endows thermally conductive composites with controlled electrical properties for emerging electronic package applications, as demonstrated in circuit board and battery thermal management.

Wet-spinning of carbon nanotube fibers: dispersion, processing and properties

Owing to the intrinsic excellent mechanical, electrical, and thermal properties of carbon nanotubes (CNTs), carbon nanotube fibers (CNTFs) have been expected to become promising candidates for the next-generation of high-performance fibers. They have received considerable interest for cutting-edge applications, such as ultra-light electric wire, aerospace craft, military equipment, and space elevators. Wet-spinning is a broadly utilized commercial technique for high-performance fiber manufacturing. Thus, compared with array spinning from drawable CNTs vertical array and direct dry spinning from floating catalyst chemical vapor deposition (FCCVD), the wet-spinning technique is considered to be a promising strategy to realize the production of CNTFs on a large scale. In this tutorial review, we begin with a summative description of CNTFs wet-spinning process. Then, we discuss the high-concentration CNTs wet-spinning dope preparation strategies and corresponding non-covalent adsorption/charge transfer mechanisms. The filament solidification during the coagulation process is another critical procedure for determining the configurations and properties for derived CNTFs. Next, we discuss post-treatment, including continuous drafting and thermal annealing, to further optimize the CNTs orientation and compact configuration. Finally, we summarize the physical property-structure relationship to give insights for further performance promotion in order to satisfy the prerequisite for detailed application. Insights into propelling high-performance CNTFs production from lab-scale to industry-scale are proposed, in anticipation of this novel fiber having an impact on our lives in the near future.

Soft Bioelectronics for Heart Monitoring

Cardiovascular diseases (CVDs) are a predominant global health concern, accounting for over 17.9 million deaths in 2019, representing approximately 32% of all global fatalities. In North America and Europe, over a million adults undergo cardiac surgeries annually. Despite the benefits, such surgeries pose risks and require precise postsurgery monitoring. However, during the postdischarge period, where monitoring infrastructures are limited, continuous monitoring of vital signals is hindered. In this area, the introduction of implantable electronics is altering medical practices by enabling real-time and out-of-hospital monitoring of physiological signals and biological information postsurgery. The multimodal implantable bioelectronic platforms have the capability of continuous heart sensing and stimulation, in both postsurgery and out-of-hospital settings. Furthermore, with the emergence of machine learning algorithms into healthcare devices, next-generation implantables will benefit artificial intelligence (AI) and connectivity with skin-interfaced electronics to provide more precise and user-specific results. This Review outlines recent advancements in implantable bioelectronics and their utilization in cardiovascular health monitoring, highlighting their transformative deployment in sensing and stimulation to the heart toward reaching truly personalized healthcare platforms compatible with the Sustainable Development Goal 3.4 of the WHO 2030 observatory roadmap. This Review also discusses the challenges and future prospects of these devices.

Thermally Conductive Polydimethylsiloxane-Based Composite with a Three-Dimensional Vertically Aligned Thermal Network Incorporating Hexagonal Boron Nitride Nanosheets and Nanodiamonds

Thermal interface materials play a pivotal role in efficiently transferring heat from heating devices to thermal management components, thereby reducing the risk of component degradation due to overheating. In this study, we propose a strategy for enhancing the out-of-plane thermal conductivity (TC) of composite materials by fabricating a three-dimensional (3D) thermal network within a polydimethylsiloxane (PDMS) matrix. Specifically, the composite material was designed to incorporate a dense thermal network comprising hexagonal boron nitride nanosheets (BNNSs) and nanodiamonds (NDs). The fabrication process commenced with the preparation of BNNSs through liquid-phase exfoliation, followed by the creation of a 3D BNNSs-NDs/polyimide aerogel thermal framework using a unidirectional solidification ice templating method and subsequent heat treatment. Vacuum impregnation and curing were then employed to finalize the production of the 3D BNNSs-NDs/PDMS composite material. Characterization analyses indicated that the addition of NDs filled the voids between BNNSs, leading to the densification of the thermal framework pore walls and the establishment of additional thermal pathways. Impressively, with concentrations of BNNSs and NDs of 17.99 and 7.71 wt %, respectively, the out-of-plane TC of the 3D BNNSs-NDs/PDMS composite material reached 1.623 W m-1 K-1, marking notable enhancements of 754.21% and 256.70% compared to those of pure PDMS and composites prepared via direct blending with randomly distributed BNNSs and NDs, respectively. Furthermore, the 3D BNNSs-NDs thermal framework improved the compressive strength and the dimensional stability of the composite material. Finite element simulations additionally confirmed the synergistic improvement of the TC achieved through the combination of BNNSs and NDs, demonstrating that the 3D BNNSs-NDs/PDMS composite material displayed superior heat conduction and a greater density of thermal pathways compared to those of its counterparts, including 3D BNNSs/PDMS and 3D NDs/PDMS composite materials. In summary, this work presents a strategy for enhancing the out-of-plane TC of polymer-based composite materials by incorporating vertically aligned thermal networks.

2D Materials-Based Thermal Interface Materials: Structure, Properties, and Applications

The challenges associated with heat dissipation in high-power electronic devices used in communication, new energy, and aerospace equipment have spurred an urgent need for high-performance thermal interface materials (TIMs) to establish efficient heat transfer pathways from the heater (chip) to heat sinks. Recently, emerging 2D materials, such as graphene and boron nitride, renowned for their ultrahigh basal-plane thermal conductivity and the capacity to facilitate cross-scale, multi-morphic structural design, have found widespread use as thermal fillers in the production of high-performance TIMs. To deepen the understanding of 2D material-based TIMs, this review focuses primarily on graphene and boron nitride-based TIMs, exploring their structures, properties, and applications. Building on this foundation, the developmental history of these TIMs is emphasized and a detailed analysis of critical challenges and potential solutions is provided. Additionally, the preparation and application of some other novel 2D materials-based TIMs are briefly introduced, aiming to offer constructive guidance for the future development of high-performance TIMs.

Molecular dynamics study on the thermal properties of DGEBA/DETA/Ag/SWCNT-Ag composite materials

CONTEXT

Traditional conductive adhesives based on epoxy resin system often encounter problems such as high brittleness and low heat resistance. Therefore, it is particularly important to improve the thermal and mechanical properties of the conductive adhesive. In this study, the effects of SWCNT-Ag and SWCNT fillers on the thermal properties of DGEBA/DETA/Ag conductive adhesive system were studied by using molecular dynamics to construct different cross-linking models. The final results show that the addition of SWCNT and SWCNT-Ag can significantly improve the thermal properties of the conductive adhesive. However, the nanosilver particles on the surface of SWCNT-Ag act as a bridge for the connection between SWCNT and Ag in the conductive adhesive. Therefore, SWCNT-Ag has a more positive impact on the thermal properties of DGEBA/DETA/Ag conductive adhesive system.

METHODS

In this paper, the influence of SWCNT-Ag on the thermal properties of traditional DGEBA/DETA/Ag conductive adhesive system was studied by using Materials Studio software. The volume shrinkage, glass transition temperature, thermal expansion coefficient, and thermal conductivity of the material were calculated based on COMPASS force field. The thermal conductivity is calculated by using reverse non-equilibrium molecular dynamics method. Finally, it is found that SWCNT-Ag has a positive effect on the thermal properties of the conductive adhesive system by comparing several groups of calculation data.

Ultrahigh Thermal Conductivity of Epoxy/Ag Flakes/MXene@Ag Composites Achieved by In Situ Sintering of Silver Nanoparticles

The growing use of high-power and integrated electronic devices has created a need for thermal conductive adhesives (TCAs) with high thermal conductivity (TC) to manage heat dissipation at the interface. However, TCAs are often limited by contact thermal resistance at the interface between materials. In this study, we synthesized MXene@Ag composites through a direct in situ reduction process. The Ag nanoparticles (Ag NPs) generated by the reduction of the MXene interlayer and surface formed effective thermally conductive pathways with Ag flakes within an epoxy resin matrix. Various characterization analyses revealed that adding MXene@Ag composites at a concentration of 3 wt % resulted in a remarkable TC of 40.80 W/(m·K). This value is 8.77 times higher than that achieved with Ag flakes and 7.9 times higher than with MXene filler alone. The improved TC is attributed to the sintering of the in situ reduced Ag NPs during the curing process, which formed a connection between MXene (a highly conductive material) and the Ag flakes, thereby reducing contact thermal resistance. This reduction in contact thermal resistance significantly enhanced the TC of the thermal interface materials (TIMs). This study presents a novel approach for developing materials with exceptionally high TC, opening new possibilities for the design and fabrication of advanced thermal management systems.

Next-generation all-organic composites: A sustainable successor to organic-inorganic hybrid materials

This Review presents an overview of all-organic nanocomposites, a sustainable alternative to organic-inorganic hybrids. All-organic nanocomposites contain nanocellulose, nanochitin, and aramid nanofibers as highly rigid reinforcing fillers. They offer superior mechanical properties and lightweight characteristics suitable for diverse applications. The Review discusses various methods for preparing the organic nanofillers, including top-down and bottom-up approaches. It highlights in situ polymerization as the preferred method for incorporating these nanomaterials into polymer matrices to achieve homogeneous filler dispersion, a crucial factor for realizing desired performance. Furthermore, the Review explores several applications of all-organic nanocomposites in diverse fields including food packaging, performance-advantaged plastics, and electronic materials. Future research directions-developing sustainable production methods, expanding biomedical applications, and enhancing resistance against heat, chemicals, and radiation of all-organic nanocomposites to permit their use in extreme environments-are explored. This Review offers insights into the potential of all-organic nanocomposites to drive sustainable growth while meeting the demand for high-performance materials across various industries.

Ag-MWCNT Composites for Improving the Electrical and Thermal Properties of Electronic Paste

With the development of microelectronics products with high density and high power, it is urgent to improve the electrical and thermal conductivity of electronic paste to achieve the new requirements of packaging materials. In this work, a new synthesis method of Ag-MWCNTs was designed: Firstly, carboxylated MWCNTs and stannous chloride were used as raw materials to prepare high-loading-rate Sn-MWCNT composite material to ensure the high loading rate of metal on the MWCNT surface. Then, Ag-MWCNT composite material was prepared by the chemical displacement method to solve the problem of the low loading rate of silver nanoparticles on the MWCNT surface. On the basis of this innovation, we analyzed and compared the electrical, thermal, and mechanical properties of Ag-MWCNT composite electronic paste. Compared with the electronic paste without adding Ag-MWCNTs, the resistivity was reduced by 77%, the thermal conductivity was increased by 66%, and the shear strength was increased by 15%. Therefore, the addition of Ag-MWCNTs effectively improves the electrical, thermal, and mechanical properties of the paste, making it a promising and competitive choice for new packaging materials in the future.

Enhanced Thermal Conductivity of Single-Walled Carbon Nanotube with Axial Tensile Strain Enabled by Boron Nitride Nanotube Anchoring

Thermal conductivity measurements are conducted by optothermal Raman technique before and after the introduction of an axial tensile strain in a suspended single-walled carbon nanotube (SWCNT) through end-anchoring by boron nitride nanotubes (BNNTs). Surprisingly, the axial tensile strain (<0.4 %) in SWCNT results in a considerable enhancement of its thermal conductivity, and the larger the strain, the higher the enhancement. Furthermore, the thermal conductivity reduction with temperature is much alleviated for the strained nanotube compared to previously reported unstrained cases. The thermal conductivity of SWCNT increases with its length is also observed.

Improved Bending Strength and Thermal Conductivity of Diamond/Al Composites with Ti Coating Fabricated by Liquid-Solid Separation Method

In response to the rapid development of high-performance electronic devices, diamond/Al composites with high thermal conductivity (TC) have been considered as the latest generation of thermal management materials. This study involved the fabrication of diamond/Al composites reinforced with Ti-coated diamond particles using a liquid-solid separation (LSS) method. The interfacial characteristics of composites both without and with Ti coatings were evaluated using SEM, XRD, and EMPA. The results show that the LSS technology can fabricate diamond/Al composites without Al4C3, hence guaranteeing excellent mechanical and thermophysical properties. The higher TC of the diamond/Al composite with a Ti coating was attributed to the favorable metallurgical bonding interface compounds. Due to the non-wettability between diamond and Al, the TC of uncoated diamond particle-reinforced composites was only 149 W/m·K. The TC of Ti-coated composites increased by 85.9% to 277 W/m·K. A simultaneous comparison and analysis were performed on the features of composites reinforced by Ti and Cr coatings. The results suggest that the application of the Ti coating increases the bending strength of the composite, while the Cr coating enhances the TC of the composite. We calculate the theoretical TC of the diamond/Al composite by using the differential effective medium (DEM) and Maxwell prediction model and analyze the effect of Ti coating on the TC of the composite.

Application-Driven High-Thermal-Conductivity Polymer Nanocomposites

Polymer nanocomposites combine the merits of polymer matrices and the unusual effects of nanoscale reinforcements and have been recognized as important members of the material family. Being a fundamental material property, thermal conductivity directly affects the molding and processing of materials as well as the design and performance of devices and systems. Polymer nanocomposites have been used in numerous industrial fields; thus, high demands are placed on the thermal conductivity feature of polymer nanocomposites. In this Perspective, we first provide roadmaps for the development of polymer nanocomposites with isotropic, in-plane, and through-plane high thermal conductivities, demonstrating the great effect of nanoscale reinforcements on thermal conductivity enhancement of polymer nanocomposites. Then the significance of the thermal conductivity of polymer nanocomposites in different application fields, including wearable electronics, thermal interface materials, battery thermal management, dielectric capacitors, electrical equipment, solar thermal energy storage, biomedical applications, carbon dioxide capture, and radiative cooling, are highlighted. In future research, we should continue to focus on methods that can further improve the thermal conductivity of polymer nanocomposites. On the other hand, we should pay more attention to the synergistic improvement of the thermal conductivity and other properties of polymer nanocomposites. Emerging polymer nanocomposites with high thermal conductivity should be based on application-oriented research.

Evaluating the Role of Functional Groups in the Selective Capture of Ag(I) onto UiO-66-Type Metal-Organic Frameworks

UiO-66-type metal-organic frameworks have been considered as promising adsorbents for capturing Ag(I) from wastewater. However, uncertainties persist regarding the specific absorptivity of individual functional groups to the UiO-66 framework structure. In this study, UiO-66-type metal-organic frameworks (UiO-66-X), featuring diverse functional groups (X = -(OH)2, -(COOH)2, -NO2, -NH2, -SO3H, -(SH)2), were synthesized in situ for Ag(I) capture. The findings revealed that functionalization significantly enhanced the adsorption capacity of Ag(I). Notably, quantitative analysis showed that 1 mol of -SH functional group onto the UiO-66 framework structure can adsorb 0.73 mol of Ag(I) ions, surpassing those of -COOH, -OH, -NH2, -SO3H, and -NO2 by 2.4-, 3.5-, 3.8-, 9.1-, and 24.3-fold, respectively. This represents the first assessment of the adsorption capacity of functionalized UiO-66 for Ag(I) based on each effective functional group, addressing limitations in traditional unit mass calculations. Further, the adsorption mechanism of UiO-66-X for selectively capturing Ag(I) was elucidated through experimental and theoretical analyses. Additionally, selectivity and practical applications confirm that UiO-66-(SH)2 exhibits strong anti-interference ability, whether in natural water bodies with complex compositions or in industrial wastewater under harsh conditions. We anticipate that this study will enhance our understanding of structure-performance dependencies of multivariate MOFs for designing novel adsorbents for Ag(I) capture.

Dry-Contact Thermal Interface Material with the Desired Bond Line Thickness and Ultralow Applied Thermal Resistance

Efforts to directly utilize thixotropic polymer composites for out-of-plane thermal transport applications, known as thermal interface materials (TIMs), have been impeded by their mediocre applied thermal resistance (Reff) in a sandwiched structure. Different from traditional attempts at enhancing thermal conductivity, this study proposes a low-bond line thickness (BLT) path for mitigating the sandwiched thermal impedance. Taking the most common TIM, polydimethylsiloxane/aluminum oxide/zinc oxide (PDMS/Al2O3/ZnO), as an example, liquid metal is designed to on-demand localize at the Al2O3-polymer and Al2O3-filler interface regions, breaking rheological challenges for lowering the BLT. Specifically, during the sandwiched compression process, interfacial LM is just like the lubricant, dexterously promoting the relaxation of immobilized PDMS chains and helping fillers to flow through mitigating the internal friction between Al2O3 and adjacent filler. As a result, this TIM first time exhibits a boundary BLT (4.28 μm) that almost approaches the diameter of the maximum filler and performs an ultralow dry-contact Reff of 4.05 mm2 K/W at 40 psi, outperforming most reported and commercial dry-contact TIMs. This study of the low-BLT direction is believed to point to a new path for future research on high-performance TIMs.

High-Performance Graphene Biocomposite Enabled by Fe3+ Coordination for Thermal Management

Emerging biocomposites with excellent heat dissipation capabilities and inherent sustainability are urgently needed to address the cooling issues of modern electronics and growing environmental concerns. However, the moisture stability, mechanical performance, thermal conductivity, and even flame retardancy of biomass-based materials are generally insufficient for practical thermal management applications. Herein, we present a high-performance graphene biocomposite consisting of carboxylated cellulose nanofibers and graphene nanosheets through an evaporation-induced self-assembly and subsequent Fe3+ cross-linking strategy. The Fe3+ coordination plays a critical role in stabilizing the material structure, thereby improving the mechanical strength and water stability of the biocomposite films, and its effect is revealed by density functional theory calculations. The hierarchical structure of the biocomposite films also leads to a high in-plane thermal conductivity of 42.5 W m-1 K-1, enabling a superior heat transfer performance. Furthermore, the resultant biocomposite films exhibit outstanding Joule heating performance with a fast thermal response and long-term stability, improved thermal stability, and flame retardancy. Therefore, such a general strategy and the desired overall properties of the biocomposite films offer wide application prospects for functional and safe thermal management.

Giant thermal rectification efficiency by geometrically enhanced asymmetric non-linear radiation

Thermal rectification is an asymmetric heat transport phenomenon where thermal conductance changes depending on the temperature gradient direction. The experimentally reported efficiency of thermal rectification materials and devices, which are applicable for a wide range of temperatures, is relatively low. Here we report a giant thermal rectification efficiency of 218% by maximizing asymmetry in parameters of the Stefan-Boltzmann law for highly non-linear thermal radiation. The asymmetry in emissivity is realized by sputter-depositing manganese (ε = ∼0.38) on the top right half surface of a polyurethane specimen (ε = ∼0.98). The surface area of the polyurethane side is also dramatically increased (1302%) by 3D printing to realize asymmetry in geometry. There is an excellent agreement between the experimentally measured temperature profiles and finite element simulation results, demonstrating the reliability of the analysis. Machine learning analysis reveals that the surface area is a dominant factor for thermal rectification and suggests novel light-weight designs with high efficiencies. This work may find applications in energy efficient thermal rectification management of electronic devices and housings.

Ladder-like Poly(methacryloxypropyl) silsesquioxane-Al2O3-polybutadiene Flexible Nanocomposites with High Thermal Conductivity

Ladder-like poly(methacryloxypropyl)-silsesquioxanes (LPMASQ) are photocurable Si-based gels characterized by a double-stranded structure that ensures superior thermal stability and mechanical properties than common organic polymers. In this work, these attractive features were exploited to produce, in combination with alumina nanoparticles (NPs), both unmodified and functionalized with methacryloxypropyl-trimethoxysilane (MPTMS), LPMASQ/Al2O3 composites displaying remarkable thermal conductivity. Additionally, we combined LPMASQ with polybutadiene (PB) to produce hybrid nanocomposites with the addition of functionalized Al2O3 NPs. The materials underwent thermal stability, structural, and morphological evaluations via thermogravimetric analysis (TGA), scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDXS), Fourier transform infrared spectroscopy (FTIR), and solid-state nuclear magnetic resonance (NMR). Both blending PB with LPMASQ and surface functionalization of nanoparticles proved to be effective strategies for incorporating a higher ceramic filler amount in the matrices, resulting in significant increases in thermal conductivity. Specifically, a 113.6% increase in comparison to the bare matrix was achieved at relatively low filler content (11.2 vol%) in the presence of 40 wt% LPMASQ. Results highlight the potential of ladder-like silsesquioxanes in the field of thermally conductive polymers and their applications in heat dissipation for flexible electronic devices.

Nanopolyhybrids: Materials, Engineering Designs, and Advances in Thermal Management

The fundamental requirements for thermal comfort along with the unbalanced growth in the energy demand and consumption worldwide have triggered the development and innovation of advanced materials for high thermal-management capabilities. However, continuous development remains a significant challenge in designing thermally robust materials for the efficient thermal management of industrial devices and manufacturing technologies. The notable achievements thus far in nanopolyhybrid design technologies include multiresponsive energy harvesting/conversion (e.g., light, magnetic, and electric), thermoregulation (including microclimate), energy saving in construction, as well as the miniaturization, integration, and intelligentization of electronic systems. These are achieved by integrating nanomaterials and polymers with desired engineering strategies. Herein, fundamental design approaches that consider diverse nanomaterials and the properties of nanopolyhybrids are introduced, and the emerging applications of hybrid composites such as personal and electronic thermal management and advanced medical applications are highlighted. Finally, current challenges and outlook for future trends and prospects are summarized to develop nanopolyhybrid materials.

Solid-state thermal rectification of bilayers by asymmetric elastic modulus

A highly efficient thermal rectification applicable to large panels still needs to be developed. Here, we experimentally achieve a high thermal rectification efficiency of 33% by carefully engineering elastic modulus asymmetry in a centimeter-scale bilayered silver-graphene oxide sponge. The thermal conduction primarily occurs in the out-of-plane direction, and the forward heat flow direction is from the hard silver to the soft graphene oxide. Surprisingly, the forward heat flow direction is reversed when a silver layer is formed on a harder polystyrene foam. The forward direction is always from the harder side to the softer side, and the asymmetry in elastic modulus is suggested as a possible mechanism based on the one-dimensional Frenkel-Kontorova (FK) model. The finite element analysis indicates that other mechanisms such as temperature-dependent thermal conductivity and radiation asymmetry cannot explain the high rectification efficiency. This scalable work over a wide temperature range may find immediate industrial applications.

Recent Advances in Limiting Fatigue Damage Accumulation Induced by Self-Heating in Polymer-Matrix Composites

The self-heating effect can be considered as a catastrophic phenomenon that occurs in polymers and polymer-matrix composites (PMCs) subjected to fatigue loading or vibrations. This phenomenon appears in the form of temperature growth in such structures due to their relatively low thermal conductivities. The appearance of thermal stress resulting from temperature growth and the coefficient of thermal expansion (CTE) mismatch between fibers and neighboring polymer matrix initiates and/or accelerates structural degradation and consequently provokes sudden fatigue failure in the structures. Therefore, it is of primary significance for a number of practical applications to first characterize the degradation mechanism at the nano-, micro- and macroscales caused by the self-heating phenomenon and then minimize it through the implementation of numerous approaches. One viable solution is to cool the surfaces of considered structures using various cooling scenarios, such as environmental and operational factors, linked with convection, contributing to enhancing heat removal through convection. Furthermore, if materials are appropriately selected regarding their thermomechanical properties involving thermal conductivity, structural degradation may be prevented or at least minimized. This article presents a benchmarking survey of the conducted research studies associated with the fatigue performance of cyclically loaded PMC structures and an analysis of possible solutions to avoid structural degradation caused by the self-heating effect.

Highly aligned welding of ultrathin graphene layer to robust carbon nanotube film for significantly enhanced thermal conductivity

Carbon nanotube (CNT) films have demonstrated great potential for highly efficient thermal management materials. However, how to enable a combined feature of excellent thermal conductivity and structural robustness, which is crucial for the high-performance realization, still remains challenging. Herein, an effective and facile strategy to solve the problem was proposed by developing a graphene (G)/CNT film with highly aligned welding of ultrathin G layer to robust CNT film. The unique architectural features of the obtained composite film enabled a high tensile strength (116 MPa) and electric conductivity (1.7 × 10³S cm^-1). Importantly, the thermal conductivity was significantly improved compared to neat CNT film, and reached as high as 174 W m^-1K^-1. In addition, the G/CNT film featured a superior electromagnetic shielding performance. This work provides useful guidelines for designing and fabricating the composite CNT film with prominent thermal conductivity, as well as excellent mechanical and electrical properties.

High-Temperature Skin Softening Materials Overcoming the Trade-Off between Thermal Conductivity and Thermal Contact Resistance

The trade-off between thermal conductivity (κ) and thermal contact resistance (R_c ) is regarded as a hurdle to develop superior interface materials for thermal management. Here a high-temperature skin softening material to overcome the trade-off relationship, realizing a record-high total thermal conductance (254.92 mW mm^-2 K^-1 ) for isotropic pad-type interface materials is introduced. A highly conductive hard core is constructed by incorporating Ag flakes and silver nanoparticle-decorated multiwalled carbon nanotubes in thermosetting epoxy (EP). The thin soft skin is composed of filler-embedded thermoplastic poly(ethylene-co-vinyl acetate) (PEVA). The κ (82.8 W m^-1 K^-1 ) of the PEVA-EP-PEVA interface material is only slightly compromised, compared with that (106.5 W m^-1 K^-1 ) of the EP core (386 µm). However, the elastic modulus (E = 2.10 GPa) at the skin is significantly smaller than the EP (26.28 GPa), enhancing conformality and decreasing R_c from 108.41 to 78.73 mm² K W^-1 . The thermoplastic skin is further softened at an elevated temperature (100 °C), dramatically decreasing E (0.19 GPa) and R_c (0.17 mm² K W^-1 ) with little change in κ, overcoming the trade-off relationship and enhancing the total thermal conductance by 2030%. The successful heat dissipation and applicability to the continuous manufacturing process demonstrate excellent feasibility as future thermal management materials.

Photothermal-assisted triphase photocatalysis over a multifunctional bilayer paper

Photocatalysis as one of the future environment technologies has been investigated for decades. Despite great efforts in catalyst engineering, the widely used powder dispersion and photoelectrode systems are still restricted by sluggish interfacial mass transfer and chemical processes. Here we develop a scalable bilayer paper from commercialized TiO 2 and carbon nanomaterials, self-supported at gas-liquid-solid interfaces for photothermal-assisted triphase photocatalysis. The photogeneration of reactive oxygen species can be facilitated through fast oxygen diffusion over triphase interfaces, while the interfacial photothermal effect promotes the following free radical reaction for advanced oxidation of phenol. Under full spectrum irradiation, the triphase system shows 13 times higher reaction rate than diphase controlled system, achieving 88.4% mineralization of high concentration phenol within 90 min full spectrum irradiation. The bilayer paper also exhibits high stability over 40 times cycling experiments and sunlight driven feasibility, showing potentials for large scale photocatalytic applications by being further integrated into a triphase flow reactor.

Silver-Nanoparticle-Embedded Hybrid Nanopaper with Significant Thermal Conductivity Enhancement

Nanopapers derived from nanofibrillated cellulose (NFC) are urgently required as attractive substrates for thermal management applications of electronic devices because of their lightweight, easy cutting, cost efficiency, and sustainability. In this paper, we provided a facile fabrication strategy to construct hybrid nanopapers composed of dialdehyde nanofibrillated cellulose (DANFC) and silver nanoparticles (AgNPs), which exhibited a favorable thermal conductivity property. AgNPs were in situ proceeded on the surface of DANFC by the silver mirror reaction inspired by the aldehyde groups. Owing to the intermolecular hydrogen bonds inside the hybrid nanopapers, the DANFC enables the uniform dispersion of AgNPs as well as promotes the formation of the hierarchical structure. It was found that the AgNPs-coated DANFC (DANFC/Ag) hybrid nanopapers could easily form an effective thermally conductive pathway for phonon transfer. As a result, the thermal conductivity (TC) of the obtained DANFC/Ag hybrid nanopapers containing only 1.9 vol % of Ag was 5.35 times higher than that of the pure NFC nanopapers along with a significantly TC enhancement per vol % Ag of 230.0%, which was supposed to benefit from the continuous heat transfer pathway constructed by the connection of AgNPs decorated on the cellulose nanofibers. The DANFC/Ag hybrid nanopapers possess potential applications as thermal management materials in the next-generation portable electronic devices.

Epoxy composite with high thermal conductivity by constructing 3D-oriented carbon fiber and BN network structure

As electronic devices tend to be integrated and high-powered, thermal conductivity is regarded as the crucial parameter of electronic components, which has become the main factor that limits the operating speed and service lifetime of electronic devices. However, constructing continuous thermal conductive paths for low content particle fillers and reducing interface thermal resistance between fillers and matrix are still two challenging issues for the preparation of thermally conductive composites. In this study, 3D-oriented carbon fiber (CF) thermal network structures filled with boron nitride flakes (BN) as thermal conductive bridges were successfully constructed. The epoxy composite was fabricated by thermal conductive material with a 3D oriented structure by the vacuum liquid impregnation method. This special 3D-oriented structure modified by BN (BN/CF) could efficiently broaden the heat conduction pathway and connected adjacent fibers, which leads to the reduction of thermal resistance. The thermal conductivity of the boron nitride/carbon fiber/epoxy resin composite (BN/CF/EP) with 5 vol% 10 mm CF and 40 vol% BN reaches up to 3.1 W m⁻¹ K⁻¹, and its conductivity is only 2.5 × 10⁻⁴ S cm⁻¹. This facile and high-efficient method could provide some useful advice for the thermal management material in the microelectronic field and aerospace industry.

As electronic devices tend to be integrated and high-powered, thermal conductivity is regarded as the crucial parameter of electronic components, which is the main factor that limits the operating speed and service lifetime of electronic devices.

Tunable solid-state thermal rectification by asymmetric nonlinear radiation

Thermal rectification is a direction-dependent asymmetric heat transport phenomenon. Here we report the tunable solid-state thermal rectification by asymmetric nonlinear far-field radiation. The asymmetry in thermal conductivity and emissivity of a three-terminal device is realized by sputtering a thin metal film (radiation barrier: niobium, copper, or silver) on the top right half of a polyethylene terephthalate strip (emitter). Both the experiment and finite element analysis are in excellent agreement, revealing a thermal rectification ratio (TR) of 13.0% for the niobium-deposited specimen. The simulation demonstrates that the TR can be further increased to 74.5% by tuning asymmetry in thermal conductivity, emissivity, and surface area. The rectification can also be actively controlled, by gating the environmental temperature, resulting in a maximum TR of 93.1%. This work is applicable for a wide range of temperatures and device sizes, which may find applications in on-demand heat control and thermal logic gates.

Tailoring the Thermal Conductivity of Rubber Nanocomposites by Inorganic Systems: Opportunities and Challenges for Their Application in Tires Formulation

The development of effective thermally conductive rubber nanocomposites for heat management represents a tricky point for several modern technologies, ranging from electronic devices to the tire industry. Since rubber materials generally exhibit poor thermal transfer, the addition of high loadings of different carbon-based or inorganic thermally conductive fillers is mandatory to achieve satisfactory heat dissipation performance. However, this dramatically alters the mechanical behavior of the final materials, representing a real limitation to their application. Moreover, upon fillers’ incorporation into the polymer matrix, interfacial thermal resistance arises due to differences between the phonon spectra and scattering at the hybrid interface between the phases. Thus, a suitable filler functionalization is required to avoid discontinuities in the thermal transfer. In this challenging scenario, the present review aims at summarizing the most recent efforts to improve the thermal conductivity of rubber nanocomposites by exploiting, in particular, inorganic and hybrid filler systems, focusing on those that may guarantee a viable transfer of lab-scale formulations to technological applicable solutions. The intrinsic relationship among the filler’s loading, structure, morphology, and interfacial features and the heat transfer in the rubber matrix will be explored in depth, with the ambition of providing some methodological tools for a more profitable design of thermally conductive rubber nanocomposites, especially those for the formulation of tires.

Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design

Thermal interface materials (TIMs), typically composed of a polymer matrix with good wetting properties and thermally conductive fillers, are applied to the interfaces of mating components to reduce the interfacial thermal resistance. As a filler material, silver has been extensively studied because of its high intrinsic thermal conductivity. However, the high cost of silver and its toxicity has hindered the wide application of silver-based TIMs. Copper is an earth-abundant element and essential micronutrient for humans. In this paper, we present a copper-based multi-dimensional filler composed of three-dimensional microscale copper flakes, one-dimensional multi-walled carbon nanotubes (MWCNTs), and zero-dimensional copper nanoparticles (Cu NPs) to create a safe and low-cost TIM with a high thermal conductivity. Cu NPs synthesized by microwave irradiation of a precursor solution were bound to MWCNTs and mixed with copper flakes and polyimide matrix to obtain a TIM paste, which was stable even in a high-temperature environment. The cross-plane thermal conductivity of the copper-based TIM was 36 W/m/K. Owing to its high thermal conductivity and low cost, the copper-based TIM could be an industrially useful heat-dissipating material in the future.

Highly Thermally Conductive and Superior Electrical Insulation Polymer Composites via In Situ Thermal Expansion of Expanded Graphite and In Situ Oxidation of Aluminum Nanoflakes

Polymer composites with highly thermally conductive and electrical insulation are urgently demanded for thermal management in modern electrical and energy applications. However, the incorporation of metal fillers in traditional polymeric composites usually fails to meet the requirements for simultaneously high thermal conductivity and high electrical insulation. Here, we successfully fabricated composites with high thermal conductivity and high electrical insulation by in situ thermal expansion of expandable graphite (EG) and in situ oxidation of aluminum (Al) nanoflakes in aluminum-plastic package waste (APPW). Due to the synergistic effect of the hybrid filler framework, the maximum thermal conductivity reached as high as 8.7 W m^-1 K^-1 for APPW/EG₁₀/Al₆₀-F composites. In addition, the formation of the nano Al₂O₃ layer around the Al filler surface brings extremely low electrical conductivity (<10^-14 S cm^-1) and low dielectric loss (<0.06). Based on the results of finite element simulation, the heat flowed mainly along the effective filler framework and the high thermal conductivity is attributed to the interconnection of the high aspect ratio filler. Furthermore, the strong thermal management capability of the prepared composites was demonstrated in the heat dissipation experiment. The present work suggests that surface-oxidized Al nanoflakes demonstrate fascinating performance and show promising application as thermal management materials in emerging electrical systems and electronic devices.

Intertube Aggregation-Dependent Convective Heat Transfer in Vertically Aligned Carbon Nanotube Channels

The heat transfer of carbon nanotube fin geometry has received considerable attention. However, the flow typically occurred over or around the pillars of nanotubes due to the greater flow resistance between the tubes. Here, we investigated the forced convective heat transfer of water through the interstitial space of vertically aligned multiwalled carbon nanotubes (VAMWNTs, intertube distance = 69 nm). The water flow provided significantly a greater Reynolds number (Re) and Nusselt number (Nu) than air flow due to the greater density, heat capacity, and thermal conductivity. However, it resulted in surface tension-induced nanotube aggregation after the flow and drying process, generating random voids in the nanotube channel. This increased permeability (1.27 × 10^-11 m²) and Re (2.83 × 10^-1) but decreased the heat transfer coefficient (h, 9900 W m^-2 K^-1) and Nu (53.77), demonstrating a trade-off relationship. The h (25,927 W m^-2 K^-1) and Nu (153.49) could be further increased, at an equivalent permeability or Re, by increasing nanotube areal density from 2.08 × 10¹⁰ to 1.04 × 10¹¹ cm^-2. The area-normalized thermal resistance of the densified and aggregated VAMWNTs was smaller than those of the Ni foam, Si microchannel, and carbon nanotube fin array, demonstrating excellent heat transfer characteristics.

Carbon Nanotube Reinforced Strong Carbon Matrix Composites

As an excellent candidate for lightweight structural materials and nonmetal electrical conductors, carbon nanotube reinforced carbon matrix (CNT/C) composites have potential use in technologies employed in aerospace, military, and defense endeavors, where the combinations of light weight, high strength, and excellent conductivity are required. Both polymer infiltration pyrolysis (PIP) and chemical vapor infiltration (CVI) methods have been widely studied for CNT/C composite fabrications with diverse focuses and various modifications. Progress has been reported to optimize the performance of CNT/C composites from broad aspects, including matrix densification, CNT alignment, microstructure control, and interface engineering, etc. Recent approaches, such as using resistance heating for PIP or CVI, contribute to the development of CNT/C composites. To deliver a timely and up-to-date overview of CNT/C composites, we have reviewed the most recent trends in fabrication processes, summarized the mechanical reinforcement mechanism, and discussed the electrical and thermal properties, as well as relevant case studies for high-temperature applications. Conclusions and perspectives addressing future routes for performance optimization are also presented. Hence, this review serves as a rundown of recent advances in CNT/C composites and will be a valuable resource to aid future developments in this field.

Ice-Templated MXene/Ag-Epoxy Nanocomposites as High-Performance Thermal Management Materials

High-performance thermal management materials are essential in miniaturized, highly integrated, and high-power modern electronics for heat dissipation. In this context, the large interface thermal resistance (ITR) that occurs between fillers and the organic matrix in polymer-based nanocomposites greatly limits their thermal conductive performance. Herein, through-plane direction aligned three-dimensional (3D) MXene/silver (Ag) aerogels are designed as heat transferring skeletons for epoxy nanocomposites. Ag nanoparticles (NPs) were in situ decorated on exfoliated MXene nanosheets to ensure good contact, and subsequent welding of ice-templated MXene/Ag nanofillers at low temperature of ∼200 °C reduced contact resistance between individual MXene sheets. Monte Carlo simulations suggest that thermal interficial resistance (R₀) of the MXene/Ag-epoxy nanocomposite was 4.5 × 10^-7 m² W^-1 K^-1, which was less than that of the MXene-epoxy nanocomposite (R_c = 5.2 × 10^-7 m² W^-1 K^-1). Furthermore, a large-scale atomic/molecular massively parallel simulator was employed to calculate the interfacial resistance. It was found that R_MXene = 2.4 × 10^-9 m² K W^-1, and R_MXene-Ag = 2.0 ×10^-9 m² K W^-1, respectively, indicating that the Ag NP enhanced the interfacial heat transport. At a relatively low loading of 15.1 vol %, through-plane thermal conductivity reached a value as high as 2.65 W m^-1 K^-1, which is 1225 % higher than that of pure epoxy resin. Furthermore, MXene/Ag-epoxy nanocomposite film exhibits an impressive thermal conductive property when applied on a Millet 8 and Dell computer for heat dissipation.

Electron tunneling of hierarchically structured silver nanosatellite particles for highly conductive healable nanocomposites

Healable conductive materials have received considerable attention. However, their practical applications are impeded by low electrical conductivity and irreversible degradation after breaking/healing cycles. Here we report a highly conductive completely reversible electron tunneling-assisted percolation network of silver nanosatellite particles for putty-like moldable and healable nanocomposites. The densely and uniformly distributed silver nanosatellite particles with a bimodal size distribution are generated by the radical and reactive oxygen species-mediated vigorous etching and reduction reaction of silver flakes using tetrahydrofuran peroxide in a silicone rubber matrix. The close work function match between silicone and silver enables electron tunneling between nanosatellite particles, increasing electrical conductivity by ~5 orders of magnitude (1.02×10³ Scm⁻¹) without coalescence of fillers. This results in ~100% electrical healing efficiency after 1000 breaking/healing cycles and stability under water immersion and 6-month exposure to ambient air. The highly conductive moldable nanocomposite may find applications in improvising and healing electrical parts.

Self-healable conductive materials are of importance for emerging electronic technologies. Here, Suh et al. report a nanocomposite exhibiting high conductivity facilitated by electron tunneling between silver nanoparticles and its 100% recovery of conductivity after 1000 breaking and healing cycles.

Self-Assembled Boron Nitride Nanotube Reinforced Graphene Oxide Aerogels for Dielectric Nanocomposites with High Thermal Management Capability

Thermally conductive polymeric composites are highly promising in current energy devices such as light-emitting diodes, integrated circuits, and solar cells to achieve appropriate thermal management. However, the introduction of traditional thermoconductive fillers into a polymer usually results in low thermal conductivity enhancement. Here, an ideal dielectric epoxy nanocomposite with ultrahigh thermal conductivity is successfully fabricated using three-dimensional interconnected boron nitride nanotube reinforced graphene oxide nanosheet (3D-BNNT-GONS) aerogels as fillers. The nanocomposite exhibits a nearly 20-fold increase in thermal conductivity with only 11.6 vol % loading fraction. Meanwhile, the nanocomposite possesses excellent insulation performance, including low dielectric constant, low dielectric loss, and high breakdown strength. A heating and cooling process reveals that the nanocomposite has a fast response of surface temperature, indicating high thermal management capability.

Antibacterial, Flexible, and Conductive Membrane Based on MWCNTs/Ag Coated Electro-Spun PLA Nanofibrous Scaffolds as Wearable Fabric for Body Motion Sensing

In the present study, flexible and conductive nanofiber membranes were prepared by coating PLA nanofibrous scaffolds with carbon nanotubes and silver nanoparticles. The morphology and structure of the prepared membrane was characterized, as well as its mechanical properties, electrical sensing behavior during consecutive stretching-releasing cycles and human motion detecting performance. Furthermore, the antibacterial properties of the membrane was also investigated. Due to the synergistic and interconnected three-dimensional (3D) conductive networks, formed by carbon nanotubes and silver nanoparticles, the membrane exhibited repeatable and durable strain-dependent sensitivity. Further, the prepared membrane could accurately detect the motions of different body parts. Accompanied with promising antibacterial properties and washing fastness, the prepared flexible and conductive membrane provides great application potential as a wearable fabric for real-time body motion sensing.

Enhanced thermal conductivity of nanocomposites with MOF-derived encapsulated magnetic oriented carbon nanotube-grafted graphene polyhedra

It remains a challenge to develop highly polymer-based nanocomposite thermal interface materials, which can effectively remove heat developed during the miniaturization of electronic instruments. It has been reported that a large number of graphene-based nanocomposites exhibit excellent performance. However, it is still an issue to construct thermal conductive pathways by orientation arrangements with a low filler volume fraction. Herein, a high-thermal conductivity filler of magnetic carbon nanotube-grafted graphene polyhedra (Co@Co₃O₄-G) was exploited via the annealing of metal–organic frameworks (ZIF-67). Co@Co₃O₄-G can improve the thermal conductivity of nanocomposites obviously by forming oriented pathways for phonon transport in an external magnetic field. Therefore, the resulting nanocomposite displayed a high thermal conductivity of 2.11 W m⁻¹ K⁻¹ for only 8.7 vol%, which is 10 times higher than that of the pure epoxy resin. Core-shell magnetic cobalt oxide (Co@Co₃O₄) was encapsulated in situ in the nanoarchitecture to avoid falling off. Moreover, the equilibrium molecular dynamics (EMD) simulation verifies that Co@Co₃O₄-G had high thermal conductivity to effectively improve the heat dissipation of nanocomposites. This strategy provides an approach for developing high-performance thermal management materials and opens up the possibility for the pioneering applications of encapsulated magnetic-oriented thermal conductive fillers.

A high-thermal conductivity filler of magnetic carbon nanotube-grafted graphene polyhedra is exploited via annealing of a metal–organic framework (ZIF-67).