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For: Murakami K, Tochinai R, Tachibana D, Isano Y, Matsuda R, Nakamura F, Kurotaki Y, Isoda Y, Yamane M, Sugita Y, Fukuda J, Ueno K, Miki N, Fuchiwaki O, Ota H. Direct Wiring of Liquid Metal on an Ultrasoft Substrate Using a Polyvinyl Alcohol Lift-off Method. ACS Appl Mater Interfaces 2022;14:7241-7251. [PMID: 35084813 DOI: 10.1021/acsami.1c20628] [Citation(s) in RCA: 7] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/14/2023]
Number Cited by Other Article(s)
1
Xia M, Meng X, Lin L, Gao A, Diao Y, Liu X, Yang H. pH-Regulated catechol-modified sodium alginate hydrogel with anti-freezing and high toughness for wearable strain sensor. Int J Biol Macromol 2025;302:140140. [PMID: 39842571 DOI: 10.1016/j.ijbiomac.2025.140140] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 09/23/2024] [Revised: 01/10/2025] [Accepted: 01/20/2025] [Indexed: 01/24/2025]
2
Zhu G, Javanmardia N, Qian L, Jin F, Li T, Zhang S, He Y, Wang Y, Xu X, Wang T, Feng ZQ. Advances of conductive hydrogel designed for flexible electronics: A review. Int J Biol Macromol 2024;281:136115. [PMID: 39349076 DOI: 10.1016/j.ijbiomac.2024.136115] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/13/2024] [Revised: 07/31/2024] [Accepted: 09/26/2024] [Indexed: 10/02/2024]
3
Wu R, Zhang H, Ma H, Zhao B, Li W, Chen Y, Liu J, Liang J, Qin Q, Qi W, Chen L, Li J, Li B, Duan X. Synthesis, Modulation, and Application of Two-Dimensional TMD Heterostructures. Chem Rev 2024;124:10112-10191. [PMID: 39189449 DOI: 10.1021/acs.chemrev.4c00174] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 08/28/2024]
4
Lu G, Ni E, Jiang Y, Wu W, Li H. Room-Temperature Liquid Metals for Flexible Electronic Devices. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2024;20:e2304147. [PMID: 37875665 DOI: 10.1002/smll.202304147] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/17/2023] [Revised: 07/26/2023] [Indexed: 10/26/2023]
5
Liu S, Xu Z, Li G, Li Z, Ye Z, Xu Z, Chen W, Jin D, Ma X. Ultrasonic-Enabled Nondestructive and Substrate-Independent Liquid Metal Ink Sintering. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2023;10:e2301292. [PMID: 37316967 PMCID: PMC10427386 DOI: 10.1002/advs.202301292] [Citation(s) in RCA: 7] [Impact Index Per Article: 3.5] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/25/2023] [Revised: 05/19/2023] [Indexed: 06/16/2023]
6
Du P, Wang J, Hsu YI, Uyama H. Bio-Inspired Homogeneous Conductive Hydrogel with Flexibility and Adhesiveness for Information Transmission and Sign Language Recognition. ACS APPLIED MATERIALS & INTERFACES 2023;15:23711-23724. [PMID: 37145870 DOI: 10.1021/acsami.3c02105] [Citation(s) in RCA: 7] [Impact Index Per Article: 3.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/06/2023]
7
Murakami K, Isano Y, Asada J, Usami N, Isoda Y, Takano T, Matsuda R, Ueno K, Fuchiwaki O, Ota H. Self-assembling bilayer wiring with highly conductive liquid metal and insulative ion gel layers. Sci Rep 2023;13:5929. [PMID: 37045927 PMCID: PMC10097700 DOI: 10.1038/s41598-023-32580-x] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/14/2023] [Accepted: 03/29/2023] [Indexed: 04/14/2023]  Open
8
Kim M, Lim H, Ko SH. Liquid Metal Patterning and Unique Properties for Next-Generation Soft Electronics. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2023;10:e2205795. [PMID: 36642850 PMCID: PMC9951389 DOI: 10.1002/advs.202205795] [Citation(s) in RCA: 20] [Impact Index Per Article: 10.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/06/2022] [Revised: 11/27/2022] [Indexed: 05/28/2023]
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