Reversible polymer-gel transition for ultra-stretchable chip-integrated circuits through self-soldering and self-coating and self-healing

Self-packaged stretchable printed circuits with ligand-bound liquid metal particles in elastomer

Packaging in stretchable electronics is crucial to protect components from environmental damage while preserving mechanical flexibility and providing electrical insulation. The conventional packaging process involves multiple steps that increase in complexity as the number of circuit layers multiply. In this study, we introduce a self-packaged stretchable printed circuit board enabled by the in situ phase separation of liquid metal particles (LMPs) within various polymer matrices during solution-based printing processes. The ligand-bound LMPs (LB-LMPs), engineered to inhibit oxide growth, undergo in situ sintering, prompting vertical phase separation. This synthesis strategy not only achieves high initial conductivity of the LMPs but also encapsulates them within the polymer matrix, preventing leakage and providing electrical insulation. Our method enables multi-layer circuit printing, eliminating the need for additional activation and packaging processes. Furthermore, by integrating conductive materials into packaging layers for selective electrical conductivity, vertical interconnect accesses and conductive pads can be formed, enabling large-scale, stretchable, and leakage-free multi-layer electrical circuits and bio-interfaces.

Programmable and Spatial Stiffness Gradient Substrates for Highly Robust Artificial Skins

Stretchable artificial skins have garnered great interest for their potential applications in real-time human-machine interaction and equipment operation status monitoring. The local stiffer structure areas on the substrates for the functional elements have been verified to improve the robustness of the artificial skins, but it remains challenging to achieve robust sensing performance under mechanical deformation due to large mechanical mismatch and the intricate fabrication process. Herein, we propose an easy strategy for fabricating a substrate with spatial and programmable stiffness gradients to greatly decrease strain interference and increase the robustness under stretching and bending. The substrate was fabricated by direct writing PDMS with laser gelation, where the sensing elements lay on the place with higher stiffness. The modulus of the substrates varied up to 10-fold, and they also show excellent adhesive properties and durability. This configuration of the spatial stiffness gradient effectively inhibits the deformation strain effect of stretching and bending on the sensing elements. Prototype flexible sensors and light-emitting diodes can be integrated into stretchable artificial skins to exhibit highly robust performance during dynamic deformations, demonstrating an efficient pathway for fabricating robust stretchable electronics, especially for real-time health surveillance.

High Through-Thickness Thermal Conductivity in an Edge-On Two-Dimensional Polyamide Thin Film

High thermal conductivity is essential for polymer applications such as electronic chip encapsulation, where efficient heat dissipation ensures system functionality and reliability. Here, we introduce a novel strategy to enhance through-plane thermal conductivity in 2D covalent organic frameworks (COFs). A highly crystalline edge-on 2D polyamide (v2DPA) film achieves a thermal conductivity of 1.16 ± 0.05 W/(mK) at 310 K, surpassing the previous record (1.03 W/(mK) in COF-5 [Evans et al. Nat. Mater. 2021, 20, 1142]) and aligning with molecular dynamics predictions (1.11 ± 0.07 W/(mK)). This value is nearly three times higher than that of bulk PA (0.34 ± 0.03 W/(mK)). Phonon dispersion calculations attribute this enhancement to strong covalent bonding, increasing phonon lifetimes, and group velocities. Our findings highlight the effectiveness of orienting 2D polymer and layer-stacked 2D COF films in an edge-on configuration to improve through-thickness thermal conductivity, offering a promising pathway for their integration into electronic thermal management applications.

Meter-scale heterostructure printing for high-toughness fiber electrodes in intelligent digital apparel

Intelligent digital apparel, which integrates electronic functionalities into clothing, represents the future of healthcare and ubiquitous control in wearable devices. Realizing such apparel necessitates developing meter-scale conductive fibers with high toughness, conductivity, stable conductance under deformation, and mechanical durability. In this study, we present a heterostructure printing method capable of producing meter-scale (~50 m) biphasic conductive fibers that meet these criteria. Our approach involves encapsulating deformable liquid metal particles (LMPs) within a functionalized thermoplastic polyurethane matrix. This encapsulation induces in situ assembly of LMPs during fiber formation, creating a heterostructure that seamlessly integrates the matrix's durability with the LMPs' superior electrical performance. Unlike rigid conductive materials, deformable LMPs offer stretchability and toughness with a low gauge factor. Through precise twisting using an engineered annealing machine, multiple fiber strands are transformed into robust, electrically stable meter-scale electrodes. This advancement enhances their practicality in various intelligent digital apparel applications, such as stretchable displays, wearable healthcare systems, and digital controls.

Photo-crosslinkable organic materials for flexible and stretchable electronics

As technology advances to enhance human perceptual experiences of the surrounding environment, significant research on stretchable electronics is actively progressing, spanning from the synthesis of materials to their applications in fully integrated devices. A critical challenge lies in developing materials that can maintain their electrical properties under substantial stretching. Photo-crosslinkable organic materials have emerged as a promising solution due to their ability to be precisely modified with light to achieve desired properties, such as enhanced durability, stable conductivity, and micropatterning. This review examines recent research on photo-crosslinkable organic materials, focusing on their components and integration within stretchable electronic devices. We explore the essential characteristics required for each device component (insulators, semiconductors, and conductors) and explain how photo-crosslinking technology addresses these needs through its principles and implementation. Additionally, we discuss the integration and utilization of these components in real-world applications, including physical sensors, organic field-effect transistors (OFETs), and organic solar cells (OSCs). Finally, we offer a concise perspective on the future directions and potential challenges in ongoing research on photo-crosslinkable organic materials.

Autonomous Bioelectronic Devices Based on Silk Fibroin

The development of autonomous bioelectronic devices capable of dynamically adapting to changing biological environments represents a significant advancement in healthcare and wearable technologies. Such systems draw inspiration from the precision, adaptability, and self-regulation of biological processes, requiring materials with intrinsic versatility and seamless bio-integration to ensure biocompatibility and functionality over time. Silk fibroin (SF) derived from Bombyx mori cocoons, has emerged as an ideal biomaterial with a unique combination of biocompatibility, mechanical flexibility, and tunable biodegradability. Adding autonomous features into SF, including self-healing, shape-morphing, and controllable degradation, enables dynamic interactions with living tissues while minimizing immune responses and mechanical mismatches. Additionally, structural tunability and environmental sustainability of SF further reinforce its potential as a platform for adaptive implants, epidermal electronics, and intelligent textiles. This review explores recent progress in understanding the structure-property relationships of SF, its modification strategies, and its great potential for integration into advanced autonomous bioelectronic systems while addressing challenges related to scalability, reproducibility, and multifunctionality. Future opportunities, such as AI-assisted material design, scalable fabrication techniques, and the incorporation of wireless and personalized technologies, are also discussed, positioning SF as a key material in bridging the gap between biological systems and artificial technologies.

Stretchable and adhesive bilayers for electrical interfacing

Integrated stretchable devices, containing soft modules, rigid modules, and encapsulation modules, are of potential use in implantable bioelectronics and wearable devices. However, such systems often suffer from electrical deterioration due to debonding failure at the connection between rigid and soft modules induced by severe stress concentration, limiting their practical implementation. Here, we report a highly conductive and adhesive bilayer interface that can reliably connect soft-soft modules and soft-rigid modules together by simply pressing without conductive pastes. This interface configuration features a nanoscale styrene-ethylene-butylene-styrene (SEBS) elastomer layer and a SEBS-liquid metal (LM) composite layer. The top SEBS layer enables a strong adhesion with different modules. The connections between soft-soft and soft-rigid modules can be stretched to high strains of 400% and 250%, respectively. Coupling electron tunneling through an ultrathin SEBS layer with LM particle networks in a SEBS-LM composite layer renders continuous pathways for electrical conductivity. Such a bilayer interface exhibits a strain-insensitive high conductivity (3.7 × 105 S m-1) over a wide strain range from 0 to 680%, which can be facilely fabricated in a self-organized manner by sedimentation of LM particles. We present a proof-of-concept demonstration of this bilayer interface as an electrode, interconnect, and self-solder for monitoring physiological signals.

Self-Adhesive Elastic Conductive Ink with High Permeability and Low Diffusivity for Direct Printing of Universal Textile Electronics

Elastic conductive ink (ECI) can effectively balance the electromechanical properties of printed flexible electronics. It remains challenging to realize ECIs for direct printing on deformable porous substrates with complex textures, such as textiles, to form continuous and stable electrical paths. We engineered a self-adhesive ECI with high permeability and low diffusivity, achieving efficient electrode printing on a wide range of textiles with material and structure diversity. The ECI consists of a microphase separation-toughened elastomer (styrene-isoprene-styrene/ethyl vinyl acetate (SIS-EVA)) and a binary conductive filler. SIS-EVA provides a tough framework to protect silver flakes (AgFKs) and forms a ductile conductive path, which can be electrically compensated by liquid metal microspheres (LMMSs) upon dynamic deformation. The freestanding ECI conductor demonstrates a breaking strain of ∼1305.5% and a conductivity of ∼5322.7 S cm-1. The ECI can be universally printed on diversified textiles free of pretreatment, with high permeability (319.2 μm) and low diffusivity (6.2 μm), demonstrating a stable printing line width of ∼216 μm on knitted cotton textiles, while maintaining electrical stability after 200 stretching cycles with 50% strain. Printed electronic textiles with stretchability, high abrasion resistance, and machine washability are demonstrated for wearable applications such as fabric electrodes, capacitive sensors, and electrocardiograph monitoring.

Stretchable Arduinos embedded in soft robots

To achieve real-world functionality, robots must have the ability to carry out decision-making computations. However, soft robots stretch and therefore need a solution other than rigid computers. Examples of embedding computing capacity into soft robots currently include appending rigid printed circuit boards to the robot, integrating soft logic gates, and exploiting material responses for material-embedded computation. Although promising, these approaches introduce limitations such as rigidity, tethers, or low logic gate density. The field of stretchable electronics has sought to solve these challenges, but a complete pipeline for direct integration of single-board computers, microcontrollers, and other complex circuitry into soft robots has remained elusive. We present a generalized method to translate any complex two-layer circuit into a soft, stretchable form. This enabled the creation of stretchable single-board microcontrollers (including Arduinos) and other commercial circuits (including SparkFun circuits), without design simplifications. As demonstrations of the method's utility, we embedded highly stretchable (>300% strain) Arduino Pro Minis into the bodies of multiple soft robots. This makes use of otherwise inert structural material, fulfilling the promise of the stretchable electronic field to integrate state-of-the-art computational power into robust, stretchable systems during active use.

Electrically weldable conductive elastomers

Flexible and stretchable electronic devices are subject to failure because of vulnerable circuit interconnections. We develop a low-voltage (1.5 to 4.5 V) and rapid (as low as 5 s) electric welding strategy to integrate both rigid electronic components and soft sensors in flexible circuits under ambient conditions. This is achieved through the design of conductive elastomers composed of borate ester polymers and conductive fillers, which can be self-welded and generate welding effects to various materials including metals, hydrogels, and other conductive elastomers. The welding effect is generated through the electrochemical reaction-triggered exposure of interfacial adhesive promotors or the cleavage/reformation of dynamic bonds. Our strategy can ensure both mechanical compliance and conductivity at the circuit interfaces and easily produce welding strengths in the kilopascal to megapascal range. The as-designed conductive elastomers in combination with the electric welding technique provide a robust platform for constructing standalone flexible and stretchable electronic devices that are detachable and assemblable on demand.

Strain-invariant stretchable radio-frequency electronics

Wireless modules that provide telecommunications and power-harvesting capabilities enabled by radio-frequency (RF) electronics are vital components of skin-interfaced stretchable electronics1-7. However, recent studies on stretchable RF components have demonstrated that substantial changes in electrical properties, such as a shift in the antenna resonance frequency, occur even under relatively low elastic strains8-15. Such changes lead directly to greatly reduced wireless signal strength or power-transfer efficiency in stretchable systems, particularly in physically dynamic environments such as the surface of the skin. Here we present strain-invariant stretchable RF electronics capable of completely maintaining the original RF properties under various elastic strains using a 'dielectro-elastic' material as the substrate. Dielectro-elastic materials have physically tunable dielectric properties that effectively avert frequency shifts arising in interfacing RF electronics. Compared with conventional stretchable substrate materials, our material has superior electrical, mechanical and thermal properties that are suitable for high-performance stretchable RF electronics. In this paper, we describe the materials, fabrication and design strategies that serve as the foundation for enabling the strain-invariant behaviour of key RF components based on experimental and computational studies. Finally, we present a set of skin-interfaced wireless healthcare monitors based on strain-invariant stretchable RF electronics with a wireless operational distance of up to 30 m under strain.

Self-Mixed Biphasic Liquid Metal Composite with Ultra-High Stretchability and Strain-Insensitivity for Neuromorphic Circuits

Neuromorphic circuits that can function under extreme deformations are important for various data-driven wearable and robotic applications. Herein, biphasic liquid metal particle (BMP) with unprecedented stretchability and strain-insensitivity (ΔR/R0 = 1.4@ 1200% strain) is developed to realize a stretchable neuromorphic circuit that mimics a spike-based biologic sensory system. The BMP consists of liquid metal particles (LMPs) and rigid liquid metal particles (RLMPs), which are homogeneously mixed via spontaneous solutal-Marangoni mixing flow during coating. This permits facile single step patterning directly on various substrates at room temperature. BMP is highly conductive (2.3 × 106 S/m) without any post activation steps. BMP interconnects are utilized for a sensory system, which is capable of distinguishing variations of biaxial strains with a spiking neural network, thus demonstrating their potential for various sensing and signal processing applications.

Recent progress in multifunctional, reconfigurable, integrated liquid metal-based stretchable sensors and standalone systems

Possessing a unique combination of properties that are traditionally contradictory in other natural or synthetical materials, Ga-based liquid metals (LMs) exhibit low mechanical stiffness and flowability like a liquid, with good electrical and thermal conductivity like metal, as well as good biocompatibility and room-temperature phase transformation. These remarkable properties have paved the way for the development of novel reconfigurable or stretchable electronics and devices. Despite these outstanding properties, the easy oxidation, high surface tension, and low rheological viscosity of LMs have presented formidable challenges in high-resolution patterning. To address this challenge, various surface modifications or additives have been employed to tailor the oxidation state, viscosity, and patterning capability of LMs. One effective approach for LM patterning is breaking down LMs into microparticles known as liquid metal particles (LMPs). This facilitates LM patterning using conventional techniques such as stencil, screening, or inkjet printing. Judiciously formulated photo-curable LMP inks or the introduction of an adhesive seed layer combined with a modified lift-off process further provide the micrometer-level LM patterns. Incorporating porous and adhesive substrates in LM-based electronics allows direct interfacing with the skin for robust and long-term monitoring of physiological signals. Combined with self-healing polymers in the form of substrates or composites, LM-based electronics can provide mechanical-robust devices to heal after damage for working in harsh environments. This review provides the latest advances in LM-based composites, fabrication methods, and their novel and unique applications in stretchable or reconfigurable sensors and resulting integrated systems. It is believed that the advancements in LM-based material preparation and high-resolution techniques have opened up opportunities for customized designs of LM-based stretchable sensors, as well as multifunctional, reconfigurable, highly integrated, and even standalone systems.

A Guide to Printed Stretchable Conductors

Printing of stretchable conductors enables the fabrication and rapid prototyping of stretchable electronic devices. For such applications, there are often specific process and material requirements such as print resolution, maximum strain, and electrical/ionic conductivity. This review highlights common printing methods and compatible inks that produce stretchable conductors. The review compares the capabilities, benefits, and limitations of each approach to help guide the selection of a suitable process and ink for an intended application. We also discuss methods to design and fabricate ink composites with the desired material properties (e.g., electrical conductance, viscosity, printability). This guide should help inform ongoing and future efforts to create soft, stretchable electronic devices for wearables, soft robots, e-skins, and sensors.

Superstretchable Liquid-Metal Electrodes for Dielectric Elastomer Transducers and Flexible Circuits

Dielectric elastomer transducers (DETs), with a dielectric elastomer (DE) film sandwiched between two compliant electrodes, are highly sought after in the fields of soft robotics, energy harvesting, and human-machine interaction. To achieve a high-performance DET, it is essential to develop electrodes with high conductivity, strain-insensitive resistance, and adaptability. Herein, we design an electrode (Supra-LMNs) based on multiple dynamic bond cross-linked supramolecular networks (Ns) and liquid metal (LM), which realizes high conductivity (up to 16,000 S cm-1), negligible resistance changes at high strain (1.3-fold increase at 1000% strain), instantaneous self-healability at ambient temperature, and rapid recycling. The conductive pathway can be activated through simple friction by transmitting stress through the silver nanowires (AgNWs) and cross-linking sites of LM particles. This method is especially attractive for printing circuits on flexible substrates, especially DE films. Utilized as dielectric elastomer generator (DEG) electrodes, it reduces the charge loss by 3 orders of magnitude and achieves high generating energy density and energy conversion efficiency on a low-resistance load. Additionally, serving as sensor (DES) and actuator (DEA) electrodes, it enables a highly sensitive sensing capability and complex interaction.

Stretchable and Lithography-Compatible Interconnects Enabled by Self-Assembled Nanofilms with Interlocking Interfaces

Stretchable interconnects with miniature widths are vital for the high-density integration of deformable electronic components on a single substrate for targeted data logic or storage functions. However, it is still challenging to attain high-resolution patternability of stretchable conductors with robust circuit fabrication capability. Here, we report a self-assembled silver nanofilm firmly interlocked by an elastomeric nanodielectric that can be photolithographically patterned into microscale features while preserving high stretchability and conductivity. Both silver and dielectric nanofilms are fabricated by layer-by-layer assembly, ensuring wafer-scale uniformity and meticulous control of thicknesses. Without any thermal annealing, the as-fabricated nanofilms from silver nanoparticles (AgNPs) exhibit conductivity of 1.54 × 106 S m-1 and stretchability of ∼200%, which is due to the impeded crack propagation by the underlying PU nanodielectrics. Furthermore, it is revealed that AgNP microstrips defined by photolithography show higher stretchability when their widths are downscaled to 100 μm owing to confined cracks. However, further scaling restricts the stretchability, following the early development of cracks cutting across the strip. In addition, the resistance change of these silver interconnects can be decreased using serpentine architectures. As a demonstration, these self-assembled interconnects are used as stretchable circuit boards to power LEDs.

Tough soldering for stretchable electronics by small-molecule modulated interfacial assemblies

The rapid-developing soft robots and wearable devices require flexible conductive materials to maintain electric functions over a large range of deformations. Considerable efforts are made to develop stretchable conductive materials; little attention is paid to the frequent failures of integrated circuits caused by the interface mismatch of soft substrates and rigid silicon-based microelectronics. Here, we present a stretchable solder with good weldability that can strongly bond with electronic components, benefiting from the hierarchical assemblies of liquid metal particles, small-molecule modulators, and non-covalently crosslinked polymer matrix. Our self-solder shows high conductivity (>2×105  S  m-1), extreme stretchability (~1000%, and >600% with chip-integrated), and high toughness (~20 MJ m-3). Additionally, the dynamic interactions within our solder's surface and interior enable a range of unique features, including ease of integration, component substitution, and circuit recyclability. With all these features, we demonstrated an application as thermoforming technology for three-dimensional (3D) conformable electronics, showing potential in reducing the complexity of microchip interfacing, as well as scalable fabrication of chip-integrated stretchable circuits and 3D electronics.

Multifunctional Intelligent Wearable Devices Using Logical Circuits of Monolithic Gold Nanowires

Although multifunctional wearable devices have been widely investigated for healthcare systems, augmented/virtual realities, and telemedicines, there are few reports on multiple signal monitoring and logical signal processing by using one single nanomaterial without additional algorithms or rigid application-specific integrated circuit chips. Here, multifunctional intelligent wearable devices are developed using monolithically patterned gold nanowires for both signal monitoring and processing. Gold bulk and hollow nanowires show distinctive electrical properties with high chemical stability and high stretchability. In accordance, the monolithically patterned gold nanowires can be used to fabricate the robust interfaces, programmable sensors, on-demand heating systems, and strain-gated logical circuits. The stretchable sensors show high sensitivity for strain and temperature changes on the skin. Furthermore, the micro-wrinkle structures of gold nanowires exhibit the negative gauge factor, which can be used for strain-gated logical circuits. Taken together, this multifunctional intelligent wearable device would be harnessed as a promising platform for futuristic electronic and biomedical applications.

Conductance stable and mechanically durable bi-layer EGaIn composite-coated stretchable fiber for 1D bioelectronics

Deformable semi-solid liquid metal particles (LMP) have emerged as a promising substitute for rigid conductive fillers due to their excellent electrical properties and stable conductance under strain. However, achieving a compact and robust coating of LMP on fibers remains a persistent challenge, mainly due to the incompatibility of conventional coating techniques with LMP. Additionally, the limited durability and absence of initial electrical conductivity of LMP restrict their widespread application. In this study, we propose a solution process that robustly and compactly assembles mechanically durable and initially conductive LMP on fibers. Specifically, we present a shearing-based deposition of polymer-attached LMP followed by additional coating with CNT-attached LMP to create bi-layer LMP composite with exceptional durability, electrical conductivity, stretchability, and biocompatibility on various fibers. The versatility and reliability of this manufacturing strategy for 1D electronics are demonstrated through the development of sewn electrical circuits, smart clothes, stretchable biointerfaced fiber, and multifunctional fiber probes.

Stretch-Induced Robust Intrinsic Antibacterial Thermoplastic Gelatin Organohydrogel for a Thermoenhanced Supercapacitor and Mono-gauge-factor Sensor

Sustainable organohydrogel electronics have shown promise in resolving the electronic waste (e-waste) evoked by traditional chemical cross-linking hydrogels. Herein, thermoplastic-recycled gelatin/oxidized starch (OST)/glycerol/ZnCl₂ organohydrogels (GOGZs) were fabricated by introducing the anionic polyelectrolyte OST and solvent exchange strategy to construct noncovalently cross-linking networks. Benefiting from the electrostatic interaction and hydrogen and coordination bonds, GOGZ possessed triple-supramolecular interactions and a continuous ion transport pathway, which resulted in excellent thermoplasticity and high ionic conductivities and mechanical and antibacterial properties. Because of the thermally induced phase transition of gelatin, GOGZ exhibited isotropic-ionic conductivity with a positive temperature coefficient and realized intrinsic affinity with the activated carbon electrode for fabricating a double-layer structure supercapacitor. These novel features significantly decreased the impedance (3.71 Ω) and facilitated the flexible supercapacitors to achieve thermoenhanced performance with 4.89 Wh kg^-1 energy density and 49.2 F g^-1 specific mass capacitance at 65 °C. Fantastically, the GOGZ-based stress sensor exhibited a monolinear gauge factor (R² = 0.999) at its full-range strain (0 to 350%), and its sensitivity increased with the thermoplastic-recycled times. Consequently, this sustainable and temperature-sensitive sensor (-40 to 60 °C) could serve as health monitoring wearable devices with excellent reliability (R² = 0.999) at tiny strain. Moreover, GOGZ could achieve efficient self-enhancement by stretch-induced alignment. The sustained weighted load, tensile strength, and elongation at break of the stretch-induced GOGZ were 6 kg/g, 2.37 MPa, and 300%, respectively. This self-enhanced feature indicated that GOGZ can be utilized as an artificial muscle. Eventually, GOGZ obtained high intrinsic antibiosis (D_{inhibition circle} > 25 mm) by a binding species (-COO^-NH₃⁺-) from COOH in OST and NH₂ in gelatin, freezing resistance, and water retention. In summary, this study provided an effective strategy to fabricate thermoplastic-recycled organohydrogels for multifunctional sustainable electronics with novel performance.

Self-Healing, Reconfigurable, Thermal-Switching, Transformative Electronics for Health Monitoring

Soft, deformable electronic devices provide the means to monitor physiological information and health conditions for disease diagnostics. However, their practical utility is limited due to the lack of intrinsical thermal switching for mechanically transformative adaptability and self-healing capability against mechanical damages. Here, the design concepts, materials and physics, manufacturing approaches, and application opportunities of self-healing, reconfigurable, thermal-switching device platforms based on hyperbranched polymers and biphasic liquid metal are reported. The former provides excellent self-healing performance and unique tunable stiffness and adhesion regulated by temperature for the on-skin switch, whereas the latter results in liquid metal circuits with extreme stretchability (>900%) and high conductivity (3.40 × 104  S cm-1 ), as well as simple recycling capability. Triggered by the increased temperature from the skin surface, a multifunctional device platform can conveniently conform and strongly adhere to the hierarchically textured skin surface for non-invasive, continuous, comfortable health monitoring. Additionally, the self-healing and adhesive characteristics allow multiple multifunctional circuit components to assemble and completely wrap on 3D curvilinear surfaces. Together, the design, manufacturing, and proof-of-concept demonstration of the self-healing, transformative, and self-assembled electronics open up new opportunities for robust soft deformable devices, smart robotics, prosthetics, and Internet-of-Things, and human-machine interfaces on irregular surfaces.

Technology Roadmap for Flexible Sensors

Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative efforts, scientific breakthroughs can be made sooner and capitalized for the betterment of humanity.

Liquid Metal Patterning and Unique Properties for Next-Generation Soft Electronics

Room-temperature liquid metal (LM)-based electronics is expected to bring advancements in future soft electronics owing to its conductivity, conformability, stretchability, and biocompatibility. However, various difficulties arise when patterning LM because of its rheological features such as fluidity and surface tension. Numerous attempts are made to overcome these difficulties, resulting in various LM-patterning methods. An appropriate choice of patterning method based on comprehensive understanding is necessary to fully utilize the unique properties. Therefore, the authors aim to provide thorough knowledge about patterning methods and unique properties for LM-based future soft electronics. First, essential considerations for LM-patterning are investigated. Then, LM-patterning methods-serial-patterning, parallel-patterning, intermetallic bond-assisted patterning, and molding/microfluidic injection-are categorized and investigated. Finally, perspectives on LM-based soft electronics with unique properties are provided. They include outstanding features of LM such as conformability, biocompatibility, permeability, restorability, and recyclability. Also, they include perspectives on future LM-based soft electronics in various areas such as radio frequency electronics, soft robots, and heterogeneous catalyst. LM-based soft devices are expected to permeate the daily lives if patterning methods and the aforementioned features are analyzed and utilized.

Venation-Mimicking, Ultrastretchable, Room-Temperature-Attachable Metal Tapes for Integrated Electronic Skins

Future electronic skin systems require stretchable conductors and low-temperature integration of external components, which remains challenging for traditional metal films. Herein, a bioinspired design concept is reported to endow metal films with 200% stretchability as well as room-temperature integration capability with diverse components. It is revealed that by controllable implantation of defects, distinctive venation-mimicking cracking modes can be induced in strained metal films, leading to profound stretchability regulation. An intriguing exponential-to-linear transition of the film electromechanical performance is observed, which is elucidated by a unified model covering the essence of all modes. Combined with room-temperature integration capability, an integrated electronic skin is constructed with metal films serving as stretchable electrodes, diverse sensors, and "tapes" to attach subcomponents, showing prospects in helping disabled people. This one-step, defect implantation strategy is applicable to common metals without special substrate treatments, which enables fascinating ultrastretchable metal film conductors with low-temperature integration capability to spark more sophisticated flexible electronic systems.

Design and Fabrication of Embroidered Textile Strain Sensors: An Alternative to Stitch-Based Strain Sensors

Smart textile sensors have been gaining popularity as alternative methods for the continuous monitoring of human motion. Multiple methods of fabrication for these textile sensors have been proposed, but the simpler ones include stitching or embroidering the conductive thread onto an elastic fabric to create a strain sensor. Although multiple studies have demonstrated the efficacy of textile sensors using the stitching technique, there is almost little to no information regarding the fabrication of textile strain sensors using the embroidery method. In this paper, a design guide for the fabrication of an embroidered resistive textile strain sensor is presented. All of the required design steps are explained, as well as the different embroidery design parameters and their optimal values. Finally, three embroidered textile strain sensors were created using these design steps. These sensors are based on the principle of superposition and were fabricated using a stainless-steel conductive thread embroidered onto a polyester-rubber elastic knit structure. The three sensors demonstrated an average gauge factor of 1.88±0.51 over a 26% working range, low hysteresis (8.54±2.66%), and good repeatability after being pre-stretched over a certain number of stretching cycles.

Reliability of printed stretchable electronics based on nano/micro materials for practical applications

Recent decades have witnessed the booming development of stretchable electronics based on nano/micro composite inks. Printing is a scalable, low-cost, and high-efficiency fabrication tool to realize stretchable electronics through additive processes. However, compared with conventional flexible electronics, stretchable electronics need to experience more severe mechanical deformation which may cause destructive damage. Most of the reported works in this field mainly focus on how to achieve a high stretchability of nano/micro composite conductors or single working modules/devices, with limited attention given to the reliability for practical applications. In this minireview, we summarized the failure modes when printing stretchable electronics using nano/micro composite ink, including dysfunction of the stretchable interconnects, the stress-concentrated rigid-soft interfaces for hybrid electronics, the vulnerable vias upon stretching, thermal accumulation, and environmental instability of stretchable materials. Strategies for tackling these challenges to realize reliable performances are proposed and discussed. Our review provides an overview on the importance of reliable, printable, and stretchable electronics, which are the key enablers in propelling stretchable electronics from fancy demos to practical applications.

Establishment of different aliphatic amines-based rapid self-healing Mg(OH)2 metallogels: exploring the morphology, rheology and intriguing semiconducting Schottky diode characteristics

Different aliphatic-amine-based rapid self-healing Mg(ii)-metallogels have been established through exploring their morphology, rheology and intriguing semiconducting Schottky diode characteristics.

A wearable cardiac ultrasound imager

Continuous imaging of cardiac functions is highly desirable for the assessment of long-term cardiovascular health, detection of acute cardiac dysfunction and clinical management of critically ill or surgical patients1-4. However, conventional non-invasive approaches to image the cardiac function cannot provide continuous measurements owing to device bulkiness5-11, and existing wearable cardiac devices can only capture signals on the skin12-16. Here we report a wearable ultrasonic device for continuous, real-time and direct cardiac function assessment. We introduce innovations in device design and material fabrication that improve the mechanical coupling between the device and human skin, allowing the left ventricle to be examined from different views during motion. We also develop a deep learning model that automatically extracts the left ventricular volume from the continuous image recording, yielding waveforms of key cardiac performance indices such as stroke volume, cardiac output and ejection fraction. This technology enables dynamic wearable monitoring of cardiac performance with substantially improved accuracy in various environments.

Recent progress in fiber-based soft electronics enabled by liquid metal

Soft electronics can seamlessly integrate with the human skin which will greatly improve the quality of life in the fields of healthcare monitoring, disease treatment, virtual reality, and human-machine interfaces. Currently, the stretchability of most soft electronics is achieved by incorporating stretchable conductors with elastic substrates. Among stretchable conductors, liquid metals stand out for their metal-grade conductivity, liquid-grade deformability, and relatively low cost. However, the elastic substrates usually composed of silicone rubber, polyurethane, and hydrogels have poor air permeability, and long-term exposure can cause skin redness and irritation. The substrates composed of fibers usually have excellent air permeability due to their high porosity, making them ideal substrates for soft electronics in long-term applications. Fibers can be woven directly into various shapes, or formed into various shapes on the mold by spinning techniques such as electrospinning. Here, we provide an overview of fiber-based soft electronics enabled by liquid metals. An introduction to the spinning technology is provided. Typical applications and patterning strategies of liquid metal are presented. We review the latest progress in the design and fabrication of representative liquid metal fibers and their application in soft electronics such as conductors, sensors, and energy harvesting. Finally, we discuss the challenges of fiber-based soft electronics and provide an outlook on future prospects.

Transfer printing technologies for soft electronics

Soft electronics have received increasing attention in recent years, owing to their wide range of applications in dynamic nonplanar surface integration electronics that include skin electronics, implantable devices, and soft robotics. Transfer printing is a widely used assembly technology for micro- and nano-fabrication, which enables the integration of functional devices with flexible or elastomeric substrates for the manufacturing of soft electronics. Through advanced materials and process design, numerous impressive studies related to transfer printing strategies and applications have been proposed. Herein, a discussion of transfer printing technologies toward soft electronics in terms of mechanisms and example demonstrations is provided. Moreover, the perspectives on the potential challenges and future directions of this field are briefly discussed.

Triple crosslinking conductive hydrogels with digitally printable and outstanding mechanical stability for high-resolution conformable bioelectronics

Soft, conductive, and stretchable hydrogels offer a broad variety of applications, including skin-interfacing electrodes, biomonitoring patches, and electrostimulation. Despite rapid developments over the last decades, a combination of good electrical and mechanical properties, low-cost fabrication, and biocompatibility is yet to be demonstrated. Also, the current methods for deposition and patterning of these hydrogels are manual, and there is a need toward autonomous and digital fabrication techniques. In this work, we demonstrate a novel Gallium (Ga) embedded sodium-alginate-polyacrylamide-LAPONITE® (Ga-SA-PAAM-La) hydrogel, that is ultra-stretchable (Maximum strain tolerance of∼985%), tough (toughness ∼30 kJ m^-3), bio-adhesive (adhesion energy ∼216 J m^-2), conductive, and digitally printable. Ga nanoparticles are used as radical initiators. By adjusting the sonication parameters, we control the solution viscosity and curing time, thus allowing us to prepare pre-polymers with the desired properties for casting, or digital printing. These hydrogels benefit from a triple-network structure due to the role of Ga droplets as crosslinkers besides BIS (N,N'-methylene-bis-acrylamide) and LAPONITE®, thus resulting in tough composite hydrogels. The inclusion of LAPONITE® into the hydrogel network improved its electrical conductivity, adhesion, digital printability, and its mechanical properties, (>6× compared to the same hydrogel without LAPONITE®). As electrodes in the electrocardiogram, the signal-to-noise ratio was surprisingly higher than the medical-grade Ag/AgCl electrodes, which are applied for monitoring muscles, heart, respiration, and body joint angle through EMG, ECG, and bioimpedance measurements. The results obtained prove that such digitally printed conductive and tough hydrogels can be used as potential electrodes and sensors in practical applications in the next generation of printed wearable computing devices.

Enhancing the interfacial binding strength between modular stretchable electronic components

Stretchable electronics are emerging for personalized and decentralized clinics, wearable devices and human-machine interactions. Nowadays, separated stretchable functional parts have been well developed and are approaching practical usage. However, the production of whole stretchable devices with full functions still faces a huge challenge: the integration of different components, which was hindered by the mechanical mismatch and stress/strain concentration at the connection interfaces. To avoid connection failure in stretchable devices, a new research focus is to improve the interfacial binding strength between different components. In this review, recent developments to enhance interfacial strength in wearable/implantable electronics are introduced and catalogued into three major strategies: (i) covalent bonding between different device parts, (ii) molecular interpenetration or mechanical interlocking at the interfaces and (iii) covalent connection between the human body and devices. Besides reviewing current methods, we also discuss the existing challenges and possible improvements for stretchable devices from the aspect of interfacial connections.

Viscoelastic Metal-in-Water Emulsion Gel via Host-Guest Bridging for Printed and Strain-Activated Stretchable Electrodes

Stretchable conductive electrodes that can be made by printing technology with high resolution is desired for preparing wearable electronics. Printable inks composed of liquid metals are ideal candidates for these applications, but their practical applications are limited by their low stability, poor printability, and low conductivity. Here, thixotropic metal-in-water (M/W) emulsion gels (MWEGs) were designed and developed by stabilizing and bridging liquid metal droplets (LMDs) via a host-guest polymer. In the MWEGs, the hydrophilic main chain of the host-guest polymers emulsified and stabilized LMDs via coordination bonds. The grafted cyclodextrin and adamantane groups formed dynamic inclusion complexes to bridge two neighboring LMDs, leading to the formation of a dynamically cross-linked network of LMDs in the aqueous phase. The MWEGs exhibited viscoelastic and shear-thinning behavior, making them ideal for direct three-dimensional (3D) and screen printing with a high resolution (∼65 μm) to assemble complex patterns consisting of ∼95 wt % liquid metal. When stretching the printed patterns, strong host-guest interactions guaranteed that the entire droplet network was cross-linked, while the brittle oxide shell of the droplets ruptured, releasing the liquid metal core and allowing it to fuse into continuous conductive pathways under an ultralow critical strain (<1.5%). This strain-activated conductivity exceeded 15800 S/cm under a large strain of 800% and exhibited long-term cyclic stability and robustness.

Emerging Iontronic Sensing: Materials, Mechanisms, and Applications

Iontronic sensors represent a novel class of soft electronics which not only replicate the biomimetic structures and perception functions of human skin but also simulate the mechanical sensing mechanism. Relying on the similar mechanism with skin perception, the iontronic sensors can achieve ion migration/redistribution in response to external stimuli, promising iontronic sensing to establish more intelligent sensing interface for human-robotic interaction. Here, a comprehensive review on advanced technologies and diversified applications for the exploitation of iontronic sensors toward ionic skins and artificial intelligence is provided. By virtue of the excellent stretchability, high transparency, ultrahigh sensitivity, and mechanical conformality, numerous attempts have been made to explore various novel ionic materials to fabricate iontronic sensors with skin-like perceptive properties, such as self-healing and multimodal sensing. Moreover, to achieve multifunctional artificial skins and intelligent devices, various mechanisms based on iontronics have been investigated to satisfy multiple functions and human interactive experiences. Benefiting from the unique material property, diverse sensing mechanisms, and elaborate device structure, iontronic sensors have demonstrated a variety of applications toward ionic skins and artificial intelligence.

Mechanical Gradients Enable Highly Stretchable Electronics Based on Nanofiber Substrates

Stretchable electronics play a pivotal role in the age of information and intelligence. Integrated circuit components are an integral part of high-performance and multifunctional stretchable electronic devices. Therefore, it is an ideal design concept for stretchable electronic devices to not only ensure the reliability of the connection between rigid inorganic electronic components and stretchable circuits but also maintain the stretchability of the device. In this work, we constructed a mechanical gradient strategy to fabricate high-performance stretchable electronic devices. Briefly, polyvinyl alcohol glue is used to fix integrated circuits on stretchable circuits, which are fabricated by printing liquid metal on a thermoplastic polyurethane nanofiber membrane. The strategy of integrated circuits (rigid)-polyvinyl alcohol glue (high elastic modulus)-thermoplastic polyurethane nanofiber membrane (low elastic modulus)-liquid metal (liquid) realizes the strain gradient during the stretching process of the device, thus ensuring the stability and reliability. Moreover, we explored the mechanism through experiments and finite element analysis. The flexible electronic devices fabricated by this scheme are not only ultra-stretchable (900%) but also have good stability and comfort. As proof, the application in stretchable sensors, human-computer interaction devices, and displays was realized.

Skin Electronics from Biocompatible In Situ Welding Enabled By Intrinsically Sticky Conductors

Welding usually involves high temperatures, toxic solvents, or conditions not compatible with human bodies, which severely limit the fusion of electronics and human tissues. To achieve direct welding of electronics on human skin, the intrinsically sticky conductors that can simultaneously achieve metal-grade electrical conductivity (≈41 7000 S m-1 ), hydrogel-grade stretchability (>900% strain), and self-adhesiveness (1.8 N cm-1 ) are reported. The sticky conductors composed of gallium indium alloy and acrylate polymer adhesives have a surface-enriched structure, which can form instant mechanical and electrical connections with different surfaces through gentle pressure without involving conditions that may damage human tissues. Based on the sticky conductors, the in situ welding of electronics on the skin is realized. To demonstrate the feasibility of in situ welding, electronic tattoos are achieved for movement monitoring. Intrinsically sticky electrodes that can resist drying and simultaneously deform with the skin for electrophysiological measurement are also developed.

A Personalized Electronic Tattoo for Healthcare Realized by On-the-Spot Assembly of an Intrinsically Conductive and Durable Liquid-Metal Composite

Conventional electronic (e-) skins are a class of thin-film electronics mainly fabricated in laboratories or factories, which is incapable of rapid and simple customization for personalized healthcare. Here a new class of e-tattoos is introduced that can be directly implemented on the skin by facile one-step coating with various designs at multi-scale depending on the purpose of the user without a substrate. An e-tattoo is realized by attaching Pt-decorated carbon nanotubes on gallium-based liquid-metal particles (CMP) to impose intrinsic electrical conductivity and mechanical durability. Tuning the CMP suspension to have low-zeta potential, excellent wettability, and high-vapor pressure enables conformal and intimate assembly of particles directly on the skin in 10 s. Low-cost, ease of preparation, on-skin compatibility, and multifunctionality of CMP make it highly suitable for e-tattoos. Demonstrations of electrical muscle stimulators, photothermal patches, motion artifact-free electrophysiological sensors, and electrochemical biosensors validate the simplicity, versatility, and reliability of the e-tattoo-based approach in biomedical engineering.

3R Electronics: Scalable Fabrication of Resilient, Repairable, and Recyclable Soft-Matter Electronics

E-waste is rapidly turning into another man-made disaster. It is proposed that a paradigm shift toward a more sustainable future can be made through soft-matter electronics that are resilient, repairable if damaged, and recyclable (3R), provided that they achieve the same level of maturity as industrial electronics. This includes high-resolution patterning, multilayer implementation, microchip integration, and automated fabrication. Herein, a novel architecture of materials and methods for microchip-integrated condensed soft-matter 3R electronics is demonstrated. The 3R function is enabled by a biphasic liquid metal-based composite, a block copolymer with nonpermanent physical crosslinks, and an electrochemical technique for material recycling. In addition, an autonomous laser-patterning method for scalable circuit patterning with an exceptional resolution of <30 µm in seconds is developed. The phase-shifting property of the BCPs is utilized for vapor-assisted "soldering" circuit repairing and recycling. The process is performed entirely at room temperature, thereby opening the door for a wide range of heat-sensitive and biodegradable polymers for the next generation of green electronics. The implementation and recycling of sophisticated skin-mounted patches with embedded sensors, electrodes, antennas, and microchips that build a digital fingerprint of the human electrophysiological signals is demonstrated by collecting mechanical, electrical, optical, and thermal data from the epidermis.

Room-temperature high-precision printing of flexible wireless electronics based on MXene inks

Wireless technologies-supported printed flexible electronics are crucial for the Internet of Things (IoTs), human-machine interaction, wearable and biomedical applications. However, the challenges to existing printing approaches remain, such as low printing precision, difficulty in conformal printing, complex ink formulations and processes. Here we present a room-temperature direct printing strategy for flexible wireless electronics, where distinct high-performance functional modules (e.g., antennas, micro-supercapacitors, and sensors) can be fabricated with high resolution and further integrated on various flat/curved substrates. The additive-free titanium carbide (Ti₃C₂T_x) MXene aqueous inks are regulated with large single-layer ratio (>90%) and narrow flake size distribution, offering metallic conductivity (~6, 900 S cm⁻¹) in the ultrafine-printed tracks (3 μm line gap and 0.43% spatial uniformity) without annealing. In particular, we build an all-MXene-printed integrated system capable of wireless communication, energy harvesting, and smart sensing. This work opens a door for high-precision additive manufacturing of printed wireless electronics at room temperature.

High-precision printing of flexible wireless electronics has not been achieved before. Here, the authors leverage a room-temperature direct printing strategy to realize an all-MXene-printed integrated system capable of wireless communication, energy harvesting, and smart sensing.

Lab-on-PCB: One step away from the accomplishment of μTAS?

The techniques, protocols, and advancements revolving around printed circuit boards (PCBs) have been gaining sustained attention in the realm of micro-total analysis systems (μTAS) as more and more efforts are devoted to searching for standardized, highly reliable, and industry-friendly solutions for point-of-care diagnostics. In this Perspective, we set out to identify the current state in which the field of μTAS finds itself, the challenges encountered by researchers in the implementation of these technologies, and the potential improvements that can be targeted to meet the current demands. We also line up some trending innovations, such as 3D printing and wearable devices, along with the development of lab-on-PCB to increase the possibility of multifunctional biosensing activities propelled by integrated microfluidic networks for a wider range of applications, anticipating to catalyze the full potential of μTAS.