Heterogeneous three-dimensional electronics by use of printed semiconductor nanomaterials

Low-dimensional nanostructures for monolithic 3D-integrated flexible and stretchable electronics

Flexible/stretchable electronics, which are characterized by their ultrathin design, lightweight structure, and excellent mechanical robustness and conformability, have garnered significant attention due to their unprecedented potential in healthcare, advanced robotics, and human-machine interface technologies. An increasing number of low-dimensional nanostructures with exceptional mechanical, electronic, and/or optical properties are being developed for flexible/stretchable electronics to fulfill the functional and application requirements of information sensing, processing, and interactive loops. Compared to the traditional single-layer format, which has a restricted design space, a monolithic three-dimensional (M3D) integrated device architecture offers greater flexibility and stretchability for electronic devices, achieving a high-level of integration to accommodate the state-of-the-art design targets, such as skin-comfort, miniaturization, and multi-functionality. Low-dimensional nanostructures possess small size, unique characteristics, flexible/elastic adaptability, and effective vertical stacking capability, boosting the advancement of M3D-integrated flexible/stretchable systems. In this review, we provide a summary of the typical low-dimensional nanostructures found in semiconductor, interconnect, and substrate materials, and discuss the design rules of flexible/stretchable devices for intelligent sensing and data processing. Furthermore, artificial sensory systems in 3D integration have been reviewed, highlighting the advancements in flexible/stretchable electronics that are deployed with high-density, energy-efficiency, and multi-functionalities. Finally, we discuss the technical challenges and advanced methodologies involved in the design and optimization of low-dimensional nanostructures, to achieve monolithic 3D-integrated flexible/stretchable multi-sensory systems.

Fabrication of Oriented Polycrystalline MOF Superstructures

The field of metal-organic frameworks (MOFs) has progressed beyond the design and exploration of powdery and single-crystalline materials. A current challenge is the fabrication of organized superstructures that can harness the directional properties of the individual constituent MOF crystals. To date, the progress in the fabrication methods of polycrystalline MOF superstructures has led to close-packed structures with defined crystalline orientation. By controlling the crystalline orientation, the MOF pore channels of the constituent crystals can be aligned along specific directions: these systems possess anisotropic properties including enhanced diffusion along specific directions, preferential orientation of guest species, and protection of functional guests. In this perspective, we discuss the current status of MOF research in the fabrication of oriented polycrystalline superstructures focusing on the specific crystalline directions of orientation. Three methods are examined in detail: the assembly from colloidal MOF solutions, the use of external fields for the alignment of MOF particles, and the heteroepitaxial ceramic-to-MOF growth. This perspective aims at promoting the progress of this field of research and inspiring the development of new protocols for the preparation of MOF systems with oriented pore channels, to enable advanced MOF-based devices with anisotropic properties.

Nondegenerate Integer Quantum Hall Effect from Topological Surface States in Ag2Te Nanoplates

The quantum Hall effect is one of the exclusive properties displayed by Dirac Fermions in topological insulators, which propagates along the chiral edge state and gives rise to quantized electron transport. However, the quantum Hall effect formed by the nondegenerate Dirac surface states has been elusive so far. Here, we demonstrate the nondegenerate integer quantum Hall effect from the topological surface states in three-dimensional (3D) topological insulator β-Ag2Te nanostructures. Surface-state dominant conductance renders quantum Hall conductance plateaus with a step of e2/h, along with typical thermopower behaviors of two-dimensional (2D) massless Dirac electrons. The 2D nature of the topological surface states is proven by the electrical and thermal transport responses under tilted magnetic fields. Moreover, the degeneracy of the surface states is removed by structure inversion asymmetry (SIA). The evidenced SIA-induced nondegenerate integer quantum Hall effect in low-symmetry β-Ag2Te has implications for both fundamental study and the realization of topological magneto-electric effects.

Unveiling the mechanism of remote epitaxy of crystalline semiconductors on 2D materials-coated substrates

Remote epitaxy has opened novel opportunities for advanced manufacturing and heterogeneous integration of two-dimensional (2D) materials and conventional (3D) materials. The lattice transparency as the fundamental principle of remote epitaxy has been studied and challenged by recent observations defying the concept. Understanding remote epitaxy requires an integrated approach of theoretical modeling and experimental validation at multi-scales because the phenomenon includes remote interactions of atoms across an atomically thin material and a few van der Waals gaps. The roles of atomically thin 2D material for the nucleation and growth of a 3D material have not been integrated into a framework of remote epitaxy research. Here, we summarize studies of remote epitaxy mechanisms with a comparison to other epitaxy techniques. In the end, we suggest the crucial topics of remote epitaxy research for basic science and applications.

Highly effective transfer of micro-LED pixels to the intermediate and rigid substrate with weak and tunable adhesion by thiol modification

Based on transfer printing technology, micro-LED pixels can be transferred to different types and sizes of driving substrates to realize displays with different application scenarios. To achieve a successful transfer, GaN-based micro-LEDs first need to be separated from the original epitaxial substrate. Here, micro-LED pixels (each size 25 μm × 30 μm) on the sapphire substrate were transferred to a flexible semiconductor wafer processing (SWP) tape that is strongly sticky by conventional laser lift-off (LLO) techniques. The pixels on the SWP tape were then transferred by using a sacrificial layer of non-crosslinked oligomeric polystyrene (PS) film onto the intermediate and rigid substrate (IRS) with weak and tunable adhesion by thiol (-SH) modification. The electrode of the micro-LED is Au metal, which forms Au-S bonds with the surface of the IRS to fix the pixels. The rigid substrate helps ensure that the pixel spacing is almost unchanged during the stamp transfer process, and the weak and tunable adhesion facilitates the pixels being picked up by the stamp. The experimental results demonstrate that the pixels can be efficiently transferred to the IRS by LLO and sacrificial layer-assistance, which will provide the possibility of achieving the further transfer of pixels to different types and sizes of driving substrates by a suitable transfer stamp. The transfer process details are discussed, which can provide insights into the transfer of micro-nano devices through polymer sacrificial layers.

Recent Advances in Stretchable and Wearable Capacitive Electrophysiological Sensors for Long-Term Health Monitoring

Over the past several years, wearable electrophysiological sensors with stretchability have received significant research attention because of their capability to continuously monitor electrophysiological signals from the human body with minimal body motion artifacts, long-term tracking, and comfort for real-time health monitoring. Among the four different sensors, i.e., piezoresistive, piezoelectric, iontronic, and capacitive, capacitive sensors are the most advantageous owing to their reusability, high durability, device sterilization ability, and minimum leakage currents between the electrode and the body to reduce the health risk arising from any short circuit. This review focuses on the development of wearable, flexible capacitive sensors for monitoring electrophysiological conditions, including the electrode materials and configuration, the sensing mechanisms, and the fabrication strategies. In addition, several design strategies of flexible/stretchable electrodes, body-to-electrode signal transduction, and measurements have been critically evaluated. We have also highlighted the gaps and opportunities needed for enhancing the suitability and practical applicability of wearable capacitive sensors. Finally, the potential applications, research challenges, and future research directions on stretchable and wearable capacitive sensors are outlined in this review.

A non-destructive and efficient transfer method for preparing 2D materials samples for transmission electron microscopy study

Studying two-dimensional (2D) materials using transmission electron microscopy (TEM) is necessary and very important in many aspects. However, some 2D materials are not resistant to acids or alkalis, which are widely used in normal wet transfer techniques to transfer the exfoliated 2D nanosheets onto the TEM grids. On the other hand, dry stamping method can damage the holey carbon film on the TEM grids. In this article, we present a non-destructive, efficient, and widely applicable transfer method for preparing the TEM samples of the exfoliated 2D materials. Our method only uses the heat-release tape, PMMA, and blue Nitto tape. Neither acid nor alkali is involved in our method, therefore, impurities and damage can be avoided to the greatest extent. The method is also very efficient and can be accomplished in less than 30 min after the exfoliation of the 2D materials. This method is particularly useful for preparing the TEM samples of the 2D materials that are not resistant to acids and alkalis. The present method is also applicable to various 2D materials and various substrates.

Laminated three-dimensional carbon nanotube integrated circuits

The fabrication procedure for each layer of the device in monolithic three-dimensional (3D) integration still follows the design philosophy of traditional planar silicon-based circuits, and such integrated circuits will ultimately be limited by the same scaling constraints that face silicon field-effect transistors. We report the direct formation of laminated 3D integrated circuits by the layer-by-layer stacking of each component through two different techniques. One is to use carbon nanotubes (CNTs) as the channels of thin-film transistors because of their low-temperature fabrication and layer-to-layer transfer capabilities. The other is to use a suitable separator between every two layers to isolate them, because the separator is not only able to maintain the stability of the performance of each component after coating, but is also a good insulator that can prevent interlayer interactions. A 5-stage CNT ring oscillator laminated onto a single inverter is finally reported, which can reduce the device area by approximately 80%, and should be greatly helpful for the continuous improvement of device functionality and integration.

One-step laser etching of a bionic hierarchical structure on a silicone rubber surface with thermal and acid/alkali resistance and tunable wettability

Superhydrophobic silicone rubbers with robust physical and chemical stability have promising application potential in the field of flexible electronics. A one-step laser etching strategy is proposed for successfully fabricating superhydrophobic silicone rubbers with bioinspired hierarchical micro/nanostructures. Regular and dense micro/nano spheres gradually accumulate on the modified silicone rubber surface with the increase of laser etching cycles. Owing to the bioinspired hierarchical micro/nano spheres, a 5 μL water droplet on the modified silicone rubber surface exhibits a contact angle of 158 ± 3° and a sliding angle of 5 ± 1°. Moreover, the modified silicone rubber can maintain a stable superhydrophobic state in acid/alkali (pH = 2, 4, 6, 8, and 10) and thermal environments (50-90 °C). Importantly, the contact angle and sliding angle are adjustable depending on the number of laser etching cycles, which is beneficial for the different application requirements. The proposed method for the fast fabrication of superhydrophobic silicone rubbers with tunable wettability can provide an excellent candidate for the protection of flexible electronics in rainy and acid/alkali environments.

Flexible Ceramic Film Sensors for Free-Form Devices

Recent technological innovations, such as material printing techniques and surface functionalization, have significantly accelerated the development of new free-form sensors for next-generation flexible, wearable, and three-dimensional electronic devices. Ceramic film sensors, in particular, are in high demand for the production of reliable flexible devices. Various ceramic films can now be formed on plastic substrates through the development of low temperature fabrication processes for ceramic films, such as photocrystallization and transferring methods. Among flexible sensors, strain sensors for precise motion detection and photodetectors for biomonitoring have seen the most research development, but other fundamental sensors for temperature and humidity have also begun to grow. Recently, flexible gas and electrochemical sensors have attracted a lot of attention from a new real-time monitoring application that uses human breath and perspiration to accurately diagnose presymptomatic states. The development of a low-temperature fabrication process of ceramic film sensors and related components will complete the chemically stable and reliable free-form sensing devices by satisfying the demands that can only be addressed by flexible metal and organic components.

Development and Characteristics of Multipurpose Transparent Polyurethane Film

In industry, recent research developments include flexible films and foldable films. The next step is the development of stretchable films, and studies are being intensively carried out. Research on the development of stretchable and transparent materials is also increasing greatly. Currently, polydimethylsiloxane (PDMS) is the most commonly used film in the industry. However, PDMS surfaces are hydrophobic, so their use is limited to making materials and compounds with hydrophilic properties. In this study, we developed a transparent polyurethane film that can be used for multiple purposes. A transparency comparison between the transparent polyurethane film and the general polyurethane film was used to verify their future application. The conventional polyurethane films showed a transmittance rate of 2.2 percent, but the transparent polyurethane films achieved a high transmittance rate of 85 percent. To determine whether the film can be realized, we produced a conductive paste using resin for the transparent polyurethane film. In addition, a conductive paste was made based on the material used in the transparent polyurethane film to verify the hardness and reliability of the adhesion of electrodes, and we confirmed this with thermogravimetric analysis (TGA). The transparent polyurethane based paste was made with stretchable electrodes through a screen printing method. The manufactured stretchable electrodes were demonstrated by mechanical and adhesion tests. Finally, a permittivity test was conducted to determine the suitability of the film for application to printed electrodes for antennas in the future. The genetic rate of transparent polyurethane films was better than that of conventional polyurethane films. Moreover, the adhesion of the transparent polyurethane film and stretchable electrodes was as good as that of conventional polyurethane film and stretchable electrodes, and observation by optical microscopy confirmed that the printing performance was also excellent. In addition, the conductive paste made based on the transparent polyurethane film material was cured for 1 hour at 120 °C, and TGA analysis confirmed that both the binders and curing agent responded well in the test for curing the developed stretchable electrodes and transparent polyurethane.

Layer-By-Layer Printing Strategy for High-Performance Flexible Electronic Devices with Low-Temperature Catalyzed Solution-Processed SiO2

Additive printing techniques have been widely investigated for fabricating multilayered electronic devices. In this work, a layer-by-layer printing strategy is developed to fabricate multilayered electronics including 3D conductive circuits and thin-film transistors (TFTs) with low-temperature catalyzed, solution-processed SiO₂ (LCSS) as the dielectric. Ultrafine, ultrasmooth LCSS films can be facilely formed at 90 °C on a wide variety of organic and inorganic substrates, offering a versatile platform to construct complex heterojunction structures with layer-by-layer fashion at microscale. The high-resolution 3D conductive circuits formed with gold nanoparticles inside the LCSS dielectric demonstrate a high-speed response to the transient voltage in less than 1 µs. The TFTs with semiconducting single-wall carbon nanotubes can be operated with the accumulation mode at a low voltage of 1 V and exhibit average field-effect mobility of 70 cm²  V^-1  s^-1 , on/off ratio of 10⁷ , small average hysteresis of 0.1 V, and high yield up to 100% as well as long-term stability, high negative-gate bias stability, and good mechanical stability. Therefore, the layer-by-layer printing strategy with the LCSS film is promising to assemble large-scale, high-resolution, and high-performance flexible electronics and to provide a fundamental understanding for correlating dielectric properties with device performance.

3D Heterogeneous Device Arrays for Multiplexed Sensing Platforms Using Transfer of Perovskites

Despite recent substantial advances in perovskite materials, their 3D integration capability for next-generation electronic devices is limited owing to their inherent vulnerability to heat and moisture with degradation of their remarkable optoelectronic properties during fabrication processing. Herein, a facile method to transfer the patterns of perovskites to planar or nonplanar surfaces using a removable polymer is reported. After fabricating perovskite devices on this removable polymer film, the conformal attachment of this film on target surfaces can place the entire devices on various substrates by removing this sacrificial film. This transfer method enables the formation of a perovskite image sensor array on a soft contact lens, and in vivo tests using rabbits demonstrate its wearability. Furthermore, 3D heterogeneous integration of a perovskite photodetector array with an active-matrix array of pressure-sensitive silicon transistors using this transfer method demonstrates the formation of a multiplexed sensing platform detecting distributions of light and tactile pressure simultaneously.

Layer-Scale and Chip-Scale Transfer Techniques for Functional Devices and Systems: A Review

Hetero-integration of functional semiconductor layers and devices has received strong research interest from both academia and industry. While conventional techniques such as pick-and-place and wafer bonding can partially address this challenge, a variety of new layer transfer and chip-scale transfer technologies have been developed. In this review, we summarize such transfer techniques for heterogeneous integration of ultrathin semiconductor layers or chips to a receiving substrate for many applications, such as microdisplays and flexible electronics. We showed that a wide range of materials, devices, and systems with expanded functionalities and improved performance can be demonstrated by using these technologies. Finally, we give a detailed analysis of the advantages and disadvantages of these techniques, and discuss the future research directions of layer transfer and chip transfer techniques.

Formation of Li2CO3 Nanostructures for Lithium-Ion Battery Anode Application by Nanotransfer Printing

Various high-performance anode and cathode materials, such as lithium carbonate, lithium titanate, cobalt oxides, silicon, graphite, germanium, and tin, have been widely investigated in an effort to enhance the energy density storage properties of lithium-ion batteries (LIBs). However, the structural manipulation of anode materials to improve the battery performance remains a challenging issue. In LIBs, optimization of the anode material is a key technology affecting not only the power density but also the lifetime of the device. Here, we introduce a novel method by which to obtain nanostructures for LIB anode application on various surfaces via nanotransfer printing (nTP) process. We used a spark plasma sintering (SPS) process to fabricate a sputter target made of Li2CO3, which is used as an anode material for LIBs. Using the nTP process, various Li2CO3 nanoscale patterns, such as line, wave, and dot patterns on a SiO2/Si substrate, were successfully obtained. Furthermore, we show highly ordered Li2CO3 nanostructures on a variety of substrates, such as Al, Al2O3, flexible PET, and 2-Hydroxylethyl Methacrylate (HEMA) contact lens substrates. It is expected that the approach demonstrated here can provide new pathway to generate many other designable structures of various LIB anode materials.

Room-temperature synthesis of earth-abundant semiconductor ZnSiN2 on amorphous carbon

This manuscript reports room-temperature one-step synthesis of earth-abundant semiconductor ZnSiN₂ on amorphous carbon substrates using radio frequency reactive magnetron co-sputtering. Transmission Electron Microscopy and Rutherford Backscattering Spectrometry analysis demonstrated that the synthesis has occurred as ZnSiN₂ nanocrystals in the orthorhombic phase, uniformly distributed on amorphous carbon. The technique of large-area deposition on an amorphous substrate can be interesting for flexible electronics technologies. Our results open possibilities for environmentally friendly semiconductor devices, leading to the development of greener technologies.

Multilayered electronic transfer tattoo that can enable the crease amplification effect

Electronic tattoos have great potential in health and movement sensing applications on the skin. However, existing electronic tattoos cannot be conformal, sticky, and multilayered at the same time. Here, we have achieved multilayered integration of the electronic tattoo that is highly stretchable (800%), conformal, and sticky. This electronic tattoo can enable the crease amplification effect, which can amplify the output signal of integrated strain sensors by three times. The tattoo can be transferred to different surfaces and form a firm attachment, where no solvent or heat is needed. The tattoo fabrication is straightforward and scalable; a layer-by-layer strategy and two materials (metal-polymer conductors and the elastomeric block copolymer) are used to fabricate the circuit module with desirable numbers of layers within the tattoo. A three-layered tattoo integrating 1 heater and 15 strain sensors is developed for temperature adjustment, movement monitoring, and remote control of robots.

Van der Waals contacted MoOx staked ZnO/GaN vertical heterostructured ultraviolet light emitting diodes

Since the discovery of two dimensional (2D) materials, there has been a gold rush for van der Waals integrated 2D material heterostructure based optoelectronic devices. Van der Waals integration involves the physical assembly of the components of the device. In the present work, we extended van der Waals integration from 2D materials to three-dimensional (3D) materials, and herein we uniquely designed a van der Waals contacted light emitting diode based on MoO_x staked ZnO/GaN heterostructure. The presence of the MoO_x layer between n-type ZnO and p-type GaN leads to the confinement of electrons and an increase in the electron charge density at n-type ZnO. The n-type MoO_x, a well-known hole injection layer, favors the availability of holes at the ZnO site, leading to the efficient recombination of electrons and holes at the ZnO site, which results in predominant high-intensity UV-EL emission around 380 nm in both forward and reverse bias.

High-performance printed electronics based on inorganic semiconducting nano to chip scale structures

The Printed Electronics (PE) is expected to revolutionise the way electronics will be manufactured in the future. Building on the achievements of the traditional printing industry, and the recent advances in flexible electronics and digital technologies, PE may even substitute the conventional silicon-based electronics if the performance of printed devices and circuits can be at par with silicon-based devices. In this regard, the inorganic semiconducting materials-based approaches have opened new avenues as printed nano (e.g. nanowires (NWs), nanoribbons (NRs) etc.), micro (e.g. microwires (MWs)) and chip (e.g. ultra-thin chips (UTCs)) scale structures from these materials have been shown to have performances at par with silicon-based electronics. This paper reviews the developments related to inorganic semiconducting materials based high-performance large area PE, particularly using the two routes i.e. Contact Printing (CP) and Transfer Printing (TP). The detailed survey of these technologies for large area PE onto various unconventional substrates (e.g. plastic, paper etc.) is presented along with some examples of electronic devices and circuit developed with printed NWs, NRs and UTCs. Finally, we discuss the opportunities offered by PE, and the technical challenges and viable solutions for the integration of inorganic functional materials into large areas, 3D layouts for high throughput, and industrial-scale manufacturing using printing technologies.

Flash Solid-Solid Synthesis of Silicon Oxide Nanorods

1D silicon-based nanomaterials, renowned for their unique chemical and physical properties, have enabled the development of numerous advanced materials and biomedical technologies. Their production often necessitates complex and expensive equipment, requires hazardous precursors and demanding experimental conditions, and involves lengthy processes. Herein, a flash solid-solid (FSS) process is presented for the synthesis of silicon oxide nanorods completed within seconds. The innovative features of this FSS process include its simplicity, speed, and exclusive use of solid precursors, comprising hydrogen-terminated silicon nanosheets and a metal nitrate catalyst. Advanced electron microscopy and X-ray spectroscopy analyses favor a solid-liquid-solid reaction pathway for the growth of the silicon oxide nanorods with vapor-liquid-solid characteristics.

Thermally assisted nanotransfer printing with sub-20-nm resolution and 8-inch wafer scalability

Nanotransfer printing (nTP) has attracted considerable attention due to its good pattern resolution, process simplicity, and cost-effectiveness. However, the development of a large-area nTP process has been hampered by critical reliability issues related to the uniform replication and regular transfer printing of functional nanomaterials. Here, we present a very practical thermally assisted nanotransfer printing (T-nTP) process that can easily produce well-ordered nanostructures on an 8-inch wafer via the use of a heat-rolling press system that provides both uniform pressure and heat. We also demonstrate various complex pattern geometries, such as wave, square, nut, zigzag, and elliptical nanostructures, on diverse substrates via T-nTP. Furthermore, we demonstrate how to obtain a high-density crossbar metal-insulator-metal memristive array using a combined method of T-nTP and directed self-assembly. We expect that the state-of-the-art T-nTP process presented here combined with other emerging patterning techniques will be especially useful for the large-area nanofabrication of various devices.

Conformable Hybrid Systems for Implantable Bioelectronic Interfaces

Conformable bioelectronic systems are promising tools that may aid the understanding of diseases, alleviate pathological symptoms such as chronic pain, heart arrhythmia, and dysfunctions, and assist in reversing conditions such as deafness, blindness, and paralysis. Combining reduced invasiveness with advanced electronic functions, hybrid bioelectronic systems have evolved tremendously in the last decade, pushed by progress in materials science, micro- and nanofabrication, system assembly and packaging, and biomedical engineering. Hybrid integration refers here to a technological approach to embed within mechanically compliant carrier substrates electronic components and circuits prepared with traditional electronic materials. This combination leverages mechanical and electronic performance of polymer substrates and device materials, respectively, and offers many opportunities for man-made systems to communicate with the body with unmet precision. However, trade-offs between materials selection, manufacturing processes, resolution, electrical function, mechanical integrity, biointegration, and reliability should be considered. Herein, prominent trends in manufacturing conformable hybrid systems are analyzed and key design, function, and validation principles are outlined together with the remaining challenges to produce reliable conformable, hybrid bioelectronic systems.

Van der Waals Epitaxy of III-Nitride Semiconductors Based on 2D Materials for Flexible Applications

III-nitride semiconductors have attracted considerable attention in recent years owing to their excellent physical properties and wide applications in solid-state lighting, flat-panel displays, and solar energy and power electronics. Generally, GaN-based devices are heteroepitaxially grown on c-plane sapphire, Si (111), or 6H-SiC substrates. However, it is very difficult to release the GaN-based films from such single-crystalline substrates and transfer them onto other foreign substrates. Consequently, it is difficult to meet the ever-increasing demand for wearable and foldable applications. On the other hand, sp² -bonded two-dimensional (2D) materials, which exhibit hexagonal in-plane lattice arrangements and weakly bonded layers, can be transferred onto flexible substrates with ease. Hence, flexible III-nitride devices can be implemented through such 2D release layers. In this progress report, the recent advances in the different strategies for the growth of III-nitrides based on 2D materials are reviewed, with a focus on van der Waals epitaxy and transfer printing. Various attempts are presented and discussed herein, including the different kinds of 2D materials (graphene, hexagonal boron nitride, and transition metal dichalcogenides) used as release layers. Finally, current challenges and future perspectives regarding the development of flexible III-nitride devices are discussed.

Heterogeneous integration of single-crystalline complex-oxide membranes

Complex-oxide materials exhibit a vast range of functional properties desirable for next-generation electronic, spintronic, magnetoelectric, neuromorphic, and energy conversion storage devices^1-4. Their physical functionalities can be coupled by stacking layers of such materials to create heterostructures and can be further boosted by applying strain^5-7. The predominant method for heterogeneous integration and application of strain has been through heteroepitaxy, which drastically limits the possible material combinations and the ability to integrate complex oxides with mature semiconductor technologies. Moreover, key physical properties of complex-oxide thin films, such as piezoelectricity and magnetostriction, are severely reduced by the substrate clamping effect. Here we demonstrate a universal mechanical exfoliation method of producing freestanding single-crystalline membranes made from a wide range of complex-oxide materials including perovskite, spinel and garnet crystal structures with varying crystallographic orientations. In addition, we create artificial heterostructures and hybridize their physical properties by directly stacking such freestanding membranes with different crystal structures and orientations, which is not possible using conventional methods. Our results establish a platform for stacking and coupling three-dimensional structures, akin to two-dimensional material-based heterostructures, for enhancing device functionalities^8,9.

Evaporated tellurium thin films for p-type field-effect transistors and circuits

There is an emerging need for semiconductors that can be processed at near ambient temperature with high mobility and device performance. Although multiple n-type options have been identified, the development of their p-type counterparts remains limited. Here, we report the realization of tellurium thin films through thermal evaporation at cryogenic temperatures for fabrication of high-performance wafer-scale p-type field-effect transistors. We achieve an effective hole mobility of ~35 cm²V^-1s^-1, on/off current ratio of ~10⁴ and subthreshold swing of 108 mV dec^-1 on an 8-nm-thick film. High-performance tellurium p-type field-effect transistors are fabricated on a wide range of substrates including glass and plastic, further demonstrating the broad applicability of this material. Significantly, three-dimensional circuits are demonstrated by integrating multi-layered transistors on a single chip using sequential lithography, deposition and lift-off processes. Finally, various functional logic gates and circuits are demonstrated.

Stimulus Responsive 3D Assembly for Spatially Resolved Bifunctional Sensors

3D electronic/optoelectronic devices have shown great potentials for various applications due to their unique properties inherited not only from functional materials, but also from 3D architectures. Although a variety of fabrication methods including mechanically guided assembly have been reported, the resulting 3D devices show no stimuli-responsive functions or are not free standing, thereby limiting their applications. Herein, the stimulus responsive assembly of complex 3D structures driven by temperature-responsive hydrogels is demonstrated for applications in 3D multifunctional sensors. The assembly driving force, compressive buckling, arises from the volume shrinkage of the responsive hydrogel substrates when they are heated above the lower critical solution temperature. Driven by the compressive buckling force, the 2D-formed membrane materials, which are pre-defined and selectively bonded to the substrates, are then assembled to 3D structures. They include "tent," "tower," "two-floor pavilion," "dome," "basket," and "nested-cages" with delicate geometries. Moreover, the demonstrated 3D bifunctional sensors based on laser induced graphene show capability of spatially resolved tactile sensing and temperature sensing. These multifunctional 3D sensors would open new applications in soft robotics, bioelectronics, micro-electromechanical systems, and others.

High-Resolution 3D Printing of Freeform, Transparent Displays in Ambient Air

Direct 3D printing technologies to produce 3D optoelectronic architectures have been explored extensively over the last several years. Although commercially available 3D printing techniques are useful for many applications, their limits in printable materials, printing resolutions, or processing temperatures are significant challenges for structural optoelectronics in achieving fully 3D-printed devices on 3D mechanical frames. Herein, the production of active optoelectronic devices with various form factors using a hybrid 3D printing process in ambient air is reported. This hybrid 3D printing system, which combines digital light processing for printing 3D mechanical architectures and a successive electrohydrodynamic jet for directly printing transparent pixels of organic light-emitting diodes at room temperature, can create high-resolution, transparent displays embedded inside arbitrarily shaped, 3D architectures in air. Also, the demonstration of a 3D-printed, eyeglass-type display for a wireless, augmented reality system is an example of another application. These results represent substantial progress in the development of next-generation, freeform optoelectronics.

Contrast-Variation Time-Resolved Small-Angle Neutron Scattering Analysis of Oil-Exchange Kinetics Between Oil-in-Water Emulsions Stabilized by Anionic Surfactants

Contrast-variation time-resolved small-angle neutron scattering (CV-SANS) was used to examine oil-exchange kinetics between identical mixtures of hydrogenated/deuterated hexadecane emulsion systems. Oil-exchange rates were estimated by transforming recorded scattering profiles to a relaxation function and by fitting to exponential decay models. We find that the oil-exchange process was accelerated when the droplets were stabilized by anionic surfactants even at concentrations well below the surfactant critical micelle concentration. Moreover, the exchange rate was not significantly accelerated when surfactant micelles were present. This suggests that micellar-mediated transport mechanisms do not play the dominant role in these systems. Screening electrostatic repulsion by increasing the ionic strength of the medium also had a negligible effect on oil-exchange kinetics. In contrast, the use of oils with shorter alkane chain lengths (e.g., dodecane), having a higher solubility in water, significantly accelerated rates of oil transport between droplets. Oil-transport rates for hexadecane were also found to increase with temperature and to follow Arrhenius behavior. These results were rationalized as an increase in the droplet-collision frequency due to Brownian motion that results in direct oil transport without irreversible coalescence. Thus, primary mechanisms for oil exchange in insoluble anionic surfactant-stabilized emulsion systems are hypothesized to be through direct emulsion contact, reversible coalescence, and/or direct oil permeation through thin liquid films. CV-SANS is also demonstrated as a powerful technique for the study of transport kinetics in all kinds of emulsion systems.

Feasibility Study of Single-Crystal Si Island Manufacturing by Microscale Printing of Nanoparticles and Laser Crystallization

Nonvacuum printing of single crystals would be ideal for high-performance functional device (such as electronics) fabrication yet challenging for most materials, especially for inorganic semiconductors. Currently, the printed films are dominant in amorphous, polycrystalline, or nanoparticle films. In this article, manufacturing of single-crystal silicon micro/nano-islands is attempted. Different from traditional vapor deposition for silicon thin-film preparation, silicon nanoparticle ink was aerosol-printed followed by confined laser melting and crystallization, allowing potential fabrication of single-crystal silicon micro/nano-islands. It is also shown that as-fabricated Si islands can be transfer-printed onto polymer substrates for potential application of flexible electronics. The additive nature of this technique suggests a scalable and economical approach for high-crystallinity semiconductor printing.

Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches

The miniaturization of electronics has been an important topic of study for several decades. The established roadmaps following Moore's Law have encountered bottlenecks in recent years, as planar processing techniques are already close to their physical limits. To bypass some of the intrinsic challenges of planar technologies, more and more efforts have been devoted to the development of 3D electronics, through either direct 3D fabrication or indirect 3D assembly. Recent research efforts into direct 3D fabrication have focused on the development of 3D transistor technologies and 3D heterogeneous integration schemes, but these technologies are typically constrained by the accessible range of sophisticated 3D geometries and the complexity of the fabrication processes. As an alternative route, 3D assembly methods make full use of mature planar technologies to form predefined 2D precursor structures in the desired materials and sizes, which are then transformed into targeted 3D mesostructures by mechanical deformation. The latest progress in the area of micro/nanoscale 3D assembly, covering the various classes of methods through rolling, folding, curving, and buckling assembly, is discussed, focusing on the design concepts, principles, and applications of different methods, followed by an outlook on the remaining challenges and open opportunities.

A Novel Preparation Method of Electrically Conductive Adhesives by Powder Spraying Process

In a conventional electrically conductive adhesive (ECA) preparation process, typical ECAs are made by adding an appropriate amount of electrically conductive fillers, such as silver, into a polymer matrix, such as epoxy resin, to form a uniformly dispersed mixture by mixing and stirring operations. However, during the preparation process, secondary pollution and mass loss are caused by the vigorous mixture process. At the same time, the stirring operation introduces many small and stable bubbles, which affect the electrical conductivity of the ECAs. In light of these problems with the conventional preparation of ECAs, we developed a novel ECA preparation method that employs a powder spraying process: silver flakes are sprayed into the epoxy resin with a certain mass fraction to form formulated pastes. The as-prepared ECAs exhibited excellent properties compared with those prepared by the conventional process. This proves that the powder spraying process is feasible and superior to the conventional process.

Droplet-Mediated Deterministic Microtransfer Printing: Water as a Temporary Adhesive

Deterministic transfer printing of solid objects has been introduced and demonstrated, where capillary force based on water droplet has been utilized. Droplets on pickup head form capillary bridges with chips to be picked, where the capillarity provides enough force to grip or lift the chip. Release or printing of chips can be achieved by simply drying droplet while the chip is in contact with receiver substrate. That is, water droplet acts as a temporary adhesive, adheres onto solid chip by capillary force, and releases it upon drying. The technique has unique features such as self-alignment during pickup, self-correction on pickup head by short exposure to water mist, and pickup capability of solids having a nonflat, corrugated surface, all of which originated from the fluidic nature of water droplet. The technique has been successfully applied for the fabrication of stretchable micro-light-emitting diode chip arrays. The proposed technique can find wide applications in many fields such as displays, sensors, printed electronics, photovoltaics, etc.

Transfer Printing and its Applications in Flexible Electronic Devices

Flexible electronic systems have received increasing attention in the past few decades because of their wide-ranging applications that include the flexible display, eyelike digital camera, skin electronics, and intelligent surgical gloves, among many other health monitoring devices. As one of the most widely used technologies to integrate rigid functional devices with elastomeric substrates for the manufacturing of flexible electronic devices, transfer printing technology has been extensively studied. Though primarily relying on reversible interfacial adhesion, a variety of advanced transfer printing methods have been proposed and demonstrated. In this review, we first summarize the characteristics of a few representative methods of transfer printing. Next, we will introduce successful demonstrations of each method in flexible electronic devices. Moreover, the potential challenges and future development opportunities for transfer printing will then be briefly discussed.

Additive Manufacturing: Applications and Directions in Photonics and Optoelectronics

The combination of materials with targeted optical properties and of complex, 3D architectures, which can be nowadays obtained by additive manufacturing, opens unprecedented opportunities for developing new integrated systems in photonics and optoelectronics. The recent progress in additive technologies for processing optical materials is here presented, with emphasis on accessible geometries, achievable spatial resolution, and requirements for printable optical materials. Relevant examples of photonic and optoelectronic devices fabricated by 3D printing are shown, which include light-emitting diodes, lasers, waveguides, optical sensors, photonic crystals and metamaterials, and micro-optical components. The potential of additive manufacturing applied to photonics and optoelectronics is enormous, and the field is still in its infancy. Future directions for research include the development of fully printable optical and architected materials, of effective and versatile platforms for multimaterial processing, and of high-throughput 3D printing technologies that can concomitantly reach high resolution and large working volumes.

Hierarchical patterns with sub-20 nm pattern fidelity via block copolymer self-assembly and soft nanotransfer printing

We describe the development of a technique to transfer micrometer patterns of organic thin films with sub-50 nm edge resolution and sub-20 nm pattern fidelity.

Mechanically Guided Assembly of Monolithic Three-Dimensional Structures from Elastomer Composites

Mechanically guided assembly is considered a facile and scalable methodology for fabrication of three-dimensional (3D) structures. However, most of the previous methods require multistep processes for bonding bi- or multilayers and only result in non-freestanding 3D structures because of usage of a supporting elastomer substrate. Herein, we report a functional elastomer composite that can be transformed to a freestanding and monolithic 3D structure driven by the mechanically guided assembly. Photolithography can be used to selectively tune the mechanical properties of UV-exposed regions which exhibit enhanced ductility compared with the nonexposed regions. Thus, a gradient of the residual strain in the thickness direction makes the films assemble into 3D structures. These 3D structures are also predicted by our computational models using finite element simulations, which yields a reasonable agreement with the experiments. The systematically designed 2D structures with varied patterns can be transformed to various 3D structures with the control of the residual strain gradient, via key processing parameters including pre-strain, film thickness, and UV exposure time. By integrating different active electronic components on the fabricated 3D structures, potential applications of this 3D platform in electronics were demonstrated. This study offers a unique capability in constructing monolithic and freestanding 3D assembly, paving new routes to many applications such as wearable electronics, smart textiles, soft robotics, and structural health monitoring.

Bendable Single Crystal Silicon Nanomembrane Thin Film Transistors with Improved Low-Temperature Processed Metal/n-Si Ohmic Contact by Inserting TiO₂ Interlayer

Bendable single crystal silicon nanomembrane thin film transistors (SiNMs TFTs), employing a simple method which can improve the metal/n-Silicon (Si) contact characteristics by inserting the titanium dioxide (TiO₂) interlayer deposited by atomic layer deposition (ALD) at a low temperature (90 °C), are fabricated on ITO/PET flexible substrates. Current-voltage characteristics of titanium (Ti)/insertion layer (IL)/n-Si structures demonstrates that they are typically ohmic contacts. X-ray photoelectron spectroscopy (XPS) results determines that TiO₂ is oxygen-vacancies rich, which may dope TiO₂ and contribute to a lower resistance. By inserting TiO₂ between Ti and n-Si, I_ds of bendable single crystal SiNMs TFTs increases 3⁻10 times than those without the TiO₂ insertion layer. The fabricated bendable devices show superior flexible properties. The TFTs, whose electrical properties keeps almost unchanged in 800 cycles bending with a bending radius of 0.75 cm, obtains the durability in bending test. All of the results confirm that it is a promising method to insert the TiO₂ interlayer for improving the Metal/n-Si ohmic contact in fabrication of bendable single crystal SiNMs TFTs.

Square Column Structure of High Efficiency, Reliable, Uniformly Flexible LED Devices

This study demonstrates that flexible white LEDs, doped with diffusion particles and with a square column structure, have excellent luminosity, uniformity, and bending reliability. This large area (5 cm × 5 cm) square column flexible device had a smaller thickness (2 mm), and enhancements in both luminous efficiency (29.5%) and uniformity (44.6%) compared to the characteristics of the 6 mm reference sample. Optimization of the reflective layer coating for the square column, flexible white LED was achieved with a higher luminous efficiency (171 lm/w) and uniformity (92%). We designed a novel lightning bolt electrode to improve reliability and bendability. After the bending test, the blue flexible LED had a lower bending diameter (10 mm) but more bending circles (increased to 2000 times.

Materials and Devices for Biodegradable and Soft Biomedical Electronics

Biodegradable and soft biomedical electronics that eliminate secondary surgery and ensure intimate contact with soft biological tissues of the human body are of growing interest, due to their emerging applications in high-quality healthcare monitoring and effective disease treatments. Recent systematic studies have significantly expanded the biodegradable electronic materials database, and various novel transient systems have been proposed. Biodegradable materials with soft properties and integration schemes of flexible or/and stretchable platforms will further advance electronic systems that match the properties of biological systems, providing an important step along the path towards clinical trials. This review focuses on recent progress and achievements in biodegradable and soft electronics for biomedical applications. The available biodegradable materials in their soft formats, the associated novel fabrication schemes, the device layouts, and the functionality of a variety of fully bioresorbable and soft devices, are reviewed. Finally, the key challenges and possible future directions of biodegradable and soft electronics are provided.

Validation study of using the free volume approximation to confined thermotropic and lyotropic liquid-crystalline fluids

We examined the accuracy of the free volume approximation (FVA) to calculate the isotropic-nematic (IN) transition properties of thermotropic and lyotropic rods between two parallel hard walls. This approximation has been proposed to ease the calculation of the confined systems. It approximates the free energy of the confined particles with a bulk free energy. It predicts a special point for these two types of liquid crystals where the first-order IN transition changes to the second one by decreasing either the temperature, the density or the pore width. This prediction is in contradiction (in spite of some qualitative agreement) with those of the other publications where the authors note that the discontinuous transition terminates at the critical point when the walls are completely impenetrable.

Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics

Transfer printing of thin-film nanoelectronics from their fabrication wafer commonly requires chemical etching on the sacrifice of wafer but is also limited by defects with a low yield. Here, we introduce a wafer-recyclable, environment-friendly transfer printing process that enables the wafer-scale separation of high-performance thin-film nanoelectronics from their fabrication wafer in a defect-free manner that enables multiple reuses of the wafer. The interfacial delamination is enabled through a controllable cracking phenomenon in a water environment at room temperature. The physically liberated thin-film nanoelectronics can be then pasted onto arbitrary places of interest, thereby endowing the particular surface with desirable add-on electronic features. Systematic experimental, theoretical, and computational studies reveal the underlying mechanics mechanism and guide manufacturability for the transfer printing process in terms of scalability, controllability, and reproducibility.

Recent Advances in Tactile Sensing Technology

Research on tactile sensing technology has been actively conducted in recent years to pave the way for the next generation of highly intelligent devices. Sophisticated tactile sensing technology has a broad range of potential applications in various fields including: (1) robotic systems with tactile sensors that are capable of situation recognition for high-risk tasks in hazardous environments; (2) tactile quality evaluation of consumer products in the cosmetic, automobile, and fabric industries that are used in everyday life; (3) robot-assisted surgery (RAS) to facilitate tactile interaction with the surgeon; and (4) artificial skin that features a sense of touch to help people with disabilities who suffer from loss of tactile sense. This review provides an overview of recent advances in tactile sensing technology, which is divided into three aspects: basic physiology associated with human tactile sensing, the requirements for the realization of viable tactile sensors, and new materials for tactile devices. In addition, the potential, hurdles, and major challenges of tactile sensing technology applications including artificial skin, medical devices, and analysis tools for human tactile perception are presented in detail. Finally, the review highlights possible routes, rapid trends, and new opportunities related to tactile devices in the foreseeable future.