Transfer Printing and its Applications in Flexible Electronic Devices

Wafer-Recyclable, Eco-Friendly, and Multiscale Dry Transfer Printing by Transferable Photoresist for Flexible Epidermal Electronics

Flexible electronics have been of great interest in the past few decades for their wide-ranging applications in health monitoring, human-machine interaction, artificial intelligence, and biomedical engineering. Currently, transfer printing is a popular technology for flexible electronics manufacturing. However, typical sacrificial intermediate layer-based transfer printing through chemical reactions results in a series of challenges, such as time consumption and interface incompatibility. In this paper, we have developed a time-saving, wafer-recyclable, eco-friendly, and multiscale transfer printing method by using a stable transferable photoresist. Demonstration of photoresist with various, high-resolution, and multiscale patterns from the donor substrate of silicon wafer to different flexible polymer substrates without any damage is conducted using the as-developed dry transfer printing process. Notably, by utilizing the photoresist patterns as conformal masks and combining them with physical vapor deposition and dry lift-off processes, we have achieved in situ fabrication of metal patterns on flexible substrates. Furthermore, a mechanical experiment has been conducted to demonstrate the mechanism of photoresist transfer printing and dry lift-off processes. Finally, we demonstrated the application of in situ fabricated electrode devices for collecting electromyography and electrocardiogram signals. Compared to commercially available hydrogel electrodes, our electrodes exhibited higher sensitivity, greater stability, and the ability to achieve long-term health monitoring.

Transfer Printing of Ordered Plasmonic Nanoparticles at Hard and Soft Interfaces with Increased Fidelity and Biocompatibility Supports a Surface Lattice Resonance

Transfer printing, the relocation of structures assembled on one surface to a different substrate by adjusting adhesive forces at the surface-substrate interface, is widely used to print electronic circuits on biological substrates like human skin and plant leaves. The fidelity of original structures must be preserved to maintain the functionality of transfer-printed circuits. This work developed new biocompatible methods to transfer a nanoscale square lattice of plasmon resonant nanoparticles from a lithographed surface onto leaf and glass substrates. The fidelity of the ordered nanoparticles was preserved across a large area in order to yield, for the first time, an optical surface lattice resonance on glass substrates. To effect the transfer, interfacial adhesion was adjusted by using laser induction of plasmons or unmounted adhesive. Optical and confocal laser scanning microscopy showed that submicron spacing of the square lattice was preserved in ≥90% of transfer-printed areas up to 4 mm2. Up to 90% of ordered nanoparticles were transferred, yielding a surface lattice resonance measured by transmission UV-vis spectroscopy.

Ionogels for flexible conductive substrates and their application in biosensing

Ionogels are highly conductive gels made from ionic liquids dispersed in a matrix made of organic or inorganic materials. Ionogels are known for high ionic conductivity, flexibility, high thermal and electrochemical stability. These characteristics make them suitable for sensing and biosensing applications. This review discusses about the two main constituents, ionic liquids and matrix, used to make ionogels and effect of these materials on the characteristics of ionogels. Here, the material properties like mechanical, electrochemical and stability are discussed for both polymer matrix and ionic liquid. We have briefly described about the fabrication methods like 3D printing, sol-gel, blade coating, spin coating, aerosol jet printing etc., used to make films or coating of these ionogels. The advantages and disadvantages of each method are also briefly summarized. Finally, the last section provides a few examples of application of flexible ionogels in areas like wearables, human-machine interface, electronic skin and detection of biological molecules.

"Visualization" Gas-Gas Sensors Based on High Performance Novel MXenes Materials

The detection of toxic, harmful, explosive, and volatile gases cannot be separated from gas sensors, and gas sensors are also used to monitor the greenhouse effect and air pollution. However, existing gas sensors remain with many drawbacks, such as lower sensitivity, lower selectivity, and unstable room temperature detection. Thus, there is an imperative need to find more suitable sensing materials. The emergence of a new 2D layered material MXenes has brought dawn to solve this problem. The multiple advantages of MXenes, namely high specific surface area, enriched terminal functionality groups, hydrophilicity, and good electrical conductivity, make them among the most prolific gas-sensing materials. Therefore, this review paper describes the current main synthesis methods of MXenes materials, and focuses on summarizing and organizing the latest research results of MXenes in gas sensing applications. It also introduces the possible gas sensing mechanisms of MXenes materials on NH3 , NO2 , CH3 , and volatile organic compounds (VOCs). In conclusion, it provides insight into the problems and upcoming challenges of MXenes materials for gas sensing.

Electrohydrodynamic Nanopatterning: A Novel Solvent-Assisted Technique for Unconventional Substrates

Electrohydrodynamic (EHD)-driven patterning is a pioneering lithographic technique capable of replicating and modifying micro/nanostructures efficiently. However, this process is currently restricted to conventional substrates, as it necessitates a uniform and robust electric field over a large area. Consequently, the use of nontraditional substrates, such as those that are flexible, nonflat, or have high insulation, has been notably limited. In our study, we extend the applicability of EHD-driven patterning by introducing a solvent-assisted capillary peel-and-transfer method that allows the successful removal of diverse EHD-induced structures from their original substrates. Compared with the traditional route, our process boasts a success rate close to 100%. The detached structures can then be efficiently transferred to nonconventional substrates, overcoming the limitations of the traditional EHD process. Our method exhibits significant versatility, as evidenced by successful transfer of structures with engineered wettability and patterned structures composed of metals and metal oxides onto nonconventional substrates.

Dry-Transferable Photoresist Enabled Reliable Conformal Patterning for Ultrathin Flexible Electronics

Photolithographic techniques, which are widely used in the silicon-based semiconductor industry, enable the manufacture of high-yield and high-resolution features at the micrometer and nanometer scales. However, conventional photolithographic processes cannot accommodate the micro/nanofabrication of flexible and stretchable electronics. In this study, a microfabrication approach that uses a synthesized, environmentally friendly, and dry-transferable photoresist to enable the reliable conformal manufacturing of thin-film electronics is reported, which is also compatible with the existing cleanroom processes. Photoresists with high-resolution, high-density, and multiscale patterns can be transferred onto various substrates in a defect-free and conformal-contact manner, thus enabling multiple wafer reuses. Theoretical studies are conducted to investigate the damage-free peel-off mechanism of the proposed approach. The in situ fabrication of various electrical components, including ultralight and ultrathin biopotential electrodes, has been demonstrated, which offer lower interfacial impedance, durability, and stability, and the components are applied to collect electromyography signals with superior signal-to-noise ratio (SNR) and quality. Additionally, an exemplary demonstration of a human-machine interface indicates the potential of these electrodes in many emerging applications, including healthcare, sensing, and artificial intelligence.

Formation of Multiscale Pattern Structures by Combined Patterning of Nanotransfer Printing and Laser Micromachining

Various lithography techniques have been widely used for the fabrication of next-generation device applications. Micro/nanoscale pattern structures formed by lithographic methods significantly improve the performance capabilities of the devices. Here, we introduce a novel method that combines the patterning of nanotransfer printing (nTP) and laser micromachining to fabricate multiscale pattern structures on a wide range of scales. Prior to the formation of various nano-in-micro-in-millimeter (NMM) patterns, the nTP process is employed to obtain periodic nanoscale patterns on the target substrates. Then, an optimum laser-based patterning that effectively engraves various nanopatterned surfaces, in this case, spin-cast soft polymer film, rigid polymer film, a stainless still plate, and a Si substrate, is established. We demonstrate the formation of well-defined square and dot-shaped multiscale NMM-patterned structures by the combined patterning method of nTP and laser processes. Furthermore, we present the generation of unusual text-shaped NMM pattern structures on colorless polyimide (CPI) film, showing optically excellent rainbow luminescence based on the configuration of multiscale patterns from nanoscale to milliscale. We expect that this combined patterning strategy will be extendable to other nano-to-micro fabrication processes for application to various nano/microdevices with complex multiscale pattern geometries.

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

Copper (Cu) and tungsten (W) possess exceptional electrical and thermal conductivity properties, making them suitable candidates for applications such as interconnects and thermal conductivity enhancements. Solution-based additive manufacturing (SBAM) offers unique advantages, including patterning capabilities, cost-effectiveness, and scalability among the various methods for manufacturing Cu and W-based films and structures. In particular, SBAM material jetting techniques, such as inkjet printing (IJP), direct ink writing (DIW), and aerosol jet printing (AJP), present a promising approach for design freedom, low material wastes, and versatility as either stand-alone printers or integrated with powder bed-based metal additive manufacturing (MAM). Thus, this review summarizes recent advancements in solution-processed Cu and W, focusing on IJP, DIW, and AJP techniques. The discussion encompasses general aspects, current status, challenges, and recent research highlights. Furthermore, this paper addresses integrating material jetting techniques with powder bed-based MAM to fabricate functional alloys and multi-material structures. Finally, the factors influencing large-scale fabrication and potential prospects in this area are explored.

Flexible Quantum Dot Light-Emitting Device for Emerging Multifunctional and Smart Applications

Quantum dot light-emitting diodes (QLEDs), owing to their exceptional performances in device efficiency, color purity/tunability in the visible region and solution-processing ability on various substrates, become a potential candidate for flexible and ultrathin electroluminescent (EL) lighting and display. Moreover, beyond the lighting and display, flexible QLEDs are enabled with endless possibilities in the era of the internet of things and artificial intelligence by acting as input/output ports in wearable integrated systems. Challenges remain in the development of flexible QLEDs with the goals for high performance, excellent flexibility/even stretchability, and emerging applications. In this paper, the recent developments of QLEDs including quantum dot materials, working mechanism, flexible/stretchable strategies and patterning strategies, and highlight its emerging multifunctional integrations and smart applications covering wearable optical medical devices, pressure-sensing EL devices, and neural smart EL devices, are reviewed. The remaining challenges are also summarized and an outlook on the future development of flexible QLEDs made. The review is expected to offer a systematic understanding and valuable inspiration for flexible QLEDs to simultaneously satisfy optoelectronic and flexible properties for emerging applications.

Nib-Assisted Coaxial Electrohydrodynamic Jet Printing for Nanowires Deposition

This paper presents the concrete design of nanowires under the precise size and morphology that play a crucial role in the practical operation of the micro/nano devices. A straightforward and operative method termed as nib-assistance coaxial electrohydrodynamic (CEHD) printing technology was proposed. It extracts the essence of a nib-assistance electric field intensity to enhance and lessen the internal fluid reflux of the CEHD jet. The experiments were performed to add microparticles into the inner liquid to indicate the liquid flow consistency within the coaxial jet. The reflux in the coaxial jet was observed for the first time in experiments. The nanowires with a minimum size of 70 nm were printed under optimum experimental conditions. The nanopatterns contained aligned nanowires structures with diameters much smaller than the inner diameter of nozzle, relying on the coaxial nib-assisted technique. The printed results revealed that the nib-assisted CEHD printing technique offers a certain level high quality for application of NEMS system.

A Fluorinated Polyimide Based Nano Silver Paste with High Thermal Resistance and Outstanding Thixotropic Performance

Because of high conductivity, acceptable cost and good screen-printing process performance, silver pastes have been extensively used for making flexible electronics. However, there are few reported articles focusing on high heat resistance solidified silver pastes and their rheological properties. In this paper, a fluorinated polyamic acids (FPAA) is synthesized by polymerization of the 4,4'-(hexafluoroisopropylidene) diphthalic anhydride and 3,4'-diaminodiphenylether as monomers in the diethylene glycol monobutyl. The nano silver pastes are prepared by mixing the obtained FPAA resin with nano silver powder. The agglomerated particles caused by nano silver powder are divided and the dispersion of nano silver pastes are improved by three-roll grinding process with low roll gaps. The obtained nano silver pastes possess excellent thermal resistance with 5% weight loss temperature higher than 500 °C. The volume resistivity of cured nano silver paste achieves 4.52 × 10^-7 Ω·m, when the silver content is 83% and the curing temperature is 300 °C. Additionally, the nano silver pastes have high thixotropic performance, which contributes to fabricate the fine pattern with high resolution. Finally, the conductive pattern with high resolution is prepared by printing silver nano pastes onto PI (Kapton-H) film. The excellent comprehensive properties, including good electrical conductivity, outstanding heat resistance and high thixotropy, make it a potential application in flexible electronics manufacturing, especially in high-temperature fields.

Screen-printed highly stretchable and stable flexible electrodes with a negative Poisson's ratio structure for supercapacitors

Flexible power sources are crucial to developing flexible electronic systems; nonetheless, the current poor stretchability and stability of flexible power sources hinder their application in such devices. Accordingly, the stretchability and fatigue stability of flexible power sources are crucial for the practical application of flexible electronic systems. In this work, a flexible electrode with an arc-shaped star concave negative Poisson's ratio (NPR) structure is fabricated through the screen printing process. Using the combination of finite element analysis (FEA) and tensile tests, it is proven that the arc-shaped star concave NPR electrode can effectively reduce the maximum tensile stress and increase the maximum elongation (maximum elongation 140%). Furthermore, the flexible electrodes prepared in this study are assembled into all-solid-state symmetric supercapacitors (SSCs), and their electrochemical properties are tested. The SSC prepared in this study has a high areal capacitance of 243.1 mF cm^-2. It retains 89.25% of its initial capacity after 5000 times of folding and can maintain a stable output even in extreme deformation, which indicates that the SSC prepared in this study has excellent stability. The SSC with the advantages mentioned above obtained in this study is expected to provide new opportunities to develop flexible electronic systems.

Integration of hydrogels in microfabrication processes for bioelectronic medicine: Progress and outlook

Recent research aiming at the development of electroceuticals for the treatment of medical conditions such as degenerative diseases, cardiac arrhythmia and chronic pain, has given rise to microfabricated implanted bioelectronic devices capable of interacting with host biological tissues in synergistic modalities. Owing to their multimodal affinity to biological tissues, hydrogels have emerged as promising interface materials for bioelectronic devices. Here, we review the state-of-the-art and forefront in the techniques used by research groups for the integration of hydrogels into the microfabrication processes of bioelectronic devices, and present the manufacturability challenges to unlock their further clinical deployment.

Transfer printing technologies for soft electronics

Soft electronics have received increasing attention in recent years, owing to their wide range of applications in dynamic nonplanar surface integration electronics that include skin electronics, implantable devices, and soft robotics. Transfer printing is a widely used assembly technology for micro- and nano-fabrication, which enables the integration of functional devices with flexible or elastomeric substrates for the manufacturing of soft electronics. Through advanced materials and process design, numerous impressive studies related to transfer printing strategies and applications have been proposed. Herein, a discussion of transfer printing technologies toward soft electronics in terms of mechanisms and example demonstrations is provided. Moreover, the perspectives on the potential challenges and future directions of this field are briefly discussed.

Extrusion-Based 3D Printing of Stretchable Electronic Coating for Condition Monitoring of Suction Cups

Suction cups (SCs) are used extensively by the industrial sector, particularly for a wide variety of automated material-handling applications. To enhance productivity and reduce maintenance costs, an online supervision system is essential to check the status of SCs. This paper thus proposes an innovative method for condition monitoring of SCs coated with printed electronics whose electrical resistance is supposed to be correlated with the mechanical strain. A simulation model is first examined to observe the deformation of SCs under vacuum compression, which is needed for the development of sensor coating thanks to the 3D printing process. The proposed design involves three circle-shaped sensors, two for the top and bottom bellows (whose mechanical strains are revealed to be the most significant), and one for the lip (small strain, but important stress that might provoke wear and tear in the long term). For the sake of simplicity, practical measurement is performed on 2D samples coated with two different conductive inks subjected to unidirectional tensile loading. Graphical representations together with analytical models of both linear and nonlinear piezoresistive responses allows for the characterization of the inks' behavior under several conditions of displacement and speed inputs. After a comparison of the two inks, the most appropriate is selected as a consequence of its excellent adhesion and stretchability, which are essential criteria to meet the target field. Room temperature extrusion-based 3D printing is then investigated using a motorized 3D Hyrel printer with a syringe-extrusion modular system. Design optimization is finally carried out to enhance the surface detection of sensitive elements while minimizing the effect of electrodes. Although several issues still need to be further considered to match specifications imposed by our industrial partner, the achievement of this work is meaningful and could pave the way for a new generation of SCs integrated with smart sensing devices. The 3D printing of conductive ink directly on the cup's curving surface is a true challenge, which has been demonstrated, for the first time, to be technically feasible throughout the additive manufacturing (AM) process.

Studies on the Mechanical Models and Behaviors for the Stamp/Film Interface in Microtransfer Printing

The adhesion/delamination characteristics at the stamp/film interface are critical for the efficiency of film microtransfer printing technology. To predict and regulate the interface mechanical behaviors, finite element models based on the J-integral, Virtual Crack Closure Technology (VCCT), and the cohesive zone method (CZM) were established and compared. Then, the effects of pulling speed and interface parameters on the pull-off force, which is used to characterize the interface adhesion strength, were investigated. Comparisons between the simulation results and previous experimental results demonstrated that the model based on the CZM was more applicable than the models based on the J-integral and VCCT in analyzing the adhesion/delamination behaviors of the stamp/film interface. Furthermore, the increase in pulling speed could enlarge the pull-off force for the viscoelastic stamp/film interface, while it had no influence on the pull-off force for the elastic stamp/film interface. In addition, a larger normal strength and normal fracture energy resulted in a larger pull-off force, which was beneficial to the realization of the picking-up process in microtransfer printing.

Contact Printing of Multilayered Thin Films with Shape Memory Polymers

This study describes a method for transfer printing microarrays of multilayered organic-inorganic thin films using shape memory printing stamps and microstructured donor substrates. By applying the films on the microstructured donor substrates during physical vapor deposition and modulating the interfacial adhesion using a shape memory elastomer during printing, this method achieves (1) high lateral and feature-edge resolution and (2) high transfer efficiency from the donor to the receiver substrate. For demonstration, polyurethane-acrylate stamps and silicon/silicon oxide donor substrates were used in the large-area transfer printing of organic-inorganic thin-film stacks with micrometer lateral dimensions and sub-200 nm thickness.

Inkjet-Printed Silver Nanowire Ink for Flexible Transparent Conductive Film Applications

The development of flexible transparent conductive electrodes has been considered as a key issue in realizing flexible functional electronics. Inkjet printing provides a new opportunity for the manufacture of FFE due to simple process, cost-effective, environmental friendliness, and digital method to circuit pattern. However, obtaining high concentration of inkjet- printed silver nanowires (AgNWs) conductive ink is a great challenge because the high aspect ratio of AgNWs makes it easy to block the jetting nozzle. This study provides an inkjet printing AgNWs conductive ink with low viscosity and high concentration of AgNWs and good printing applicability, especially without nozzle blockage after printing for more than 4 h. We discussed the effects of the components of the ink on surface tension, viscosity, contact angle as well as droplet spreading behavior. Under the optimized process and formulation of ink, flexible transparent conductive electrode with a sheet resistance of 32 Ω·sq⁻¹–291 nm·sq⁻¹ and a transmittancy at 550 nm of 72.5–86.3% is achieved. We investigated the relationship between the printing layer and the sheet resistance and the stability of the sheet resistance under a bending test as well as the infrared thermal response of the AgNWs–based flexible transparent conductive electrode. We successfully printed the coupling electrodes and demonstrated the excellent potential of inkjet-printed AgNWs—based flexible transparent conductive electrode for developing flexible functional electronics.

Strain-Engineered Adhesion and Reversible Transfer Printing of Water Droplets and Nanoparticles

Transfer printing has been playing a crucial role in the fabrication of various functional devices. In spite of the extensive progress in technology, challenges are remaining, in the aspects of accuracy, efficiency, and adaptivity. Here, we propose a reversible transfer printing technique of tailoring adhesion by selectively stretching the surfaces. Through molecular dynamics simulations, we demonstrate the transfer of nanoscale substances such as water droplets, colloids, and nanoparticles between two graphene surfaces with strains switched on and off. We reveal the mechanism of the dynamic behaviors by analyzing the energies and driving forces of the substances during the process of transfer. The work not only advances the fundamental understanding of adhesion but also can inspire applications in the design of next-generation electronic and biomedical devices.

Investigations on the Adhesive Contact Behaviors between a Viscoelastic Stamp and a Transferred Element in Microtransfer Printing

Microtransfer printing is a sophisticated technique for the heterogeneous integration of separately fabricated micro/nano-elements into functional systems by virtue of an elastomeric stamp. One important factor influencing the capability of this technique depends on the adhesion between the viscoelastic stamp and the transferred element. To provide theoretical guidance for the control of adhesion in the transfer printing process, a finite element model for the viscoelastic adhesive contact between a polydimethylsiloxane (PDMS) stamp and a spherical transferred element was established, in which the adhesive interaction was modeled by the Lennard-Jones surface force law. Effects of the unloading velocity, preload, and thermodynamic work of adhesion on the adhesion strength, characterized by the pull-off force, were examined for a loading-dwelling-unloading history. Simulation results showed that the unloading path deviated from the loading path due to the viscoelastic property of the PDMS stamp. The pull-off force increased with the unloading velocity, and the increasing ratio was large at first and then became low. Furthermore, the influence of the preload on increasing the pull-off force was more significant under larger unloading velocity than that under smaller unloading velocity. In addition, the pull-off force increased remarkably with the thermodynamic work of adhesion at a fixed maximum approach.

Transfer Printing of Freestanding Nanoassemblies: A Route to Membrane Resonators with Adjustable Prestress

Freestanding nanoassemblies represent a new class of functional materials with highly responsive optical, electrical, and mechanical properties. Hence, they are well-suited for applications in advanced sensor devices. Here, it is shown that transfer printing enables the well-controlled fabrication of freestanding membranes from layered nanoassemblies: Using a polydimethylsiloxane (PDMS) stamp, thin films (thickness: ∼45 to ∼51 nm) of 1,6-hexanedithiol cross-linked gold nanoparticles (diameter: ∼3.9 ± 0.8 nm) were transferred onto surface-oxidized silicon substrates featuring square microcavities with edge lengths of ∼78 μm. After adjusting the contact pressure to 1.8 bar, intact membranes were printed in yields of ∼70%. The prestress of printed membranes was determined by measuring their resonance frequencies under electrostatic actuation. In general, the prestress values were in the ∼10 MPa range with standard deviations below 10% for parallel printed resonators. The deviations in average prestress between resonators printed onto different substrates were 21% or less. By increasing the temperature during the final transfer step from 5 to 48 °C, it was possible to tune the average prestress from ∼14 to ∼28 MPa. This effect was attributed to the pronounced thermal expansion of the PDMS stamp. Finally, by transfer printing layered films of graphene oxide/silk fibroin (GO/SF), it is shown that the approach can be adapted for the fabrication of freestanding membranes from very different nanomaterials.

Controlled self-assembly of block copolymers in printed sub-20 nm cross-bar structures

Directed self-assembly (DSA) of block copolymers (BCPs) has garnered much attention due to its excellent pattern resolution, simple process, and good compatibility with many other lithography methods for useful nanodevice applications. Here, we present a BCP-based multiple nanopatterning process to achieve three-dimensional (3D) pattern formation of metal/oxide hybrid nanostructures. We employed a self-assembled sub-20 nm SiO _x line pattern as a master mold for nanotransfer printing (nTP) to generate a cross-bar array. By using the transfer-printed cross-bar structures as BCP-guiding templates, we can obtain well-ordered BCP microdomains in the distinct spaces of the nanotemplates through a confined BCP self-assembly process. We also demonstrate the morphological evolution of a cylinder-forming BCP by controlling the BCP film thickness, showing a clear morphological transition from cylinders to spheres in the designated nanospaces. Furthermore, we demonstrate how to control the number of BCP spheres within the cross-bar 3D pattern by adjusting the printing angle of the multiple nTP process to provide a suitable area for spontaneous BCP accommodation. This multiple-patterning-based approach is applicable to useful 3D nanofabrication of various devices with complex hybrid nanostructures.

What Is Driving the Growth of Inorganic Glass in Smart Materials and Opto-Electronic Devices?

Inorganic glass is a transparent functional material and one of the few materials that keeps leading innovation. In the last decades, inorganic glass was integrated into opto-electronic devices such as optical fibers, semiconductors, solar cells, transparent photovoltaic devices, or photonic crystals and in smart materials applications such as environmental, pharmaceutical, and medical sensors, reinforcing its influence as an essential material and providing potential growth opportunities for the market. Moreover, inorganic glass is the only material that is 100% recyclable and can incorporate other industrial offscourings and/or residues to be used as raw materials. Over time, inorganic glass experienced an extensive range of fabrication techniques, from traditional melting-quenching (with an immense diversity of protocols) to chemical vapor deposition (CVD), physical vapor deposition (PVD), and wet chemistry routes as sol-gel and solvothermal processes. Additive manufacturing (AM) was recently added to the list. Bulks (3D), thin/thick films (2D), flexible glass (2D), powders (2D), fibers (1D), and nanoparticles (NPs) (0D) are examples of possible inorganic glass architectures able to integrate smart materials and opto-electronic devices, leading to added-value products in a wide range of markets. In this review, selected examples of inorganic glasses in areas such as: (i) magnetic glass materials, (ii) solar cells and transparent photovoltaic devices, (iii) photonic crystal, and (iv) smart materials are presented and discussed.

A Study about Schottky Barrier Height and Ideality Factor in Thin Film Transistors with Metal/Zinc Oxide Nanoparticles Structures Aiming Flexible Electronics Application

Zinc oxide nanoparticles (ZnO NP) used for the channel region in inverted coplanar setup in Thin Film Transistors (TFT) were the focus of this study. The regions between the source electrode and the ZnO NP and the drain electrode were under investigation as they produce a Schottky barrier in metal-semiconductor interfaces. A more general Thermionic emission theory must be evaluated: one that considers both metal/semiconductor interfaces (MSM structures). Aluminum, gold, and nickel were used as metallization layers for source and drain electrodes. An organic-inorganic nanocomposite was used as a gate dielectric. The TFTs transfer and output characteristics curves were extracted, and a numerical computational program was used for fitting the data; hence information about Schottky Barrier Height (SBH) and ideality factors for each TFT could be estimated. The nickel metallization appears with the lowest SBH among the metals investigated. For this metal and for higher drain-to-source voltages, the SBH tended to converge to some value around 0.3 eV. The developed fitting method showed good fitting accuracy even when the metallization produced different SBH in each metal-semiconductor interface, as was the case for gold metallization. The Schottky effect is also present and was studied when the drain-to-source voltages and/or the gate voltage were increased.

Layer-Scale and Chip-Scale Transfer Techniques for Functional Devices and Systems: A Review

Hetero-integration of functional semiconductor layers and devices has received strong research interest from both academia and industry. While conventional techniques such as pick-and-place and wafer bonding can partially address this challenge, a variety of new layer transfer and chip-scale transfer technologies have been developed. In this review, we summarize such transfer techniques for heterogeneous integration of ultrathin semiconductor layers or chips to a receiving substrate for many applications, such as microdisplays and flexible electronics. We showed that a wide range of materials, devices, and systems with expanded functionalities and improved performance can be demonstrated by using these technologies. Finally, we give a detailed analysis of the advantages and disadvantages of these techniques, and discuss the future research directions of layer transfer and chip transfer techniques.

Stretchable gas sensors for detecting biomarkers from humans and exposed environments

The recent advent of stretchable gas sensors demonstrates their capabilities to detect not only gaseous biomarkers from the human body but also toxic gas species from the exposed environment. To ensure accurate gas detection without device breakdown from the mechanical deformations, the stretchable gas sensors often rely on the direct integration of gas-sensitive nanomaterials on the stretchable substrate or fibrous network, as well as being configured into stretchable structures. The nanomaterials in the forms of nanoparticles, nanowires, or thin-films with nanometer thickness are explored for a variety of sensing materials. The commonly used stretchable structures in the stretchable gas sensors include wrinkled structures from a pre-strain strategy, island-bridge layouts or serpentine interconnects, strain isolation approaches, and their combinations. This review aims to summarize the recent advancement in novel nanomaterials, sensor design innovations, and new fabrication approaches of stretchable gas sensors.

Hydroxypropyl Cellulose Adhesives for Transfer Printing of Carbon Nanotubes and Metallic Nanostructures

Transfer printing is one of the key nanofabrication techniques for the large-scale manufacturing of complex device architectures. It provides a cost-effective and high-throughput route for the integration of independently processed materials into spatially tailored architectures. Furthermore, this method enables the fabrication of flexible and curvilinear devices, paving the way for the fabrication of a new generation of technologies for optics, electronics, and biomedicine. In this work, hydroxypropyl cellulose (HPC) membranes are used as water soluble adhesives for transfer printing processes with improved performance and versatility compared to conventional silicone alternatives. The high-water solubility and excellent mechanical properties of HPC facilitate transfer printing with high yield for both metal and carbon nanotubes (CNTs) inks. In the case of metal inks, crack-free stripping of silver films and the simple fabrication of Moiré Plasmonic architectures of different geometries are demonstrated. Furthermore, HPC membranes are used to transfer print carbon nanotube films with different thicknesses and up to 77% transparency in the visible and near infrared region with potential applications as transparent conductive substrates. Finally, the use of prepatterned HPC membranes enables nanoscale patterning of CNT with feature resolution down to 1 µm.

Sulpho-Salicylic Acid Grafted to Ferrite Nanoparticles for n-Type Organic Semiconductors

A disadvantage of the use of pentacene and typical organic materials in electronics is that their precursors are toxic for manufacturers and the environment. To the best of our knowledge, this is the first report of an n-type non-toxic semiconductor for organic transistors that uses sulpho-salicylic acid—a stable, electron-donating compound with reduced toxicity—grafted on a ferrite core–shell and a green synthesis method. The micro-physical characterization indicated a good dispersion stability and homogeneity of the obtained nanofilms using the dip-coating technique. The in-situ electrical characterization was based on a point-contact transistor configuration, and the increase in the drain current as the positive gate voltage increased proved the functionality of the n-type semiconductor.

The Current Trends of Biosensors in Tissue Engineering

Biosensors constitute selective, sensitive, and rapid tools for disease diagnosis in tissue engineering applications. Compared to standard enzyme-linked immunosorbent assay (ELISA) analytical technology, biosensors provide a strategy to real-time and on-site monitor micro biophysiological signals via a combination of biological, chemical, and physical technologies. This review summarizes the recent and significant advances made in various biosensor technologies for different applications of biological and biomedical interest, especially on tissue engineering applications. Different fabrication techniques utilized for tissue engineering purposes, such as computer numeric control (CNC), photolithographic, casting, and 3D printing technologies are also discussed. Key developments in the cell/tissue-based biosensors, biomolecular sensing strategies, and the expansion of several biochip approaches such as organs-on-chips, paper based-biochips, and flexible biosensors are available. Cell polarity and cell behaviors such as proliferation, differentiation, stimulation response, and metabolism detection are included. Biosensors for diagnosing tissue disease modes such as brain, heart, lung, and liver systems and for bioimaging are discussed. Finally, we discuss the challenges faced by current biosensing techniques and highlight future prospects of biosensors for tissue engineering applications.

Quantitative peel test for thin films/layers based on a coupled parametric and statistical study

The adhesion strength of thin films is critical to the durability of micro and nanofabricated devices. However, current testing methods are imprecise and do not produce quantitative results necessary for design specifications. The most common testing methods involve the manual application and removal of unspecified tape. This overcome many of the challenges of connecting to thin films to test their adhesion properties but different tapes, variation in manual application, and poorly controlled removal of tape can result in wide variation in resultant forces. Furthermore, the most common tests result in a qualitative ranking of film survival, not a measurement with scientific units. This paper presents a study into application and peeling parameters that can cause variation in the peeling force generated by tapes. The results of this study were then used to design a test methodology that would control the key parameters and produced repeatable quantitative measurements. Testing using the resulting method showed significant improvement over more standard methods, producing measured results with reduced variation. The new method was tested on peeling a layer of paint from a PTFE backing and was found to be sensitive enough to register variation in force due to differing peeling mechanisms within a single test.

Transfer of transition-metal dichalcogenide circuits onto arbitrary substrates for flexible device applications

Transition-metal dichalcogenide (TMD) materials with two-dimensional layered structures and stable surfaces are well suited for transparent and flexible device applications. In order to completely utilize the advantages of thickness control and fabrication of various heterostructure stacks, we proposed a transfer method of TMD field-effect transistors (FETs) and TMD complementary metal-oxide-semiconductor (CMOS) circuits from a Si/SiO2 substrate to a flexible substrate. We compared the characteristics of transferred MoS2 and WSe2 FETs with those of the corresponding devices transferred after channel passivation with an Al2O3 layer on a flexible substrate. Al2O3 passivation further stabilized the transfer of the entire device with electrodes. A CMOS circuit with MoS2 and WSe2 materials could be successfully transferred to a polyethylene terephthalate substrate after the channel passivation. This implies that TMD circuits can be easily fabricated on polymer substrates, which makes them suitable for use in semiconductor processes, for various applications.

Fabrication of High-resolution Graphene-based Flexible Electronics via Polymer Casting

In this study, a novel method based on the transfer of graphene patterns from a rigid or flexible substrate onto a polymeric film surface via solvent casting was developed. The method involves the creation of predetermined graphene patterns on the substrate, casting a polymer solution, and directly transferring the graphene patterns from the substrate to the surface of the target polymer film via a peeling-off method. The feature sizes of the graphene patterns on the final film can vary from a few micrometers (as low as 5 µm) to few millimeters range. This process, applied at room temperature, eliminates the need for harsh post-processing techniques and enables creation of conductive graphene circuits (sheet resistance: ~0.2 kΩ/sq) with high stability (stable after 100 bending and 24 h washing cycles) on various polymeric flexible substrates. Moreover, this approach allows precise control of the substrate properties such as composition, biodegradability, 3D microstructure, pore size, porosity and mechanical properties using different film formation techniques. This approach can also be used to fabricate flexible biointerfaces to control stem cell behavior, such as differentiation and alignment. Overall, this promising approach provides a facile and low-cost method for the fabrication of flexible and stretchable electronic circuits.