Development of Solution-Processable, Optically Transparent Polyimides with Ultra-Low Linear Coefficients of Thermal Expansion

Monomer Dependence of Colorless and Transparent Polyimide Films: Thermomechanical Properties, Optical Transparency, and Solubility

Six poly(amic acid)s (PAAs) were synthesized by reacting bis(3-aminophenyl) sulfone with various dianhydride monomers such as pyromellitic dianhydride, 4,4'-biphthalic anhydride, dicyclohexyl-3,4,3',4'-tetracarboxylic dianhydride, 4,4'-oxidiphthalic anhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride, and 4,4'-(hexafluoroisopropylidene) diphthalic anhydride. These PAAs were then converted to polyimide (PI) films by thermal imidization at various temperatures. To obtain colorless and transparent PI (CPI), the dianhydride monomer used in this study had an overall bent structure, a structure containing a strong electron-withdrawing -CF3 substituent or an alicyclic ring. In addition, some monomers contained ether or ketone functional groups in their bent structures. The thermomechanical properties, optical transparency, and solubility of CPI films with six different dianhydride monomer structures were investigated, and the correlation between the monomer structure and CPI film properties was clarified. Overall, CPI with an aromatic main chain structure or a linear structure had excellent thermal and mechanical properties. In contrast, CPI with a bent structure containing functional groups or substituents in the main chain exhibited excellent optical transparency and solubility.

Preparation and Properties of Mechanically Robust, Colorless, and Transparent Aramid Films

In this study, various diamine monomers were used to synthesize aramid polymer films via a low-temperature solution condensation reaction with diacid chloride. For diamines with relatively high basicity, the reaction system became opaque because amine salt formation inhibited polymer synthesis. Meanwhile, low-basicity diamines with strong electron-withdrawing groups, such as CF3 and sulfone, were smoothly polymerized without amine salt formation to provide highly viscous solutions. The acid byproduct HCl generated during polymerization was removed by adding propylene oxide to the reaction vessel and converting the acid into highly volatile inert substances. The resulting solutions were used as varnishes without any additional purification, and polymer films with an excellent appearance were easily obtained through a conventional casting and convection drying process. The films neither tore nor broke when pulled or bent by hand; furthermore, even when heated up to 400 °C, they did not decompose or melt. Moreover, polymers prepared from 2,2-bis(trifluoromethyl)benzidine (TFMB) and bis(4-aminophenyl)sulfone (pAPS) did not exhibit glass transition until decomposition. The prepared polymer films showed a high elastic modulus of more than 4.1 GPa and a high tensile strength of more than 52 MPa. In particular, TFMB-, pAPS-, and 2,2-bis(4-aminophenyl)hexafluoropropane-based polymer films were colorless and transparent, with very high light transmittances of 95%, 96%, and 91%, respectively, at 420 nm and low yellow indexes of 2.4, 1.9, and 4.3, respectively.

High-sensitivity humidity and temperature sensor by cascading a polyimide coated long period fiber grating and a polydimethylsiloxane wrapped Mach-Zehnder interferometer

Two different structures, long period fiber grating (LPFG) and a Mach-Zehnder interferometer (MZI), were cascaded to fabricate a sensor for sensing humidity and temperature simultaneously. Due to the humidity sensitive characteristic of polyimide (PI) and the temperature sensitive characteristic of polydimethylsiloxane (PDMS), the LPFG was coated with PI and the MZI was wrapped in PDMS to improve the humidity and temperature sensitivities, respectively. Humidity and temperature experiments and the stability and repeatability of the proposed sensors were performed. The sensor shows humidity and temperature sensitivities of ∼164 pm/%RH and 183 pm/°C in the humidity and temperature increasing experiments, respectively. Combining increasing, decreasing, and repeatable experiments of temperature and humidity, the proposed sensor shows stable performance in humidity sensitivity of ∼159 pm/%RH and temperature sensitivity of ∼175 pm/°C, with good linearity of ∼0.994. The structure of the proposed sensor has the advantages of low implementation cost, easy fabrication, and good stability.

Colorless Polyimides Derived from 5,5'-bis(2,3-norbornanedicarboxylic anhydride): Strategies to Reduce the Linear Coefficients of Thermal Expansion and Improve the Film Toughness

In this paper, novel colorless polyimides (PIs) derived from 5,5'-bis(2,3-norbornanedicarboxylic anhydride) (BNBDA) were presented. The results of single-crystal X-ray structural analysis using a BNBDA-based model compound suggested that it had a unique steric structure with high structural linearity. Therefore, BNBDA is expected to afford new colorless PI films with an extremely high glass transition temperature (Tg) and a low linear coefficient of thermal expansion (CTE) when combined with aromatic diamines with rigid and linear structures (typically, 2,2'-bis(trifluoromethyl)benzidine (TFMB)). However, the polyaddition of BNBDA and TFMB did not form a PI precursor with a sufficiently high molecular weight; consequently, the formation of a flexible, free-standing PI film via the two-step process was inhibited because of its brittleness. One-pot polycondensation was also unsuccessful in this system because of precipitation during the reaction, probably owing to the poor solubility of the initially yielded BNBDA/TFMB imide oligomers. The combinations of (1) the structural modification of the BNBDA/TFMB system, (2) the application of a modified one-pot process, in which the conditions of the temperature-rising profile, solvents, azeotropic agent, catalysts, and reactor were refined, and (3) the optimization of the film preparation conditions overcame the trade-off between low CTE and high film toughness and afforded unprecedented PI films with well-balanced properties, simultaneously achieving excellent optical transparency, extremely high Tg, sufficiently high thermal stability, low CTE, high toughness, relatively low water uptake, and excellent solution processability.

Design, Synthesis and Properties of Semi-Alicyclic Colorless and Transparent Polyimide Films with High Glass Transition Temperatures and Low Retardation for Potential Applications in Flexible Electronics

Polyimide (PI) optical films with high glass transition temperatures (high-Tg), high optical transparency, and low optical retardations (low-Rth) are highly desired in advanced optoelectronic applications. However, the standard PI films usually suffer from deep colors, high optical anisotropies and limited Tg values. In the current work, a series of semi-alicyclic colorless and transparent PI (CPI) films were developed from hydrogenated pyromellitic dianhydride stereoisomers, 1S,2R,4S,5R-hydrogenated pyromellitic dianhydride and 1R,2S,4S,5R-hydrogenated pyromellitic dianhydride, and fluorene-containing diamines, including 9,9-bis(4-aminophenyl)fluorene and 9,9-bis(3-fluoro-4-aminophenyl)fluorene, respectively. The derived CPI films showed Tg values higher than 420 °C according to differential scanning calorimetry measurements. In addition, the fluorene-based CPI film showed optical transmittances higher than 80% at the wavelength of 400 nm, with yellow indices in the range of 0.60~1.01 and haze values below 3.0%. The CPI films showed average refractive indices from 1.5407 to 1.6309, extremely low birefringence at the level of minus fourth power of ten, and further exhibited quite low optical retardations below 10 nm.

Structural Designs of Transparent Polyimide Films with Low Dielectric Properties and Low Water Absorption: A Review

The rapid development of communication networks (5G and 6G) that rely on high-speed devices requiring fast and high-quality intra- and inter-terminal signal transmission media has led to a steady increase in the need for high-performance, low-dielectric-constant (D_k) (<2.5) materials. Consequently, low-dielectric polymeric materials, particularly polyimides (PIs), are very attractive materials that are capable of meeting the requirements of high-performance terminal devices that transmit broadband high-frequency signals. However, such a PI needs to be properly designed with appropriate properties, including a low D_k, low dielectric loss (D_f), and low water absorptivity. PI materials are broadly used in various fields owing to their superior property/processibility combinations. This review summarizes the structural designs of PIs with low D_k and D_f values, low water-absorbing capacity, and high optical transparency intended for communication applications. Furthermore, we characterize structure-property relationships for various PI types and finally propose structural modifications required to obtain useful values of the abovementioned parameters.

Molecularly Imprinted Chalcone-Branched Polyimide-Based Chemosensors with Stripe Nanopatterns for the Detection of Melittin

In this study, a chalcone-branched polyimide (CB-PI) was synthesized by the Steglich esterification reaction for selective recognition of the toxic peptide melittin (MEL). MEL was immobilized on a nanopatterned poly(dimethylsiloxane) (PDMS) mold using a conventional surface modification technique to increase binding sites. A stripe-nanopatterned thin CB-PI film was formed on a quartz crystal (QC) substrate by simultaneously performing microcontact printing and ultraviolet (UV) light dimerization using a MEL-immobilized mold. The surface morphology changes and dimensions of the molecularly imprinted polymer (MIP) films with stripe nanopatterns (S-MIP) were analyzed using scanning electron microscopy (SEM) and atomic force microscopy (AFM). The sensing signals (Δf and Qe) of the S-MIP sensor were investigated upon adsorption in a 100-μL dilute plasma solution containing 30 μg/mL MEL, and its reproducibility, reuse, stability, and durability were investigated. The S-MIP sensor showed high sensitivity (5.49 mL/mg) and coefficient of determination (R2 = 0.999), and the detection limit (LOD) and the quantification limit (LOQ) were determined as 0.3 and 1.1 μg/mL, respectively. In addition, the selectivity coefficients (k*) calculated from the selectivity tests were 2.7-5.7, 2.1-4.3, and 2.8-4.6 for bovine serum albumin (BSA), immunoglobulin G (IgG), and apamin (APA), respectively. Our results indicate that the nanopatterned MIP sensors based on CB-PI demonstrate great potential as a sensing tool for the quantitative analysis of biomolecules.

Alicyclic polyimides with large band gaps exhibit superior high-temperature capacitive energy storage

Flexible polymer dielectrics for capacitive energy storage that can function well at elevated temperatures are increasingly in demand for continuously advancing and miniaturizing electrical devices. However, traditional high-resistance polymer dielectrics composed of aromatic backbones have a compromised band gap (E_g) and hence suffer from low breakdown strength and a huge loss at high temperatures. Here, based on the density functional theory (DFT) calculations, rigid and non-coplanar alicyclic segments are introduced into the polyimide backbone to overcome the incompatibility of a high glass transition temperature (T_g) and large E_g. Thanks to the large optical E_g (∼4.6 eV) and high T_g (∼277 °C), the all-alicyclic polyimide at 200 °C delivers a maximum discharge energy density (U_e) of 5.01 J cm^-3 with a charge-discharge efficiency (η) of 78.1% at 600 MV m^-1, and a record U_e of 2.55 J cm^-3 at η = 90%, which is 10-fold larger than that of the state-of-art commercial polyetherimides (PEIs). In addition, compared with aromatic polyimides, the all-alicyclic polyimide possesses a better self-clearing characteristic due to a smaller ratio of carbon to hydrogen and oxygen, which facilitates its long-term reliability in practical applications.

Research Progress and Application of Polyimide-Based Nanocomposites

Polyimide (PI) is one of the most dominant engineering plastics with excellent thermal, mechanical, chemical stability and dielectric performance. Further improving the versatility of PIs is of great significance, broadening their application prospects. Thus, integrating functional nanofillers can finely tune the individual characteristic to a certain extent as required by the function. Integrating the two complementary benefits, PI-based composites strongly expand applications, such as aerospace, microelectronic devices, separation membranes, catalysis, and sensors. Here, from the perspective of system science, the recent studies of PI-based composites for molecular design, manufacturing process, combination methods, and the relevant applications are reviewed, more relevantly on the mechanism underlying the phenomena. Additionally, a systematic summary of the current challenges and further directions for PI nanocomposites is presented. Hence, the review will pave the way for future studies.

Comparison of the properties of polyimide nanocomposite films containing functionalized-graphene and organoclay as nanofillers

Poly(amic acid) (PAA) is prepared by the reaction of dianhydride 4,4'-biphthalic anhydride and diamine bis[4-(3-aminophenoxy)phenyl]sulfone in N,N'-dimethylacetamide. Two types of fillers were dispersed in the as-synthesized PAA via a solution intercalation method; polyimide (PI) hybrid films were synthesized under various heat treatment conditions. Octylamine (C8) was introduced into graphene sheets (C8-GS) and bentonite (C8-BTN), which were then used as nanofillers in the PI hybrid films. The synthesized nanofillers were used in varying amounts of 0.25-1.00 wt% with respect to the matrix PI. The thermal and morphological properties and optical transparency of the hybrid films were investigated and compared for both C8-GS and C8-BTN at varying nanofiller content. The C8-BTN nanocomposite showed superior thermal properties, and optical transparency, and the filler was well dispersed in the PI matrix compared to the C8-GS nanocomposite. The thermal stability of the hybrid films improved upon the addition of small amounts of the nanofiller. However, beyond a certain critical filler concentration, the thermal stability declined. These results were verified through the dispersion of fillers via transmission electron microscopy.

A Novel Diamine Containing Ester and Diphenylethane Groups for Colorless Polyimide with a Low Dielectric Constant and Low Water Absorption

In this study, a novel diamine monomer containing ester and phenyl moieties, 1,2-diphenylethane-1,2-diyl bis(4-aminobenzoate) (1,2-DPEDBA), was synthesized through a three-step reaction. Using this diamine, a novel polyimide (PI) film was prepared with 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6-FDA) as a counter dianhydride through a typical two-step chemical imidization. For comparison, poly(pyromellitic dianhydride-co-4,4'-oxydianiline) (PMDA-ODA PI) was also synthesized via thermal imidization. The resulting 6-FDA-DPEDBA PI film was not only soluble in common polar solvents with high boiling points, such as N,N-dimethylacetamide (DMAc) and N,N-dimethylformamide (DMF), but also soluble in common low-boiling-point polar solvents, such as chloroform (CHCl₃) and dichloromethane (CH₂Cl₂), at room temperature. The resulting novel PI showed a 5% weight loss temperature (T⁵_d) at 360 °C under a nitrogen atmosphere. The resulting PI film was colorless and transparent with a transmittance of 87.1% in the visible light region ranging from 400 to 760 nm. The water absorption of the novel PI film was of 1.78%. The PI film also possessed a good moisture barrier and hydrophobicity. Furthermore, the resulting PI film displayed a low dielectric constant of 2.17 at 10⁶ Hz at room temperature. In conclusion, the novel PI film exhibited much better optical transparency, lower moisture absorption, and a lower dielectric constant as well as better solubility than the PMDA-ODA PI film, which is insoluble in any solvent, although its thermal stability is not better than that of PMDA-ODA PI.

Synthesis and Properties of Optically Transparent Fluoro-Containing Polyimide Films with Reduced Linear Coefficients of Thermal Expansion from Organo-Soluble Resins Derived from Aromatic Diamine with Benzanilide Units

Wholly aromatic polyimide (PI) films with good solution processability, light colors, good optical transparency, high storage modulus, and improved heat resistance were prepared and characterized. For this purpose, a multi-component copolymerization methodology was performed from a fluoro-containing dianhydride, 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA), a rigid dianhydride, 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), and a fluoro-containing diamine, 2,2'-bis(trifluoromethyl)-4,4'-bis [4-(4-amino-3-methyl)benzamide]biphenyl (MABTFMB). One homopolymer, FPI-1 (6FDA-MABTFMB), and five copolymers, FPI-2~FPI-6, containing the BPDA units from 10 mol% to 50 mol% in the dianhydride moieties, were prepared, respectively. The derived PI resins showed good solubility in the polar aprotic solvents, such as N-methyl-2-pyrrolidone (NMP) and N,N-dimethylacetamide (DMAc). The flexible PI films obtained by the solution casting procedure showed good optical properties with the transmittances higher than 74.0% at the wavelength of 450 nm. The PI films exhibited excellent thermal properties, including 5% weight loss temperatures (T_5%) over 510 °C, together with glass transition temperatures (T_g) over 350.0 °C according to the peak temperatures of the loss modulus in dynamical mechanical analysis (DMA) measurements. The FPI-6 film also showed the lowest linear coefficient of thermal expansion (CTE) value of 23.4 × 10^-6/K from 50 to 250 °C according to the thermomechanical analysis (TMA) measurements, which was obviously lower than that of FPI-1 (CTE = 30.6 × 10^-6/K).

Molecular mechanisms of the antibacterial activity of polyimide fibers in a skin-wound model with Gram-positive and Gram-negative bacterial infection in vivo

Recently, the need for antibacterial dressings has amplified because of the increase of traumatic injuries. However, there is still a lack of ideal, natural antibacterial dressings that show an efficient antibacterial property with no toxicity. Polyimide (PI) used as an implantable and flexible material has been recently reported as a mixture of particles showing more desirable antibacterial properties. However, we have identified a novel type of natural polyimide (PI) fiber that revealed antibacterial properties by itself for the first time. The PI fiber material is mainly composed of C, N, and O, and contains a small amount of Ca and Cl; the characteristic peaks of polyimide appear at 1774 cm-1, 1713 cm-1, 1370 cm-1, 1087 cm-1, and 722 cm-1. PI fibers displayed significant antibacterial activities against Escherichia coli (as a Gram-negative bacteria model) and methicillin-resistant Staphylococcus aureus (MRSA, as a Gram-positive bacteria model) according to the time-kill kinetics in vitro, and PI fibers damaged both bacterial cell walls directly. PI fibers efficiently ameliorated a local infection in vivo, inhibited the bacterial burden, decreased infiltrating macrophages, and accelerated wound healing in an E. coli- or MRSA-infected wound model. In conclusion, PI fibers used in the present study may act as potent antibacterial dressings protecting from MRSA or E. coli infections and as promising candidates for antimicrobial materials for trauma and surgical applications.

Comparison of Properties of Colorless and Transparent Polyimide Nanocomposites Containing Chemically Modified Nanofillers: Functionalized-Graphene and Organoclay

Poly(amic acid) (PAA) was synthesized from dianhydride 4,4-(4,4-isopropylidenediphenoxy)bis(phthalic anhydride) and diamine bis [4-(3-aminophenoxy) phenyl] sulfone. Colorless and transparent polyimide (CPI) hybrid films were synthesized through thermal imidization after dispersing nanofillers using an intercalation method in a PAA solution. C16-GS and C16-MMT, in which hexadecylamine (C16) was substituted on graphene sheet (GS) and montmorillonite (MMT), respectively, were used as nanofillers to reinforce the CPI hybrid films. These two nanofillers were admixed in varying loadings of 0.25 to 1.00 wt%, and the morphology, thermal properties, and optical transparency of the hybrid films were investigated and compared. The results suggest that the thermal properties of the CPI hybrid films can be improved by adding only a small amount of nanofiller. Transmission electron microscopy results of the CPI hybrid film containing two types of fillers suggested that the fillers were well dispersed in the nano-size in the matrix polymer; however, some of the fillers were observed as agglomerated particles above the critical concentration of 0.50 wt%.

Synthesis and characterization of an adamantane-based copolyimides with high transparency

In this work, a copolyimide (Co-PI) film with high transparency was prepared by the copolymerization of hexafluoroisopropylidene)diphthalic anhydride (6FDA), 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), 2,2′-Bis(trifluoromethyl)benzidine (TFMB) and adamantane-1,3-diamine (DAA). The effects of DAA monomers on the optical, thermal, and mechanical properties of the co-PIs were discussed in detail. We found that the preparation of polyimide (PI) based on the combination of two dianhydrides and two diamines could obtain the co-PI film with excellent comprehensive performance due to the synergy between the -CF3 group, the aliphatic ring and the aromatic structure. Through the structure and composition optimization, the co-PI film with 1.30% DAA (Q3) has a Tg of 374oC, T5 higher than 530oC, T430 of 82% and the tensile strength higher than 145 MPa. These results indicate that the Co-PI films can be successfully utilized in the development of novel heat-resistant plastic substrates for the optoelectronic engineering applications.

Transparent polyimide films with ultra-low coefficient of thermal expansion

According to the application requirements of colorless transparent polyimide (CPI) film for low coefficient of thermal expansion (CTE) in the field of OLED display, the new aromatic dianhydride monomers with amide bond structure were synthesized, namely s-ABDA, i-ABDA, EADA. Furthermore, a series of CPI films were prepared by two-step method from the reaction of as-synthesized dianhydrides with 2.2′-bis (trifluoromethyl) −4.4′-diaminobiphenyl (TFMB) or trans-1.4′-cyclohexanediamine ( t-CHDA). Based on the analysis of performance results, the incorporation of amide group and biphenyl, benzene or ether bond into dianhydride monomer helped this new type of transparent polyimide film with excellent optical properties (T550 nm> 88%), great heat stability (CTE < 4.4 ppm/K; Tg > 314°C; Td5% > 478°C) and good mechanical strength (σ > 208 MPa). The film s-ABDA/TFMB showed ultra-low CTE value at 4.4 ppm/K, aligning with the maximum birefringence, indicating that the role of hydrogen bonding was of great benefit to the regulation of thermal expansion.

A Universal Study on the Effect Thermal Imidization Has on the Physico-Chemical, Mechanical, Thermal and Electrical Properties of Polyimide for Integrated Electronics Applications

Polyimides (PI) are a class of dielectric polymer used in a wide range of electronics and electrical engineering applications from low-voltage microelectronics to high voltage isolation. They are well appreciated because of their excellent thermal, electrical, and mechanical properties, each of which need to be optimized uniquely depending on the end application. For example, for high-voltage applications, the final polymer breakdown field and dielectric properties must be optimized, both of which are dependent on the curing process and the final physico-chemical properties of PI. The majority of studies to date have focused on a limited set of properties of the polymer and have analyzed the effect of curing from a physicochemical-, mechanical- or electrical-centric viewpoint. This paper seeks to overcome this, unifying all of these characterizations in the same study to accurately describe the universal effect of the cure temperature on the properties of PI and at an industrial processing scale. This paper reports the widest-ranging study of its kind on the effect that cure temperature has on the physico-chemical, mechanical, thermal and electrical properties of polyimide, specifically poly (pyromellitic dianhydride-co-4, 4′-oxydianiline) (PMDA/ODA). The optimization of the cure temperature is accurately studied not only regarding the degree of imidization (DOI), but also considering the entire physical properties. Particularly, the analysis elucidates the key role of the charge–transfer complex (CTC) on these properties. The results show that while the thermal and mechanical properties improve with both DOI and CTC formation, the electrical properties, particularly at high field conditions, show an antagonistic behavior enhancing with increasing DOI while degrading at higher temperatures as the CTC formation increases. The electrical characterization at low field presents an enhancement of the final PI properties likely due to the DOI. On the contrary, at high electric field, the conductivity results show an improvement at an intermediate temperature emphasizing an ideal compromise between a high DOI and PI chain packing when the thermal imidization process is performed over this equilibrium. This balance enables maximum performance to be obtained for the PI film with optimized electrical properties and, overall, optimal thermal and mechanical properties are achieved.

Solution-Processable Colorless Polyimides Derived from Hydrogenated Pyromellitic Dianhydride: Strategies to Reduce the Coefficients of Thermal Expansion by Maximizing the Spontaneous Chain Orientation Behavior during Solution Casting

In this study, practically useful colorless polyimides (PIs) with low coefficients of thermal expansion (CTEs) and other desirable properties were prepared from hydrogenated pyromellitic dianhydride (1-exo,2-exo,4-exo,5-exo-cyclohexanetetracarboxylic dianhydride, H-PMDA). A modified one-pot polymerization method afforded a high-molecular-weight PI with sufficient film-forming ability from 2,2′-bis(trifluoromethyl)benzidine (TFMB) with a rod-like structure and H-PMDA. However, the PI film cast from its homogeneous solution did not have low CTEs, similar to the analogous system using meta-tolidine. To solve this problem, a series of amide- and amide-imide-containing diamines were designed and synthesized. The modified one-pot polymerization of H-PMDA and the diamines in γ-butyrolactone produced homogeneous, viscous, and stable solutions of high-molecular-weight PIs with high solid contents. The cast films of certain systems examined in this study simultaneously achieved low CTEs, high optical transparency, considerably high glass transition temperatures (T_gs), and sufficient ductility. A possible mechanism for the generation of low CTEs, which is closely related to the spontaneous in-plane orientation behavior during solution casting, was proposed. Certain H-PMDA-based PIs developed in this study are promising colorless heat-resistant plastic substrates for use in image display devices and other optical applications.

Dielectric Properties of Fluorinated Aromatic Polyimide Films with Rigid Polymer Backbones

Fluorinated aromatic polyimide (FAPI) films with rigid polymer backbones have been prepared by chemical imidization approach. The polyimide films exhibited excellent mechanical properties including elastic modulus of up to 8.4 GPa and tensile strength of up to 326.7 MPa, and outstanding thermal stability including glass transition temperature (T_g) of 346.3-351.6 °C and thermal decomposition temperature in air (T_d5) of 544.1-612.3 °C, as well as high colorless transmittance of >81.2% at 500 nm. Moreover, the polyimide films showed stable dielectric constant and low dielectric loss at 10-60 GHz, attributed to the close packing of rigid polymer backbones that limited the deflection of the dipole in the electric field. Molecular dynamics simulation was also established to describe the relationship of molecular structure and dielectric loss.

Soluble Poly(amide-imide)s from Diamide–Diamine Monomer with Trifluoromethyl Groups

A series of soluble aromatic poly(amide-imide)s (PAIs) was prepared from a new diamide–diamine monomer having biphenyl units with two CF₃ groups. The diamide–diamine monomer was polymerized with 2,2′-bis(trifluoromethyl)benzidine and pyromelltic dianhydride through an imidization reaction to prepare PAIs with a controlled imide/amide bond ratio in the main chains. While the PAIs with the highest imide bond content showed a limited solubility, other PAIs were soluble in polar organic solvents and can be solution-cast into flexible freestanding films. All PAIs exhibited high thermal stability with 5% weight loss temperature (T_d5) from 464 to 497 °C in air, and no appearance of glass transition up to 400 °C. Notably, the linear coefficient of thermal expansion (CTE) value of the PAI films was linearly decreased with the imide bond content and varied from 44.8 to 7.8 ppm/°C.

Highly Transparent Aromatic Polyamides from Unsymmetrical Diamine with Trifluoromethyl Groups

Soluble and transparent wholly aromatic polyamides (PAs) were synthesized from an unsymmetrical diamine monomer having trifluoromethyl (CF₃) groups, 4-(4′-aminophenoxy)-3,5-bis(trifluoromethyl)aniline. The monomer was polymerized with several dicarboxylic acid monomers via the Yamazaki–Higashi polycondensation method. All of the synthesized polyamides have an amorphous morphology, and they are soluble in many polar organic solvents at room temperature. Flexible and transparent films of the polyamides were prepared by solution casting and these polymer films show good optical transparencies with cut-off wavelengths of 337–367 nm and transparencies of 88%–90% at 550 nm. In addition, all the polymers were thermally stable over 400 °C and exhibited glass transition temperatures (T_g) higher than 300 °C. Unsymmetrically inserted trifluoromethyl groups on polyamides improves the solubility as well as the transparency of the polymers while maintaining good thermal properties. They also showed low refractive indices around 1.5333~1.5833 at 633 nm owing to the existence of low polarizable trifluoromethyl groups.

The effects of long and bulky aromatic pendent groups with flexible linkages on the thermal, mechanical and electrical properties of the polyimides and their nanocomposites with functionalized silica

A novel diamine bis(4-aminophenyl)bis{3,4[(4-(8-quinolyloxymethyl carbonyl)]}methane, containing two long/bulky aromatic pendent chains was synthesized by incorporating aromatic and hetero aromatic groups with flexible linkages. Flexible, stretchable, thermally stable and processable polyimides were prepared by reacting this newly synthesized diamine with commercial tetracarboxylic acid dianhydrides like 3,3',4,4'-benzophenone tetra carboxylic acid dianhydride (BTDA) and 4,4'-(4,4'-isopropylidenediphenoxy)diphthalic Anhydride (BPADA). Nanocomposites of polyimides were prepared using aromatic amine functionalized silica as a filler by solution casting method. The current work investigates the effects of incorporating long/bulky aromatic side chains and flexible linkages on the thermal, mechanical, electrical and optical properties of the polyimides and nanocomposites. The polyimides showed good thermal stability (T 10% = 364 & 388), high flame resistance, low glass transition temperatures (T g = 130 °C & 156 °C), very low dielectric constants (2.5 & 2.8 at 1 MHz) and good optical transparency. The neat polyimides displayed good elongation at break (133-155%) but possessed low tensile strength. The chemically imidized polyimides showed good solubility in low and high boiling solvents. Nanocomposites of polyimides based on aromatic amine functionalized silica exhibited enhanced properties with T 10% values varying between 409-482 °C, T g between 165-280 °C and higher dielectric constants (3-5.7 at 1 MHz).

Synthesis and properties of colorless copolyimides derived from 4,4′-diaminodiphenyl ether-based diamines with different substituents

Highly transparent PI films with excellent mechanical strength, high heat-resistance and superior fracture toughness were fabricated.

Synthesis and characterization of amide-bridged colorless polyimide films with low CTE and high optical performance for flexible OLED displays

Starting from three novel amide-incorporating dianhydride monomers, we synthesized a series of amide-bridged cPI films that have ultra-low CTE and high Tg due to the formation of hydrogen bonds as well as great optical performance.

Crosslinked porous polyimides: structure, properties and applications

Porous polyimides (pPIs) represent a fascinating class of porous organic polymers (POPs). Here the properties and functions of amorphous and crystalline pPIs are reviewed, and applications contributing to solutions to global challenges highlighted.

The effect of nanoparticles on gas permeability with polyimide membranes and network hybrid membranes: a review

Polyimide membranes and network hybrid membranes exhibit high permeability despite good thermal and chemical stability, and high selectivity in gas mixture separation. In this study, the effect of nanoparticle distribution on the network polymer network, and changes in permeability, selectivity, and structure of the composite lattice membrane are investigated. According to the obtained permeability results, this increase in permeability was due to the increase of polymer network free volume and the formation of cavities in the nanoparticle-polymer interface. The significant results were that the permeability growth of gases with larger molecular size such as methane and nitrogen was higher than other gases. A comparison of the permeability growth of gases with the increasing volume fraction of nanoparticles confirms the dominance of the molecular sieve mechanism and the type of membrane transport mechanism change over polyimide and network Hybrid.

Preparation and Characterization of Semi-alicyclic Polyimides Containing Trifluoromethyl Groups for Optoelectronic Application

Transparent polyimides (PI) films with outstanding overall performance are attractive for next generation optoelectronic and microelectronic applications. Semi-alicyclic PIs derived from alicyclic dianhydrides and aromatic diamines have proved effective to prepare transparent PIs with high transmittance. To optimize the combined properties of semi-alicyclic PIs, incorporating bulky trifluoromethyl groups into the backbones is regarded as a powerful tool. However, the lack of fundamental understanding of structure–property relationships of fluorinated semi-alicyclic PIs constrains the design and engineering of advanced films for such challenging applications. Herein, a series of semi-alicyclic PIs derived from alicyclic dianhydrides and trifluoromethyl-containing aromatic diamines was synthesized by solution polycondensation at high temperature. The effects of alicyclic structures and bulky trifluoromethyl groups on thermal, dielectric and optical properties of PIs were investigated systematically. These PI films had excellent solubility, low water absorption and good mechanical property. They showed high heat resistance with T_g in the range of 294–390 °C. It is noted that tensile strength and thermal stability were greatly affected by the rigid linkages and alicyclic moieties, respectively. These films exhibited obviously low refractive indices and significantly reduced dielectric constants from 2.61 to 2.76, together with low optical birefringence and dielectric anisotropy. Highly transparent films exhibited cutoff wavelength even as low as 298 nm and transmittance at 500 nm over 85%, displaying almost colorless appearance with yellowness index (b*) below 4.2. The remarkable optical improvement should be mainly ascribed to both weak electron-accepting alicyclic units and bulky electron-withdrawing trifluoromethyl or sulfone groups. The present work provides an effective strategy to design molecular structures of optically transparent PIs for a trade-off between solution-processability, low water uptake, good toughness, high heat resistance, low dielectric constant and excellent optical transparency.

Transparent and Colorless Polyimides Containing Multiple Trifluoromethyl Groups as Gate Insulators for Flexible Organic Transistors with Superior Electrical Stability

A suitable insulating polymer material that is compatible with the fabrication process of organic transistors and has excellent electrical properties is critically required for the next-generation flexible organic electronics. In this study, using a one-step polymerization method, we synthesized two different solution-processable polyimides (PIs) incorporated with abundant trifluoromethyl groups. Not only were the two resulting PIs-termed 6FDA-6FDAM-PI and 6FDA-TFMB-PI-well soluble in organic solvents, but also they showed transparent and colorless optical properties. The fluorinated PI films showed smooth surface topographies and surface energy values that were appropriate for their use in bottom-gate organic transistors. Organic transistors separately fabricated with 6FDA-6FDAM-PI and 6FDA-TFMB-PI as the gate insulators showed excellent device performance and electrical stability under various testing conditions, especially for pentacene-based devices. The excellent performance of the devices with fluorinated PIs was attributed to the enhanced microstructure of the organic semiconductor and the fluorine-rich characteristic of the underlying gate insulator. Furthermore, organic complementary circuits including the basic logic gates of NOT, NOR, and NAND were demonstrated using these devices.

Poly(ester imide)s Possessing Low Coefficients of Thermal Expansion and Low Water Absorption (V). Effects of Ester-linked Diamines with Different Lengths and Substituents

A series of ester-linked diamines, with different lengths and substituents, was synthesized to obtain poly(ester imide)s (PEsIs) having improved properties. A substituent-free ester-linked diamine (AB-HQ) was poorly soluble in N-methyl-2-pyrrolidone at room temperature, which forced the need for polyaddition by adding tetracarboxylic dianhydride solid into a hot diamine solution. This procedure enabled the smooth progress of polymerization, however, accompanied by a significant decrease in the molecular weights of poly(amic acid)s (PAAs), particularly when using hydrolytically less stable pyromellitic dianhydride. On the other hand, the incorporation of various substituents (–CH₃, –OCH₃, and phenyl groups) to AB-HQ was highly effective in improving diamine solubility, which enabled the application of the simple polymerization process without the initial heating of the diamine solutions, and led to PAAs with sufficiently high molecular weights. The introduction of bulkier phenyl substituent tends to increase the coefficients of thermal expansion (CTE) of the PEsI films, in contrast to that of the small substituents (–CH₃, –OCH₃). The effects of ester-linked diamines, consisting of longitudinally further extended structures, were also investigated. However, this approach was unsuccessful due to the solubility problems of these diamines. Consequently, the CTE values of the PEsIs, obtained using longitudinally further extended diamines, were not as low as we had expected initially. The effects of substituent bulkiness on the target properties, and the dominant factors for water uptake (W_A) and the coefficients of hygroscopic expansion (CHE), are also discussed in this study. The PEsI derived from methoxy-sustituted AB-HQ analog and 3,3′,4,4′-biphenyltetracarboxylic dianhydride achieved well-balanced properties, i.e., a very high T_g (424 °C), a very low CTE (5.6 ppm K⁻¹), a low W_A (0.41%), a very low CHE value (3.1 ppm/RH%), and sufficient ductility, although the 26 μm-thick film narrowly missed certification of the V-0 standard in the UL-94V test. This PEsI film also displayed a moderate ε_r (3.18) and a low tan δ (3.14 × 10⁻³) at 10 GHz under 50% RH and at 23 °C. Thus, this PEsI system is a promising candidate as a novel dielectric substrate material for use in the next generation of high-performance flexible printed circuit boards operating at higher frequencies (≥10 GHz).

Synthesis and properties of colorless polyamide films with high thermal resistance and dimensional stability

Polyamides (PAs) based on terephthaloyl chloride and a series of aromatic diamines were synthesized; PA films were prepared by solution casting without mechanical stretching to produce high-performance films with good optical transparency and dimensional stability. The PA films displayed high heat resistance with glass transition temperatures ( Tg) of 342–399°C. Good mechanical properties were obtained with tensile modulus and strength up to 5.38 GPa and 195.4 MPa, respectively. Coefficient of thermal expansion of the as-cast PA films achieved to an ultralow value of 8.3 ppm °C−1 and could be tailored in a wide range as a function of the macromolecular composition. The series of PA films showed a transparent and colorless feature, with the cutoff wavelength in the range of 355–365 nm. The data were discussed from the perspective of structure–property relationship, may give helpful knowledge for the topic of PA chemistry, and this method could provide an alternative for the production of high-performance colorless polymer films.

Reduced Coefficients of Linear Thermal Expansion of Colorless and Transparent Semi-Alicyclic Polyimide Films via Incorporation of Rigid-Rod Amide Moiety: Preparation and Properties

Semi-alicyclic colorless and transparent polyimide (CPI) films usually suffer from the high linear coefficients of thermal expansion (CTEs) due to the intrinsic thermo-sensitive alicyclic segments in the polymers. A series of semi-alicyclic CPI films containing rigid-rod amide moieties were successfully prepared in the current work in order to reduce the CTEs of the CPI films while maintaining their original optical transparency and solution-processability. For this purpose, two alicyclic dianhydrides, hydrogenated pyromellitic anhydride (HPMDA, I), and hydrogenated 3,3',4,4'-biphenyltetracarboxylic dianhydride (HBPDA, II) were polymerized with two amide-bridged aromatic diamines, 2-methyl-4,4'-diaminobenzanilide (MeDABA, a) and 2-chloro-4,4'-diaminobenzanilide (ClDABA, b) respectively to afford four CPI resins. The derived CPI resins were all soluble in polar aprotic solvents, including N-methyl-2-pyrrolidone (NMP) and N,N-dimethylacetamide (DMAc). Flexible and tough CPI films were successfully prepared by casing the PI solutions onto glass substrates followed by thermally cured at elevated temperatures from 80 °C to 250 °C. The MeDABA derived PI-I_a (HPMDA-MeDABA) and PI-II_a (HBPDA-MeDABA) exhibited superior optical transparency compared to those derived from ClDABA (PI-I_b and PI-II_b). PI-I_a and PI-II_a showed the optical transmittances of 82.3% and 85.8% at the wavelength of 400 nm with a thickness around 25 μm, respectively. Introduction of rigid-rod amide moiety endowed the HPMDA-PI films good thermal stability at elevated temperatures with the CTE values of 33.4 × 10^-6/K for PI-I_a and 27.7 × 10^-6/K for PI-I_b in the temperature range of 50-250 °C. Comparatively, the HBPDA-PI films exhibited much higher CTE values. In addition, the HPMDA-PI films exhibited good thermal stability with the 5% weight loss temperatures (T_5%) higher than 430 °C and glass transition temperatures (T_g) in the range of 349-351 °C.