An Effect of Layered Auxiliary Cathode on Thickness Uniformity in Micro Electroforming Process

Thickness nonuniformity is a bottleneck in the micro electroforming process of micro-metal devices. In this paper, a new method of fabricating a layered auxiliary cathode is proposed to improve the thickness uniformity of a micro-electroforming layer. In order to analyze the general applicability of the proposed method, four basic microstructures, namely circular, square, regular triangular, and regular hexagonal were used to study the effect of a layered auxiliary cathode on thickness uniformity through simulation and experimentation. The simulation results showed that with the help of the proposed auxiliary cathode, the thickness nonuniformity of four microstructures should decrease due to the reduced edge effect of the current density. The experimental results showed that the thickness uniformity of four microstructures fabricated via the proposed method was improved by 190.63%, 116.74%, 80.43%, and 164.30% compared to that fabricated via the traditional method, respectively. Meanwhile, the micro-gear was fabricated and the nonuniformity was reduced by 101.15% using the proposed method.

Concurrently Fabricating Precision Meso- and Microscale Cross-Scale Arrayed Metal Features and Components by Using Wire-Anode Scanning Electroforming Technique

In order to improve the thickness uniformity of the electroformed metal layer and components, a new electroforming technique is proposed-wire-anode scanning electroforming (WAS-EF). WAS-EF uses an ultrafine inert anode so that the interelectrode voltage/current is superimposed upon a very narrow ribbon-shaped area at the cathode, thus ensuring better localization of the electric field. The anode of WAS-EF is in constant motion, which reduces the effect of the current edge effect. The stirring paddle of WAS-EF can affect the fluid flow in the microstructure, and improve the mass transfer effect inside the structure. The simulation results show that, when the depth-to-width ratio decreases from 1 to 0.23, the depth of fluid flow in the microstructure can increase from 30% to 100%. Experimental results show that. Compared with the traditional electroforming method, the single metal feature and arrayed metal components prepared by WAS-EF are respectively improved by 15.5% and 11.4%.

Improving the Thickness Uniformity of Micro Gear by Multi-Step, Self-Aligned Lithography and Electroforming

The thickness nonuniformity of an electroformed layer is a bottleneck problem for electroformed micro metal devices. In this paper, a new fabrication method is proposed to improve the thickness uniformity of micro gear, which is the key element of various microdevices. The effect of the thickness of the photoresist on the uniformity was studied by simulation analysis, which showed that as the thickness of the photoresist increased, the thickness nonuniformity of the electroformed gear should decrease due to the reduced edge effect of the current density. Differently from the traditional method performed by one-step front lithography and electroforming, multi-step, self-aligned lithography and electroforming are used to fabricate micro gear structures in proposed method, which intermittently keeps the thickness of photoresist from decreasing during processes of alternate lithography and electroforming. The experimental results show that the thickness uniformity of micro gear fabricated by the proposed method was improved by 45.7% compared with that fabricated by the traditional method. Meanwhile, the roughness of the middle region of the gear structure was reduced by 17.4%.

Towards Scalable Large-Area Pulsed Laser Deposition

One of the significant limitations of the pulsed laser deposition method in the mass-production-technologies of micro- and nanoelectronic and molecular device electronic fabrication is the issue of ensuring deposition of films with uniform thickness on substrates with large diameter (more than 100 mm) since the area of the laser spot (1–5 mm²) on the surface of the ablated target is incommensurably smaller than the substrate area. This paper reports the methodology that allows to calculate the distribution profile of the film thickness over the surface substrate with a large diameter, taking into account the construction and technological parameters of the pulsed laser deposition equipment. Experimental verification of the proposed methodology showed that the discrepancy with the experiment does not exceed 8%. The modeling of various technological parameters influence on the thickness uniformity has been carried out. Based on the modeling results, recommendations and parameters are proposed for manufacturing uniform thickness films. The results allow for increasing the film thickness uniformity with the thickness distribution < 5% accounts for ~ 31% of 300 mm diameter substrate.

Effects of Process Parameters on the Thickness Uniformity in Two-Point Incremental Forming (TPIF) with a Positive Die for an Irregular Stepped Part

Incremental sheet forming (ISF) is a novel flexible forming technology with advantages, such as a low forming force, low-energy-consuming equipment, and good forming performance. The lack of available information about the formability of the two-point incremental forming (TPIF) process makes it limited for practical applications. Taking an irregular stepped part as the target part, the effects of process parameters on the thickness uniformity when using TPIF with a positive die for AA1060 aluminum alloy sheets were investigated. First, the set of optimal parameters regarding the diameter of the tool head, feed rate, and the step size were obtained through orthogonal experiments. Furthermore, the optimal parameter set of the number of forming passes, the direction of movement of the forming tool, and the forming angle was determined and the optimal forming result was numerically and experimentally verified. This demonstrated that the parameters affecting the thickness uniformity of the irregular stepped parts were, in descending order, the diameter of the forming tool, the feed rate, and the step size, with corresponding optimal values of 12 mm, 15,000 mm/min, and 0.4 mm, respectively. With an increase of the number of passes and a decrease of the forming angle between adjacent passes, and adopting an alternating clockwise and counterclockwise toolpath, the thickness uniformity of the formed parts was effectively improved.