Hybrid Copper-Silver Conductive Tracks for Enhanced Oxidation Resistance under Flash Light Sintering

Micro-Addition of Silver to Copper: One Small Step in Composition, a Change for a Giant Leap in Biocidal Activity

The use of copper as an antimicrobial agent has a long history and has gained renewed interest in the context of the COVID-19 pandemic. In this study, the authors investigated the antimicrobial properties of an alloy composed of copper with a small percentage of silver (Cu-0.03% wt.Ag). The alloy was tested against various pathogens, including Escherichia coli, Staphylococcus aureus, Candida albicans, Pseudomonas aeruginosa, and the H1N1 virus, using contact exposure tests. Results showed that the alloy was capable of inactivating these pathogens in two hours or less, indicating its strong antimicrobial activity. Electrochemical measurements were also performed, revealing that the small addition of silver to copper promoted a higher resistance to corrosion and shifted the formation of copper ions to higher potentials. This shift led to a slow but continuous release of Cu2+ ions, which have high biocidal activity. These findings show that the addition of small amounts of silver to copper can enhance its biocidal properties and improve its effectiveness as an antimicrobial material.

Sustainable fabrication of hybrid silver-copper nanocomposites (Ag-CuO NCs) using Ocimum americanum L. as an effective regime against antibacterial, anticancer, photocatalytic dye degradation and microalgae toxicity

In this study, a sustainable fabrication of hybrid silver-copper oxide nanocomposites (Ag-CuO NCs) was accomplished utilizing Ocimum americanum L. by one pot green chemistry method. The multifarious biological and environmental applications of the green fabricated Ag-CuO NCs were evaluated through their antibacterial, anticancer, dye degradation, and microalgae growth inhibition activities. The morphological features of the surface functionalized hybrid Ag-CuO NCs were confirmed by FE-SEM and HR-TEM techniques. The surface plasmon resonance λ_max peak appeared at 441.56 nm. The average hydrodynamic size distribution of synthesized nanocomposite was 69.80 nm. Zeta potential analysis of Ag-CuO NCs confirmed its remarkable stability at -21.5 mV. XRD and XPS techniques validated the crystalline structure and electron binding affinity of NCs, respectively. The Ag-CuO NCs demonstrated excellent inhibitory activity against Vibrio cholerae (19.93 ± 0.29 mm) at 100 μg/mL. Anticancer efficacy of Ag-CuO NCs was investigated against the A549 lung cancer cell line, and Ag-CuO NCs exhibited outstanding antiproliferative activity with a low IC₅₀ of 2.8 ± 0.05 μg/mL. Furthermore, staining and comet assays substantiated that the Ag-CuO NCs hindered the progression of the A549 cells and induced apoptosis as a result of cell cycle arrest at the G₀/G₁ phase. Concerning the environmental applications, the Ag-CuO NCs displayed efficient photocatalytic activity against eosin yellow degradation up to 80.94% under sunlight irradiation. Microalgae can be used as an early bio-indicator/prediction of environmental contaminants and toxic substances. The treatment of the Ag-CuO NCs on the growth of marine microalgae Tetraselmis suecica demonstrated the dose and time-dependent growth reduction and variations in the chlorophyll content. Therefore, the efficient multifunctional properties of hybrid Ag-CuO NCs could be exploited as a regime against infective diseases and cancer. Further, the findings of our investigation witness the remarkable scope and potency of Ag-CuO NCs for environmental applications.

Deep-Sintered Copper Tracks for Thermal Oxidation Resistance Using Large Pulsed Electron Beam

Thermal oxidation resistance is an important property in printed electronics for sustaining electrical conductivity for long time and/or under harsh environments such as high temperature. This study reports the fabrication of copper nanoparticles (CuNPs)-based conductive tracks using large pulsed electron beam (LPEB) by irradiation on CuNPs to be sintered. With an acceleration voltage of 11 kV, the LPEB irradiation induced deep-sintering of CuNPs so that the sintered CuNPs exhibited bulk-like electrical conductivity. Consequently, the sintered Cu tracks maintained high electrical conductivity at 220 °C without using any thermal oxidation protection additive, such as silver, carbon nanotube, and graphene. In contrast, the films irradiated with an acceleration voltage of 8 kV and irradiated by intense pulsed light (IPL) showed fast oxidation characteristics and a corresponding reduction of electrical conductivities under high temperatures owing to a thin sintered layer. The performance of highly thermal oxidation-resistant Cu films sintered by LPEB irradiations was demonstrated through the device performance of a Joule heater.

Increased sanitization potency of hydrogen peroxide with synergistic O3 and intense pulsed light for non-woven polypropylene

Supplies of respiratory masks have recently become a concern due to the onset of the SARS-CoV-2 pandemic. Sanitization and reuse of masks can alleviate high mask consumption and production stresses. In the present work, improved sanitization potency of vaporous hydrogen peroxide (VHP) treatment of resilient bacterial spores while retaining polymeric filter performance was explored. A batch fumigation chamber with hydrogen peroxide (H₂O₂) vapor and ozone (O₃) is featured, followed by intense pulsed light (IPL) flash treatments. A resilient bacterial indicator, Geobacillus stearothermophilus (G. stearothermophilus), was utilized to compare the efficacy of various H₂O₂ concentrations in combination with O₃ and IPL. It was found that exposure to 30 minutes of 4.01 L min⁻¹ 0.03% H₂O₂ aqueous vapor and 3 g h⁻¹ O₃ followed by 10 IPL flashes per side completely inactivated G. stearothermophilus. The xenon sourced IPL irradiation was found to synergistically enhance radical production and strengthen the complementary biocidal interaction of H₂O₂ with O₃. Due to the synergistic effects, H₂O₂ was able to sanitize at a diluted concentration of 0.03% H₂O₂. The physical properties, such as surface potential, tensile strength, hydrophobicity, and filtration efficiency of >300 nm saline water aerosol of fibrous polypropylene (PP) sheets, were maintained. In addition, no residue of sanitizers was detected, thus confirming the biosafety and applicability of this method to disposable masks. Performance was benchmarked and compared with commercially available processes. The synergistic regime was found to achieve sterilization of G. stearothermophilus at drastically reduced H₂O₂ concentrations and in ambient conditions relative to commercial methods.

By introducing synergistic elements to the VHP processes, potent sanitization of polymeric filters is achieved at low H₂O₂ concentrations.

Surface and Interface Designs in Copper-Based Conductive Inks for Printed/Flexible Electronics

Silver (Ag), gold (Au), and copper (Cu) have been utilized as metals for fabricating metal-based inks/pastes for printed/flexible electronics. Among them, Cu is the most promising candidate for metal-based inks/pastes. Cu has high intrinsic electrical/thermal conductivity, which is more cost-effective and abundant, as compared to Ag. Moreover, the migration tendency of Cu is less than that of Ag. Thus, recently, Cu-based inks/pastes have gained increasing attention as conductive inks/pastes for printed/flexible electronics. However, the disadvantages of Cu-based inks/pastes are their instability against oxidation under an ambient condition and tendency to form insulating layers of Cu oxide, such as cuprous oxide (Cu2O) and cupric oxide (CuO). The formation of the Cu oxidation causes a low conductivity in sintered Cu films and interferes with the sintering of Cu particles. In this review, we summarize the surface and interface designs for Cu-based conductive inks/pastes, in which the strategies for the oxidation resistance of Cu and low-temperature sintering are applied to produce highly conductive Cu patterns/electrodes on flexible substrates. First, we classify the Cu-based inks/pastes and briefly describe the surface oxidation behaviors of Cu. Next, we describe various surface control approaches for Cu-based inks/pastes to achieve both the oxidation resistance and low-temperature sintering to produce highly conductive Cu patterns/electrodes on flexible substrates. These surface control approaches include surface designs by polymers, small ligands, core-shell structures, and surface activation. Recently developed Cu-based mixed inks/pastes are also described, and the synergy effect in the mixed inks/pastes offers improved performances compared with the single use of each component. Finally, we offer our perspectives on Cu-based inks/pastes for future efforts.

Intense Pulsed Light-Treated Near-Field Electrospun Nanofiber on a Quartz Tuning Fork for Multimodal Gas Sensors

Accurate and portable gas sensors are required for environmental monitoring, locating leakages, and detecting trace chemical vapors or gases. Although many sensors have been developed, few can rapidly and selectively detect parts per million (ppm) concentration changes. In this work, we fabricate multimodal gas sensors by depositing a single nanocomposite fiber between the prongs of a quartz tuning fork (QTF). The resulting sensors are portable and integrate multimodal approaches by applying both chemo-mechanical sensing for sensitivity and electrochemical sensing for selectivity. Near-field electrospinning (NFES) produces a flexible and semiconductive nanocomposite fiber with ∼500 nm diameter that can be integrated into electronic systems as environmental gas sensors. Intense pulsed light (IPL) and sputter coating improve adhesion of the nanocomposite fiber onto a QTF. Furthermore, IPL offers improved sensing performance due to the higher specific surface area and reduction in polymer content. In this study, hydrogen gas (H₂) is chosen as a target gas since it is a common energy source in fuel cell applications and byproduct in chemical reactions. An electrospinning solution containing polyaniline, multiwalled carbon nanotubes, and platinum nanoparticles is used to test H₂ gas sensing performance. The resulting multimodal sensors are selective to hydrogen versus other gases and vapors including methane, hexane, toluene, ammonia, ethanol, carbon dioxide, and oxygen. Furthermore, the sensors detect ppm levels of hydrogen gas even in the presence of high humidity that typically hinders gas sensor performance. The development of this sensor leads to a new method for compact and portable multimodal gas sensing.

Shape-Tuned Junction Resistivity and Self-Damping Dynamics in Intense Pulsed Light Sintering of Silver Nanostructure Films

Concurrently reducing processing temperature, electrical resistance, and material cost with scalable fabrication capabilities is critical for conductive elements of flexible and planar electronics. Intense pulsed light sintering (IPL) of mixed dissimilar-shape conductive nanostructures may achieve this goal. However, this potential is hindered by knowledge gaps on how dissimilarity in nanostructure shape affects interparticle neck growth kinetics in general and the self-damping coupling between neck growth and optical absorption in IPL. We study these phenomena for IPL of mixed Ag nanowires (NWs, 40 nm diameter, 100-200 μm length) and nanospheres (NSs, 40 nm diameter), both experimentally and by linking molecular dynamics simulations with optical modeling. An optimal 50:50 mixing ratio lowers resistivity (5.59 μΩ·cm) and peak temperatures (250-150 °C) relative to pure NS films and reduces material costs relative to pure NW films with similar resistivity, in 2.5 s of IPL. The drop in peak temperatures in consecutive optical pulses reduces with greater NW content. Sintering-induced dislocation generation drives higher neck growth at NW-NS and NW-NW interfaces and anisotropic neck growth at NW-NS interfaces. This indicates that when NWs are introduced into NS films, along with lesser number of interfacial contact points, an inherent reduction in sintering-induced junction resistivity plays a major role in reducing film resistivity. The self-damping coupling and optical absorption, which drive temperature evolution in IPL, are tunable by nanostructure shape. The introduction of NWs into a NS ensemble reduces the dependence of optical absorption on neck growth. We discuss how these insights elucidate a set of physical phenomena that can guide the choice of dissimilar shaped nanostructures to concurrently reduce resistivity and temperatures in IPL and other sintering processes.

Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 °C

Cu-Ag complex inks are developed for printing conductive tracks of low cost, high stability, and high conductivity on heat-sensitive substrates such as polyethylene terephthalate (PET) substrates. The inks show an obvious self-catalyzed characteristic due to the in situ formation of fresh metal nanoparticles which promote rapid decomposition and sintering of the inks at a low temperature below 100 °C. The temperature is 40-60 °C lower than those of general Cu complex inks and 100-120 °C lower than those of general Cu/Ag particle inks. Highly conductive Cu-Ag tracks of 2.80 × 10^-5 Ω cm and 6.40 × 10^-5 Ω cm have been easily realized at 100 °C and 80 °C, respectively. In addition, the printed Cu-based tracks not only show high oxidation resistance at high temperatures of up to 140 °C (the maximum tolerable temperature of current PET substrate) but also show excellent stability at high humidity of 85% because of the very uniform Cu-Ag hybrid structure. The printable tracks exhibit great potential application in various wearable devices fabricated on textiles, papers, and other heat-sensitive substrates.

Hybrid Copper-Silver-Graphene Nanoplatelet Conductive Inks on PDMS for Oxidation Resistance Under Intensive Pulsed Light

A simple, low-cost, and reliable process of production for conductive tracks and their transfer to poly(dimethylsiloxane) (PDMS) substrate has been proposed. Flexible electrodes were fabricated using conductive nanoparticulates under intensive pulsed light, which were then transferred on to a PDMS substrate via a pouring, curing, and peeling process. The combination of copper-silver nitrate-graphene nanoplatelets (GnPs) provided multiple benefits to the conductive tracks, such as oxidation resistance and increased durability on PDMS. The addition of silver nitrate reduced the speed of oxidation during the curing process of PDMS in the presence of heat and air. The addition of GnPs then increased the stability of conductive tracks on PDMS, whereas the films without GnPs were not conductive on PDMS due to mechanical cracks. The copper-silver-GnP electrodes on PDMS were successfully demonstrated as flexible electrodes and reveal the enhancement of oxidation resistance during thermal oxidation for Joule heater application.

Printable and Flexible Copper-Silver Alloy Electrodes with High Conductivity and Ultrahigh Oxidation Resistance

Printable and flexible Cu-Ag alloy electrodes with high conductivity and ultrahigh oxidation resistance have been successfully fabricated by using a newly developed Cu-Ag hybrid ink and a simple fabrication process consisting of low-temperature precuring followed by rapid photonic sintering (LTRS). A special Ag nanoparticle shell on a Cu core structure is first created in situ by low-temperature precuring. An instantaneous photonic sintering can induce rapid mutual dissolution between the Cu core and the Ag nanoparticle shell so that core-shell structures consisting of a Cu-rich phase in the core and a Ag-rich phase in the shell (Cu-Ag alloy) can be obtained on flexible substrates. The resulting Cu-Ag alloy electrode has high conductivity (3.4 μΩ·cm) and ultrahigh oxidation resistance even up to 180 °C in an air atmosphere; this approach shows huge potential and is a tempting prospect for the fabrication of highly reliable and cost-effective printed electronic devices.

Inorganic nanomaterials for printed electronics: a review

Owing to their capability of bypassing conventional high-priced and inflexible silicon based electronics to manufacture a variety of devices on flexible substrates by using large-scale and high-volume printing techniques, printed electronics (PE) have attracted increasing attention in the field of manufacturing industry for electronic devices. This simple and cost-effective approach could enhance current methods of constructing a patterned surface for nanomaterials and offer opportunities for developing fully-printed functional devices, especially offering the possibility of ubiquitous low-cost and flexible devices. This review presents a summary of work to date on the inorganic nanomaterials involved in PE applications, focused on the utilization of inorganic nanomaterials-based inks in the successful preparation of printed conductive patterns, electrodes, sensors, thin film transistors (TFTs) and other micro-/nanoscale devices. The printing techniques, sintering methods and printability of functional inks with their associated challenges are discussed, and we look forward so you can glimpse the future of PE applications.

Instantaneous Pulsed-Light Cross-Linking of a Polymer Gate Dielectric for Flexible Organic Thin-Film Transistors

We report the instantaneous pulsed-light cross-linking of polymer gate dielectrics on a flexible substrate by using intensely pulsed white light (IPWL) irradiation. Irradiation with IPWL for only 1.8 s of a poly(4-vinylphenol) (PVP) thin film with the cross-linking agent poly(melamine-co-formaldehyde) (PMF) deposited on a plastic substrate was found to yield fully cross-linked PVP films. It was confirmed that the IPWL-cross-linked PVP films have smooth pinhole-free surfaces and exhibit a low leakage current density, organic solvent resistance, and good compatibility with organic semiconductor, and that they can be used as replacements for typical PVP dielectrics that are cross-linked with time and energy intensive thermal heating processes. The synchronization of the IPWL irradiation with substrate transfer was found to enable the preparation of cross-linked PVP films on large area substrates with a highly uniform capacitance. Flexible OTFT based on IPWL-cross-linked PVP dielectrics were found to exhibit good electrical performance that is comparable to that of devices with thermally cross-linked PVP dielectric, as well as excellent deformation stability even at a bending radius of 3 mm.