1
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Zhang B, Liu Y, Chen Z, Wang X. Deformation-Tailored MoS 2 Optoelectronics: Fold-Induced Band Reconstruction for Programmable Polarity Switching. NANOMATERIALS (BASEL, SWITZERLAND) 2025; 15:727. [PMID: 40423117 DOI: 10.3390/nano15100727] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/27/2025] [Revised: 04/27/2025] [Accepted: 05/03/2025] [Indexed: 05/28/2025]
Abstract
This study proposes an innovative design strategy for molybdenum disulfide (MoS2) optoelectronic devices based on three-dimensional folded configurations. A "Z"-shaped folded MoS2 device was fabricated through mechanical exfoliation combined with a pre-strain technique on elastic substrates. Experimental investigations reveal that the geometric folding deformation induces novel photocurrent response zones near folded regions beyond the Schottky junction area via band structure reconstruction, achieving triple polarity switching (negative-positive-negative-positive) of photocurrent. This breakthrough overcomes the single-polarity separation mechanism limitation in conventional planar devices. Scanning photocurrent microscopy demonstrates a 40-fold enhancement in photocurrent intensity at folded regions compared to flat areas, attributed to the optimization of carrier separation efficiency through a pn junction-like built-in electric field induced by the three-dimensional configuration. Voltage-modulation experiments show that negative bias (-150 mV) expands positive response regions, while +200 mV bias induces a global negative response, revealing a dynamic synergy between folding deformation and electric field regulation. Theoretical analysis identifies that the band bending and built-in electric field in folded regions constitutes the physical origin of multiple polarity reversals. This work establishes a design paradigm integrating "geometric deformation-band engineering" for regulating optoelectronic properties of two-dimensional materials, demonstrating significant application potential in programmable photoelectric sensing and neuromorphic devices.
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Affiliation(s)
- Bo Zhang
- Department of Physics, Shanghai Normal University, Shanghai 200234, China
- School of Arts and Sciences, Shanghai Dianji University, Shanghai 201306, China
- State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
| | - Yaqian Liu
- State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
| | - Zhen Chen
- School of Microelectronics, Shanghai University, Shanghai 200444, China
| | - Xiaofang Wang
- School of Arts and Sciences, Shanghai Dianji University, Shanghai 201306, China
- State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
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2
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Xu Q, Yang Z, Wang Z, Wang R, Zhang B, Cheung Y, Jiao R, Shi F, Hong W, Yu H. Sandwich Miura-Ori Enabled Large Area, Super Resolution Tactile Skin for Human-Machine Interactions. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2025; 12:e2414580. [PMID: 40104964 PMCID: PMC12079333 DOI: 10.1002/advs.202414580] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 11/08/2024] [Revised: 12/20/2024] [Indexed: 03/20/2025]
Abstract
With substantial advances in materials science and electronics, flexible tactile sensors have emerged as a promising sector with extensive applications, notably in human-machine interactions. However, achieving large-area sensing with few sensing units at a low cost remains a challenge; the use of sensor arrays will complicate wiring and increase costs. To solve these issues, a sandwich Miura-ori (SMo)-enabled super-resolution tactile skin capable of resolving normal and shear forces is proposed, and a theoretical model that incorporates the impact of actual manufacturing process is also developed, enabling the model to be employed for different tactile skins following calibration. Using machine learning techniques, the proposed tactile skin can accurately localize touch inputs (average localization error of 1.89 mm) and estimate the external force (average estimation error of 8%). Furthermore, a curved SMo skin is designed and fabricated using the tessellation algorithm, then installed on a robotic arm to control the motion, demonstrating its potential in human-machine interactions. This research introduces a straightforward and cost-effective approach to the design and manufacturing of super-resolution tactile skins, and it also offers a valuable solution for future large-area tactile sensor technologies.
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Affiliation(s)
- Qian Xu
- Department of Mechanical and Aerospace EngineeringThe Hong Kong University of Science and TechnologyKowloonHong Kong SAR999077China
| | - Zhiwei Yang
- Department of Mechanics and Aerospace EngineeringSouthern University of Science and TechnologyShenzhenGuangdong Province518055China
| | - Zhengjun Wang
- Department of Mechanical and Aerospace EngineeringThe Hong Kong University of Science and TechnologyKowloonHong Kong SAR999077China
| | - Ruoqin Wang
- Department of Mechanical and Aerospace EngineeringThe Hong Kong University of Science and TechnologyKowloonHong Kong SAR999077China
| | - Boyang Zhang
- Department of Mechanical and Aerospace EngineeringThe Hong Kong University of Science and TechnologyKowloonHong Kong SAR999077China
| | - YikKin Cheung
- Department of Mechanical and Aerospace EngineeringThe Hong Kong University of Science and TechnologyKowloonHong Kong SAR999077China
| | - Rui Jiao
- Department of Mechanical and Aerospace EngineeringThe Hong Kong University of Science and TechnologyKowloonHong Kong SAR999077China
| | - Fan Shi
- Department of Mechanical and Aerospace EngineeringThe Hong Kong University of Science and TechnologyKowloonHong Kong SAR999077China
| | - Wei Hong
- Department of Mechanics and Aerospace EngineeringSouthern University of Science and TechnologyShenzhenGuangdong Province518055China
| | - Hongyu Yu
- Department of Mechanical and Aerospace EngineeringThe Hong Kong University of Science and TechnologyKowloonHong Kong SAR999077China
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3
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Mondal I, Haick H. Smart Dust for Chemical Mapping. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2025; 37:e2419052. [PMID: 40130762 PMCID: PMC12075923 DOI: 10.1002/adma.202419052] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 12/05/2024] [Revised: 03/05/2025] [Indexed: 03/26/2025]
Abstract
This review article explores the transformative potential of smart dust systems by examining how existing chemical sensing technologies can be adapted and advanced to realize their full capabilities. Smart dust, characterized by submillimeter-scale autonomous sensing platforms, offers unparalleled opportunities for real-time, spatiotemporal chemical mapping across diverse environments. This article introduces the technological advancements underpinning these systems, critically evaluates current limitations, and outlines new avenues for development. Key challenges, including multi-compound detection, system control, environmental impact, and cost, are discussed alongside potential solutions. By leveraging innovations in miniaturization, wireless communication, AI-driven data analysis, and sustainable materials, this review highlights the promise of smart dust to address critical challenges in environmental monitoring, healthcare, agriculture, and defense sectors. Through this lens, the article provides a strategic roadmap for advancing smart dust from concept to practical application, emphasizing its role in transforming the understanding and management of complex chemical systems.
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Affiliation(s)
- Indrajit Mondal
- Department of Chemical Engineering and Russell Berrie Nanotechnology InstituteTechnion – Israel Institute of TechnologyHaifa3200003Israel
| | - Hossam Haick
- Department of Chemical Engineering and Russell Berrie Nanotechnology InstituteTechnion – Israel Institute of TechnologyHaifa3200003Israel
- Life Science Technology (LiST) GroupDanube Private UniversityFakultät Medizin/Zahnmedizin, Steiner Landstraße 124
, Krems‐SteinÖSTERREICH3500Austria
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4
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Vasanth A, Ashok A, Do TN, Phan HP. Advancements in flexible porous Nanoarchitectonic materials for biosensing applications. Adv Colloid Interface Sci 2025; 339:103439. [PMID: 39978155 DOI: 10.1016/j.cis.2025.103439] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 11/02/2024] [Revised: 02/03/2025] [Accepted: 02/08/2025] [Indexed: 02/22/2025]
Abstract
The development of nanoporous materials has gained significant attention due to their unique structural properties and multimodalities, which are highly relevant for advanced sensing technologies. The capability to directly grow nanoporous materials on flexible substrates or indirectly integrate them into soft templates through mixing and dispersion opens exciting opportunities for a new class of flexible and stretchable electronics for personalized healthcare applications. This review paper provides a snapshot of recent advancements in flexible nanoporous materials and their applications, emphasizing biological and biomedical sensors. The review highlights the material of choice for flexible and stretchable substrates and effective approaches to synthesize and integrate nanoporous architectures onto soft polymers. Applications from wearable sweat sensors, mechanical sensors for electronic skins, implantable bioelectronics, and gas sensing are also presented. The paper concludes with current challenges and future perspectives within this highly active research paradigm.
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Affiliation(s)
- Arya Vasanth
- School of Mechanical and Manufacturing Engineering, The University of New South Wales, Sydney, New South Wales 2052, Australia; Graduate School of Biomedical Engineering, The University of New South Wales, Sydney, New South Wales 2052, Australia
| | - Aditya Ashok
- School of Mechanical and Manufacturing Engineering, The University of New South Wales, Sydney, New South Wales 2052, Australia; Graduate School of Biomedical Engineering, The University of New South Wales, Sydney, New South Wales 2052, Australia.
| | - Thanh Nho Do
- Graduate School of Biomedical Engineering, The University of New South Wales, Sydney, New South Wales 2052, Australia; Tyree Foundation Institute of Health Engineering, The University of New South Wales, Sydney, New South Wales 2052, Australia
| | - Hoang-Phuong Phan
- School of Mechanical and Manufacturing Engineering, The University of New South Wales, Sydney, New South Wales 2052, Australia; Tyree Foundation Institute of Health Engineering, The University of New South Wales, Sydney, New South Wales 2052, Australia.
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5
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Hu X, Liu Z, Zhang Y. Three-Dimensionally Architected Tactile Electronic Skins. ACS NANO 2025; 19:14523-14539. [PMID: 40194921 DOI: 10.1021/acsnano.5c02232] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 04/09/2025]
Abstract
Tactile electronic skins (e-skins) are flexible electronic devices that aim to replicate tactile sensing capabilities of the human skin, while possessing skin-like geometric features and materials properties. Since the human skin is composed of complex 3D constructions, where the various types of mechanoreceptors are distributed in a spatial layout, an important trend of tactile e-skin development involves introduction of 3D device architectures that can replicate certain structural features of human skins. The resulting 3D architected e-skins have demonstrated advantages in the detection of shear forces and the decoupled perception of multiple mechanical stimuli, which are of pivotal importance in many application scenarios. In this perspective, we summarize the main biological prototypes of existing 3D architected e-skins, and focus on the key 3D architectures related to tactile sensing capabilities. Then we highlight the enhanced tactile perception of 3D architected e-skins in terms of the super-resolution tactile sensing and predictions of diverse physical properties and surface features of an object, which allow for a broad spectrum of practical applications, such as object recognition, human-machine interactions, dexterous manipulation, and health monitoring. Finally, we discuss scientific challenges and opportunities for future developments of 3D architected tactile e-skins.
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Affiliation(s)
- Xiaonan Hu
- Mechano-X Institute, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
| | - Zhi Liu
- Mechano-X Institute, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
- Key Laboratory for Intelligent Nano Materials and Devices of Ministry of Education, State Key Laboratory of Mechanics and Control for Aerospace Structures, Institute for Frontier Science, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
| | - Yihui Zhang
- Mechano-X Institute, Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. China
- State Key Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P. R. China
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6
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Park M. Recent Advances in Wearable Thermal Devices for Virtual and Augmented Reality. MICROMACHINES 2025; 16:383. [PMID: 40283260 PMCID: PMC12029164 DOI: 10.3390/mi16040383] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 02/18/2025] [Revised: 03/20/2025] [Accepted: 03/25/2025] [Indexed: 04/29/2025]
Abstract
Thermal technologies that effectively deliver thermal stimulation through skin-integrated systems and enable temperature perception via the activation of cutaneous thermoreceptors are key to enhancing immersive experiences in virtual and augmented reality (VR/AR) through multisensory engagement. However, recent advancements and commercial adoption have predominantly focused on haptic rather than thermal technology. This review provides an overview of recent advancements in wearable thermal devices (WTDs) designed to reconstruct artificial thermal sensations for VR/AR applications. It examines key thermal stimulation parameters, including stimulation area, magnitude, and duration, with a focus on thermal perception mechanisms and thermoreceptor distribution in the skin. Input power requirements for surpassing thermal perception thresholds are discussed based on analytical modeling. Material choices for WTDs, including metal nanowires, carbon nanotubes, liquid metals, thermoelectric devices, and passive cooling elements, are introduced. The functionalities, device designs, operation modes, fabrication processes, and electrical and mechanical properties of various WTDs are analyzed. Representative applications illustrate how flexible, thin WTDs enable immersive VR/AR experiences through spatiotemporal, programmable stimulation. A concluding section summarizes key challenges and future opportunities in advancing skin-integrated VR/AR systems.
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Affiliation(s)
- Minsu Park
- Department of Polymer Science and Engineering, Dankook University, 152 Jukjeon-ro, Yongin 16890, Gyeonggi-do, Republic of Korea
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7
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Jeon C, Kim M, Kim J, Yang S, Choi E, Lim B. Systematic Analysis of Driving Modes and NiFe Layer Thickness in Planar Hall Magnetoresistance Sensors. SENSORS (BASEL, SWITZERLAND) 2025; 25:1235. [PMID: 40006464 PMCID: PMC11860601 DOI: 10.3390/s25041235] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/07/2025] [Revised: 02/10/2025] [Accepted: 02/14/2025] [Indexed: 02/27/2025]
Abstract
Planar Hall magnetoresistance (PHMR) sensors are widely utilized due to their high sensitivity, simple structure, and cost-effectiveness. However, their performance is influenced by both the driving mode and the thickness of the ferromagnetic layer, yet the combined effects of these factors remain insufficiently explored. This study systematically investigates the impact of Ni80Fe20 thickness (5-35 nm) on PHMR sensor performance under constant current (CC) and constant voltage (CV) modes, with a focus on optimizing the peak-to-peak voltage (Vp-p). In CC mode, electron surface scattering at 5-10 nm increases resistance, leading to a sharp rise in Vp-p, followed by a decline as the thickness increases. In contrast, CV mode minimizes resistance-related effects, with sensor signals predominantly governed by magnetization-dependent resistivity. Experimentally, the optimal Vp-p was observed at 25 nm in CV mode. However, for thicknesses beyond this point, the reduction in sensor resistance suggests that voltage distribution across both the sensor and external load resistance significantly influences performance. These findings provide practical insights into optimizing PHMR sensors by elucidating the interplay between driving modes and material properties. The results contribute to the advancement of high-performance PHMR sensors with enhanced signal stability and sensitivity for industrial and scientific applications.
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Affiliation(s)
- Changyeop Jeon
- Department of Physics and Chemistry, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, Republic of Korea; (C.J.); (M.K.); (J.K.); (S.Y.); (E.C.)
| | - Mijin Kim
- Department of Physics and Chemistry, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, Republic of Korea; (C.J.); (M.K.); (J.K.); (S.Y.); (E.C.)
| | - Jinwoo Kim
- Department of Physics and Chemistry, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, Republic of Korea; (C.J.); (M.K.); (J.K.); (S.Y.); (E.C.)
| | - Sunghee Yang
- Department of Physics and Chemistry, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, Republic of Korea; (C.J.); (M.K.); (J.K.); (S.Y.); (E.C.)
| | - Eunseo Choi
- Department of Physics and Chemistry, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, Republic of Korea; (C.J.); (M.K.); (J.K.); (S.Y.); (E.C.)
| | - Byeonghwa Lim
- Department of Smart Sensor Engineering, Andong National University, Andong-si 36729, Republic of Korea
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Makushko P, Ge J, Cañón Bermúdez GS, Volkov O, Zabila Y, Avdoshenko S, Illing R, Ionov L, Kaltenbrunner M, Fassbender J, Xu R, Makarov D. Scalable magnetoreceptive e-skin for energy-efficient high-resolution interaction towards undisturbed extended reality. Nat Commun 2025; 16:1647. [PMID: 39952943 PMCID: PMC11828903 DOI: 10.1038/s41467-025-56805-x] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/14/2024] [Accepted: 01/30/2025] [Indexed: 02/17/2025] Open
Abstract
Electronic skins (e-skins) seek to go beyond the natural human perception, e.g., by creating magnetoperception to sense and interact with omnipresent magnetic fields. However, realizing magnetoreceptive e-skin with spatially continuous sensing over large areas is challenging due to increase in power consumption with increasing sensing resolution. Here, by incorporating the giant magnetoresistance effect and electrical resistance tomography, we achieve continuous sensing of magnetic fields across an area of 120 × 120 mm2 with a sensing resolution of better than 1 mm. Our approach enables magnetoreceptors with three orders of magnitude less energy consumption compared to state-of-the-art transistor-based magnetosensitive matrices. A simplified circuit configuration results in optical transparency, mechanical compliance, and vapor/liquid permeability, consequently permitting its imperceptible integration onto skins. Ultimately, these achievements pave the way for exceptional applications, including magnetoreceptive e-skin capable of undisturbed recognition of fine-grained gesture and a magnetoreceptive contact lens permitting touchless interaction.
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Affiliation(s)
- Pavlo Makushko
- Helmholtz-Zentrum Dresden-Rossendorf e.V., Institute of Ion Beam Physics and Materials Research, Bautzner Landstrasse 400, 01328, Dresden, Germany
| | - Jin Ge
- Helmholtz-Zentrum Dresden-Rossendorf e.V., Institute of Ion Beam Physics and Materials Research, Bautzner Landstrasse 400, 01328, Dresden, Germany.
| | - Gilbert Santiago Cañón Bermúdez
- Helmholtz-Zentrum Dresden-Rossendorf e.V., Institute of Ion Beam Physics and Materials Research, Bautzner Landstrasse 400, 01328, Dresden, Germany
| | - Oleksii Volkov
- Helmholtz-Zentrum Dresden-Rossendorf e.V., Institute of Ion Beam Physics and Materials Research, Bautzner Landstrasse 400, 01328, Dresden, Germany
| | - Yevhen Zabila
- Helmholtz-Zentrum Dresden-Rossendorf e.V., Institute of Ion Beam Physics and Materials Research, Bautzner Landstrasse 400, 01328, Dresden, Germany
| | - Stanislav Avdoshenko
- Institute for Solid State Research, Leibniz Institute for Solid State and Materials Research Dresden, 01069, Dresden, Germany
| | - Rico Illing
- Helmholtz-Zentrum Dresden-Rossendorf e.V., Institute of Ion Beam Physics and Materials Research, Bautzner Landstrasse 400, 01328, Dresden, Germany
| | - Leonid Ionov
- Faculty of Engineering Science, Biofabrication, University of Bayreuth, Ludwig-Thoma-Str. 36a, 95447, Bayreuth, Germany
| | - Martin Kaltenbrunner
- Division of Soft Matter Physics, Institute for Experimental Physics, Johannes Kepler University, Altenberger Str. 69, 4040, Linz, Austria
- Soft Materials Lab, Linz Institute of Technology, Johannes Kepler University, Altenberger Str. 69, 4040, Linz, Austria
| | - Jürgen Fassbender
- Helmholtz-Zentrum Dresden-Rossendorf e.V., Institute of Ion Beam Physics and Materials Research, Bautzner Landstrasse 400, 01328, Dresden, Germany
| | - Rui Xu
- Helmholtz-Zentrum Dresden-Rossendorf e.V., Institute of Ion Beam Physics and Materials Research, Bautzner Landstrasse 400, 01328, Dresden, Germany.
| | - Denys Makarov
- Helmholtz-Zentrum Dresden-Rossendorf e.V., Institute of Ion Beam Physics and Materials Research, Bautzner Landstrasse 400, 01328, Dresden, Germany.
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9
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Pan L, Xie Y, Yang H, Bao X, Chen J, Zou M, Li RW. Omnidirectionally Stretchable Spin-Valve Sensor Array with Stable Giant Magnetoresistance Performance. ACS NANO 2025; 19:5699-5708. [PMID: 39883044 DOI: 10.1021/acsnano.4c15964] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 01/31/2025]
Abstract
Flexible magnetic sensors, which have advantages such as deformability, vector field sensing, and noncontact detection, are an important branch of flexible electronics and have significant applications in fields such as magnetosensitive electronic skin. Human skin surfaces have complicated deformations, which pose a demand for magnetic sensors that can withstand omnidirectional strain while maintaining stable performance. However, existing flexible magnetic sensor arrays can only withstand stretching along specific directions and are prone to failure under complicated deformations. Here, we demonstrate an omnidirectionally stretchable spin-valve sensor array with high stretchability and excellent performance. By integrating the modulus-distributed structure with liquid metal, the sensor can maintain its performance under complex deformations, enabling the overall system with omnidirectional stretchability. The fabricated spin-valve sensor exhibits a nearly unchanged giant magnetoresistance ratio of 8% and a maximum sensitivity of 0.93%/Oe upon omnidirectional strain up to 86% and can maintain stable performance without fatigue for over 1000 stretching cycles. Furthermore, this spin-valve sensor array is characterized by stable sensing performance for magnetic fields under complicated deformations and can be applied as a magnetosensitive electronic skin. Our results provide insights into the development of next-generation stretchable and wearable magnetoelectronics.
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Affiliation(s)
- Lili Pan
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Yali Xie
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
| | - Huali Yang
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
| | - Xilai Bao
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Jinxia Chen
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
| | - Mengting Zou
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
| | - Run-Wei Li
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
- Center of Materials and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
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10
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Jo Y, Lee Y, Kwon J, Kim S, Ryu G, Yun S, Baek S, Ko H, Jung S. 3D active-matrix multimodal sensor arrays for independent detection of pressure and temperature. SCIENCE ADVANCES 2025; 11:eads4516. [PMID: 39823340 PMCID: PMC11740967 DOI: 10.1126/sciadv.ads4516] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/16/2024] [Accepted: 12/17/2024] [Indexed: 01/19/2025]
Abstract
Pressure and temperature sensing simultaneously and independently is crucial for creating electronic skin that replicates complex sensory functions of human skin. Thin-film transistor (TFT) arrays with sensors have enabled cross-talk-free spatial sensing. However, the thermal dependence of charge transport in semiconductors has resulted in interference between thermal and pressure stimuli. We develop multimodal sensor arrays based on three-dimensional integration of an active matrix to detect temperature and pressure independently. Our approach includes a calibrated compensation to decouple temperature and pressure signals. An individual pixel device consists of a TFT-based pressure sensor layered above a TFT-based temperature sensor. The detected temperature is used to compensate for the thermal effect on TFT-based pressure sensors. We develop large-area sensor arrays to enable accurate detection of two-dimensional pressure and temperature, leveraging these technologies to demonstrate advanced robotic grippers. The grippers stably grasp and lift a cup regardless of temperature, proving their possibility in skin-like electronic applications.
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Affiliation(s)
- Youngmin Jo
- Department of Convergence IT Engineering, Pohang University of Science and Technology, 77 Cheongam-Ro, Pohang 37673, Republic of Korea
| | - Youngoh Lee
- School of Energy and Chemical Engineering, Ulsan National Institute of Science and Technology, Ulsan 44919, Republic of Korea
| | - Jimin Kwon
- Department of Electrical Engineering, Ulsan National Institute of Science and Technology, Ulsan 44919, Republic of Korea
| | - Seongju Kim
- Department of Materials Science and Engineering, Pohang University of Science and Technology, 77 Cheongam-Ro, Pohang 37673, Republic of Korea
| | - Gyungin Ryu
- Department of Materials Science and Engineering, Pohang University of Science and Technology, 77 Cheongam-Ro, Pohang 37673, Republic of Korea
| | - Soyoung Yun
- Department of Materials Science and Engineering, Pohang University of Science and Technology, 77 Cheongam-Ro, Pohang 37673, Republic of Korea
| | - Sanghoon Baek
- Department of Materials Science and Engineering, Pohang University of Science and Technology, 77 Cheongam-Ro, Pohang 37673, Republic of Korea
| | - Hyunhyub Ko
- School of Energy and Chemical Engineering, Ulsan National Institute of Science and Technology, Ulsan 44919, Republic of Korea
| | - Sungjune Jung
- Department of Convergence IT Engineering, Pohang University of Science and Technology, 77 Cheongam-Ro, Pohang 37673, Republic of Korea
- Department of Materials Science and Engineering, Pohang University of Science and Technology, 77 Cheongam-Ro, Pohang 37673, Republic of Korea
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11
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Zhang Y, Mehrez JAA, Yang J, Ni W, Fan C, Quan W, Zhang K, Wang T, Zeng M, Hu N, Yang Z. Highly Sensitive Linear Triaxial Force Sensor Based on Multimodal Sensing for 3D Pose Reconstruction. SMALL METHODS 2025:e2401876. [PMID: 39748625 DOI: 10.1002/smtd.202401876] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/04/2024] [Revised: 12/25/2024] [Indexed: 01/04/2025]
Abstract
Flexible sensing offers real-time force monitoring, presenting a versatile and effective solution for dexterous manipulation, healthcare, environmental exploration, and perception of physical properties. Nonetheless, a limitation of many existing flexible force sensors stems from their isotropic structure or material properties, preventing them from simultaneously detecting both the direction and magnitude of the applied force. Herein, a high-performance 3D force sensor based on orthogonal multimodal sensing, the cancellation principle, and the strain effect is proposed. Finite element analysis further reveals the decoupling and anti-interference mechanisms of the innovative capacitor-resistance dual-mode sensing based on a solid mechanics and electrostatic multiphysics model. The sensor demonstrates the ability to measure both the magnitude and direction of normal and shear forces in any combination using the proposed decoupling and reconstruction algorithms, showing the potential for accurately reconstructing the posture of objects.
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Affiliation(s)
- Yongwei Zhang
- National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, 200240, China
- Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Jaafar Abdul-Aziz Mehrez
- National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, 200240, China
- Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Jianhua Yang
- National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, 200240, China
- Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Wangze Ni
- National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, 200240, China
- Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Chao Fan
- National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, 200240, China
- Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Wenjing Quan
- National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, 200240, China
- Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Kai Zhang
- National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, 200240, China
- Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Tao Wang
- Shanghai Key Laboratory of Intelligent Sensing and Detection Technology, School of Mechanical and Power Engineering, East China University of Science and Technology, Shanghai, 200237, China
| | - Min Zeng
- National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Nantao Hu
- National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, 200240, China
- Department of Micro/Nano Electronics, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai, 200240, China
| | - Zhi Yang
- National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, 200240, China
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12
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Zhang W, Tang H, Yan Y, Ma J, Ferro LM, Merces L, Karnaushenko DD, Karnaushenko D, Schmidt OG, Zhu M. Unlocking Micro-Origami Energy Storage. ACS APPLIED ENERGY MATERIALS 2024; 7:11256-11268. [PMID: 39734918 PMCID: PMC11672231 DOI: 10.1021/acsaem.4c00702] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 03/21/2024] [Revised: 05/12/2024] [Accepted: 05/21/2024] [Indexed: 12/31/2024]
Abstract
Transforming thin films into high-order stacks has proven effective for robust energy storage in macroscopic configurations like cylindrical, prismatic, and pouch cells. However, the lack of tools at the submillimeter scales has hindered the creation of similar high-order stacks for micro- and nanoscale energy storage devices, a critical step toward autonomous intelligent microsystems. This Spotlight on Applications article presents recent advancements in micro-origami technology, focusing on shaping nano/micrometer-thick films into three-dimensional architectures to achieve folded or rolled structures for microscale energy storage devices. Micro-Swiss-rolls, created through a roll-up process actuated by inherent strain in multiple layer stacks, have been employed to develop on-chip microbatteries and microsupercapacitors with superior performance compared to their planar counterparts. The technology allows additional functionalities to be integrated into the same device using multifunctional materials. Despite significant progress, the key challenge for micro-origami technology in creating microscale energy storage devices lies in diversifying shape-morphing mechanisms to expand material choices, improve process reliability, and enhance reproducibility. Additionally, developing a universal microscale energy storage device that can cater to various tiny devices is intricate. Therefore, considering the integration of energy storage into final applications during the development phase is crucial. Micro-origami energy storage systems are poised to significantly impact the future of autonomous tiny devices, such as smart dust and microrobots.
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Affiliation(s)
- Wenlan Zhang
- Research
Center for Materials, Architectures and Integration of Nanomembranes
(MAIN), Chemnitz University of Technology, 09107 Chemnitz, Germany
- Material
Systems for Nanoelectronics, TU Chemnitz, 09107 Chemnitz, Germany
| | - Hongmei Tang
- Research
Center for Materials, Architectures and Integration of Nanomembranes
(MAIN), Chemnitz University of Technology, 09107 Chemnitz, Germany
- Material
Systems for Nanoelectronics, TU Chemnitz, 09107 Chemnitz, Germany
| | - Yaping Yan
- Research
Center for Materials, Architectures and Integration of Nanomembranes
(MAIN), Chemnitz University of Technology, 09107 Chemnitz, Germany
- Material
Systems for Nanoelectronics, TU Chemnitz, 09107 Chemnitz, Germany
| | - Jiachen Ma
- Research
Center for Materials, Architectures and Integration of Nanomembranes
(MAIN), Chemnitz University of Technology, 09107 Chemnitz, Germany
- Material
Systems for Nanoelectronics, TU Chemnitz, 09107 Chemnitz, Germany
| | - Letícia
M. M. Ferro
- Research
Center for Materials, Architectures and Integration of Nanomembranes
(MAIN), Chemnitz University of Technology, 09107 Chemnitz, Germany
- Material
Systems for Nanoelectronics, TU Chemnitz, 09107 Chemnitz, Germany
| | - Leandro Merces
- Research
Center for Materials, Architectures and Integration of Nanomembranes
(MAIN), Chemnitz University of Technology, 09107 Chemnitz, Germany
- Material
Systems for Nanoelectronics, TU Chemnitz, 09107 Chemnitz, Germany
| | - Dmitriy D. Karnaushenko
- Research
Center for Materials, Architectures and Integration of Nanomembranes
(MAIN), Chemnitz University of Technology, 09107 Chemnitz, Germany
- Material
Systems for Nanoelectronics, TU Chemnitz, 09107 Chemnitz, Germany
| | - Daniil Karnaushenko
- Research
Center for Materials, Architectures and Integration of Nanomembranes
(MAIN), Chemnitz University of Technology, 09107 Chemnitz, Germany
- Material
Systems for Nanoelectronics, TU Chemnitz, 09107 Chemnitz, Germany
| | - Oliver G. Schmidt
- Research
Center for Materials, Architectures and Integration of Nanomembranes
(MAIN), Chemnitz University of Technology, 09107 Chemnitz, Germany
- Material
Systems for Nanoelectronics, TU Chemnitz, 09107 Chemnitz, Germany
- School
of Science, TU Dresden, 01069 Dresden, Germany
| | - Minshen Zhu
- Research
Center for Materials, Architectures and Integration of Nanomembranes
(MAIN), Chemnitz University of Technology, 09107 Chemnitz, Germany
- Material
Systems for Nanoelectronics, TU Chemnitz, 09107 Chemnitz, Germany
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13
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Nie Z, Kwak JW, Han M, Rogers JA. Mechanically Active Materials and Devices for Bio-Interfaced Pressure Sensors-A Review. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024; 36:e2205609. [PMID: 35951770 DOI: 10.1002/adma.202205609] [Citation(s) in RCA: 21] [Impact Index Per Article: 21.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/20/2022] [Revised: 07/31/2022] [Indexed: 06/15/2023]
Abstract
Pressures generated by external forces or by internal body processes represent parameters of critical importance in diagnosing physiological health and in anticipating injuries. Examples span intracranial hypertension from traumatic brain injuries, high blood pressure from poor diet, pressure-induced skin ulcers from immobility, and edema from congestive heart failure. Pressures measured on the soft surfaces of vital organs or within internal cavities of the body can provide essential insights into patient status and progression. Challenges lie in the development of high-performance pressure sensors that can softly interface with biological tissues to enable safe monitoring for extended periods of time. This review focuses on recent advances in mechanically active materials and structural designs for classes of soft pressure sensors that have proven uses in these contexts. The discussions include applications of such sensors as implantable and wearable systems, with various unique capabilities in wireless continuous monitoring, minimally invasive deployment, natural degradation in biofluids, and/or multiplexed spatiotemporal mapping. A concluding section summarizes challenges and future opportunities for this growing field of materials and biomedical research.
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Affiliation(s)
- Zhongyi Nie
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
| | - Jean Won Kwak
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Mengdi Han
- Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing, 100871, China
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, 60208, USA
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
- Departments of Biomedical Engineering, Materials Science and Engineering, Neurological Surgery, Chemistry, and Electrical Engineering and Computer Science, Northwestern University, Evanston, IL, 60208, USA
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14
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Wu B, Liu Q. Integrating Point Spread Function Into Taxel-Based Tactile Pattern Super Resolution. IEEE TRANSACTIONS ON HAPTICS 2024; 17:637-649. [PMID: 38416624 DOI: 10.1109/toh.2024.3371092] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 03/01/2024]
Abstract
The past decade has witnessed the development of tactile sensors, which have been increasingly considered as an essential equipment in robotics, especially the dexterous manipulation and collaborative human-robot interactions. There are two major types of tactile sensors, i.e., the vision-based and taxel-based sensors. The latter is capable of achieving lower integration complexity with existing robotic systems, but unable to provide high-resolution (HR) tactile information as that of the vision-based counterpart due to the manufacturing limitations. Therefore, we propose a novel tactile pattern super-resolution (SR) scheme for taxel-based sensors, which is a data-driven scheme enabling customized selection on the number of applied "tapping" actions to achieve improvable performance from single tapping SR (STSR) to the multi-tapping SR (MTSR). In addition, we develop a new dataset for the proposed tactile SR scheme. In order to obtain scalable resolutions (e.g. ×4, ×10, ×20, etc.) of ground-truth HR tactile patterns, we propose a novel tactile point spread function (PSF) scheme to generate HR tactile patterns by leveraging the low-resolution (LR) data gathered directly from the taxel-based sensor and the depth information of contact surfaces. This is in strong contrast to the conventional ground-truth generation approach with overlapped multi-sampling and registration strategy, which can only provide a fixed resolution. Experimental results confirm the efficiency of the proposed scheme.
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15
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Dai H, Zhang C, Hu H, Hu Z, Sun H, Liu K, Li T, Fu J, Zhao P, Yang H. Biomimetic Hydrodynamic Sensor with Whisker Array Architecture and Multidirectional Perception Ability. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2024; 11:e2405276. [PMID: 39119873 PMCID: PMC11481291 DOI: 10.1002/advs.202405276] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/14/2024] [Revised: 07/16/2024] [Indexed: 08/10/2024]
Abstract
The rapid development of ocean exploration and underwater robot technology has put forward new requirements for underwater sensing methods, which can be used for hydrodynamic characteristics perception, underwater target tracking, and even underwater cluster communication. Here, inspired by the specialized undulated surface structure of the seal whisker and its ability to suppress vortex-induced vibration, a multidirectional hydrodynamic sensor based on biomimetic whisker array structure and magnetic 3D self-decoupling theory is introduced. The magnetic-based sensing method enables wireless connectivity between the magnetic functional structures and electronics, simplifying device design and endowing complete watertightness. The 3D self-decoupling capability enables the sensor, like a seal or other organisms, to perceive arbitrary whisker motions caused by the action of water flow without complex calibration and additional sensing units. The whisker sensor is capable of detecting a variety of hydrodynamic information, including the velocity (RMSE < 0.061 m s-1) and direction of the steady flow field, the frequency (error < 0.05 Hz) of the dynamic vortex wake, and the orientation (error < 7°) of the vortex wake source, demonstrating its extensive potential for underwater environmental perception and communication, especially in deep sea conditions.
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Affiliation(s)
- Huangzhe Dai
- The State Key Laboratory of Fluid Power and Mechatronic SystemsZhejiang UniversityHangzhou310027China
- The Key Laboratory of 3D Printing Process and Equipment of Zhejiang ProvinceCollege of Mechanical EngineeringZhejiang UniversityHangzhou310027China
| | - Chengqian Zhang
- The State Key Laboratory of Fluid Power and Mechatronic SystemsZhejiang UniversityHangzhou310027China
| | - Hao Hu
- The State Key Laboratory of Fluid Power and Mechatronic SystemsZhejiang UniversityHangzhou310027China
- The Key Laboratory of 3D Printing Process and Equipment of Zhejiang ProvinceCollege of Mechanical EngineeringZhejiang UniversityHangzhou310027China
| | - Zhezai Hu
- The State Key Laboratory of Fluid Power and Mechatronic SystemsZhejiang UniversityHangzhou310027China
- The Key Laboratory of 3D Printing Process and Equipment of Zhejiang ProvinceCollege of Mechanical EngineeringZhejiang UniversityHangzhou310027China
| | - Haonan Sun
- The State Key Laboratory of Fluid Power and Mechatronic SystemsZhejiang UniversityHangzhou310027China
- The Key Laboratory of 3D Printing Process and Equipment of Zhejiang ProvinceCollege of Mechanical EngineeringZhejiang UniversityHangzhou310027China
| | - Kan Liu
- The State Key Laboratory of Fluid Power and Mechatronic SystemsZhejiang UniversityHangzhou310027China
| | - Tiefeng Li
- The State Key Laboratory of Fluid Power and Mechatronic SystemsZhejiang UniversityHangzhou310027China
- Center for X‐MechanicsDepartment of Engineering MechanicsZhejiang UniversityHangzhou310027China
| | - Jianzhong Fu
- The State Key Laboratory of Fluid Power and Mechatronic SystemsZhejiang UniversityHangzhou310027China
- The Key Laboratory of 3D Printing Process and Equipment of Zhejiang ProvinceCollege of Mechanical EngineeringZhejiang UniversityHangzhou310027China
| | - Peng Zhao
- The State Key Laboratory of Fluid Power and Mechatronic SystemsZhejiang UniversityHangzhou310027China
- The Key Laboratory of 3D Printing Process and Equipment of Zhejiang ProvinceCollege of Mechanical EngineeringZhejiang UniversityHangzhou310027China
| | - Huayong Yang
- The State Key Laboratory of Fluid Power and Mechatronic SystemsZhejiang UniversityHangzhou310027China
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Chen Y, Zhang L, Wu X, Sun X, Sundah NR, Wong CY, Natalia A, Tam JKC, Lim DWT, Chowbay B, Ang BT, Tang C, Loh TP, Shao H. Magnetic augmentation through multi-gradient coupling enables direct and programmable profiling of circulating biomarkers. Nat Commun 2024; 15:8410. [PMID: 39333499 PMCID: PMC11437193 DOI: 10.1038/s41467-024-52754-z] [Citation(s) in RCA: 2] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/16/2024] [Accepted: 09/19/2024] [Indexed: 09/29/2024] Open
Abstract
Conventional magnetic biosensing technologies have reduced analytical capacity for magnetic field dimensionality and require extensive sample processing. To address these challenges, we spatially engineer 3D magnetic response gradients for direct and programmable molecular detection in native biofluids. Named magnetic augmentation through triple-gradient coupling for high-performance detection (MATCH), the technology comprises gradient-distributed magnetic nanoparticles encapsulated within responsive hydrogel pillars and suspended above a magnetic sensor array. This configuration enables multi-gradient matching to achieve optimal magnetic activation, response and transduction, respectively. Through focused activation by target biomarkers, the platform preferentially releases sensor-proximal nanoparticles, generating response gradients that complement the sensor's intrinsic detection capability. By implementing an upstream module that recognizes different biomarkers and releases universal activation molecules, the technology achieves programmable detection of various circulating biomarkers in native plasma. It bypasses conventional magnetic labeling, completes in <60 minutes and achieves sensitive detection (down to 10 RNA and 1000 protein copies). We apply the MATCH to measure RNAs and proteins directly in patient plasma, achieving accurate cancer classification.
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Affiliation(s)
- Yuan Chen
- Institute for Health Innovation & Technology, National University of Singapore, Singapore, Singapore
- Department of Biomedical Engineering, College of Design and Engineering, National University of Singapore, Singapore, Singapore
| | - Li Zhang
- Institute for Health Innovation & Technology, National University of Singapore, Singapore, Singapore
- Department of Biomedical Engineering, College of Design and Engineering, National University of Singapore, Singapore, Singapore
| | - Xingjie Wu
- Institute for Health Innovation & Technology, National University of Singapore, Singapore, Singapore
| | - Xuecheng Sun
- Institute for Health Innovation & Technology, National University of Singapore, Singapore, Singapore
| | - Noah R Sundah
- Institute for Health Innovation & Technology, National University of Singapore, Singapore, Singapore
- Department of Biomedical Engineering, College of Design and Engineering, National University of Singapore, Singapore, Singapore
| | - Chi Yan Wong
- Institute for Health Innovation & Technology, National University of Singapore, Singapore, Singapore
- Department of Medicine, Yong Loo Lin School of Medicine, National University of Singapore, Singapore, Singapore
| | - Auginia Natalia
- Institute for Health Innovation & Technology, National University of Singapore, Singapore, Singapore
- Department of Biomedical Engineering, College of Design and Engineering, National University of Singapore, Singapore, Singapore
| | - John K C Tam
- Department of Surgery, Yong Loo Lin School of Medicine, National University of Singapore, Singapore, Singapore
| | - Darren Wan-Teck Lim
- Division of Medical Oncology, National Cancer Centre Singapore, Singapore, Singapore
- Institute of Molecular and Cell Biology, Agency for Science, Technology and Research, Singapore, Singapore
- Centre for Clinician-Scientist Development, Duke-NUS Medical School, Singapore, Singapore
| | - Balram Chowbay
- Centre for Clinician-Scientist Development, Duke-NUS Medical School, Singapore, Singapore
- Clinical Pharmacology Laboratory, National Cancer Centre Singapore, Singapore, Singapore
- Singapore Immunology Network, Agency for Science, Technology and Research, Singapore, Singapore
| | - Beng Ti Ang
- National Neuroscience Institute, Singapore, Singapore
- Duke-NUS Medical School, Singapore, Singapore
| | - Carol Tang
- National Neuroscience Institute, Singapore, Singapore
- Duke-NUS Medical School, Singapore, Singapore
- SG Enable, Innovation, Singapore, Singapore
| | - Tze Ping Loh
- Institute for Health Innovation & Technology, National University of Singapore, Singapore, Singapore
- Department of Laboratory Medicine, National University Hospital, Singapore, Singapore
| | - Huilin Shao
- Institute for Health Innovation & Technology, National University of Singapore, Singapore, Singapore.
- Department of Biomedical Engineering, College of Design and Engineering, National University of Singapore, Singapore, Singapore.
- Department of Surgery, Yong Loo Lin School of Medicine, National University of Singapore, Singapore, Singapore.
- Institute of Molecular and Cell Biology, Agency for Science, Technology and Research, Singapore, Singapore.
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17
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Yang H, Li S, Wu Y, Bao X, Xiang Z, Xie Y, Pan L, Chen J, Liu Y, Li RW. Advances in Flexible Magnetosensitive Materials and Devices for Wearable Electronics. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024; 36:e2311996. [PMID: 38776537 DOI: 10.1002/adma.202311996] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/11/2023] [Revised: 05/14/2024] [Indexed: 05/25/2024]
Abstract
Emerging fields, such as wearable electronics, digital healthcare, the Internet of Things, and humanoid robots, highlight the need for flexible devices capable of recording signals on curved surfaces and soft objects. In particular, flexible magnetosensitive devices garner significant attention owing to their ability to combine the advantages of flexible electronics and magnetoelectronic devices, such as reshaping capability, conformability, contactless sensing, and navigation capability. Several key challenges must be addressed to develop well-functional flexible magnetic devices. These include determining how to make magnetic materials flexible and even elastic, understanding how the physical properties of magnetic films change under external strain and stress, and designing and constructing flexible magnetosensitive devices. In recent years, significant progress is made in addressing these challenges. This study aims to provide a timely and comprehensive overview of the most recent developments in flexible magnetosensitive devices. This includes discussions on the fabrications and mechanical regulations of flexible magnetic materials, the principles and performances of flexible magnetic sensors, and their applications for wearable electronics. In addition, future development trends and challenges in this field are discussed.
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Affiliation(s)
- Huali Yang
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
| | - Shengbin Li
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
| | - Yuanzhao Wu
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
| | - Xilai Bao
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- College of Materials Sciences and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Ziyin Xiang
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
| | - Yali Xie
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
| | - Lili Pan
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- College of Materials Sciences and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Jinxia Chen
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- College of Materials Sciences and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Yiwei Liu
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- College of Materials Sciences and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
| | - Run-Wei Li
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, P. R. China
- College of Materials Sciences and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing, 100049, P. R. China
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18
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Xu C, Wang Y, Zhang J, Wan J, Xiang Z, Nie Z, Xu J, Lin X, Zhao P, Wang Y, Zhang S, Zhang J, Liu C, Xue N, Zhao W, Han M. Three-dimensional micro strain gauges as flexible, modular tactile sensors for versatile integration with micro- and macroelectronics. SCIENCE ADVANCES 2024; 10:eadp6094. [PMID: 39167641 PMCID: PMC11338218 DOI: 10.1126/sciadv.adp6094] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/04/2024] [Accepted: 07/12/2024] [Indexed: 08/23/2024]
Abstract
Flexible tactile sensors play important roles in many areas, like human-machine interface, robotic manipulation, and biomedicine. However, their flexible form factor poses challenges in their integration with wafer-based devices, commercial chips, or circuit boards. Here, we introduce manufacturing approaches, device designs, integration strategies, and biomedical applications of a set of flexible, modular tactile sensors, which overcome the above challenges and achieve cooperation with commercial electronics. The sensors exploit lithographically defined thin wires of metal or alloy as the sensing elements. Arranging these elements across three-dimensional space enables accurate, hysteresis-free, and decoupled measurements of temperature, normal force, and shear force. Assembly of such sensors on flexible printed circuit boards together with commercial electronics forms various flexible electronic systems with capabilities in wireless measurements at the skin interface, continuous monitoring of biomechanical signals, and spatial mapping of tactile information. The flexible, modular tactile sensors expand the portfolio of functional components in both microelectronics and macroelectronics.
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Affiliation(s)
- Chen Xu
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
- Academy for Advanced Interdisciplinary Studies, Peking University, Beijing 100871, China
| | - Yiran Wang
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
| | - Jingyan Zhang
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
| | - Ji Wan
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
- Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China
- School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Zehua Xiang
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
- Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China
- School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Zhongyi Nie
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
| | - Jie Xu
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
| | - Xiang Lin
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
| | - Pengcheng Zhao
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
- Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China
- School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Yaozheng Wang
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
- Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China
- School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Shaotong Zhang
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
| | - Jing Zhang
- Department of Microelectronics, North China University of Technology, Beijing 100144, China
| | - Chunxiu Liu
- School of Electronic, Electrical, and Communication Engineering, University of Chinese Academy of Sciences (UCAS), State Key Laboratory of Transducer Technology, Aerospace Information Research Institute (AIR), Chinese Academy of Medical Sciences, Beijing 100190, China
| | - Ning Xue
- School of Electronic, Electrical, and Communication Engineering, University of Chinese Academy of Sciences (UCAS), State Key Laboratory of Transducer Technology, Aerospace Information Research Institute (AIR), Chinese Academy of Medical Sciences, Beijing 100190, China
| | - Wei Zhao
- Department of Cardiology and Institute of Vascular Medicine, Peking University Third Hospital, Beijing 100191, China
- NHC Key Laboratory of Cardiovascular Molecular Biology and Regulatory Peptides, Beijing 100191, China
- Key Laboratory of Molecular Cardiovascular Science, Ministry of Education, Beijing 100191, China
- Beijing Key Laboratory of Cardiovascular Receptors Research, Beijing 100191, China
| | - Mengdi Han
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Biomedical Engineering, College of Future Technology, Peking University, Beijing 100871, China
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19
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Patel D, Shetty S, Acha C, Pantoja IEM, Zhao A, George D, Gracias DH. Microinstrumentation for Brain Organoids. Adv Healthc Mater 2024; 13:e2302456. [PMID: 38217546 DOI: 10.1002/adhm.202302456] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/30/2023] [Revised: 12/10/2023] [Indexed: 01/15/2024]
Abstract
Brain organoids are three-dimensional aggregates of self-organized differentiated stem cells that mimic the structure and function of human brain regions. Organoids bridge the gaps between conventional drug screening models such as planar mammalian cell culture, animal studies, and clinical trials. They can revolutionize the fields of developmental biology, neuroscience, toxicology, and computer engineering. Conventional microinstrumentation for conventional cellular engineering, such as planar microfluidic chips; microelectrode arrays (MEAs); and optical, magnetic, and acoustic techniques, has limitations when applied to three-dimensional (3D) organoids, primarily due to their limits with inherently two-dimensional geometry and interfacing. Hence, there is an urgent need to develop new instrumentation compatible with live cell culture techniques and with scalable 3D formats relevant to organoids. This review discusses conventional planar approaches and emerging 3D microinstrumentation necessary for advanced organoid-machine interfaces. Specifically, this article surveys recently developed microinstrumentation, including 3D printed and curved microfluidics, 3D and fast-scan optical techniques, buckling and self-folding MEAs, 3D interfaces for electrochemical measurements, and 3D spatially controllable magnetic and acoustic technologies relevant to two-way information transfer with brain organoids. This article highlights key challenges that must be addressed for robust organoid culture and reliable 3D spatiotemporal information transfer.
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Affiliation(s)
- Devan Patel
- Department of Chemical and Biomolecular Engineering, Johns Hopkins University, Baltimore, MD, 21218, USA
| | - Saniya Shetty
- Department of Biomedical Engineering, Johns Hopkins University, Baltimore, MD, 21218, USA
| | - Chris Acha
- Department of Chemical and Biomolecular Engineering, Johns Hopkins University, Baltimore, MD, 21218, USA
| | - Itzy E Morales Pantoja
- Center for Alternatives to Animal Testing (CAAT), Department of Environmental Health and Engineering, Bloomberg School of Public Health, Johns Hopkins University, Baltimore, MD, 21205, USA
| | - Alice Zhao
- Department of Biology, Johns Hopkins University, Baltimore, MD, 21218, USA
| | - Derosh George
- Department of Chemical and Biomolecular Engineering, Johns Hopkins University, Baltimore, MD, 21218, USA
| | - David H Gracias
- Department of Chemical and Biomolecular Engineering, Johns Hopkins University, Baltimore, MD, 21218, USA
- Department of Chemistry, Johns Hopkins University, Baltimore, MD, 21218, USA
- Department of Materials Science and Engineering, Johns Hopkins University, Baltimore, MD, 21218, USA
- Department of Oncology, Johns Hopkins University School of Medicine, Baltimore, MD, 21205, USA
- Laboratory for Computational Sensing and Robotics (LCSR), Johns Hopkins University, Baltimore, MD, 21218, USA
- Sidney Kimmel Comprehensive Cancer Center (SKCCC), Johns Hopkins School of Medicine, Baltimore, MD, 21205, USA
- Center for MicroPhysiological Systems (MPS), Johns Hopkins School of Medicine, Baltimore, MD, 21205, USA
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20
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Merces L, Ferro LMM, Thomas A, Karnaushenko DD, Luo Y, Egunov AI, Zhang W, Bandari VK, Lee Y, McCaskill JS, Zhu M, Schmidt OG, Karnaushenko D. Bio-Inspired Dynamically Morphing Microelectronics toward High-Density Energy Applications and Intelligent Biomedical Implants. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024; 36:e2313327. [PMID: 38402420 DOI: 10.1002/adma.202313327] [Citation(s) in RCA: 11] [Impact Index Per Article: 11.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/07/2023] [Revised: 02/09/2024] [Indexed: 02/26/2024]
Abstract
Choreographing the adaptive shapes of patterned surfaces to exhibit designable mechanical interactions with their environment remains an intricate challenge. Here, a novel category of strain-engineered dynamic-shape materials, empowering diverse multi-dimensional shape modulations that are combined to form fine-grained adaptive microarchitectures is introduced. Using micro-origami tessellation technology, heterogeneous materials are provided with strategic creases featuring stimuli-responsive micro-hinges that morph precisely upon chemical and electrical cues. Freestanding multifaceted foldable packages, auxetic mesosurfaces, and morphable cages are three of the forms demonstrated herein of these complex 4-dimensional (4D) metamaterials. These systems are integrated in dual proof-of-concept bioelectronic demonstrations: a soft foldable supercapacitor enhancing its power density (≈108 mW cm-2), and a bio-adaptive device with a dynamic shape that may enable novel smart-implant technologies. This work demonstrates that intelligent material systems are now ready to support ultra-flexible 4D microelectronics, which can impart autonomy to devices culminating in the tangible realization of microelectronic morphogenesis.
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Affiliation(s)
- Leandro Merces
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, 09126, Chemnitz, Germany
| | - Letícia Mariê Minatogau Ferro
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, 09126, Chemnitz, Germany
| | - Aleena Thomas
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
- Institute of Chemistry, Chemnitz University of Technology, 09107, Chemnitz, Germany
| | - Dmitriy D Karnaushenko
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, 09126, Chemnitz, Germany
| | - Yumin Luo
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, 09126, Chemnitz, Germany
| | - Aleksandr I Egunov
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, 09126, Chemnitz, Germany
| | - Wenlan Zhang
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, 09126, Chemnitz, Germany
| | - Vineeth K Bandari
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, 09126, Chemnitz, Germany
| | - Yeji Lee
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, 09126, Chemnitz, Germany
| | - John S McCaskill
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
- European Centre for Living Technology (ECLT), Venice, 30123, Italy
| | - Minshen Zhu
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
| | - Oliver G Schmidt
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, 09126, Chemnitz, Germany
- Nanophysics, Faculty of Physics, Dresden University of Technology, 01062, Dresden, Germany
| | - Daniil Karnaushenko
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
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21
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Wang Y, Wang S, Gao Y, Li P, Zhao B, Liu S, Ma J, Wang L, Yin Q, Wang Z, Peng L, Ming X, Cao M, Liu Y, Gao C, Xu Z, Xu Z. Determinative scrolling and folding of membranes through shrinking channels. SCIENCE ADVANCES 2024; 10:eadm7737. [PMID: 38669331 PMCID: PMC11051672 DOI: 10.1126/sciadv.adm7737] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/05/2023] [Accepted: 03/25/2024] [Indexed: 04/28/2024]
Abstract
Flat membranes ubiquitously transform into mysterious complex shapes in nature and artificial worlds. Behind the complexity, clear determinative deformation modes have been continuously found to serve as basic application rules but remain unfulfilled. Here, we decipher two elemental deformation modes of thin membranes, spontaneous scrolling and folding as passing through shrinking channels. We validate that these two modes rule the deformation of membranes of a wide thickness range from micrometer to atomic scale. Their occurrence and the determinative fold number quantitatively correlate with the Föppl-von Kármán number and shrinkage ratio. The unveiled determinative deformation modes can guide fabricating foldable designer microrobots and delicate structures of two-dimensional sheets and provide another mechanical principle beyond genetic determinism in biological morphogens.
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Affiliation(s)
- Ya Wang
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, International Research Center for X Polymers, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials & Technologies of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Shijun Wang
- Applied Mechanics Laboratory, Department of Engineering Mechanics and Center for Nano and Micro Mechanics, Tsinghua University, Beijing 100084, China
- CAS Key Laboratory of Nanosystem and Hierarchical Fabrication and CAS Center for Excellence in Nanoscience, National Center for Nanoscience and Technology, Beijing 100190, China
| | - Yue Gao
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, International Research Center for X Polymers, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials & Technologies of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Peng Li
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, International Research Center for X Polymers, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials & Technologies of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Bo Zhao
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, International Research Center for X Polymers, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials & Technologies of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Senping Liu
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, International Research Center for X Polymers, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials & Technologies of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Jingyu Ma
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, International Research Center for X Polymers, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials & Technologies of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Lidan Wang
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, International Research Center for X Polymers, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials & Technologies of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Qichen Yin
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, International Research Center for X Polymers, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials & Technologies of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Ziqiu Wang
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, International Research Center for X Polymers, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials & Technologies of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Li Peng
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, International Research Center for X Polymers, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials & Technologies of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Xin Ming
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, International Research Center for X Polymers, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials & Technologies of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Min Cao
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, International Research Center for X Polymers, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials & Technologies of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Yingjun Liu
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, International Research Center for X Polymers, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials & Technologies of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Chao Gao
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, International Research Center for X Polymers, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials & Technologies of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
| | - Zhiping Xu
- Applied Mechanics Laboratory, Department of Engineering Mechanics and Center for Nano and Micro Mechanics, Tsinghua University, Beijing 100084, China
| | - Zhen Xu
- MOE Key Laboratory of Macromolecular Synthesis and Functionalization, International Research Center for X Polymers, Department of Polymer Science and Engineering, Key Laboratory of Adsorption and Separation Materials & Technologies of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
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22
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Leanza S, Wu S, Sun X, Qi HJ, Zhao RR. Active Materials for Functional Origami. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024; 36:e2302066. [PMID: 37120795 DOI: 10.1002/adma.202302066] [Citation(s) in RCA: 13] [Impact Index Per Article: 13.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/04/2023] [Revised: 04/13/2023] [Indexed: 06/19/2023]
Abstract
In recent decades, origami has been explored to aid in the design of engineering structures. These structures span multiple scales and have been demonstrated to be used toward various areas such as aerospace, metamaterial, biomedical, robotics, and architectural applications. Conventionally, origami or deployable structures have been actuated by hands, motors, or pneumatic actuators, which can result in heavy or bulky structures. On the other hand, active materials, which reconfigure in response to external stimulus, eliminate the need for external mechanical loads and bulky actuation systems. Thus, in recent years, active materials incorporated with deployable structures have shown promise for remote actuation of light weight, programmable origami. In this review, active materials such as shape memory polymers (SMPs) and alloys (SMAs), hydrogels, liquid crystal elastomers (LCEs), magnetic soft materials (MSMs), and covalent adaptable network (CAN) polymers, their actuation mechanisms, as well as how they have been utilized for active origami and where these structures are applicable is discussed. Additionally, the state-of-the-art fabrication methods to construct active origami are highlighted. The existing structural modeling strategies for origami, the constitutive models used to describe active materials, and the largest challenges and future directions for active origami research are summarized.
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Affiliation(s)
- Sophie Leanza
- Department of Mechanical Engineering, Stanford University, Stanford, CA, 94305, USA
| | - Shuai Wu
- Department of Mechanical Engineering, Stanford University, Stanford, CA, 94305, USA
| | - Xiaohao Sun
- The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, 30332, USA
| | - H Jerry Qi
- The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, 30332, USA
| | - Ruike Renee Zhao
- Department of Mechanical Engineering, Stanford University, Stanford, CA, 94305, USA
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23
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Zhao Q, Fan L, Zhao N, He H, Zhang L, Tan Q. Synergistic advancements in high-performance flexible capacitive pressure sensors: structural modifications, AI integration, and diverse applications. NANOSCALE 2024. [PMID: 38415750 DOI: 10.1039/d3nr05155b] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 02/29/2024]
Abstract
The development of flexible pressure sensors for monitoring human motion and physiological signals has attracted extensive scientific research. However, achieving low monitoring limits, a wide detection range, large bending stresses, and excellent mechanical stability simultaneously remains a serious challenge. With the aim of developing a high-performance capacitive pressure sensor (CPS), this paper introduces the successful preparation of a single-walled carbon nanotube (SWNT)/polydimethylsiloxane (S-PDMS) composite dielectric with a foam-like structure (high permittivity and low elasticity modulus) and MXene/SWNT (S-MXene) composite film electrodes with a micro-crumpled structure. The above structurally modified CPS (SMCPS) demonstrated an excellent response output during pressure loading, achieving a wide pressure detection range (up to 700 kPa), a low detection limit (16.55 Pa), fast response/recovery characteristics (48/60 ms), enhanced sensitivity across a wide pressure range, long-term stability under repeated heavy loading and unloading (40 kPa, >2000 cycles), and reliable performance under various temperature and humidity conditions. The SMCPS demonstrated a precise and stable capacitive response in monitoring subtle physiological signals and detecting motion, owing to its unique electrode structure. The flexible device was integrated with an Internet of Things module to create a smart glove system that enables real-time tracking of dynamic gestures. This system demonstrates exceptional performance in gesture recognition and prediction with artificial intelligence analysis, highlighting the potential of the SMCPS in human-machine interface applications.
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Affiliation(s)
- Qiang Zhao
- Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China.
- Science and Technology on Electronic Test and Measurement Laboratory, North University of China, Tai Yuan 030051, China
| | - Lei Fan
- Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China.
- Science and Technology on Electronic Test and Measurement Laboratory, North University of China, Tai Yuan 030051, China
| | - Nan Zhao
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Shanghai Jiao Tong University, Shanghai 200240, China
| | - Haoyun He
- Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China.
- Science and Technology on Electronic Test and Measurement Laboratory, North University of China, Tai Yuan 030051, China
| | - Lei Zhang
- Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China.
- Science and Technology on Electronic Test and Measurement Laboratory, North University of China, Tai Yuan 030051, China
| | - Qiulin Tan
- Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, North University of China, Tai Yuan 030051, China.
- Science and Technology on Electronic Test and Measurement Laboratory, North University of China, Tai Yuan 030051, China
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24
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Nichterwitz M, Hiekel K, Wolf D, Eychmüller A, Leistner K. Voltage-Controlled ON-OFF-Switching of Magnetoresistance in FeO x/Fe/Au Aerogel Networks. ACS MATERIALS AU 2024; 4:55-64. [PMID: 38221921 PMCID: PMC10786128 DOI: 10.1021/acsmaterialsau.3c00045] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 05/27/2023] [Revised: 09/28/2023] [Accepted: 09/28/2023] [Indexed: 01/16/2024]
Abstract
Voltage control of magnetoresistance (MR) in nanoscale three-dimensional (3D) geometries is interesting from a fundamental point of view and a promising route toward novel sensors and energy-efficient computing schemes. Magneto-ionic mechanisms are favorable for low-voltage control of magnetism and room-temperature operation, but magneto-ionic control of MR has been studied only for planar geometries so far. We synthesize a 3D nanomaterial with magneto-ionic functionality by electrodepositing an iron hydroxide/iron coating on a porous nanoscale gold network (aerogel). To enable maximum magneto-ionic ON-OFF-switching, the thickness of the coating is adjusted to a few nanometers by a self-terminating electrodeposition process. In situ magnetotransport measurements during electrolytic gating of these nanostructures reveal large reversible changes in MR, including ON-OFF-switching of MR, with a small applied voltage difference (1.72 V). This effect is related to the electrochemical switching between a ferromagnetic iron shell/gold core nanostructure (negative MR at the reduction voltage) and an iron oxide shell/gold core nanostructure (negligible MR at the oxidation voltage).
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Affiliation(s)
- Martin Nichterwitz
- Electrochemical
Sensors and Energy Storage, Faculty of Natural Sciences, Institute of Chemistry, TU Chemnitz, Strasse der Nationen 62, Chemnitz 09111, Germany
- Leibniz
IFW Dresden, Helmholtzstrasse 20, Dresden 01069, Germany
| | - Karl Hiekel
- Physical
Chemistry, TU Dresden, Zellescher Weg 19, Dresden 01062, Germany
| | - Daniel Wolf
- Leibniz
IFW Dresden, Helmholtzstrasse 20, Dresden 01069, Germany
| | | | - Karin Leistner
- Electrochemical
Sensors and Energy Storage, Faculty of Natural Sciences, Institute of Chemistry, TU Chemnitz, Strasse der Nationen 62, Chemnitz 09111, Germany
- Leibniz
IFW Dresden, Helmholtzstrasse 20, Dresden 01069, Germany
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25
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McCaskill JS, Karnaushenko D, Zhu M, Schmidt OG. Microelectronic Morphogenesis: Smart Materials with Electronics Assembling into Artificial Organisms. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023; 35:e2306344. [PMID: 37814374 DOI: 10.1002/adma.202306344] [Citation(s) in RCA: 5] [Impact Index Per Article: 2.5] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/30/2023] [Revised: 08/27/2023] [Indexed: 10/11/2023]
Abstract
Microelectronic morphogenesis is the creation and maintenance of complex functional structures by microelectronic information within shape-changing materials. Only recently has in-built information technology begun to be used to reshape materials and their functions in three dimensions to form smart microdevices and microrobots. Electronic information that controls morphology is inheritable like its biological counterpart, genetic information, and is set to open new vistas of technology leading to artificial organisms when coupled with modular design and self-assembly that can make reversible microscopic electrical connections. Three core capabilities of cells in organisms, self-maintenance (homeostatic metabolism utilizing free energy), self-containment (distinguishing self from nonself), and self-reproduction (cell division with inherited properties), once well out of reach for technology, are now within the grasp of information-directed materials. Construction-aware electronics can be used to proof-read and initiate game-changing error correction in microelectronic self-assembly. Furthermore, noncontact communication and electronically supported learning enable one to implement guided self-assembly and enhance functionality. Here, the fundamental breakthroughs that have opened the pathway to this prospective path are reviewed, the extent and way in which the core properties of life can be addressed are analyzed, and the potential and indeed necessity of such technology for sustainable high technology in society is discussed.
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Affiliation(s)
- John S McCaskill
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, 09126, Chemnitz, Germany
- European Centre for Living Technology (ECLT), Ca' Bottacin, Dorsoduro 3911, Venice, 30123, Italy
| | - Daniil Karnaushenko
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, 09126, Chemnitz, Germany
| | - Minshen Zhu
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, 09126, Chemnitz, Germany
| | - Oliver G Schmidt
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, 09126, Chemnitz, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, 09126, Chemnitz, Germany
- European Centre for Living Technology (ECLT), Ca' Bottacin, Dorsoduro 3911, Venice, 30123, Italy
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26
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Bo R, Xu S, Yang Y, Zhang Y. Mechanically-Guided 3D Assembly for Architected Flexible Electronics. Chem Rev 2023; 123:11137-11189. [PMID: 37676059 PMCID: PMC10540141 DOI: 10.1021/acs.chemrev.3c00335] [Citation(s) in RCA: 31] [Impact Index Per Article: 15.5] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/22/2023] [Indexed: 09/08/2023]
Abstract
Architected flexible electronic devices with rationally designed 3D geometries have found essential applications in biology, medicine, therapeutics, sensing/imaging, energy, robotics, and daily healthcare. Mechanically-guided 3D assembly methods, exploiting mechanics principles of materials and structures to transform planar electronic devices fabricated using mature semiconductor techniques into 3D architected ones, are promising routes to such architected flexible electronic devices. Here, we comprehensively review mechanically-guided 3D assembly methods for architected flexible electronics. Mainstream methods of mechanically-guided 3D assembly are classified and discussed on the basis of their fundamental deformation modes (i.e., rolling, folding, curving, and buckling). Diverse 3D interconnects and device forms are then summarized, which correspond to the two key components of an architected flexible electronic device. Afterward, structure-induced functionalities are highlighted to provide guidelines for function-driven structural designs of flexible electronics, followed by a collective summary of their resulting applications. Finally, conclusions and outlooks are given, covering routes to achieve extreme deformations and dimensions, inverse design methods, and encapsulation strategies of architected 3D flexible electronics, as well as perspectives on future applications.
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Affiliation(s)
- Renheng Bo
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Shiwei Xu
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Youzhou Yang
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Yihui Zhang
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
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27
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Li M, Yang H, Xie Y, Huang K, Pan L, Tang W, Bao X, Yang Y, Sun J, Wang X, Che S, Li RW. Enhanced Stress Stability in Flexible Co/Pt Multilayers with Strong Perpendicular Magnetic Anisotropy. NANO LETTERS 2023; 23:8073-8080. [PMID: 37615627 DOI: 10.1021/acs.nanolett.3c02047] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 08/25/2023]
Abstract
Due to the magnetoelastic coupling, the magnetic properties of many flexible magnetic films (such as Fe, Co, and Ni) are sensitive to mechanical stress, which deteriorates the performance of flexible magnetoelectronic devices. We show that by stacking Co and Pt alternatively to form multilayers with strong perpendicular magnetic anisotropy (PMA), both magnetic hysteresis and magnetic domain measurements reveal robust PMA against external stress. As the PMA weakens at increased Co thickness, the magnetic anisotropy is vulnerable to external stress. These results were understood based on a micromagnetic model, which suggests that the strength of magnetoelastic anisotropy with respect to initial effective magnetic anisotropy affects the stress-stability of the film. Although the stress coefficient of magnetoelastic anisotropy is enhanced at reduced Co thickness, the concomitant increase of initial effective magnetic anisotropy guarantees a robust PMA against external stress. Our results provide a route to constructing flexible magnetoelectronic devices with enhanced stress stability.
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Affiliation(s)
- Mengchao Li
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, People's Republic of China
- College of Materials Science and Engineering, Zhejiang University of Technology, Hangzhou 310034, People's Republic of China
| | - Huali Yang
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, People's Republic of China
| | - Yali Xie
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, People's Republic of China
| | - Kai Huang
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, People's Republic of China
- College of Materials Science and Engineering, Zhejiang University of Technology, Hangzhou 310034, People's Republic of China
| | - Lili Pan
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, People's Republic of China
| | - Wei Tang
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, People's Republic of China
| | - Xilai Bao
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, People's Republic of China
| | - Yumeng Yang
- School of Information Science and Technology, ShanghaiTech University, Shanghai 201210, People's Republic of China
| | - Jie Sun
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, People's Republic of China
| | - Xinming Wang
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, People's Republic of China
| | - Shenglei Che
- College of Materials Science and Engineering, Zhejiang University of Technology, Hangzhou 310034, People's Republic of China
| | - Run-Wei Li
- CAS Key Laboratory of Magnetic Materials and Devices & Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, People's Republic of China
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28
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Wu D, Su Y, Li R, Zhao J, Yang L, Yang P. Anisotropic and Highly Sensitive Flexible Strain Sensors Based on Carbon Nanotubes and Iron Nanowires for Human-Computer Interaction Systems. Int J Mol Sci 2023; 24:13029. [PMID: 37685836 PMCID: PMC10488179 DOI: 10.3390/ijms241713029] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/23/2023] [Revised: 08/12/2023] [Accepted: 08/15/2023] [Indexed: 09/10/2023] Open
Abstract
Flexible strain sensors for multi-directional strain detection are crucial in complicated hman-computer interaction (HCI) applications. However, enhancing the anisotropy and sensitivity of the sensors for multi-directional detection in a simple and effective method remains a significant issue. Therefore, this study proposes a flexible strain sensor with anisotropy and high sensitivity based on a high-aspect-ratio V-groove array and a hybrid conductive network of iron nanowires and carbon nanotubes (Fe NWs/CNTs). The sensor exhibits significant anisotropy, with a difference in strain detection sensitivity of up to 35.92 times between two mutually perpendicular directions. Furthermore, the dynamic performance of the sensor shows a good response rate, ranging from 223 ms to 333 ms. The sensor maintains stability and consistent performance even after undergoing 1000 testing cycles. Additionally, the constructed flexible strain sensor is tested using the remote control application of a trolley, demonstrating its high potential for usage in practical HCI systems. This research offers a significant competitive advantage in the development of flexible strain sensors in the field of HCI.
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Affiliation(s)
| | | | - Rui Li
- School of Automation, Chongqing University of Posts and Telecommunications, Chongqing 400065, China; (D.W.); (Y.S.); (J.Z.); (L.Y.)
| | | | | | - Pingan Yang
- School of Automation, Chongqing University of Posts and Telecommunications, Chongqing 400065, China; (D.W.); (Y.S.); (J.Z.); (L.Y.)
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29
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Bellott E, Li Y, Gunter C, Kovaleski S, Maschmann MR. Investigating the Electromechanical Sensitivity of Carbon-Nanotube-Coated Microfibers. SENSORS (BASEL, SWITZERLAND) 2023; 23:s23115190. [PMID: 37299915 DOI: 10.3390/s23115190] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/03/2023] [Revised: 05/25/2023] [Accepted: 05/26/2023] [Indexed: 06/12/2023]
Abstract
The piezoresistance of carbon nanotube (CNT)-coated microfibers is examined using diametric compression. Diverse CNT forest morphologies were studied by changing the CNT length, diameter, and areal density via synthesis time and fiber surface treatment prior to CNT synthesis. Large-diameter (30-60 nm) and relatively low-density CNTs were synthesized on as-received glass fibers. Small-diameter (5-30 nm) and-high density CNTs were synthesized on glass fibers coated with 10 nm of alumina. The CNT length was controlled by adjusting synthesis time. Electromechanical compression was performed by measuring the electrical resistance in the axial direction during diametric compression. Gauge factors exceeding three were measured for small-diameter (<25 μm) coated fibers, corresponding to as much as 35% resistance change per micrometer of compression. The gauge factor for high-density, small-diameter CNT forests was generally greater than those for low-density, large-diameter forests. A finite element simulation shows that the piezoresistive response originates from both the contact resistance and intrinsic resistance of the forest itself. The change in contact and intrinsic resistance are balanced for relatively short CNT forests, while the response is dominated by CNT electrode contact resistance for taller CNT forests. These results are expected to guide the design of piezoresistive flow and tactile sensors.
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Affiliation(s)
- Elizabeth Bellott
- Department of Mechanical & Aerospace Engineering, University of Missouri, Columbia, MO 65211, USA
| | - Yushan Li
- Department of Mechanical & Aerospace Engineering, University of Missouri, Columbia, MO 65211, USA
| | - Connor Gunter
- Department of Electrical Engineering & Computer Science, University of Missouri, Columbia, MO 65211, USA
| | - Scott Kovaleski
- Department of Electrical Engineering & Computer Science, University of Missouri, Columbia, MO 65211, USA
| | - Matthew R Maschmann
- Department of Mechanical & Aerospace Engineering, University of Missouri, Columbia, MO 65211, USA
- MU Materials Science and Engineering Institute, University of Missouri, Columbia, MO 65211, USA
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30
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Ma S, Dahiya AS, Dahiya R. Out-of-Plane Electronics on Flexible Substrates Using Inorganic Nanowires Grown on High-Aspect-Ratio Printed Gold Micropillars. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023:e2210711. [PMID: 37178312 DOI: 10.1002/adma.202210711] [Citation(s) in RCA: 6] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/17/2022] [Revised: 02/06/2023] [Indexed: 05/15/2023]
Abstract
Out-of-plane or 3D electronics on flexible substrates are an interesting direction that can enable novel solutions such as efficient bioelectricity generation and artificial retina. However, the development of devices with such architectures is limited by the lack of suitable fabrication techniques. Additive manufacturing (AM) can but often fail to provide high-resolution, sub-micrometer 3D architectures. Herein, the optimization of a drop-on-demand (DoD), high-resolution electrohydrodynamic (EHD)-based jet printing method for generating 3D gold (Au) micropillars is reported. Libraries of Au micropillar electrode arrays (MEAs) reaching a maximum height of 196 µm and a maximum aspect ratio of 52 are printed. Further, by combining AM with the hydrothermal growth method, a seedless synthesis of zinc oxide (ZnO) nanowires (NWs) on the printed Au MEAs is demonstrated. The developed hybrid approach leads to hierarchical light-sensitive NW-connected networks exhibiting favorable ultraviolet (UV) sensing as demonstrated via fabricating flexible photodetectors (PDs). The 3D PDs exhibit an excellent omnidirectional light-absorption ability and thus, maintain high photocurrents over wide light incidence angles (±90°). Lastly, the PDs are tested under both concave and convex bending at 40 mm, showing excellent mechanical flexibility.
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Affiliation(s)
- Sihang Ma
- James Watt School of Engineering, University of Glasgow, Glasgow, G12 8QQ, UK
| | | | - Ravinder Dahiya
- Bendable Electronics and Sustainable Technologies (BEST) Group, Electrical and Computer Engineering Department, Northeastern University, Boston, MA, 02115, USA
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31
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Pan L, Xie Y, Yang H, Li M, Bao X, Shang J, Li RW. Flexible Magnetic Sensors. SENSORS (BASEL, SWITZERLAND) 2023; 23:4083. [PMID: 37112422 PMCID: PMC10141728 DOI: 10.3390/s23084083] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 02/28/2023] [Revised: 04/03/2023] [Accepted: 04/13/2023] [Indexed: 06/19/2023]
Abstract
With the merits of high sensitivity, high stability, high flexibility, low cost, and simple manufacturing, flexible magnetic field sensors have potential applications in various fields such as geomagnetosensitive E-Skins, magnetoelectric compass, and non-contact interactive platforms. Based on the principles of various magnetic field sensors, this paper introduces the research progress of flexible magnetic field sensors, including the preparation, performance, related applications, etc. In addition, the prospects of flexible magnetic field sensors and their challenges are presented.
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Affiliation(s)
- Lili Pan
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (L.P.); (M.L.); (X.B.); (R.-W.L.)
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
- School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Yali Xie
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (L.P.); (M.L.); (X.B.); (R.-W.L.)
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
| | - Huali Yang
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (L.P.); (M.L.); (X.B.); (R.-W.L.)
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
| | - Mengchao Li
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (L.P.); (M.L.); (X.B.); (R.-W.L.)
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
| | - Xilai Bao
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (L.P.); (M.L.); (X.B.); (R.-W.L.)
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
| | - Jie Shang
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (L.P.); (M.L.); (X.B.); (R.-W.L.)
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
| | - Run-Wei Li
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China; (L.P.); (M.L.); (X.B.); (R.-W.L.)
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
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32
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Luo Y, Abidian MR, Ahn JH, Akinwande D, Andrews AM, Antonietti M, Bao Z, Berggren M, Berkey CA, Bettinger CJ, Chen J, Chen P, Cheng W, Cheng X, Choi SJ, Chortos A, Dagdeviren C, Dauskardt RH, Di CA, Dickey MD, Duan X, Facchetti A, Fan Z, Fang Y, Feng J, Feng X, Gao H, Gao W, Gong X, Guo CF, Guo X, Hartel MC, He Z, Ho JS, Hu Y, Huang Q, Huang Y, Huo F, Hussain MM, Javey A, Jeong U, Jiang C, Jiang X, Kang J, Karnaushenko D, Khademhosseini A, Kim DH, Kim ID, Kireev D, Kong L, Lee C, Lee NE, Lee PS, Lee TW, Li F, Li J, Liang C, Lim CT, Lin Y, Lipomi DJ, Liu J, Liu K, Liu N, Liu R, Liu Y, Liu Y, Liu Z, Liu Z, Loh XJ, Lu N, Lv Z, Magdassi S, Malliaras GG, Matsuhisa N, Nathan A, Niu S, Pan J, Pang C, Pei Q, Peng H, Qi D, Ren H, Rogers JA, Rowe A, Schmidt OG, Sekitani T, Seo DG, Shen G, Sheng X, Shi Q, Someya T, Song Y, Stavrinidou E, Su M, Sun X, Takei K, Tao XM, Tee BCK, Thean AVY, Trung TQ, et alLuo Y, Abidian MR, Ahn JH, Akinwande D, Andrews AM, Antonietti M, Bao Z, Berggren M, Berkey CA, Bettinger CJ, Chen J, Chen P, Cheng W, Cheng X, Choi SJ, Chortos A, Dagdeviren C, Dauskardt RH, Di CA, Dickey MD, Duan X, Facchetti A, Fan Z, Fang Y, Feng J, Feng X, Gao H, Gao W, Gong X, Guo CF, Guo X, Hartel MC, He Z, Ho JS, Hu Y, Huang Q, Huang Y, Huo F, Hussain MM, Javey A, Jeong U, Jiang C, Jiang X, Kang J, Karnaushenko D, Khademhosseini A, Kim DH, Kim ID, Kireev D, Kong L, Lee C, Lee NE, Lee PS, Lee TW, Li F, Li J, Liang C, Lim CT, Lin Y, Lipomi DJ, Liu J, Liu K, Liu N, Liu R, Liu Y, Liu Y, Liu Z, Liu Z, Loh XJ, Lu N, Lv Z, Magdassi S, Malliaras GG, Matsuhisa N, Nathan A, Niu S, Pan J, Pang C, Pei Q, Peng H, Qi D, Ren H, Rogers JA, Rowe A, Schmidt OG, Sekitani T, Seo DG, Shen G, Sheng X, Shi Q, Someya T, Song Y, Stavrinidou E, Su M, Sun X, Takei K, Tao XM, Tee BCK, Thean AVY, Trung TQ, Wan C, Wang H, Wang J, Wang M, Wang S, Wang T, Wang ZL, Weiss PS, Wen H, Xu S, Xu T, Yan H, Yan X, Yang H, Yang L, Yang S, Yin L, Yu C, Yu G, Yu J, Yu SH, Yu X, Zamburg E, Zhang H, Zhang X, Zhang X, Zhang X, Zhang Y, Zhang Y, Zhao S, Zhao X, Zheng Y, Zheng YQ, Zheng Z, Zhou T, Zhu B, Zhu M, Zhu R, Zhu Y, Zhu Y, Zou G, Chen X. Technology Roadmap for Flexible Sensors. ACS NANO 2023; 17:5211-5295. [PMID: 36892156 PMCID: PMC11223676 DOI: 10.1021/acsnano.2c12606] [Show More Authors] [Citation(s) in RCA: 337] [Impact Index Per Article: 168.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative efforts, scientific breakthroughs can be made sooner and capitalized for the betterment of humanity.
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Affiliation(s)
- Yifei Luo
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
| | - Mohammad Reza Abidian
- Department of Biomedical Engineering, University of Houston, Houston, Texas 77024, United States
| | - Jong-Hyun Ahn
- School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
| | - Deji Akinwande
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States
| | - Anne M Andrews
- Department of Chemistry and Biochemistry, California NanoSystems Institute, and Department of Psychiatry and Biobehavioral Sciences, Semel Institute for Neuroscience and Human Behavior, and Hatos Center for Neuropharmacology, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Markus Antonietti
- Colloid Chemistry Department, Max Planck Institute of Colloids and Interfaces, 14476 Potsdam, Germany
| | - Zhenan Bao
- Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
| | - Magnus Berggren
- Laboratory of Organic Electronics, Department of Science and Technology, Campus Norrköping, Linköping University, 83 Linköping, Sweden
- Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC), SE-100 44 Stockholm, Sweden
| | - Christopher A Berkey
- Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
| | - Christopher John Bettinger
- Department of Biomedical Engineering and Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States
| | - Jun Chen
- Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Peng Chen
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Wenlong Cheng
- Nanobionics Group, Department of Chemical and Biological Engineering, Monash University, Clayton, Australia, 3800
- Monash Institute of Medical Engineering, Monash University, Clayton, Australia3800
| | - Xu Cheng
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
| | - Seon-Jin Choi
- Division of Materials of Science and Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, Republic of Korea
| | - Alex Chortos
- School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47906, United States
| | - Canan Dagdeviren
- Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States
| | - Reinhold H Dauskardt
- Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
| | - Chong-An Di
- Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
| | - Michael D Dickey
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States
| | - Xiangfeng Duan
- Department of Chemistry and Biochemistry, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Antonio Facchetti
- Department of Chemistry and the Materials Research Center, Northwestern University, Evanston, Illinois 60208, United States
| | - Zhiyong Fan
- Department of Electronic and Computer Engineering and Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China
| | - Yin Fang
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Jianyou Feng
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Xue Feng
- Laboratory of Flexible Electronics Technology, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
| | - Huajian Gao
- School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Wei Gao
- Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, California, 91125, United States
| | - Xiwen Gong
- Department of Chemical Engineering, Department of Materials Science and Engineering, Department of Electrical Engineering and Computer Science, Applied Physics Program, and Macromolecular Science and Engineering Program, University of Michigan, Ann Arbor, Michigan, 48109 United States
| | - Chuan Fei Guo
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China
| | - Xiaojun Guo
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
| | - Martin C Hartel
- Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Zihan He
- Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
| | - John S Ho
- Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- The N.1 Institute for Health, National University of Singapore, Singapore 117456, Singapore
| | - Youfan Hu
- School of Electronics and Center for Carbon-Based Electronics, Peking University, Beijing 100871, China
| | - Qiyao Huang
- School of Fashion and Textiles, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
| | - Yu Huang
- Department of Materials Science and Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Fengwei Huo
- Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, PR China
| | - Muhammad M Hussain
- mmh Labs, Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47906, United States
| | - Ali Javey
- Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States
- Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States
| | - Unyong Jeong
- Department of Materials Science and Engineering, Pohang University of Science and Engineering (POSTECH), Pohang, Gyeong-buk 37673, Korea
| | - Chen Jiang
- Department of Electronic Engineering, Tsinghua University, Beijing 100084, China
| | - Xingyu Jiang
- Department of Biomedical Engineering, Southern University of Science and Technology, No 1088, Xueyuan Road, Xili, Nanshan District, Shenzhen, Guangdong 518055, PR China
| | - Jiheong Kang
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Daniil Karnaushenko
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
| | | | - Dae-Hyeong Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Il-Doo Kim
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea
| | - Dmitry Kireev
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States
| | - Lingxuan Kong
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Chengkuo Lee
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
- NUS Graduate School-Integrative Sciences and Engineering Programme (ISEP), National University of Singapore, Singapore 119077, Singapore
| | - Nae-Eung Lee
- School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
| | - Pooi See Lee
- School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
- Singapore-HUJ Alliance for Research and Enterprise (SHARE), Campus for Research Excellence and Technological Enterprise (CREATE), Singapore 138602, Singapore
| | - Tae-Woo Lee
- Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
- School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
- Institute of Engineering Research, Research Institute of Advanced Materials, Seoul National University, Soft Foundry, Seoul 08826, Republic of Korea
- Interdisciplinary Program in Bioengineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Fengyu Li
- College of Chemistry and Materials Science, Jinan University, Guangzhou, Guangdong 510632, China
| | - Jinxing Li
- Department of Biomedical Engineering, Department of Electrical and Computer Engineering, Neuroscience Program, BioMolecular Science Program, and Institute for Quantitative Health Science and Engineering, Michigan State University, East Lansing, Michigan 48823, United States
| | - Cuiyuan Liang
- School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
| | - Chwee Teck Lim
- Department of Biomedical Engineering, National University of Singapore, Singapore 117583, Singapore
- Mechanobiology Institute, National University of Singapore, Singapore 117411, Singapore
- Institute for Health Innovation and Technology, National University of Singapore, Singapore 119276, Singapore
| | - Yuanjing Lin
- School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China
| | - Darren J Lipomi
- Department of Nano and Chemical Engineering, University of California, San Diego, La Jolla, California 92093-0448, United States
| | - Jia Liu
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Kai Liu
- School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
| | - Nan Liu
- Beijing Key Laboratory of Energy Conversion and Storage Materials, College of Chemistry, Beijing Normal University, Beijing 100875, PR China
| | - Ren Liu
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Yuxin Liu
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Department of Biomedical Engineering, N.1 Institute for Health, Institute for Health Innovation and Technology (iHealthtech), National University of Singapore, Singapore 119077, Singapore
| | - Yuxuan Liu
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Zhiyuan Liu
- Neural Engineering Centre, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China 518055
| | - Zhuangjian Liu
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Xian Jun Loh
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
| | - Nanshu Lu
- Department of Aerospace Engineering and Engineering Mechanics, Department of Electrical and Computer Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Zhisheng Lv
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
| | - Shlomo Magdassi
- Institute of Chemistry and the Center for Nanoscience and Nanotechnology, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel
| | - George G Malliaras
- Electrical Engineering Division, Department of Engineering, University of Cambridge CB3 0FA, Cambridge United Kingdom
| | - Naoji Matsuhisa
- Institute of Industrial Science, The University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan
| | - Arokia Nathan
- Darwin College, University of Cambridge, Cambridge CB3 9EU, United Kingdom
| | - Simiao Niu
- Department of Biomedical Engineering, Rutgers University, Piscataway, New Jersey 08854, United States
| | - Jieming Pan
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
| | - Changhyun Pang
- School of Chemical Engineering and Samsung Advanced Institute for Health Science and Technology, Sungkyunkwan University, Suwon 16419, Republic of Korea
| | - Qibing Pei
- Department of Materials Science and Engineering, Department of Mechanical and Aerospace Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Huisheng Peng
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Dianpeng Qi
- School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
| | - Huaying Ren
- Department of Chemistry and Biochemistry, University of California, Los Angeles, Los Angeles, California, 90095, United States
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
- Department of Materials Science and Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Departments of Electrical and Computer Engineering and Chemistry, and Department of Neurological Surgery, Northwestern University, Evanston, Illinois 60208, United States
| | - Aaron Rowe
- Becton, Dickinson and Company, 1268 N. Lakeview Avenue, Anaheim, California 92807, United States
- Ready, Set, Food! 15821 Ventura Blvd #450, Encino, California 91436, United States
| | - Oliver G Schmidt
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, Chemnitz 09107, Germany
- Nanophysics, Faculty of Physics, TU Dresden, Dresden 01062, Germany
| | - Tsuyoshi Sekitani
- The Institute of Scientific and Industrial Research (SANKEN), Osaka University, Osaka, Japan 5670047
| | - Dae-Gyo Seo
- Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Guozhen Shen
- School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China
| | - Xing Sheng
- Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Institute for Precision Medicine, Center for Flexible Electronics Technology, and IDG/McGovern Institute for Brain Research, Tsinghua University, Beijing, 100084, China
| | - Qiongfeng Shi
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
| | - Takao Someya
- Department of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo, Tokyo 113-8656, Japan
| | - Yanlin Song
- Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
| | - Eleni Stavrinidou
- Laboratory of Organic Electronics, Department of Science and Technology, Linköping University, SE-601 74 Norrkoping, Sweden
| | - Meng Su
- Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
| | - Xuemei Sun
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Kuniharu Takei
- Department of Physics and Electronics, Osaka Metropolitan University, Sakai, Osaka 599-8531, Japan
| | - Xiao-Ming Tao
- Research Institute for Intelligent Wearable Systems, School of Fashion and Textiles, Hong Kong Polytechnic University, Hong Kong, China
| | - Benjamin C K Tee
- Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore
- iHealthtech, National University of Singapore, Singapore 119276, Singapore
| | - Aaron Voon-Yew Thean
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Tran Quang Trung
- School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
| | - Changjin Wan
- School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China
| | - Huiliang Wang
- Department of Biomedical Engineering, University of Texas at Austin, Austin, Texas 78712, United States
| | - Joseph Wang
- Department of Nanoengineering, University of California, San Diego, California 92093, United States
| | - Ming Wang
- Frontier Institute of Chip and System, State Key Laboratory of Integrated Chip and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China
- the Shanghai Qi Zhi Institute, 41th Floor, AI Tower, No.701 Yunjin Road, Xuhui District, Shanghai 200232, China
| | - Sihong Wang
- Pritzker School of Molecular Engineering, The University of Chicago, Chicago, Illinois, 60637, United States
| | - Ting Wang
- State Key Laboratory of Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
| | - Zhong Lin Wang
- Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China
- Georgia Institute of Technology, Atlanta, Georgia 30332-0245, United States
| | - Paul S Weiss
- California NanoSystems Institute, Department of Chemistry and Biochemistry, Department of Bioengineering, and Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Hanqi Wen
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
- Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, China 314000
| | - Sheng Xu
- Department of Nanoengineering, Department of Electrical and Computer Engineering, Materials Science and Engineering Program, and Department of Bioengineering, University of California San Diego, La Jolla, California, 92093, United States
| | - Tailin Xu
- School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong, 518060, PR China
| | - Hongping Yan
- Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
| | - Xuzhou Yan
- School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
| | - Hui Yang
- Tianjin Key Laboratory of Molecular Optoelectronic Sciences, Department of Chemistry, School of Science, Tianjin University, Tianjin, China, 300072
| | - Le Yang
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Department of Materials Science and Engineering, National University of Singapore (NUS), 9 Engineering Drive 1, #03-09 EA, Singapore 117575, Singapore
| | - Shuaijian Yang
- School of Biomedical Sciences, Faculty of Biological Sciences, University of Leeds, Leeds, LS2 9JT, United Kingdom
| | - Lan Yin
- School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, and Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
| | - Cunjiang Yu
- Department of Engineering Science and Mechanics, Department of Biomedical Engineering, Department of Material Science and Engineering, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, 16802, United States
| | - Guihua Yu
- Materials Science and Engineering Program and Walker Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas, 78712, United States
| | - Jing Yu
- School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
| | - Shu-Hong Yu
- Department of Chemistry, Institute of Biomimetic Materials and Chemistry, Hefei National Research Center for Physical Science at the Microscale, University of Science and Technology of China, Hefei 230026, China
| | - Xinge Yu
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Evgeny Zamburg
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Haixia Zhang
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Xiangyu Zhang
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Xiaosheng Zhang
- School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
| | - Xueji Zhang
- School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong 518060, PR China
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
| | - Yu Zhang
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Siyuan Zhao
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Xuanhe Zhao
- Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, United States
| | - Yuanjin Zheng
- Center for Integrated Circuits and Systems, School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
| | - Yu-Qing Zheng
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication; School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Zijian Zheng
- Department of Applied Biology and Chemical Technology, Faculty of Science, Research Institute for Intelligent Wearable Systems, Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
| | - Tao Zhou
- Center for Neural Engineering, Department of Engineering Science and Mechanics, The Huck Institutes of the Life Sciences, Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, United States
| | - Bowen Zhu
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou 310024, China
| | - Ming Zhu
- Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, 59 Nanyang Drive, Singapore 636921, Singapore
| | - Rong Zhu
- Department of Precision Instrument, Tsinghua University, Beijing 100084, China
| | - Yangzhi Zhu
- Terasaki Institute for Biomedical Innovation, Los Angeles, California, 90064, United States
| | - Yong Zhu
- Department of Mechanical and Aerospace Engineering, Department of Materials Science and Engineering, and Department of Biomedical Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Guijin Zou
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Xiaodong Chen
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
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33
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Cheng X, Fan Z, Yao S, Jin T, Lv Z, Lan Y, Bo R, Chen Y, Zhang F, Shen Z, Wan H, Huang Y, Zhang Y. Programming 3D curved mesosurfaces using microlattice designs. Science 2023; 379:1225-1232. [PMID: 36952411 DOI: 10.1126/science.adf3824] [Citation(s) in RCA: 41] [Impact Index Per Article: 20.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 03/25/2023]
Abstract
Cellular microstructures form naturally in many living organisms (e.g., flowers and leaves) to provide vital functions in synthesis, transport of nutrients, and regulation of growth. Although heterogeneous cellular microstructures are believed to play pivotal roles in their three-dimensional (3D) shape formation, programming 3D curved mesosurfaces with cellular designs remains elusive in man-made systems. We report a rational microlattice design that allows transformation of 2D films into programmable 3D curved mesosurfaces through mechanically guided assembly. Analytical modeling and a machine learning-based computational approach serve as the basis for shape programming and determine the heterogeneous 2D microlattice patterns required for target 3D curved surfaces. About 30 geometries are presented, including both regular and biological mesosurfaces. Demonstrations include a conformable cardiac electronic device, a stingray-like dual mode actuator, and a 3D electronic cell scaffold.
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Affiliation(s)
- Xu Cheng
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Zhichao Fan
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
- College of Mechanical and Vehicle Engineering, Hunan University, Changsha 410082, P.R. China
| | - Shenglian Yao
- School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, P.R. China
| | - Tianqi Jin
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Zengyao Lv
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Yu Lan
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Renheng Bo
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Yitong Chen
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Department of Automation, Tsinghua University, Beijing 100084, P.R. China
| | - Fan Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Zhangming Shen
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Huanhuan Wan
- College of Mechanical and Vehicle Engineering, Hunan University, Changsha 410082, P.R. China
| | - Yonggang Huang
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL 60208, USA
- Departments of Civil & Environmental Engineering, Mechanical Engineering, and Materials Science & Engineering, Northwestern University, Evanston, IL 60208, USA
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
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Wang Y, Sun K, Zhang Q, Yu SS, Han BS, Wang J, Zhao M, Meng X, Chen S, Zheng Y. Flexible integrated sensor with asymmetric structure for simultaneously 3D tactile and thermal sensing. Biosens Bioelectron 2023; 224:115054. [PMID: 36603284 DOI: 10.1016/j.bios.2022.115054] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 11/17/2022] [Revised: 12/27/2022] [Accepted: 12/28/2022] [Indexed: 12/31/2022]
Abstract
The human body detects tactile stimuli through a combination of pressure force and temperature signals via various cutaneous receptors. The development of a multifunctional artificial tactile perception system has potential benefits for future robotic technologies, human-machine interfaces, artificial intelligence, and health monitoring devices. However, constructing systems beyond simple pressure sensing capabilities remains challenging. Here, we propose an artificial flexible and ultra-thin (50 μ m) skin system to simultaneously capture 3D tactile and thermal signals, which mimics the human tactile recognition process using customized sensor pairs and compact peripheral signal-converting circuits. The 3D tactile sensors have a flower-like asymmetric structure with 5-ports and 4 capacitive elements in pairs. Differential and average signals would reveal the curl and amplitude values of the fore field with a resolution of 0.18/mm. The resistive thermal sensors are fabricated with serpentine lines and possess stable heat-sensing performance (165 mV/°C) under shape deformation conditions. Real-time monitoring of the skin stimuli is displayed on the user interface and stored on mobile clients. This work offers broad capabilities relevant to practical applications ranging from assistant prosthetics to artificial electronic skins.
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Affiliation(s)
- Yongqing Wang
- School of Geophysics and Information Technology, China University of Geosciences, Beijing, 100084, China; School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore
| | - Kun Sun
- Beijing Key Laboratory of Advanced Manufacturing Technology, Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, China
| | - Qisheng Zhang
- School of Geophysics and Information Technology, China University of Geosciences, Beijing, 100084, China
| | | | - Boon Siew Han
- Schaeffler Hub for Advanced Research (SHARE@NTU), Nanyang Technological University, 61 Nanyang Dr, 637460, Singapore
| | - Jianpeng Wang
- Department of Critical CareMedicine, The First Affiliated Hospital of Harbin Medical University, Harbin, 150007, China
| | - Mingyan Zhao
- Department of Critical CareMedicine, The First Affiliated Hospital of Harbin Medical University, Harbin, 150007, China
| | - Xianglin Meng
- Department of Critical CareMedicine, The First Affiliated Hospital of Harbin Medical University, Harbin, 150007, China
| | - Sicheng Chen
- School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore.
| | - Yuanjin Zheng
- School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, 639798, Singapore.
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35
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Duan S, Shi Q, Hong J, Zhu D, Lin Y, Li Y, Lei W, Lee C, Wu J. Water-Modulated Biomimetic Hyper-Attribute-Gel Electronic Skin for Robotics and Skin-Attachable Wearables. ACS NANO 2023; 17:1355-1371. [PMID: 36629247 DOI: 10.1021/acsnano.2c09851] [Citation(s) in RCA: 38] [Impact Index Per Article: 19.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/17/2023]
Abstract
Electronic skin (e-skin), mimicking the physical-chemical and sensory properties of human skin, is promising to be applied as robotic skins and skin-attachable wearables with multisensory functionalities. To date, most e-skins are dedicated to sensory function development to mimic human skins in one or several aspects, yet advanced e-skin covering all the hyper-attributes (including both the sensory and physical-chemical properties) of human skins is seldom reported. Herein, a water-modulated biomimetic hyper-attribute-gel (Hygel) e-skin with reversible gel-solid transition is proposed, which exhibits all the desired skin-like physical-chemical properties (stretchability, self-healing, biocompatibility, biodegradability, weak acidity, antibacterial activities, flame retardance, and temperature adaptivity), sensory properties (pressure, temperature, humidity, strain, and contact), function reconfigurability, and evolvability. Then the Hygel e-skin is applied as an on-robot e-skin and skin-attached wearable to demonstrate its highly skin-like attributes in capturing multiple sensory information, reconfiguring desired functions, and excellent skin compatibility for real-time gesture recognition via deep learning. This Hygel e-skin may find more applications in advanced robotics and even skin-replaceable artificial skin.
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Affiliation(s)
- Shengshun Duan
- Joint International Research Laboratory of Information Display and Visualization, School of Electronic Science and Engineering, Southeast University, Nanjing210096, China
| | - Qiongfeng Shi
- Joint International Research Laboratory of Information Display and Visualization, School of Electronic Science and Engineering, Southeast University, Nanjing210096, China
| | - Jianlong Hong
- Joint International Research Laboratory of Information Display and Visualization, School of Electronic Science and Engineering, Southeast University, Nanjing210096, China
| | - Di Zhu
- Joint International Research Laboratory of Information Display and Visualization, School of Electronic Science and Engineering, Southeast University, Nanjing210096, China
| | - Yucheng Lin
- Joint International Research Laboratory of Information Display and Visualization, School of Electronic Science and Engineering, Southeast University, Nanjing210096, China
| | - Yinghui Li
- Joint International Research Laboratory of Information Display and Visualization, School of Electronic Science and Engineering, Southeast University, Nanjing210096, China
| | - Wei Lei
- Joint International Research Laboratory of Information Display and Visualization, School of Electronic Science and Engineering, Southeast University, Nanjing210096, China
| | - Chengkuo Lee
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore, 117583
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore, 117608
| | - Jun Wu
- Joint International Research Laboratory of Information Display and Visualization, School of Electronic Science and Engineering, Southeast University, Nanjing210096, China
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36
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Jia S, Gao H, Xue Z, Meng X. Recent Advances in Multifunctional Wearable Sensors and Systems: Design, Fabrication, and Applications. BIOSENSORS 2022; 12:bios12111057. [PMID: 36421175 PMCID: PMC9688294 DOI: 10.3390/bios12111057] [Citation(s) in RCA: 10] [Impact Index Per Article: 3.3] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/21/2022] [Revised: 11/14/2022] [Accepted: 11/18/2022] [Indexed: 05/24/2023]
Abstract
Multifunctional wearable sensors and systems are of growing interest over the past decades because of real-time health monitoring and disease diagnosis capability. Owing to the tremendous efforts of scientists, wearable sensors and systems with attractive advantages such as flexibility, comfort, and long-term stability have been developed, which are widely used in temperature monitoring, pulse wave detection, gait pattern analysis, etc. Due to the complexity of human physiological signals, it is necessary to measure multiple physiological information simultaneously to evaluate human health comprehensively. This review summarizes the recent advances in multifunctional wearable sensors, including single sensors with various functions, planar integrated sensors, three-dimensional assembled sensors, and stacked integrated sensors. The design strategy, manufacturing method, and potential application of each type of sensor are discussed. Finally, we offer an outlook on future developments and provide perspectives on the remaining challenges and opportunities of wearable multifunctional sensing technology.
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37
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Man J, Chen G, Chen J. Recent Progress of Biomimetic Tactile Sensing Technology Based on Magnetic Sensors. BIOSENSORS 2022; 12:1054. [PMID: 36421172 PMCID: PMC9688171 DOI: 10.3390/bios12111054] [Citation(s) in RCA: 7] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/20/2022] [Revised: 11/08/2022] [Accepted: 11/17/2022] [Indexed: 05/14/2023]
Abstract
In the past two decades, biomimetic tactile sensing technology has been a hot spot in academia. It has prospective applications in many fields such as medical treatment, health monitoring, robot tactile feedback, and human-machine interaction. With the rapid development of magnetic sensors, biomimetic tactile sensing technology based on magnetic sensors (which are called magnetic tactile sensors below) has been widely studied in recent years. In order to clarify the development status and application characteristics of magnetic tactile sensors, this paper firstly reviews the magnetic tactile sensors from three aspects: the types of magnetic sensors, the sources of magnetic field, and the structures of sensitive bodies used in magnetic tactile sensors. Secondly, the development of magnetic tactile sensors in four applications of robot precision grasping, texture characterization, flow velocity measurement, and medical treatment is introduced in detail. Finally, this paper analyzes technical difficulties and proposes prospective research directions for magnetic tactile sensors.
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Affiliation(s)
- Jiandong Man
- State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, China
- School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Guangyuan Chen
- State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, China
| | - Jiamin Chen
- State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, China
- School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
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38
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Shimada K. Morphological Fabrication of Equilibrium and Auditory Sensors through Electrolytic Polymerization on Hybrid Fluid Rubber (HF Rubber) for Smart Materials of Robotics. SENSORS (BASEL, SWITZERLAND) 2022; 22:s22145447. [PMID: 35891135 PMCID: PMC9319743 DOI: 10.3390/s22145447] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/13/2022] [Revised: 07/07/2022] [Accepted: 07/20/2022] [Indexed: 05/14/2023]
Abstract
The development of auditory sensors and systems is essential in smart materials of robotics and is placed at the strategic category of mutual communication between humans and robots. We designed prototypes of the rubber-made equilibrium and auditory sensors, mimicking hair cells in the saccule and the cochlea at the vestibule of the human ear by utilizing our previously proposed technique of electrolytic polymerization on the hybrid fluid rubber (HF rubber). The fabricated artificial hair cells embedded with mimicked free nerve endings and Pacinian corpuscles, which are well-known receptors in the human skin and have already been elucidated effective in the previous study, have the intelligence of equilibrium and auditory sensing. Moreover, they have a voltage that is generated from built-in electricity caused by the ionized particles and molecules in the HF rubber due to piezoelectricity. We verified the equilibrium and auditory characteristics by measuring the changes in voltage with inclination, vibration over a wide frequency range, and sound waves. We elucidated experimentally that the intelligence has optimum morphological conditions. This work has the possibility of advancing the novel technology of state-of-the-art social robotics.
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Affiliation(s)
- Kunio Shimada
- Faculty of Symbiotic Systems Sciences, Fukushima University, 1 Kanayagawa, Fukushima 960-1296, Japan
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