51
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Comandini G, Ouisse M, Ting VP, Scarpa F. Acoustic transmission loss in Hilbert fractal metamaterials. Sci Rep 2023; 13:19058. [PMID: 37925576 PMCID: PMC10625595 DOI: 10.1038/s41598-023-43646-1] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/29/2023] [Accepted: 09/26/2023] [Indexed: 11/06/2023] Open
Abstract
Acoustic metamaterials are increasingly being considered as a viable technology for sound insulation. Fractal patterns constitute a potentially groundbreaking architecture for acoustic metamaterials. We describe in this work the behaviour of the transmission loss of Hilbert fractal metamaterials used for sound control purposes. The transmission loss of 3D printed metamaterials with Hilbert fractal patterns related to configurations from the zeroth to the fourth order is investigated here using impedance tube tests and Finite Element models. We evaluate, in particular, the impact of the equivalent porosity and the relative size of the cavity of the fractal pattern versus the overall dimensions of the metamaterial unit. We also provide an analytical formulation that relates the acoustic cavity resonances in the fractal patterns and the frequencies associated with the maxima of the transmission losses, providing opportunities to tune the sound insulation properties through control of the fractal architecture.
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Affiliation(s)
- Gianni Comandini
- Bristol Composite Institute (BCI), School of Civil, Aerospace and Mechanical Engineering (CAME), University of Bristol, Bristol, UK.
- SUPMICROTECH, Université de Franche-Comté, CNRS, Institut FEMTO-ST, 25000, Besançon, France.
| | - Morvan Ouisse
- SUPMICROTECH, Université de Franche-Comté, CNRS, Institut FEMTO-ST, 25000, Besançon, France
| | - Valeska P Ting
- Bristol Composite Institute (BCI), School of Civil, Aerospace and Mechanical Engineering (CAME), University of Bristol, Bristol, UK
- Research School of Chemistry, Australian National University, Canberra, ACT, 2601, Australia
| | - Fabrizio Scarpa
- Bristol Composite Institute (BCI), School of Civil, Aerospace and Mechanical Engineering (CAME), University of Bristol, Bristol, UK
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52
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Li G, Wong TW, Shih B, Guo C, Wang L, Liu J, Wang T, Liu X, Yan J, Wu B, Yu F, Chen Y, Liang Y, Xue Y, Wang C, He S, Wen L, Tolley MT, Zhang AM, Laschi C, Li T. Bioinspired soft robots for deep-sea exploration. Nat Commun 2023; 14:7097. [PMID: 37925504 PMCID: PMC10625581 DOI: 10.1038/s41467-023-42882-3] [Citation(s) in RCA: 29] [Impact Index Per Article: 14.5] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/13/2023] [Accepted: 10/24/2023] [Indexed: 11/06/2023] Open
Abstract
The deep ocean, Earth's untouched expanse, presents immense challenges for exploration due to its extreme pressure, temperature, and darkness. Unlike traditional marine robots that require specialized metallic vessels for protection, deep-sea species thrive without such cumbersome pressure-resistant designs. Their pressure-adaptive forms, unique propulsion methods, and advanced senses have inspired innovation in designing lightweight, compact soft machines. This perspective addresses challenges, recent strides, and design strategies for bioinspired deep-sea soft robots. Drawing from abyssal life, it explores the actuation, sensing, power, and pressure resilience of multifunctional deep-sea soft robots, offering game-changing solutions for profound exploration and operation in harsh conditions.
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Affiliation(s)
- Guorui Li
- Qingdao Innovation and Development Base, Harbin Engineering University, Qingdao, China.
- Science and Technology on Underwater Vehicle Technology Laboratory, Harbin Engineering University, Harbin, China.
- College of Shipbuilding Engineering, Harbin Engineering University, Harbin, China.
| | - Tuck-Whye Wong
- Center for X-Mechanics, Zhejiang University, Hangzhou, China
- Department of Biomedical Engineering and Health Sciences, Universiti Teknologi Malaysia, Skudai, Malaysia
| | - Benjamin Shih
- School of Engineering and Applied Sciences, Harvard University, Cambridge, MA, USA
| | - Chunyu Guo
- Qingdao Innovation and Development Base, Harbin Engineering University, Qingdao, China
- Science and Technology on Underwater Vehicle Technology Laboratory, Harbin Engineering University, Harbin, China
- College of Shipbuilding Engineering, Harbin Engineering University, Harbin, China
| | - Luwen Wang
- School of Information and Electrical Engineering, Hangzhou City University, Hangzhou, China
| | - Jiaqi Liu
- School of Mechanical Engineering and Automation, Beihang University, Beijing, China
| | - Tao Wang
- Qingdao Innovation and Development Base, Harbin Engineering University, Qingdao, China
- Science and Technology on Underwater Vehicle Technology Laboratory, Harbin Engineering University, Harbin, China
- College of Shipbuilding Engineering, Harbin Engineering University, Harbin, China
| | - Xiaobo Liu
- Qingdao Innovation and Development Base, Harbin Engineering University, Qingdao, China
- Science and Technology on Underwater Vehicle Technology Laboratory, Harbin Engineering University, Harbin, China
- College of Shipbuilding Engineering, Harbin Engineering University, Harbin, China
| | - Jiayao Yan
- Department of Mechanical and Aerospace Engineering, University of California, San Diego, MA, USA
| | - Baosheng Wu
- School of Ecology and Environment, Northwestern Polytechnical University, Xi'an, China
| | - Fajun Yu
- Qingdao Innovation and Development Base, Harbin Engineering University, Qingdao, China
- Science and Technology on Underwater Vehicle Technology Laboratory, Harbin Engineering University, Harbin, China
| | - Yunsai Chen
- Qingdao Innovation and Development Base, Harbin Engineering University, Qingdao, China
| | | | - Yaoting Xue
- Center for X-Mechanics, Zhejiang University, Hangzhou, China
| | - Chengjun Wang
- Center for X-Mechanics, Zhejiang University, Hangzhou, China
| | - Shunping He
- Institute of Deep-Sea Science and Engineering, Chinese Academy of Sciences, Sanya, China
| | - Li Wen
- School of Mechanical Engineering and Automation, Beihang University, Beijing, China
| | - Michael T Tolley
- Department of Mechanical and Aerospace Engineering, University of California, San Diego, MA, USA
| | - A-Man Zhang
- Science and Technology on Underwater Vehicle Technology Laboratory, Harbin Engineering University, Harbin, China
- College of Shipbuilding Engineering, Harbin Engineering University, Harbin, China
| | - Cecilia Laschi
- Department of Mechanical Engineering, National University of Singapore, Singapore, Singapore
- The BioRobotics Institute, Scuola Superiore Sant'Anna, Pisa, Italy
| | - Tiefeng Li
- Center for X-Mechanics, Zhejiang University, Hangzhou, China.
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53
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Yu J, Hu C, Wang Z, Wei Y, Liu Z, Li Q, Zhang L, Tan Q, Zang X. Printing Three-Dimensional Refractory Metal Patterns in Ambient Air: Toward High Temperature Sensors. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2023; 10:e2302479. [PMID: 37544898 PMCID: PMC10625119 DOI: 10.1002/advs.202302479] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/19/2023] [Revised: 07/02/2023] [Indexed: 08/08/2023]
Abstract
Refractory metals offer exceptional benefits for high temperature electronics including high-temperature resistance, corrosion resistance and excellent mechanical strength, while their high melting temperature and poor processibility poses challenges to manufacturing. Here this work reports a direct ink writing and tar-mediated laser sintering (DIW-TMLS) technique to fabricate three-dimensional (3D) refractory metal devices for high temperature applications. Metallic inks with high viscosity and enhanced light absorbance are designed by utilizing coal tar as binder. The printed patterns are sintered into oxidation-free porous metallic structures using a low-power (<10 W) laser in ambient environment, and 3D freestanding architectures can be rapidly fabricated by one step. Several applications are presented, including a fractal pattern-based strain gauge, an electrically small antenna (ESA) patterned on a hemisphere, and a wireless temperature sensor that can work up to 350 °C and withstand burning flames. The DIW-TMLS technique paves a viable route for rapid patterning of various metal materials with wide applicability, high flexibility, and 3D conformability, expanding the possibilities of harsh environment sensors.
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Affiliation(s)
- Jichuan Yu
- Department of Mechanical EngineeringTsinghua UniversityBeijing100084China
- Beijing Key Laboratory of Precision/Ultra‐Precision Manufacture Equipments and ControlTsinghua UniversityBeijing100084China
| | - Chuxiong Hu
- Department of Mechanical EngineeringTsinghua UniversityBeijing100084China
- Beijing Key Laboratory of Precision/Ultra‐Precision Manufacture Equipments and ControlTsinghua UniversityBeijing100084China
| | - Ze Wang
- Department of Mechanical EngineeringTsinghua UniversityBeijing100084China
- Beijing Key Laboratory of Precision/Ultra‐Precision Manufacture Equipments and ControlTsinghua UniversityBeijing100084China
| | - Yuankong Wei
- Department of Mechanical EngineeringTsinghua UniversityBeijing100084China
- Key Laboratory for Advanced Materials Processing TechnologyMinistry of EducationTsinghua UniversityBeijing100084China
| | - Zhijin Liu
- Department of Mechanical EngineeringTsinghua UniversityBeijing100084China
- Beijing Key Laboratory of Precision/Ultra‐Precision Manufacture Equipments and ControlTsinghua UniversityBeijing100084China
| | - Qingang Li
- Department of Mechanical EngineeringTsinghua UniversityBeijing100084China
- Key Laboratory for Advanced Materials Processing TechnologyMinistry of EducationTsinghua UniversityBeijing100084China
| | - Lei Zhang
- State Key Laboratory of Dynamic Measurement TechnologyNorth University of ChinaTai Yuan030051China
| | - Qiulin Tan
- State Key Laboratory of Dynamic Measurement TechnologyNorth University of ChinaTai Yuan030051China
| | - Xining Zang
- Department of Mechanical EngineeringTsinghua UniversityBeijing100084China
- Key Laboratory for Advanced Materials Processing TechnologyMinistry of EducationTsinghua UniversityBeijing100084China
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54
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Hu H, Zhang C, Ding Y, Chen F, Huang Q, Zheng Z. A Review of Structure Engineering of Strain-Tolerant Architectures for Stretchable Electronics. SMALL METHODS 2023; 7:e2300671. [PMID: 37661591 DOI: 10.1002/smtd.202300671] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/29/2023] [Revised: 08/01/2023] [Indexed: 09/05/2023]
Abstract
Stretchable electronics possess significant advantages over their conventional rigid counterparts and boost game-changing applications such as bioelectronics, flexible displays, wearable health monitors, etc. It is, nevertheless, a formidable task to impart stretchability to brittle electronic materials such as silicon. This review provides a concise but critical discussion of the prevailing structural engineering strategies for achieving strain-tolerant electronic devices. Not only the more commonly discussed lateral designs of structures such as island-bridge, wavy structures, fractals, and kirigami, but also the less discussed vertical architectures such as strain isolation and elastoplastic principle are reviewed. Future opportunities are envisaged at the end of the paper.
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Affiliation(s)
- Hong Hu
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
| | - Chi Zhang
- Department of Applied Biology and Chemical Technology, Faculty of Science, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
| | - Yichun Ding
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
| | - Fan Chen
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
| | - Qiyao Huang
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
- Research Institute for Intelligent Wearable Systems, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
| | - Zijian Zheng
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
- Department of Applied Biology and Chemical Technology, Faculty of Science, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
- Research Institute for Intelligent Wearable Systems, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
- Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hong Kong SAR, 999077, China
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55
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Kim S, Jang J, Kang K, Jin S, Choi H, Son D, Shin M. Injection-on-Skin Granular Adhesive for Interactive Human-Machine Interface. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023; 35:e2307070. [PMID: 37769671 DOI: 10.1002/adma.202307070] [Citation(s) in RCA: 6] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/18/2023] [Revised: 09/12/2023] [Indexed: 10/03/2023]
Abstract
Realization of interactive human-machine interfaces (iHMI) is improved with development of soft tissue-like strain sensors beyond hard robotic exosuits, potentially allowing cognitive behavior therapy and physical rehabilitation for patients with brain disorders. Here, this study reports on a strain-sensitive granular adhesive inspired by the core-shell architectures of natural basil seeds for iHMI as well as human-metaverse interfacing. The granular adhesive sensor consists of easily fragmented hydropellets as a core and tissue-adhesive catecholamine layers as a shell, satisfying great on-skin injectability, ionic-electrical conductivity, and sensitive resistance changes through reversible yet robust cohesion among the hydropellets. Particularly, it is found that the ionic-electrical self-doping of the catecholamine shell on hydrosurfaces leads to a compact ion density of the materials. Based on these physical and electrical properties of the sensor, it is demonstrated that successful iHMI integration with a robot arm in both real and virtual environments enables robotic control by finger gesture and haptic feedback. This study expresses benefits of using granular hydrogel-based strain sensors for implementing on-skin writable bioelectronics and their bridging into the metaverse world.
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Affiliation(s)
- Sumin Kim
- Department of Intelligent Precision Healthcare Convergence, Sungkyunkwan University, Suwon, 16419, Republic of Korea
- Center for Neuroscience Imaging Research, Institute for Basic Science (IBS), Suwon, 16419, Republic of Korea
| | - Jaepyo Jang
- Center for Neuroscience Imaging Research, Institute for Basic Science (IBS), Suwon, 16419, Republic of Korea
- Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, 16419, Republic of Korea
| | - Kyumin Kang
- Center for Neuroscience Imaging Research, Institute for Basic Science (IBS), Suwon, 16419, Republic of Korea
- Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, 16419, Republic of Korea
| | - Subin Jin
- Department of Intelligent Precision Healthcare Convergence, Sungkyunkwan University, Suwon, 16419, Republic of Korea
- Center for Neuroscience Imaging Research, Institute for Basic Science (IBS), Suwon, 16419, Republic of Korea
| | - Heewon Choi
- Center for Neuroscience Imaging Research, Institute for Basic Science (IBS), Suwon, 16419, Republic of Korea
- Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, 16419, Republic of Korea
| | - Donghee Son
- Center for Neuroscience Imaging Research, Institute for Basic Science (IBS), Suwon, 16419, Republic of Korea
- Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, 16419, Republic of Korea
- Department of Artificial Intelligence System Engineering, Sungkyunkwan University, Suwon, 16419, Republic of Korea
| | - Mikyung Shin
- Department of Intelligent Precision Healthcare Convergence, Sungkyunkwan University, Suwon, 16419, Republic of Korea
- Center for Neuroscience Imaging Research, Institute for Basic Science (IBS), Suwon, 16419, Republic of Korea
- Department of Biomedical Engineering, Sungkyunkwan University, Suwon, 16419, Republic of Korea
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56
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Zhang Y, Lee G, Li S, Hu Z, Zhao K, Rogers JA. Advances in Bioresorbable Materials and Electronics. Chem Rev 2023; 123:11722-11773. [PMID: 37729090 DOI: 10.1021/acs.chemrev.3c00408] [Citation(s) in RCA: 32] [Impact Index Per Article: 16.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 09/22/2023]
Abstract
Transient electronic systems represent an emerging class of technology that is defined by an ability to fully or partially dissolve, disintegrate, or otherwise disappear at controlled rates or triggered times through engineered chemical or physical processes after a required period of operation. This review highlights recent advances in materials chemistry that serve as the foundations for a subclass of transient electronics, bioresorbable electronics, that is characterized by an ability to resorb (or, equivalently, to absorb) in a biological environment. The primary use cases are in systems designed to insert into the human body, to provide sensing and/or therapeutic functions for timeframes aligned with natural biological processes. Mechanisms of bioresorption then harmlessly eliminate the devices, and their associated load on and risk to the patient, without the need of secondary removal surgeries. The core content focuses on the chemistry of the enabling electronic materials, spanning organic and inorganic compounds to hybrids and composites, along with their mechanisms of chemical reaction in biological environments. Following discussions highlight the use of these materials in bioresorbable electronic components, sensors, power supplies, and in integrated diagnostic and therapeutic systems formed using specialized methods for fabrication and assembly. A concluding section summarizes opportunities for future research.
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Affiliation(s)
- Yamin Zhang
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
| | - Geumbee Lee
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
| | - Shuo Li
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
| | - Ziying Hu
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
| | - Kaiyu Zhao
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States
| | - John A Rogers
- Center for Bio-Integrated Electronics, Northwestern University, Evanston, Illinois 60208, United States
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
- Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States
- Department of Neurological Surgery, Feinberg School of Medicine, Northwestern University, Chicago, Illinois 60611, United States
- Department of Mechanical Engineering, Biomedical Engineering, Chemistry, Electrical Engineering and Computer Science, Northwestern University, Evanston, Illinois 60208, United States
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57
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Cao S, Wei Y, Bo R, Yun X, Xu S, Guan Y, Zhao J, Lan Y, Zhang B, Xiong Y, Jin T, Lai Y, Chang J, Zhao Q, Wei M, Shao Y, Quan Q, Zhang Y. Inversely engineered biomimetic flexible network scaffolds for soft tissue regeneration. SCIENCE ADVANCES 2023; 9:eadi8606. [PMID: 37756408 PMCID: PMC10530085 DOI: 10.1126/sciadv.adi8606] [Citation(s) in RCA: 4] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/22/2023] [Accepted: 08/25/2023] [Indexed: 09/29/2023]
Abstract
Graft-host mechanical mismatch has been a longstanding issue in clinical applications of synthetic scaffolds for soft tissue regeneration. Although numerous efforts have been devoted to resolve this grand challenge, the regenerative performance of existing synthetic scaffolds remains limited by slow tissue growth (comparing to autograft) and mechanical failures. We demonstrate a class of rationally designed flexible network scaffolds that can precisely replicate nonlinear mechanical responses of soft tissues and enhance tissue regeneration via reduced graft-host mechanical mismatch. Such flexible network scaffold includes a tubular network frame containing inversely engineered curved microstructures to produce desired mechanical properties, with an electrospun ultrathin film wrapped around the network to offer a proper microenvironment for cell growth. Using rat models with sciatic nerve defects or Achilles tendon injuries, our network scaffolds show regenerative performances evidently superior to that of clinically approved electrospun conduit scaffolds and achieve similar outcomes to autologous nerve transplantation in prevention of target organ atrophy and recovery of static sciatic index.
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Affiliation(s)
- Shunze Cao
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Yu Wei
- Department of Orthopedic Surgery, The Fourth Medical Center of Chinese PLA General Hospital, Beijing 100142, P.R. China
| | - Renheng Bo
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Xing Yun
- Department of Orthopedic Surgery, The Fourth Medical Center of Chinese PLA General Hospital, Beijing 100142, P.R. China
| | - Shiwei Xu
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Yanjun Guan
- Department of Orthopedic Surgery, Key Laboratory of Musculoskeletal Trauma & War Injuries PLA, Beijing 100142, P.R. China
- Key Lab of Regenerative Medicine in Orthopedics, Chinese PLA General Hospital, Beijing 100142, Beijing, P.R. China
| | - Jianzhong Zhao
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Yu Lan
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Bin Zhang
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
| | - Yingjie Xiong
- Department of Orthopedic Surgery, Key Laboratory of Musculoskeletal Trauma & War Injuries PLA, Beijing 100142, P.R. China
- Key Lab of Regenerative Medicine in Orthopedics, Chinese PLA General Hospital, Beijing 100142, Beijing, P.R. China
| | - Tianqi Jin
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Yuchen Lai
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Jiahui Chang
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
| | - Qing Zhao
- Department of Orthopedic Surgery, The Fourth Medical Center of Chinese PLA General Hospital, Beijing 100142, P.R. China
- Department of Orthopedic Surgery, Key Laboratory of Musculoskeletal Trauma & War Injuries PLA, Beijing 100142, P.R. China
- Key Lab of Regenerative Medicine in Orthopedics, Chinese PLA General Hospital, Beijing 100142, Beijing, P.R. China
| | - Min Wei
- Department of Orthopedic Surgery, The Fourth Medical Center of Chinese PLA General Hospital, Beijing 100142, P.R. China
| | - Yue Shao
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Institute of Biomechanics and Medical Engineering, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
| | - Qi Quan
- Department of Orthopedic Surgery, The Fourth Medical Center of Chinese PLA General Hospital, Beijing 100142, P.R. China
- Department of Orthopedic Surgery, Key Laboratory of Musculoskeletal Trauma & War Injuries PLA, Beijing 100142, P.R. China
- Key Lab of Regenerative Medicine in Orthopedics, Chinese PLA General Hospital, Beijing 100142, Beijing, P.R. China
| | - Yihui Zhang
- AML, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
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58
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Bo R, Xu S, Yang Y, Zhang Y. Mechanically-Guided 3D Assembly for Architected Flexible Electronics. Chem Rev 2023; 123:11137-11189. [PMID: 37676059 PMCID: PMC10540141 DOI: 10.1021/acs.chemrev.3c00335] [Citation(s) in RCA: 31] [Impact Index Per Article: 15.5] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/22/2023] [Indexed: 09/08/2023]
Abstract
Architected flexible electronic devices with rationally designed 3D geometries have found essential applications in biology, medicine, therapeutics, sensing/imaging, energy, robotics, and daily healthcare. Mechanically-guided 3D assembly methods, exploiting mechanics principles of materials and structures to transform planar electronic devices fabricated using mature semiconductor techniques into 3D architected ones, are promising routes to such architected flexible electronic devices. Here, we comprehensively review mechanically-guided 3D assembly methods for architected flexible electronics. Mainstream methods of mechanically-guided 3D assembly are classified and discussed on the basis of their fundamental deformation modes (i.e., rolling, folding, curving, and buckling). Diverse 3D interconnects and device forms are then summarized, which correspond to the two key components of an architected flexible electronic device. Afterward, structure-induced functionalities are highlighted to provide guidelines for function-driven structural designs of flexible electronics, followed by a collective summary of their resulting applications. Finally, conclusions and outlooks are given, covering routes to achieve extreme deformations and dimensions, inverse design methods, and encapsulation strategies of architected 3D flexible electronics, as well as perspectives on future applications.
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Affiliation(s)
- Renheng Bo
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Shiwei Xu
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Youzhou Yang
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
| | - Yihui Zhang
- Applied
Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, 100084 Beijing, People’s Republic of China
- Laboratory
of Flexible Electronics Technology, Tsinghua
University, 100084 Beijing, People’s Republic
of China
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59
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Wang Y, Zhou Z, Li R, Wang J, Sha B, Li S, Su Y. A Hierarchical Theory for the Tensile Stiffness of Non-Buckling Fractal-Inspired Interconnects. NANOMATERIALS (BASEL, SWITZERLAND) 2023; 13:2542. [PMID: 37764571 PMCID: PMC10536892 DOI: 10.3390/nano13182542] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/31/2023] [Revised: 08/21/2023] [Accepted: 09/08/2023] [Indexed: 09/29/2023]
Abstract
The design of non-buckling interconnects with thick sections has gained important applications in stretchable inorganic electronics due to their simultaneous achievement of high stretchability, low resistance, and low heat generation. However, at the same time, such a design sharply increased the tensile stiffness, which is detrimental to the conformal fit and skin comfort. Introducing the fractal design into the non-buckling interconnects is a promising approach to greatly reduce the tensile stiffness while maintaining other excellent performances. Here, a hierarchical theory is proposed for the tensile stiffness of the non-buckling fractal-inspired interconnects with an arbitrary shape at each order, which is verified by the finite element analysis. The results show that the tensile stiffness of the non-buckling fractal-inspired interconnects decreases with the increase in either the height/span ratio or the number of fractal orders but is not highly correlated with the ratio of the two adjacent dimensions. When the ratio of the two adjacent dimensions and height/span ratio are fixed, the tensile stiffness of the serpentine fractal-inspired interconnect is smaller than that of sinusoidal and zigzag fractal-inspired interconnects. These findings are of great significance for the design of non-buckling fractal-inspired interconnects of stretchable inorganic electronics.
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Affiliation(s)
- Yongkang Wang
- State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China
- School of Engineering Science, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Zanxin Zhou
- State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China
- School of Engineering Science, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Rui Li
- State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, Department of Engineering Mechanics, International Research Center for Computational Mechanics, Dalian University of Technology, Dalian 116024, China
| | - Jianru Wang
- Xi’an Aerospace Propulsion Technology Institute, Xi’an 710025, China
| | - Baolin Sha
- The 41st Institute of the Fourth Academy of CASC, Xi’an 710025, China
| | - Shuang Li
- State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China
- School of Engineering Science, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Yewang Su
- State Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China
- School of Engineering Science, University of Chinese Academy of Sciences, Beijing 100049, China
- Beijing Key Laboratory of Engineered Construction and Mechanobiology, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China
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Wu SD, Hsu SH, Ketelsen B, Bittinger SC, Schlicke H, Weller H, Vossmeyer T. Fabrication of Eco-Friendly Wearable Strain Sensor Arrays via Facile Contact Printing for Healthcare Applications. SMALL METHODS 2023; 7:e2300170. [PMID: 37154264 DOI: 10.1002/smtd.202300170] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/13/2023] [Revised: 03/28/2023] [Indexed: 05/10/2023]
Abstract
Wearable flexible strain sensors with spatial resolution enable the acquisition and analysis of complex actions for noninvasive personalized healthcare applications. To provide secure contact with skin and to avoid environmental pollution after usage, sensors with biocompatibility and biodegradability are highly desirable. Herein, wearable flexible strain sensors composed of crosslinked gold nanoparticle (GNP) thin films as the active conductive layer and transparent biodegradable polyurethane (PU) films as the flexible substrate are developed. The patterned GNP films (micrometer- to millimeter-scale square and rectangle geometry, alphabetic characters, and wave and array patterns) are transferred onto the biodegradable PU film via a facile, clean, rapid and high-precision contact printing method, without the need of a sacrificial polymer carrier or organic solvents. The GNP-PU strain sensor with low Young's modulus (≈17.8 MPa) and high stretchability showed good stability and durability (10 000 cycles) as well as degradability (42% weight loss after 17 days at 74 °C in water). The GNP-PU strain sensor arrays with spatiotemporal strain resolution are applied as wearable eco-friendly electronics for monitoring subtle physiological signals (e.g., mapping of arterial lines and sensing pulse waveforms) and large-strain actions (e.g., finger bending).
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Affiliation(s)
- Shin-Da Wu
- Institute of Polymer Science and Engineering, National Taiwan University, Taipei, 10617, Taiwan
- Institute of Physical Chemistry, University of Hamburg, 20146, Hamburg, Germany
| | - Shan-Hui Hsu
- Institute of Polymer Science and Engineering, National Taiwan University, Taipei, 10617, Taiwan
- Institute of Cellular and System Medicine, National Health Research Institutes, Miaoli, 35053, Taiwan
| | - Bendix Ketelsen
- Institute of Physical Chemistry, University of Hamburg, 20146, Hamburg, Germany
| | - Sophia C Bittinger
- Institute of Physical Chemistry, University of Hamburg, 20146, Hamburg, Germany
| | - Hendrik Schlicke
- Fraunhofer Center for Applied Nanotechnology CAN, 20146, Hamburg, Germany
| | - Horst Weller
- Institute of Physical Chemistry, University of Hamburg, 20146, Hamburg, Germany
- Fraunhofer Center for Applied Nanotechnology CAN, 20146, Hamburg, Germany
| | - Tobias Vossmeyer
- Institute of Physical Chemistry, University of Hamburg, 20146, Hamburg, Germany
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Niu W, Tian Q, Liu Z, Liu X. Solvent-Free and Skin-Like Supramolecular Ion-Conductive Elastomers with Versatile Processability for Multifunctional Ionic Tattoos and On-Skin Bioelectronics. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023; 35:e2304157. [PMID: 37345560 DOI: 10.1002/adma.202304157] [Citation(s) in RCA: 19] [Impact Index Per Article: 9.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/04/2023] [Revised: 06/16/2023] [Indexed: 06/23/2023]
Abstract
The development of stable and biocompatible soft ionic conductors, alternatives to hydrogels and ionogels, will open up new avenues for the construction of stretchable electronics. Here, a brand-new design, encapsulating a naturally occurring ionizable compound by a biocompatible polymer via high-density hydrogen bonds, resulting in a solvent-free supramolecular ion-conductive elastomer (SF-supra-ICE) that eliminates the dehydration problem of hydrogels and possesses excellent biocompatibility, is reported. The SF-supra-ICE with high ionic conductivity (>3.3 × 10-2 S m-1 ) exhibits skin-like softness and strain-stiffening behaviors, excellent elasticity, breathability, and self-adhesiveness. Importantly, the SF-supra-ICE can be obtained by a simple water evaporation step to solidify the aqueous precursor into a solvent-free nature. Therefore, the aqueous precursor can act as inks to be painted and printed into customized ionic tattoos (I-tattoos) for the construction of multifunctional on-skin bioelectronics. The painted I-tattoos exhibit ultraconformal and seamless contact with human skin, enabling long-term and high-fidelity recording of various electrophysiological signals with extraordinary immunity to motion artifacts. Human-machine interactions are achieved by exploiting the painted I-tattoos to transmit the electrophysiological signals of human beings. Stretchable I-tattoo electrode arrays, manufactured by the printing method, are demonstrated for multichannel digital diagnosis of the health condition of human back muscles and spine.
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Affiliation(s)
- Wenwen Niu
- State Key Laboratory of Supramolecular Structure and Materials, College of Chemistry, Jilin University, Changchun, 130012, China
| | - Qiong Tian
- CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences (CAS), Shenzhen, 518055, China
| | - Zhiyuan Liu
- CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences (CAS), Shenzhen, 518055, China
| | - Xiaokong Liu
- State Key Laboratory of Supramolecular Structure and Materials, College of Chemistry, Jilin University, Changchun, 130012, China
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Zhao Y, Jin KQ, Li JD, Sheng KK, Huang WH, Liu YL. Flexible and Stretchable Electrochemical Sensors for Biological Monitoring. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023:e2305917. [PMID: 37639636 DOI: 10.1002/adma.202305917] [Citation(s) in RCA: 9] [Impact Index Per Article: 4.5] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/19/2023] [Revised: 08/23/2023] [Indexed: 08/31/2023]
Abstract
The rise of flexible and stretchable electronics has revolutionized biosensor techniques for probing biological systems. Particularly, flexible and stretchable electrochemical sensors (FSECSs) enable the in situ quantification of numerous biochemical molecules in different biological entities owing to their exceptional sensitivity, fast response, and easy miniaturization. Over the past decade, the fabrication and application of FSECSs have significantly progressed. This review highlights key developments in electrode fabrication and FSECSs functionalization. It delves into the electrochemical sensing of various biomarkers, including metabolites, electrolytes, signaling molecules, and neurotransmitters from biological systems, encompassing the outer epidermis, tissues/organs in vitro and in vivo, and living cells. Finally, considering electrode preparation and biological applications, current challenges and future opportunities for FSECSs are discussed.
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Affiliation(s)
- Yi Zhao
- College of Chemistry and Molecular Sciences, Wuhan University, Wuhan, 430072, China
| | - Kai-Qi Jin
- College of Chemistry and Molecular Sciences, Wuhan University, Wuhan, 430072, China
| | - Jing-Du Li
- College of Chemistry and Molecular Sciences, Wuhan University, Wuhan, 430072, China
| | - Kai-Kai Sheng
- College of Chemistry and Molecular Sciences, Wuhan University, Wuhan, 430072, China
| | - Wei-Hua Huang
- College of Chemistry and Molecular Sciences, Wuhan University, Wuhan, 430072, China
| | - Yan-Ling Liu
- College of Chemistry and Molecular Sciences, Wuhan University, Wuhan, 430072, China
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63
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Won D, Bang J, Choi SH, Pyun KR, Jeong S, Lee Y, Ko SH. Transparent Electronics for Wearable Electronics Application. Chem Rev 2023; 123:9982-10078. [PMID: 37542724 PMCID: PMC10452793 DOI: 10.1021/acs.chemrev.3c00139] [Citation(s) in RCA: 52] [Impact Index Per Article: 26.0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/07/2023] [Indexed: 08/07/2023]
Abstract
Recent advancements in wearable electronics offer seamless integration with the human body for extracting various biophysical and biochemical information for real-time health monitoring, clinical diagnostics, and augmented reality. Enormous efforts have been dedicated to imparting stretchability/flexibility and softness to electronic devices through materials science and structural modifications that enable stable and comfortable integration of these devices with the curvilinear and soft human body. However, the optical properties of these devices are still in the early stages of consideration. By incorporating transparency, visual information from interfacing biological systems can be preserved and utilized for comprehensive clinical diagnosis with image analysis techniques. Additionally, transparency provides optical imperceptibility, alleviating reluctance to wear the device on exposed skin. This review discusses the recent advancement of transparent wearable electronics in a comprehensive way that includes materials, processing, devices, and applications. Materials for transparent wearable electronics are discussed regarding their characteristics, synthesis, and engineering strategies for property enhancements. We also examine bridging techniques for stable integration with the soft human body. Building blocks for wearable electronic systems, including sensors, energy devices, actuators, and displays, are discussed with their mechanisms and performances. Lastly, we summarize the potential applications and conclude with the remaining challenges and prospects.
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Affiliation(s)
- Daeyeon Won
- Applied
Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, Seoul 08826, Korea
| | - Junhyuk Bang
- Applied
Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, Seoul 08826, Korea
| | - Seok Hwan Choi
- Applied
Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, Seoul 08826, Korea
| | - Kyung Rok Pyun
- Applied
Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, Seoul 08826, Korea
| | - Seongmin Jeong
- Applied
Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, Seoul 08826, Korea
| | - Youngseok Lee
- Applied
Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, Seoul 08826, Korea
| | - Seung Hwan Ko
- Applied
Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, Seoul 08826, Korea
- Institute
of Engineering Research/Institute of Advanced Machinery and Design
(SNU-IAMD), Seoul National University, Seoul 08826, South Korea
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64
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Wang P, Ding H, Li X, Liu Y, Sun Y, Li Y, Xu G, Chen S, Wang X. Stretchable and Self-Adhesive Humidity-Sensing Patch for Multiplexed Non-Contact Sensing. ACS APPLIED MATERIALS & INTERFACES 2023; 15:38562-38571. [PMID: 37530029 DOI: 10.1021/acsami.3c06767] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 08/03/2023]
Abstract
The slippage of moisture-sensitive materials from substrates during bending or stretching is a common issue that causes baseline drift and even failure of the flexible humidity sensors, which are essential components of wearable electronic devices. In this study, we report a stretchable, self-adhesive, and transparent humidity-sensing electronic patch comprising liquid metal particle electrodes with a stretchable serpentine structure and a humidity-sensing layer made of Ti3C2Tx MXene/carboxymethyl cellulose. This patch is constructed on a soft-hard integrated heterostructure substrate and demonstrates stable humidity-sensitive response performance at 100% tensile strain, along with autonomous adhesion to human skin. Additionally, it exhibits maximum response (1145.4%) at 90% relative humidity (RH), fast response and recovery time (1.4/5.9 s), elevated sensitivity (64.63%/% RH), and preserved humidity sensing under deformation, as well as easy scalability for multiplexed detection. We further illustrate the patch's potential applications in healthcare and environmental monitoring through a non-contact security door control system and wind monitor system. Our proposed strain-isolation strategy can be extended to other rigid conductive materials and stretchable substrates, providing a feasible mechanism for producing stretchable electronic skin patches.
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Affiliation(s)
- Peihe Wang
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan 411105, China
| | - Hongyan Ding
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan 411105, China
| | - Xiaofeng Li
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan 411105, China
| | - Yangchengyi Liu
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan 411105, China
| | - Yi Sun
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan 411105, China
| | - Yujing Li
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan 411105, China
| | - Guozhuang Xu
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan 411105, China
| | - Shangda Chen
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan 411105, China
| | - Xiufeng Wang
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, Hunan 411105, China
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65
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Yang J, Chen Y, Liu S, Liu C, Ma T, Luo Z, Ge G. Single-Line Multi-Channel Flexible Stress Sensor Arrays. MICROMACHINES 2023; 14:1554. [PMID: 37630090 PMCID: PMC10456942 DOI: 10.3390/mi14081554] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/19/2023] [Revised: 08/01/2023] [Accepted: 08/01/2023] [Indexed: 08/27/2023]
Abstract
Flexible stress sensor arrays, comprising multiple flexible stress sensor units, enable accurate quantification and analysis of spatial stress distribution. Nevertheless, the current implementation of flexible stress sensor arrays faces the challenge of excessive signal wires, resulting in reduced deformability, stability, reliability, and increased costs. The primary obstacle lies in the electric amplitude modulation nature of the sensor unit's signal (e.g., resistance and capacitance), allowing only one signal per wire. To overcome this challenge, the single-line multi-channel signal (SLMC) measurement has been developed, enabling simultaneous detection of multiple sensor signals through one or two signal wires, which effectively reduces the number of signal wires, thereby enhancing stability, deformability, and reliability. This review offers a general knowledge of SLMC measurement beginning with flexible stress sensors and their piezoresistive, capacitive, piezoelectric, and triboelectric sensing mechanisms. A further discussion is given on different arraying methods and their corresponding advantages and disadvantages. Finally, this review categorizes existing SLMC measurement methods into RLC series resonant sensing, transmission line sensing, ionic conductor sensing, triboelectric sensing, piezoresistive sensing, and distributed fiber optic sensing based on their mechanisms, describes the mechanisms and characteristics of each method and summarizes the research status of SLMC measurement.
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Affiliation(s)
- Jiayi Yang
- College of Computer Science and Technology, Xi’an University of Science and Technology, Xi’an 710054, China
- College of Safety Science and Engineering, Xi’an University of Science and Technology, Xi’an 710054, China
| | - Yuanyuan Chen
- College of Computer Science and Technology, Xi’an University of Science and Technology, Xi’an 710054, China
| | - Shuoyan Liu
- Department of Materials Science and Engineering, National University of Singapore, Singapore 117583, Singapore
| | - Chang Liu
- Department of Materials Science and Engineering, National University of Singapore, Singapore 117583, Singapore
| | - Tian Ma
- College of Computer Science and Technology, Xi’an University of Science and Technology, Xi’an 710054, China
- College of Safety Science and Engineering, Xi’an University of Science and Technology, Xi’an 710054, China
| | - Zhenmin Luo
- College of Safety Science and Engineering, Xi’an University of Science and Technology, Xi’an 710054, China
| | - Gang Ge
- Department of Materials Science and Engineering, National University of Singapore, Singapore 117583, Singapore
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66
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Gao Y, Zhang H, Song B, Zhao C, Lu Q. Electric Double Layer Based Epidermal Electronics for Healthcare and Human-Machine Interface. BIOSENSORS 2023; 13:787. [PMID: 37622873 PMCID: PMC10452760 DOI: 10.3390/bios13080787] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 06/20/2023] [Revised: 07/25/2023] [Accepted: 07/31/2023] [Indexed: 08/26/2023]
Abstract
Epidermal electronics, an emerging interdisciplinary field, is advancing the development of flexible devices that can seamlessly integrate with the skin. These devices, especially Electric Double Layer (EDL)-based sensors, overcome the limitations of conventional electronic devices, offering high sensitivity, rapid response, and excellent stability. Especially, Electric Double Layer (EDL)-based epidermal sensors show great potential in the application of wearable electronics to detect biological signals due to their high sensitivity, fast response, and excellent stability. The advantages can be attributed to the biocompatibility of the materials, the flexibility of the devices, and the large capacitance due to the EDL effect. Furthermore, we discuss the potential of EDL epidermal electronics as wearable sensors for health monitoring and wound healing. These devices can analyze various biofluids, offering real-time feedback on parameters like pH, temperature, glucose, lactate, and oxygen levels, which aids in accurate diagnosis and effective treatment. Beyond healthcare, we explore the role of EDL epidermal electronics in human-machine interaction, particularly their application in prosthetics and pressure-sensing robots. By mimicking the flexibility and sensitivity of human skin, these devices enhance the functionality and user experience of these systems. This review summarizes the latest advancements in EDL-based epidermal electronic devices, offering a perspective for future research in this rapidly evolving field.
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Affiliation(s)
- Yuan Gao
- School of CHIPS, XJTLU Entrepreneur College (Taicang), Xi’an Jiaotong-Liverpool University, 111 Taicang Avenue, Taicang 215488, China; (Y.G.); (H.Z.); (B.S.)
| | - Hanchu Zhang
- School of CHIPS, XJTLU Entrepreneur College (Taicang), Xi’an Jiaotong-Liverpool University, 111 Taicang Avenue, Taicang 215488, China; (Y.G.); (H.Z.); (B.S.)
| | - Bowen Song
- School of CHIPS, XJTLU Entrepreneur College (Taicang), Xi’an Jiaotong-Liverpool University, 111 Taicang Avenue, Taicang 215488, China; (Y.G.); (H.Z.); (B.S.)
| | - Chun Zhao
- School of Advanced Technology, Xi’an Jiaotong-Liverpool University, Suzhou 215123, China;
| | - Qifeng Lu
- School of CHIPS, XJTLU Entrepreneur College (Taicang), Xi’an Jiaotong-Liverpool University, 111 Taicang Avenue, Taicang 215488, China; (Y.G.); (H.Z.); (B.S.)
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67
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Kim S, Oh YS, Lee K, Kim S, Maeng WY, Kim KS, Kim GB, Cho S, Han H, Park H, Wang M, Avila R, Xie Z, Ko K, Choi J, Je M, Lee H, Lee S, Koo J, Park I. Battery-Free, Wireless, Cuff-Type, Multimodal Physical Sensor for Continuous Temperature and Strain Monitoring of Nerve. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2023; 19:e2206839. [PMID: 37069777 DOI: 10.1002/smll.202206839] [Citation(s) in RCA: 5] [Impact Index Per Article: 2.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/05/2022] [Revised: 02/22/2023] [Indexed: 06/19/2023]
Abstract
Peripheral nerve injuries cause various disabilities related to loss of motor and sensory functions. The treatment of these injuries typically requires surgical operations for improving functional recovery of the nerve. However, capabilities for continuous nerve monitoring remain a challenge. Herein, a battery-free, wireless, cuff-type, implantable, multimodal physical sensing platform for continuous in vivo monitoring of temperature and strain from the injured nerve is introduced. The thin, soft temperature, and strain sensors wrapped around the nerve exhibit good sensitivity, excellent stability, high linearity, and minimum hysteresis in relevant ranges. In particular, the strain sensor integrated with circuits for temperature compensation provides reliable, accurate strain monitoring with negligible temperature dependence. The system enables power harvesting and data communication to wireless, multiple implanted devices wrapped around the nerve. Experimental evaluations, verified by numerical simulations, with animal tests, demonstrate the feasibility and stability of the sensor system, which has great potential for continuous in vivo nerve monitoring from an early stage to complete regeneration.
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Affiliation(s)
- Seunghwan Kim
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea
| | - Yong Suk Oh
- Department of Mechanical Engineering, Changwon National University, Changwon, 51140, Republic of Korea
| | - Kwanghyoung Lee
- Department of Thoracic and Cardiovascular Surgery, Korea University College of Medicine, Seoul, 02841, Republic of Korea
| | - Seongchan Kim
- Center for Biomaterials, Korea Institute of Science and Technology, Seoul, 02841, Republic of Korea
| | - Woo-Youl Maeng
- School of Biomedical Engineering, Korea University, Seoul, 02841, Republic of Korea
| | - Kyung Su Kim
- School of Biomedical Engineering, Korea University, Seoul, 02841, Republic of Korea
- Interdisciplinary Program in Precision Public Health, Korea University, Seoul, 02841, Republic of Korea
| | - Ga-Been Kim
- Center for Biomaterials, Korea Institute of Science and Technology, Seoul, 02841, Republic of Korea
- School of Biomedical Engineering, Korea University, Seoul, 02841, Republic of Korea
| | - Seokjoo Cho
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea
| | - Hyeonseok Han
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea
| | - Hyunwoo Park
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea
| | - Mengqiu Wang
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, 116023, P. R. China
- Ningbo Institute of Dalian University of Technology, Ningbo, 315016, P. R. China
| | - Raudel Avila
- Department of Mechanical Engineering, Northwestern University, Evanston, IL, 60208, USA
| | - Zhaoqian Xie
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, 116023, P. R. China
- Ningbo Institute of Dalian University of Technology, Ningbo, 315016, P. R. China
- DUT-BSU Joint Institute, Dalian University of Technology, Dalian, 116023, P. R. China
| | - Kabseok Ko
- Qualcomm Institute, La Jolla, CA, 92093, USA
- Department of Electronics Engineering, Kangwon National University, Chuncheon, 24341, Republic of Korea
| | - Jungrak Choi
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea
| | - Minkyu Je
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea
| | - Hyojin Lee
- Center for Biomaterials, Korea Institute of Science and Technology, Seoul, 02841, Republic of Korea
| | - Sungho Lee
- Department of Thoracic and Cardiovascular Surgery, Korea University College of Medicine, Seoul, 02841, Republic of Korea
| | - Jahyun Koo
- School of Biomedical Engineering, Korea University, Seoul, 02841, Republic of Korea
- Interdisciplinary Program in Precision Public Health, Korea University, Seoul, 02841, Republic of Korea
| | - Inkyu Park
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea
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Jeong S, Oh J, Kim H, Bae J, Ko SH. Pattern design of a liquid metal-based wearable heater for constant heat generation under biaxial strain. iScience 2023; 26:107008. [PMID: 37332675 PMCID: PMC10275728 DOI: 10.1016/j.isci.2023.107008] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/17/2023] [Revised: 05/05/2023] [Accepted: 05/26/2023] [Indexed: 06/20/2023] Open
Abstract
As the wearable heater is increasingly popular due to its versatile applications, there is a growing need to improve the tensile stability of the wearable heater. However, maintaining the stability and precise control of heating in resistive heaters for wearable electronics remains challenging due to multiaxial dynamic deformation with human motion. Here, we propose a pattern study for a circuit control system without complex structure or deep learning of the liquid metal (LM)-based wearable heater. The LM direct ink writing (DIW) method was used to fabricate the wearable heaters in various designs. Through the study about the pattern, the significance of input power per unit area for steady average temperature with tension was proven, and the directionality of the pattern was shown to be a factor that makes feedback control difficult due to the difference in resistance change according to strain direction. For this issue, a wearable heater with the same minimal resistance change regardless of the tension direction was developed using Peano curves and sinuous pattern structure. Lastly, by attaching to a human body model, the wearable heater with the circuit control system shows stable heating (52.64°C, with a standard deviation of 0.91°C) in actual motion.
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Affiliation(s)
- Seongmin Jeong
- Applied Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul 08826, Korea
| | - Jinhyeok Oh
- Bio-Robotics and Control Lab, Department of Mechanical Engineering, Ulsan National Institute of Science and Technology, 50 UNIST-gil, Ulsan 44919, Korea
| | - Hongchan Kim
- Applied Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul 08826, Korea
| | - Joonbum Bae
- Bio-Robotics and Control Lab, Department of Mechanical Engineering, Ulsan National Institute of Science and Technology, 50 UNIST-gil, Ulsan 44919, Korea
| | - Seung Hwan Ko
- Applied Nano and Thermal Science Lab, Department of Mechanical Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul 08826, Korea
- Institute of Engineering Research/Institute of Advanced Machinery and Design (SNU-IAMD), Seoul National University, Gwanak-ro, Gwanak-gu, Seoul 08826, Korea
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69
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Tsai YY, Chiang Y, Buford JL, Tsai ML, Chen HC, Chang SW. Mechanical and Crack Propagating Behavior of Sierpiński Carpet Composites. ACS Biomater Sci Eng 2023; 9:3912-3922. [PMID: 33843186 DOI: 10.1021/acsbiomaterials.0c01595] [Citation(s) in RCA: 4] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/28/2022]
Abstract
Fractals, mathematically defined as "self-similar subsets at different scales", are ubiquitous in nature despite their complexity in assembly and formulation. Fractal geometry formed by simple components has long been applied to many fields, from physics and chemistry to electronics and architecture. The Sierpiński carpet (SC), a fractal with a Hausdorff dimension of approximately 1.8933, has two-dimensional space-filling abilities and therefore provides many structural applications. However, few studies have investigated its mechanical properties and fracture behaviors. Here, utilizing the lattice spring model (LSM), we constructed SC composites with two base materials and simulated tensile tests to show how fractal iterations affect their mechanical properties and crack propagation. From observing the stress-strain responses, we find that, for either the soft-base or stiff-base SC composites, the second iteration has the optimal mechanical performance in the terms of stiffness, strength, and toughness compared to the composites with higher hierarchies. The reason behind this surprising result is that the largest stress intensities occur at the corners of the smallest squares in the middle zone, which consequently induces crack nucleation. We also find that the main crack tends to deflect locally in SC composites with a soft matrix, but in global main crack behavior, SC composites with a stiff matrix have a large equivalent crack deflection. Furthermore, considering the inherent anisotropy of SC composites, we rotated the samples by 45°. The results show that the tensile strength and toughness of rotated SC composites are inferior and the crack propagating behaviors are distinct from the standard SC composites. This finding infers advanced engineering for crack control and deflection by adjusting the orientation of SC composites. Overall, our study opens the door for future engineering applications in stretchable devices, seismic metamaterials, and structural materials with tunable properties and hierarchies.
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Affiliation(s)
- Ya-Yun Tsai
- Department of Civil Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan
| | - Yuan Chiang
- Department of Civil Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan
| | - Jacqueline L Buford
- Department of Civil Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan
| | - Meng-Lin Tsai
- Department of Civil Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan
| | - Hsien-Chun Chen
- Department of Civil Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan
| | - Shu-Wei Chang
- Department of Civil Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan
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Kwon S, Kim HS, Kwon K, Kim H, Kim YS, Lee SH, Kwon YT, Jeong JW, Trotti LM, Duarte A, Yeo WH. At-home wireless sleep monitoring patches for the clinical assessment of sleep quality and sleep apnea. SCIENCE ADVANCES 2023; 9:eadg9671. [PMID: 37224243 DOI: 10.1126/sciadv.adg9671] [Citation(s) in RCA: 44] [Impact Index Per Article: 22.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/01/2023] [Accepted: 04/17/2023] [Indexed: 05/26/2023]
Abstract
Although many people suffer from sleep disorders, most are undiagnosed, leading to impairments in health. The existing polysomnography method is not easily accessible; it's costly, burdensome to patients, and requires specialized facilities and personnel. Here, we report an at-home portable system that includes wireless sleep sensors and wearable electronics with embedded machine learning. We also show its application for assessing sleep quality and detecting sleep apnea with multiple patients. Unlike the conventional system using numerous bulky sensors, the soft, all-integrated wearable platform offers natural sleep wherever the user prefers. In a clinical study, the face-mounted patches that detect brain, eye, and muscle signals show comparable performance with polysomnography. When comparing healthy controls to sleep apnea patients, the wearable system can detect obstructive sleep apnea with an accuracy of 88.5%. Furthermore, deep learning offers automated sleep scoring, demonstrating portability, and point-of-care usability. At-home wearable electronics could ensure a promising future supporting portable sleep monitoring and home healthcare.
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Affiliation(s)
- Shinjae Kwon
- IEN Center for Human-Centric Interfaces and Engineering at the Institute for Electronics and Nanotechnology, Georgia Institute of Technology, Atlanta, GA 30332, USA
- George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA
| | - Hyeon Seok Kim
- IEN Center for Human-Centric Interfaces and Engineering at the Institute for Electronics and Nanotechnology, Georgia Institute of Technology, Atlanta, GA 30332, USA
- George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA
| | - Kangkyu Kwon
- IEN Center for Human-Centric Interfaces and Engineering at the Institute for Electronics and Nanotechnology, Georgia Institute of Technology, Atlanta, GA 30332, USA
- School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA
| | - Hodam Kim
- IEN Center for Human-Centric Interfaces and Engineering at the Institute for Electronics and Nanotechnology, Georgia Institute of Technology, Atlanta, GA 30332, USA
- George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA
| | - Yun Soung Kim
- Department of Radiology, Icahn School of Medicine at Mount Sinai, BioMedical Engineering and Imaging Institute, New York, NY 10029, USA
| | - Sung Hoon Lee
- IEN Center for Human-Centric Interfaces and Engineering at the Institute for Electronics and Nanotechnology, Georgia Institute of Technology, Atlanta, GA 30332, USA
- School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA
| | - Young-Tae Kwon
- Metal Powder Department, Korea Institute of Materials Science, Changwon 51508, Republic of Korea
| | - Jae-Woong Jeong
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, Republic of Korea
| | - Lynn Marie Trotti
- Emory Sleep Center and Department of Neurology, Emory University School of Medicine, Atlanta, GA 30329, USA
| | - Audrey Duarte
- Department of Psychology, University of Texas at Austin, Austin, TX 78712, USA
| | - Woon-Hong Yeo
- IEN Center for Human-Centric Interfaces and Engineering at the Institute for Electronics and Nanotechnology, Georgia Institute of Technology, Atlanta, GA 30332, USA
- George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA
- Wallace H. Coulter Department of Biomedical Engineering, Georgia Tech and Emory University, Atlanta, GA 30332, USA
- Parker H. Petit Institute for Bioengineering and Biosciences, Institute for Materials, Neural Engineering Center, Institute for Robotics and Intelligent Machines, Georgia Institute of Technology, Atlanta, GA 30332, USA
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71
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Pérez-Moroyoqui R, Rodríguez-Romo S, Ibáñez-Orozco O. Patterns of the radiation properties for Peano antennas. Sci Rep 2023; 13:8358. [PMID: 37225759 DOI: 10.1038/s41598-023-35185-6] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/03/2022] [Accepted: 05/14/2023] [Indexed: 05/26/2023] Open
Abstract
This paper studies metallic microstrip antennas with air as a substrate in the UHF band, patterned after space-filling, self-avoiding, and self-similar (FASS) Peano curves. Our novel study is based on context-free grammar and genetic programming as computing tools to unravel the role of geometry on both; the Voltage Standing Wave Ratio (VSWR[Formula: see text]) and frequency resonance patterns for Peano antennas. We use in our approach the numeric method of moments (MoM) implemented in Matlab 2021a to solve the corresponding Maxwell equations. Novel equations for the patterns of both features (resonance frequencies and frequencies such that the VSWR[Formula: see text]) are provided as functions of the characteristic length L. Antennas spanning a [Formula: see text] area ([Formula: see text]), feeding points set at seven places, and three widths of the metallic strip are introduced as instances of our approach. Finally, a Python 3.7 application is constructed to facilitate the extension and use of our results.
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Affiliation(s)
- René Pérez-Moroyoqui
- Centro de Investigaciones Teóricas, Facultad de Estudios Superiores Cuautitlán, Universidad Nacional Autónoma de México, Cuautitlan, Izcalli, Mexico
| | - Suemi Rodríguez-Romo
- Centro de Investigaciones Teóricas, Facultad de Estudios Superiores Cuautitlán, Universidad Nacional Autónoma de México, Cuautitlan, Izcalli, Mexico.
| | - Oscar Ibáñez-Orozco
- Centro de Investigaciones Teóricas, Facultad de Estudios Superiores Cuautitlán, Universidad Nacional Autónoma de México, Cuautitlan, Izcalli, Mexico
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72
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Zou J, Chen Z, Wang SJ, Liu ZH, Liu YJ, Feng PY, Jing X. A Flexible Sensor with Excellent Environmental Stability Using Well-Designed Encapsulation Structure. Polymers (Basel) 2023; 15:polym15102308. [PMID: 37242884 DOI: 10.3390/polym15102308] [Citation(s) in RCA: 2] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/20/2023] [Revised: 05/06/2023] [Accepted: 05/12/2023] [Indexed: 05/28/2023] Open
Abstract
The hydrogel-based sensors suffer from poor stability and low sensitivity, severely limiting their further development. It is still "a black box" to understand the effect of the encapsulation as well as the electrode on the performance of the hydrogel-based sensors. To address these problems, we prepared an adhesive hydrogel that could robustly adhere to Ecoflex (adhesive strength is 4.7 kPa) as an encapsulation layer and proposed a rational encapsulation model that fully encapsulated the hydrogel within Ecoflex. Owing to the excellent barrier and resilience of Ecoflex, the encapsulated hydrogel-based sensor can still work normally after 30 days, displaying excellent long-term stability. In addition, we performed theoretical and simulation analyses on the contact state between the hydrogel and the electrode. It was surprising to find that the contact state significantly affects the sensitivity of the hydrogel sensors (the maximum difference in sensitivity was 333.6%), indicating that the reasonable design of the encapsulation and electrode are indispensable parts for fabricating successful hydrogel sensors. Therefore, we paved the way for a novel insight to optimize the properties of the hydrogel sensors, which is greatly favorable to developing hydrogel-based sensors to be applied in various fields.
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Affiliation(s)
- Jian Zou
- Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, Hunan University of Technology, Zhuzhou 412007, China
- National and Local Joint Engineering Research Center for Advanced Packaging Material and Technology, Hunan University of Technology, Zhuzhou 412007, China
| | - Zhuo Chen
- Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, Hunan University of Technology, Zhuzhou 412007, China
- National and Local Joint Engineering Research Center for Advanced Packaging Material and Technology, Hunan University of Technology, Zhuzhou 412007, China
| | - Sheng-Ji Wang
- Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, Hunan University of Technology, Zhuzhou 412007, China
- National and Local Joint Engineering Research Center for Advanced Packaging Material and Technology, Hunan University of Technology, Zhuzhou 412007, China
| | - Zi-Hao Liu
- Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, Hunan University of Technology, Zhuzhou 412007, China
| | - Yue-Jun Liu
- Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, Hunan University of Technology, Zhuzhou 412007, China
- National and Local Joint Engineering Research Center for Advanced Packaging Material and Technology, Hunan University of Technology, Zhuzhou 412007, China
| | - Pei-Yong Feng
- National and Local Joint Engineering Research Center for Advanced Packaging Material and Technology, Hunan University of Technology, Zhuzhou 412007, China
| | - Xin Jing
- Key Laboratory of Advanced Packaging Materials and Technology of Hunan Province, Hunan University of Technology, Zhuzhou 412007, China
- National and Local Joint Engineering Research Center for Advanced Packaging Material and Technology, Hunan University of Technology, Zhuzhou 412007, China
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73
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Shi R, Liu X, Lei T, Lu L, Xia Z, Wong M. An Integrated Analog Front-End System on Flexible Substrate for the Acquisition of Bio-Potential Signals. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2023; 10:e2207683. [PMID: 36869413 PMCID: PMC10161121 DOI: 10.1002/advs.202207683] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/27/2022] [Revised: 02/09/2023] [Indexed: 05/06/2023]
Abstract
The application of a versatile, low-temperature thin-film transistor (TFT) technology is presently described as the implementation on a flexible substrate of an analog front-end (AFE) system for the acquisition of bio-potential signals. The technology is based on semiconducting amorphous indium-gallium-zinc oxide (IGZO). The AFE system consists of three monolithically integrated constituent components: a bias-filter circuit with a bio-compatible low cut-off frequency of ≈1 Hz, a 4-stage differential amplifier offering a large gain-bandwidth product of ≈955 kHz, and an additional notch filter exhibiting over 30 dB suppression of the power-line noise. Respectively built using conductive IGZO electrodes with thermally induced donor agents and enhancement-mode fluorinated IGZO TFTs with exceptionally low leakage current, both capacitors and resistors with significantly reduced footprints are realized. Defined as the ratio of the gain-bandwidth product of an AFE system to its area, a record-setting figure-of-merit of ≈86 kHz mm-2 is achieved. This is about an order of magnitude larger than the < 10 kHz mm-2 of the nearest benchmark. Requiring no supplementary off-substrate signal-conditioning components and occupying an area of ≈11 mm2 , the stand-alone AFE system is successfully applied to both electromyography and electrocardiography (ECG).
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Affiliation(s)
- Runxiao Shi
- State Key Laboratory of Advanced Displays and Optoelectronics and TechnologiesDepartment of Electronic and Computer EngineeringThe Hong Kong University of Science and TechnologyHong Kong999077China
| | - Xuchi Liu
- State Key Laboratory of Advanced Displays and Optoelectronics and TechnologiesDepartment of Electronic and Computer EngineeringThe Hong Kong University of Science and TechnologyHong Kong999077China
| | - Tengteng Lei
- State Key Laboratory of Advanced Displays and Optoelectronics and TechnologiesDepartment of Electronic and Computer EngineeringThe Hong Kong University of Science and TechnologyHong Kong999077China
| | - Lei Lu
- School of Electronic and Computer EngineeringPeking UniversityShenzhen518055China
| | - Zhihe Xia
- State Key Laboratory of Advanced Displays and Optoelectronics and TechnologiesDepartment of Electronic and Computer EngineeringThe Hong Kong University of Science and TechnologyHong Kong999077China
| | - Man Wong
- State Key Laboratory of Advanced Displays and Optoelectronics and TechnologiesDepartment of Electronic and Computer EngineeringThe Hong Kong University of Science and TechnologyHong Kong999077China
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74
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Mao P, Li H, Yu Z. A Review of Skin-Wearable Sensors for Non-Invasive Health Monitoring Applications. SENSORS (BASEL, SWITZERLAND) 2023; 23:3673. [PMID: 37050733 PMCID: PMC10099362 DOI: 10.3390/s23073673] [Citation(s) in RCA: 21] [Impact Index Per Article: 10.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 02/28/2023] [Revised: 03/24/2023] [Accepted: 03/27/2023] [Indexed: 06/19/2023]
Abstract
The early detection of fatal diseases is crucial for medical diagnostics and treatment, both of which benefit the individual and society. Portable devices, such as thermometers and blood pressure monitors, and large instruments, such as computed tomography (CT) and X-ray scanners, have already been implemented to collect health-related information. However, collecting health information using conventional medical equipment at home or in a hospital can be inefficient and can potentially affect the timeliness of treatment. Therefore, on-time vital signal collection via healthcare monitoring has received increasing attention. As the largest organ of the human body, skin delivers significant signals reflecting our health condition; thus, receiving vital signals directly from the skin offers the opportunity for accessible and versatile non-invasive monitoring. In particular, emerging flexible and stretchable electronics demonstrate the capability of skin-like devices for on-time and continuous long-term health monitoring. Compared to traditional electronic devices, this type of device has better mechanical properties, such as skin conformal attachment, and maintains compatible detectability. This review divides the health information that can be obtained from skin using the sensor aspect's input energy forms into five categories: thermoelectrical signals, neural electrical signals, photoelectrical signals, electrochemical signals, and mechanical pressure signals. We then summarize current skin-wearable health monitoring devices and provide outlooks on future development.
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Affiliation(s)
- Pengsu Mao
- Department of Industrial and Manufacturing Engineering, FAMU-FSU College of Engineering, Florida State University, Tallahassee, FL 32310, USA
- High-Performance Materials Institute, Florida State University, Tallahassee, FL 32310, USA
| | - Haoran Li
- Department of Industrial and Manufacturing Engineering, FAMU-FSU College of Engineering, Florida State University, Tallahassee, FL 32310, USA
- High-Performance Materials Institute, Florida State University, Tallahassee, FL 32310, USA
| | - Zhibin Yu
- Department of Industrial and Manufacturing Engineering, FAMU-FSU College of Engineering, Florida State University, Tallahassee, FL 32310, USA
- High-Performance Materials Institute, Florida State University, Tallahassee, FL 32310, USA
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75
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Luo Y, Abidian MR, Ahn JH, Akinwande D, Andrews AM, Antonietti M, Bao Z, Berggren M, Berkey CA, Bettinger CJ, Chen J, Chen P, Cheng W, Cheng X, Choi SJ, Chortos A, Dagdeviren C, Dauskardt RH, Di CA, Dickey MD, Duan X, Facchetti A, Fan Z, Fang Y, Feng J, Feng X, Gao H, Gao W, Gong X, Guo CF, Guo X, Hartel MC, He Z, Ho JS, Hu Y, Huang Q, Huang Y, Huo F, Hussain MM, Javey A, Jeong U, Jiang C, Jiang X, Kang J, Karnaushenko D, Khademhosseini A, Kim DH, Kim ID, Kireev D, Kong L, Lee C, Lee NE, Lee PS, Lee TW, Li F, Li J, Liang C, Lim CT, Lin Y, Lipomi DJ, Liu J, Liu K, Liu N, Liu R, Liu Y, Liu Y, Liu Z, Liu Z, Loh XJ, Lu N, Lv Z, Magdassi S, Malliaras GG, Matsuhisa N, Nathan A, Niu S, Pan J, Pang C, Pei Q, Peng H, Qi D, Ren H, Rogers JA, Rowe A, Schmidt OG, Sekitani T, Seo DG, Shen G, Sheng X, Shi Q, Someya T, Song Y, Stavrinidou E, Su M, Sun X, Takei K, Tao XM, Tee BCK, Thean AVY, Trung TQ, et alLuo Y, Abidian MR, Ahn JH, Akinwande D, Andrews AM, Antonietti M, Bao Z, Berggren M, Berkey CA, Bettinger CJ, Chen J, Chen P, Cheng W, Cheng X, Choi SJ, Chortos A, Dagdeviren C, Dauskardt RH, Di CA, Dickey MD, Duan X, Facchetti A, Fan Z, Fang Y, Feng J, Feng X, Gao H, Gao W, Gong X, Guo CF, Guo X, Hartel MC, He Z, Ho JS, Hu Y, Huang Q, Huang Y, Huo F, Hussain MM, Javey A, Jeong U, Jiang C, Jiang X, Kang J, Karnaushenko D, Khademhosseini A, Kim DH, Kim ID, Kireev D, Kong L, Lee C, Lee NE, Lee PS, Lee TW, Li F, Li J, Liang C, Lim CT, Lin Y, Lipomi DJ, Liu J, Liu K, Liu N, Liu R, Liu Y, Liu Y, Liu Z, Liu Z, Loh XJ, Lu N, Lv Z, Magdassi S, Malliaras GG, Matsuhisa N, Nathan A, Niu S, Pan J, Pang C, Pei Q, Peng H, Qi D, Ren H, Rogers JA, Rowe A, Schmidt OG, Sekitani T, Seo DG, Shen G, Sheng X, Shi Q, Someya T, Song Y, Stavrinidou E, Su M, Sun X, Takei K, Tao XM, Tee BCK, Thean AVY, Trung TQ, Wan C, Wang H, Wang J, Wang M, Wang S, Wang T, Wang ZL, Weiss PS, Wen H, Xu S, Xu T, Yan H, Yan X, Yang H, Yang L, Yang S, Yin L, Yu C, Yu G, Yu J, Yu SH, Yu X, Zamburg E, Zhang H, Zhang X, Zhang X, Zhang X, Zhang Y, Zhang Y, Zhao S, Zhao X, Zheng Y, Zheng YQ, Zheng Z, Zhou T, Zhu B, Zhu M, Zhu R, Zhu Y, Zhu Y, Zou G, Chen X. Technology Roadmap for Flexible Sensors. ACS NANO 2023; 17:5211-5295. [PMID: 36892156 PMCID: PMC11223676 DOI: 10.1021/acsnano.2c12606] [Show More Authors] [Citation(s) in RCA: 335] [Impact Index Per Article: 167.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative efforts, scientific breakthroughs can be made sooner and capitalized for the betterment of humanity.
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Affiliation(s)
- Yifei Luo
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
| | - Mohammad Reza Abidian
- Department of Biomedical Engineering, University of Houston, Houston, Texas 77024, United States
| | - Jong-Hyun Ahn
- School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
| | - Deji Akinwande
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States
| | - Anne M Andrews
- Department of Chemistry and Biochemistry, California NanoSystems Institute, and Department of Psychiatry and Biobehavioral Sciences, Semel Institute for Neuroscience and Human Behavior, and Hatos Center for Neuropharmacology, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Markus Antonietti
- Colloid Chemistry Department, Max Planck Institute of Colloids and Interfaces, 14476 Potsdam, Germany
| | - Zhenan Bao
- Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
| | - Magnus Berggren
- Laboratory of Organic Electronics, Department of Science and Technology, Campus Norrköping, Linköping University, 83 Linköping, Sweden
- Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC), SE-100 44 Stockholm, Sweden
| | - Christopher A Berkey
- Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
| | - Christopher John Bettinger
- Department of Biomedical Engineering and Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States
| | - Jun Chen
- Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Peng Chen
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Wenlong Cheng
- Nanobionics Group, Department of Chemical and Biological Engineering, Monash University, Clayton, Australia, 3800
- Monash Institute of Medical Engineering, Monash University, Clayton, Australia3800
| | - Xu Cheng
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
| | - Seon-Jin Choi
- Division of Materials of Science and Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, Republic of Korea
| | - Alex Chortos
- School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47906, United States
| | - Canan Dagdeviren
- Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States
| | - Reinhold H Dauskardt
- Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
| | - Chong-An Di
- Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
| | - Michael D Dickey
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States
| | - Xiangfeng Duan
- Department of Chemistry and Biochemistry, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Antonio Facchetti
- Department of Chemistry and the Materials Research Center, Northwestern University, Evanston, Illinois 60208, United States
| | - Zhiyong Fan
- Department of Electronic and Computer Engineering and Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China
| | - Yin Fang
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Jianyou Feng
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Xue Feng
- Laboratory of Flexible Electronics Technology, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
| | - Huajian Gao
- School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Wei Gao
- Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, California, 91125, United States
| | - Xiwen Gong
- Department of Chemical Engineering, Department of Materials Science and Engineering, Department of Electrical Engineering and Computer Science, Applied Physics Program, and Macromolecular Science and Engineering Program, University of Michigan, Ann Arbor, Michigan, 48109 United States
| | - Chuan Fei Guo
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China
| | - Xiaojun Guo
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
| | - Martin C Hartel
- Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Zihan He
- Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
| | - John S Ho
- Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- The N.1 Institute for Health, National University of Singapore, Singapore 117456, Singapore
| | - Youfan Hu
- School of Electronics and Center for Carbon-Based Electronics, Peking University, Beijing 100871, China
| | - Qiyao Huang
- School of Fashion and Textiles, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
| | - Yu Huang
- Department of Materials Science and Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Fengwei Huo
- Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, PR China
| | - Muhammad M Hussain
- mmh Labs, Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47906, United States
| | - Ali Javey
- Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States
- Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States
| | - Unyong Jeong
- Department of Materials Science and Engineering, Pohang University of Science and Engineering (POSTECH), Pohang, Gyeong-buk 37673, Korea
| | - Chen Jiang
- Department of Electronic Engineering, Tsinghua University, Beijing 100084, China
| | - Xingyu Jiang
- Department of Biomedical Engineering, Southern University of Science and Technology, No 1088, Xueyuan Road, Xili, Nanshan District, Shenzhen, Guangdong 518055, PR China
| | - Jiheong Kang
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Daniil Karnaushenko
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
| | | | - Dae-Hyeong Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Il-Doo Kim
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea
| | - Dmitry Kireev
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States
| | - Lingxuan Kong
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Chengkuo Lee
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
- NUS Graduate School-Integrative Sciences and Engineering Programme (ISEP), National University of Singapore, Singapore 119077, Singapore
| | - Nae-Eung Lee
- School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
| | - Pooi See Lee
- School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
- Singapore-HUJ Alliance for Research and Enterprise (SHARE), Campus for Research Excellence and Technological Enterprise (CREATE), Singapore 138602, Singapore
| | - Tae-Woo Lee
- Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
- School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
- Institute of Engineering Research, Research Institute of Advanced Materials, Seoul National University, Soft Foundry, Seoul 08826, Republic of Korea
- Interdisciplinary Program in Bioengineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Fengyu Li
- College of Chemistry and Materials Science, Jinan University, Guangzhou, Guangdong 510632, China
| | - Jinxing Li
- Department of Biomedical Engineering, Department of Electrical and Computer Engineering, Neuroscience Program, BioMolecular Science Program, and Institute for Quantitative Health Science and Engineering, Michigan State University, East Lansing, Michigan 48823, United States
| | - Cuiyuan Liang
- School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
| | - Chwee Teck Lim
- Department of Biomedical Engineering, National University of Singapore, Singapore 117583, Singapore
- Mechanobiology Institute, National University of Singapore, Singapore 117411, Singapore
- Institute for Health Innovation and Technology, National University of Singapore, Singapore 119276, Singapore
| | - Yuanjing Lin
- School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China
| | - Darren J Lipomi
- Department of Nano and Chemical Engineering, University of California, San Diego, La Jolla, California 92093-0448, United States
| | - Jia Liu
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Kai Liu
- School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
| | - Nan Liu
- Beijing Key Laboratory of Energy Conversion and Storage Materials, College of Chemistry, Beijing Normal University, Beijing 100875, PR China
| | - Ren Liu
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Yuxin Liu
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Department of Biomedical Engineering, N.1 Institute for Health, Institute for Health Innovation and Technology (iHealthtech), National University of Singapore, Singapore 119077, Singapore
| | - Yuxuan Liu
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Zhiyuan Liu
- Neural Engineering Centre, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China 518055
| | - Zhuangjian Liu
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Xian Jun Loh
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
| | - Nanshu Lu
- Department of Aerospace Engineering and Engineering Mechanics, Department of Electrical and Computer Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Zhisheng Lv
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
| | - Shlomo Magdassi
- Institute of Chemistry and the Center for Nanoscience and Nanotechnology, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel
| | - George G Malliaras
- Electrical Engineering Division, Department of Engineering, University of Cambridge CB3 0FA, Cambridge United Kingdom
| | - Naoji Matsuhisa
- Institute of Industrial Science, The University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan
| | - Arokia Nathan
- Darwin College, University of Cambridge, Cambridge CB3 9EU, United Kingdom
| | - Simiao Niu
- Department of Biomedical Engineering, Rutgers University, Piscataway, New Jersey 08854, United States
| | - Jieming Pan
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
| | - Changhyun Pang
- School of Chemical Engineering and Samsung Advanced Institute for Health Science and Technology, Sungkyunkwan University, Suwon 16419, Republic of Korea
| | - Qibing Pei
- Department of Materials Science and Engineering, Department of Mechanical and Aerospace Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Huisheng Peng
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Dianpeng Qi
- School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
| | - Huaying Ren
- Department of Chemistry and Biochemistry, University of California, Los Angeles, Los Angeles, California, 90095, United States
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
- Department of Materials Science and Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Departments of Electrical and Computer Engineering and Chemistry, and Department of Neurological Surgery, Northwestern University, Evanston, Illinois 60208, United States
| | - Aaron Rowe
- Becton, Dickinson and Company, 1268 N. Lakeview Avenue, Anaheim, California 92807, United States
- Ready, Set, Food! 15821 Ventura Blvd #450, Encino, California 91436, United States
| | - Oliver G Schmidt
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, Chemnitz 09107, Germany
- Nanophysics, Faculty of Physics, TU Dresden, Dresden 01062, Germany
| | - Tsuyoshi Sekitani
- The Institute of Scientific and Industrial Research (SANKEN), Osaka University, Osaka, Japan 5670047
| | - Dae-Gyo Seo
- Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Guozhen Shen
- School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China
| | - Xing Sheng
- Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Institute for Precision Medicine, Center for Flexible Electronics Technology, and IDG/McGovern Institute for Brain Research, Tsinghua University, Beijing, 100084, China
| | - Qiongfeng Shi
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
| | - Takao Someya
- Department of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo, Tokyo 113-8656, Japan
| | - Yanlin Song
- Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
| | - Eleni Stavrinidou
- Laboratory of Organic Electronics, Department of Science and Technology, Linköping University, SE-601 74 Norrkoping, Sweden
| | - Meng Su
- Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
| | - Xuemei Sun
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Kuniharu Takei
- Department of Physics and Electronics, Osaka Metropolitan University, Sakai, Osaka 599-8531, Japan
| | - Xiao-Ming Tao
- Research Institute for Intelligent Wearable Systems, School of Fashion and Textiles, Hong Kong Polytechnic University, Hong Kong, China
| | - Benjamin C K Tee
- Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore
- iHealthtech, National University of Singapore, Singapore 119276, Singapore
| | - Aaron Voon-Yew Thean
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Tran Quang Trung
- School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
| | - Changjin Wan
- School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China
| | - Huiliang Wang
- Department of Biomedical Engineering, University of Texas at Austin, Austin, Texas 78712, United States
| | - Joseph Wang
- Department of Nanoengineering, University of California, San Diego, California 92093, United States
| | - Ming Wang
- Frontier Institute of Chip and System, State Key Laboratory of Integrated Chip and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China
- the Shanghai Qi Zhi Institute, 41th Floor, AI Tower, No.701 Yunjin Road, Xuhui District, Shanghai 200232, China
| | - Sihong Wang
- Pritzker School of Molecular Engineering, The University of Chicago, Chicago, Illinois, 60637, United States
| | - Ting Wang
- State Key Laboratory of Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
| | - Zhong Lin Wang
- Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China
- Georgia Institute of Technology, Atlanta, Georgia 30332-0245, United States
| | - Paul S Weiss
- California NanoSystems Institute, Department of Chemistry and Biochemistry, Department of Bioengineering, and Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Hanqi Wen
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
- Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, China 314000
| | - Sheng Xu
- Department of Nanoengineering, Department of Electrical and Computer Engineering, Materials Science and Engineering Program, and Department of Bioengineering, University of California San Diego, La Jolla, California, 92093, United States
| | - Tailin Xu
- School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong, 518060, PR China
| | - Hongping Yan
- Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
| | - Xuzhou Yan
- School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
| | - Hui Yang
- Tianjin Key Laboratory of Molecular Optoelectronic Sciences, Department of Chemistry, School of Science, Tianjin University, Tianjin, China, 300072
| | - Le Yang
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Department of Materials Science and Engineering, National University of Singapore (NUS), 9 Engineering Drive 1, #03-09 EA, Singapore 117575, Singapore
| | - Shuaijian Yang
- School of Biomedical Sciences, Faculty of Biological Sciences, University of Leeds, Leeds, LS2 9JT, United Kingdom
| | - Lan Yin
- School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, and Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
| | - Cunjiang Yu
- Department of Engineering Science and Mechanics, Department of Biomedical Engineering, Department of Material Science and Engineering, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, 16802, United States
| | - Guihua Yu
- Materials Science and Engineering Program and Walker Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas, 78712, United States
| | - Jing Yu
- School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
| | - Shu-Hong Yu
- Department of Chemistry, Institute of Biomimetic Materials and Chemistry, Hefei National Research Center for Physical Science at the Microscale, University of Science and Technology of China, Hefei 230026, China
| | - Xinge Yu
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Evgeny Zamburg
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Haixia Zhang
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Xiangyu Zhang
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Xiaosheng Zhang
- School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
| | - Xueji Zhang
- School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong 518060, PR China
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
| | - Yu Zhang
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Siyuan Zhao
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Xuanhe Zhao
- Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, United States
| | - Yuanjin Zheng
- Center for Integrated Circuits and Systems, School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
| | - Yu-Qing Zheng
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication; School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Zijian Zheng
- Department of Applied Biology and Chemical Technology, Faculty of Science, Research Institute for Intelligent Wearable Systems, Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
| | - Tao Zhou
- Center for Neural Engineering, Department of Engineering Science and Mechanics, The Huck Institutes of the Life Sciences, Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, United States
| | - Bowen Zhu
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou 310024, China
| | - Ming Zhu
- Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, 59 Nanyang Drive, Singapore 636921, Singapore
| | - Rong Zhu
- Department of Precision Instrument, Tsinghua University, Beijing 100084, China
| | - Yangzhi Zhu
- Terasaki Institute for Biomedical Innovation, Los Angeles, California, 90064, United States
| | - Yong Zhu
- Department of Mechanical and Aerospace Engineering, Department of Materials Science and Engineering, and Department of Biomedical Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Guijin Zou
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Xiaodong Chen
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
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Zhang G, Yu H, Li D, Yan Y, Wei D, Ye J, Zhao Y, Zeng W, Duan H. Ultrathin Lithiophilic 3D Arrayed Skeleton Enabling Spatial-Selection Deposition for Dendrite-Free Lithium Anodes. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2023:e2300734. [PMID: 36967553 DOI: 10.1002/smll.202300734] [Citation(s) in RCA: 11] [Impact Index Per Article: 5.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/26/2023] [Revised: 03/06/2023] [Indexed: 06/18/2023]
Abstract
Lithium metal batteries are promising to become a new generation of energy storage batteries. However, the growth of Li dendrites and the volume expansion of the anode are serious constraints to their commercial implementation. Herein, a controllable strategy is proposed to construct an ultrathin 3D hierarchical host of honeycomb copper micromesh loaded with lithiophilic copper oxide nanowires (CMMC). The uniquely designed 3D hierarchical arrayed skeletons demonstrate a surface-preferred and spatial-selective effect to homogenize local current density and relieve the volume expansion, effectively suppressing the dendrite growth. Employing the constructed CMMC current collector in a half-cell, >400 cycles with 99% coulombic efficiency at 0.5 mA cm-2 is performed. The symmetric battery cycles stably for >2000 h, and the full battery delivers a capacity of 166.6 mAh g-1 . This facile and controllable approach provides an effective strategy for constructing high-performance lithium metal batteries.
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Affiliation(s)
- Guanhua Zhang
- State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082, P. R. China
- Greater Bay Area Institute for Innovation, Hunan University, Guangzhou, 511300, P. R. China
| | - Huihuang Yu
- State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082, P. R. China
| | - Du Li
- State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082, P. R. China
| | - Yu Yan
- State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082, P. R. China
| | - Donghai Wei
- State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082, P. R. China
| | - Jinghua Ye
- State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082, P. R. China
| | - Yanli Zhao
- State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082, P. R. China
| | - Wei Zeng
- State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082, P. R. China
| | - Huigao Duan
- State Key Laboratory of Advanced Design and Manufacturing for Vehicle Body, College of Mechanical and Vehicle Engineering, Hunan University, Changsha, 410082, P. R. China
- Greater Bay Area Institute for Innovation, Hunan University, Guangzhou, 511300, P. R. China
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77
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Chen PA, Guo J, Yan X, Liu Y, Wei H, Qiu X, Xia J, Guo J, Ding J, Gong Z, Chen C, Lei T, Chen H, Zeng Z, Hu Y. A Methodology of Fabricating Novel Electrodes for Semiconductor Devices: Doping and Van der Waals Integrating Organic Semiconductor Films. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2023:e2207858. [PMID: 36949014 DOI: 10.1002/smll.202207858] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/15/2022] [Revised: 03/03/2023] [Indexed: 06/18/2023]
Abstract
Electrodes are indispensable components in semiconductor devices, and now are mainly made from metals, which are convenient for use but not ideal for emerging technologies such as bioelectronics, flexible electronics, or transparent electronics. Here the methodology of fabricating novel electrodes for semiconductor devices using organic semiconductors (OSCs) is proposed and demonstrated. It is shown that polymer semiconductors can be heavily p- or n-doped to achieve sufficiently high conductivity for electrodes. In contrast with metals, the doped OSC films (DOSCFs) are solution-processable, mechanically flexible, and have interesting optoelectronic properties. By integrating the DOSCFs with semiconductors through van der Waals contacts different kinds of semiconductor devices can be constructed. Importantly, these devices exhibit higher performance than their counterparts with metal electrodes, and/or excellent mechanical or optical properties that are unavailable in metal-electrode devices, suggesting the superiority of DOSCF electrodes. Given the existing large amount of OSCs, the established methodology can provide abundant electrode choices to meet the demand of various emerging devices.
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Affiliation(s)
- Ping-An Chen
- International Science and Technology Innovation Cooperation Base for Advanced Display Technologies of Hunan Province, School of Physics and Electronics, Hunan University, Changsha, 410082, P. R. China
- Shenzhen Research Institute of Hunan University, Shenzhen, 518063, P. R. China
- Changsha Semiconductor Technology and Application Innovation Research Institute, College of Semiconductors (College of Integrated Circuits), Hunan University, Changsha, 410082, P. R. China
| | - Junjun Guo
- Institute of Functional Nano & Soft Materials (FUNSOM) Jiangsu Key Laboratory for Carbon-Based Functional Materials and Devices, Soochow University, Suzhou, 215123, P. R. China
| | - Xinwen Yan
- Key Laboratory of Polymer Chemistry and Physics of Ministry of Education, School of Materials Science and Engineering, Peking University, Beijing, 100871, P. R. China
| | - Yu Liu
- International Science and Technology Innovation Cooperation Base for Advanced Display Technologies of Hunan Province, School of Physics and Electronics, Hunan University, Changsha, 410082, P. R. China
- Shenzhen Research Institute of Hunan University, Shenzhen, 518063, P. R. China
| | - Huan Wei
- International Science and Technology Innovation Cooperation Base for Advanced Display Technologies of Hunan Province, School of Physics and Electronics, Hunan University, Changsha, 410082, P. R. China
- Shenzhen Research Institute of Hunan University, Shenzhen, 518063, P. R. China
| | - Xincan Qiu
- International Science and Technology Innovation Cooperation Base for Advanced Display Technologies of Hunan Province, School of Physics and Electronics, Hunan University, Changsha, 410082, P. R. China
- Shenzhen Research Institute of Hunan University, Shenzhen, 518063, P. R. China
| | - Jiangnan Xia
- International Science and Technology Innovation Cooperation Base for Advanced Display Technologies of Hunan Province, School of Physics and Electronics, Hunan University, Changsha, 410082, P. R. China
- Shenzhen Research Institute of Hunan University, Shenzhen, 518063, P. R. China
| | - Jing Guo
- International Science and Technology Innovation Cooperation Base for Advanced Display Technologies of Hunan Province, School of Physics and Electronics, Hunan University, Changsha, 410082, P. R. China
| | - Jiaqi Ding
- International Science and Technology Innovation Cooperation Base for Advanced Display Technologies of Hunan Province, School of Physics and Electronics, Hunan University, Changsha, 410082, P. R. China
| | - Zhenqi Gong
- International Science and Technology Innovation Cooperation Base for Advanced Display Technologies of Hunan Province, School of Physics and Electronics, Hunan University, Changsha, 410082, P. R. China
| | - Chen Chen
- Science and Technology on Advanced Ceramic Fibers and Composites Laboratory, College of Aerospace Science and Engineering, National University of Defense Technology, Changsha, 410000, P. R. China
| | - Ting Lei
- Key Laboratory of Polymer Chemistry and Physics of Ministry of Education, School of Materials Science and Engineering, Peking University, Beijing, 100871, P. R. China
| | - Huajie Chen
- Key Laboratory of Environmentally Friendly Chemistry and Applications of Ministry of Education, College of Chemistry, Xiangtan University, Xiangtan, 411105, P. R. China
| | - Zebing Zeng
- State Key Laboratory of Chemo/Biosensing and Chemometrics, College of Chemistry and Chemical Engineering, Hunan University, Changsha, 410082, P. R. China
| | - Yuanyuan Hu
- International Science and Technology Innovation Cooperation Base for Advanced Display Technologies of Hunan Province, School of Physics and Electronics, Hunan University, Changsha, 410082, P. R. China
- Shenzhen Research Institute of Hunan University, Shenzhen, 518063, P. R. China
- Changsha Semiconductor Technology and Application Innovation Research Institute, College of Semiconductors (College of Integrated Circuits), Hunan University, Changsha, 410082, P. R. China
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78
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Han N, Yao X, Wang Y, Huang W, Niu M, Zhu P, Mao Y. Recent Progress of Biomaterials-Based Epidermal Electronics for Healthcare Monitoring and Human-Machine Interaction. BIOSENSORS 2023; 13:393. [PMID: 36979605 PMCID: PMC10046871 DOI: 10.3390/bios13030393] [Citation(s) in RCA: 4] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 01/30/2023] [Revised: 03/08/2023] [Accepted: 03/14/2023] [Indexed: 06/18/2023]
Abstract
Epidermal electronics offer an important platform for various on-skin applications including electrophysiological signals monitoring and human-machine interactions (HMI), due to their unique advantages of intrinsic softness and conformal interfaces with skin. The widely used nondegradable synthetic materials may produce massive electronic waste to the ecosystem and bring safety issues to human skin. However, biomaterials extracted from nature are promising to act as a substitute material for the construction of epidermal electronics, owing to their diverse characteristics of biocompatibility, biodegradability, sustainability, low cost and natural abundance. Therefore, the development of natural biomaterials holds great prospects for advancement of high-performance sustainable epidermal electronics. Here, we review the recent development on different types of biomaterials including proteins and polysaccharides for multifunctional epidermal electronics. Subsequently, the applications of biomaterials-based epidermal electronics in electrophysiological monitoring and HMI are discussed, respectively. Finally, the development situation and future prospects of biomaterials-based epidermal electronics are summarized. We expect that this review can provide some inspirations for the development of future, sustainable, biomaterials-based epidermal electronics.
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79
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Li M, Chen D, Deng X, Xu B, Li M, Liang H, Wang M, Song G, Zhang T, Liu Y. Graded Mxene-Doped Liquid Metal as Adhesion Interface Aiming for Conductivity Enhancement of Hybrid Rigid-Soft Interconnection. ACS APPLIED MATERIALS & INTERFACES 2023. [PMID: 36893387 DOI: 10.1021/acsami.2c23002] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
Hybrid rigid-soft electronic system combines the biocompatibility of stretchable electronics and the computing capacity of silicon-based chips, which has a chance to realize a comprehensive stretchable electronic system with perception, control, and algorithm in near future. However, a reliable rigid-soft interconnection interface is urgently required to ensure both the conductivity and stretchability under a large strain. To settle this demand, this paper proposes a graded Mxene-doped liquid metal (LM) method to achieve a stable solid-liquid composite interconnect (SLCI) between the rigid chip and stretchable interconnect lines. To overcome the surface tension of LM, a high-conductive Mxene is doped for the balance between adhesion and liquidity of LM. And the high-concentration doping could prevent the contact failure with chip pins, while the low-concentration doping tends to maintain the stretchability. Based on this dosage-graded interface structure, the solid light-emitting diode (LED) and other devices integrated into the stretchable hybrid electronic system could achieve an excellent conductivity insensitive to the exerted tensile strain. In addition, the hybrid electronic system is demonstrated for skin-mounted and tire-mounted temperature-test applications under the tensile strain up to 100%. This Mxene-doped LM method aims to obtain a robust interface between rigid components and flexible interconnects by attenuating the inherent Young's modulus mismatch between rigid and flexible systems and makes it a promising candidate for effective interconnection between solid electronics and soft electronics.
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Affiliation(s)
- Min Li
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Da Chen
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Xiupeng Deng
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Baochun Xu
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Mingyue Li
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Hongrui Liang
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Mengxin Wang
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Ge Song
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Tong Zhang
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
| | - Yijian Liu
- College of Electronic and Information Engineering, Shandong University of Science and Technology, 266590 Qingdao, China
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80
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Liu J, Guo H, Liu H, Lu T. Designing Hierarchical Soft Network Materials with Developable Lattice Nodes for High Stretchability. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2023; 10:e2206099. [PMID: 36698297 PMCID: PMC10015852 DOI: 10.1002/advs.202206099] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 10/19/2022] [Revised: 01/10/2023] [Indexed: 06/17/2023]
Abstract
Soft network materials (SNMs) represent one of the best candidates for the substrates and the encapsulation layers of stretchable inorganic electronics, because they are capable of precisely customizing the J-shaped stress-strain curves of biological tissues. Although a variety of microstructures and topologies have been exploited to adjust the nonlinear stress-strain responses of SNMs, the stretchability of most SNMs is hard to exceed 100%. Designing novel high-strength SNMs with much larger stretchability (e.g., >200%) than existing SNMs and conventional elastomers remains a challenge. This paper develops a class of hierarchical soft network materials (HSNMs) with developable lattice nodes, which can significantly improve the stretchability of SNMs without any loss of strength. The effects of geometric parameters, lattice topologies, and loading directions on the mechanical properties of HSNMs are systematically discussed by experiments and numerical simulations. The proposed node design strategy for SNMs is also proved to be widely applicable to different constituent materials, including polymers and metals.
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Affiliation(s)
- Jianxing Liu
- State Key Lab for Strength and Vibration of Mechanical StructuresSoft Machines LabDepartment of Engineering MechanicsXi'an Jiaotong UniversityXi'an710049P. R. China
| | - Haoyu Guo
- State Key Lab for Strength and Vibration of Mechanical StructuresSoft Machines LabDepartment of Engineering MechanicsXi'an Jiaotong UniversityXi'an710049P. R. China
| | - Haiyang Liu
- State Key Lab for Strength and Vibration of Mechanical StructuresSoft Machines LabDepartment of Engineering MechanicsXi'an Jiaotong UniversityXi'an710049P. R. China
| | - Tongqing Lu
- State Key Lab for Strength and Vibration of Mechanical StructuresSoft Machines LabDepartment of Engineering MechanicsXi'an Jiaotong UniversityXi'an710049P. R. China
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81
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Hu H, Guo X, Zhang Y, Chen Z, Wang L, Gao Y, Wang Z, Zhang Y, Wang W, Rong M, Liu G, Huang Q, Zhu Y, Zheng Z. Elasto-Plastic Design of Ultrathin Interlayer for Enhancing Strain Tolerance of Flexible Electronics. ACS NANO 2023; 17:3921-3930. [PMID: 36762695 DOI: 10.1021/acsnano.2c12269] [Citation(s) in RCA: 6] [Impact Index Per Article: 3.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
The ability to tolerate large strains during various degrees of deformation is a core issue in the development of flexible electronics. Commonly used strategies nowadays to enhance the strain tolerance of thin film devices focus on the optimization of the device architecture and the increase of bonding at the materials interface. In this paper, we propose a strategy, namely elasto-plastic design of an ultrathin interlayer, to boost the strain tolerance of flexible electronics. We demonstrate that insertion of an ultrathin, stiff (high Young's modulus) and elastic (high yield strain) interlayer between an upper rigid film/device and a soft substrate, regardless of the substrate thickness or the interfacial bonding, can significantly reduce the actual strain applied on the film/device when the substrate is bent. Being independent of existing strategies, the elasto-plastic design strategy offers an effective method to enhance the device flexibility without redesigning the device structure or altering the material interface.
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Affiliation(s)
- Hong Hu
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
| | - Xuyun Guo
- Department of Applied Physics, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
| | - Yaokang Zhang
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
| | - Zijian Chen
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
| | - Lei Wang
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
| | - Yuan Gao
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
| | - Ziran Wang
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
| | - Yuqi Zhang
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
| | - Wenshuo Wang
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
| | - Mingming Rong
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
| | - Guoqiang Liu
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
| | - Qiyao Huang
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
| | - Ye Zhu
- Department of Applied Physics, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
| | - Zijian Zheng
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
- Department of Applied Biology and Chemical Technology, Faculty of Science, The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
- Research Institute for Intelligent Wearable Systems (RI-IWEAR), The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
- Research Institute for Smart Energy (RISE), The Hong Kong Polytechnic University, Hong Kong SAR 999077, People's Republic of China
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82
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Sun M, Li H, Hou Y, Huang N, Xia X, Zhu H, Xu Q, Lin Y, Xu L. Multifunctional tendon-mimetic hydrogels. SCIENCE ADVANCES 2023; 9:eade6973. [PMID: 36800416 PMCID: PMC9937573 DOI: 10.1126/sciadv.ade6973] [Citation(s) in RCA: 45] [Impact Index Per Article: 22.5] [Reference Citation Analysis] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 09/02/2022] [Accepted: 01/18/2023] [Indexed: 05/21/2023]
Abstract
We report multifunctional tendon-mimetic hydrogels constructed from anisotropic assembly of aramid nanofiber composites. The stiff nanofibers and soft polyvinyl alcohol in these anisotropic composite hydrogels (ACHs) mimic the structural interplay between aligned collagen fibers and proteoglycans in tendons. The ACHs exhibit a high modulus of ~1.1 GPa, strength of ~72 MPa, fracture toughness of 7333 J/m2, and many additional characteristics matching those of natural tendons, which was not achieved with previous synthetic hydrogels. The surfaces of ACHs were functionalized with bioactive molecules to present biophysical cues for the modulation of morphology, phenotypes, and other behaviors of attached cells. Moreover, soft bioelectronic components can be integrated on ACHs, enabling in situ sensing of various physiological parameters. The outstanding mechanics and functionality of these tendon mimetics suggest their further applications in advanced tissue engineering, implantable prosthetics, human-machine interactions, and other technologies.
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Affiliation(s)
- Mingze Sun
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, China
| | - Hegeng Li
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, China
| | - Yong Hou
- Department of Electrical and Electronic Engineering, The University of Hong Kong, Hong Kong SAR, China
| | - Nan Huang
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, China
| | - Xingyu Xia
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, China
| | - Hengjia Zhu
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, China
| | - Qin Xu
- Department of Physics, Faculty of Sciences, The Hong Kong University of Science and Technology, Hong Kong SAR, China
| | - Yuan Lin
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, China
- Advanced Biomedical Instrumentation Centre Limited, Hong Kong SAR, China
| | - Lizhi Xu
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, China
- Advanced Biomedical Instrumentation Centre Limited, Hong Kong SAR, China
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83
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Jiang Y, Ji S, Sun J, Huang J, Li Y, Zou G, Salim T, Wang C, Li W, Jin H, Xu J, Wang S, Lei T, Yan X, Peh WYX, Yen SC, Liu Z, Yu M, Zhao H, Lu Z, Li G, Gao H, Liu Z, Bao Z, Chen X. A universal interface for plug-and-play assembly of stretchable devices. Nature 2023; 614:456-462. [PMID: 36792740 DOI: 10.1038/s41586-022-05579-z] [Citation(s) in RCA: 138] [Impact Index Per Article: 69.0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 09/22/2021] [Accepted: 11/18/2022] [Indexed: 02/17/2023]
Abstract
Stretchable hybrid devices have enabled high-fidelity implantable1-3 and on-skin4-6 monitoring of physiological signals. These devices typically contain soft modules that match the mechanical requirements in humans7,8 and soft robots9,10, rigid modules containing Si-based microelectronics11,12 and protective encapsulation modules13,14. To make such a system mechanically compliant, the interconnects between the modules need to tolerate stress concentration that may limit their stretching and ultimately cause debonding failure15-17. Here, we report a universal interface that can reliably connect soft, rigid and encapsulation modules together to form robust and highly stretchable devices in a plug-and-play manner. The interface, consisting of interpenetrating polymer and metal nanostructures, connects modules by simply pressing without using pastes. Its formation is depicted by a biphasic network growth model. Soft-soft modules joined by this interface achieved 600% and 180% mechanical and electrical stretchability, respectively. Soft and rigid modules can also be electrically connected using the above interface. Encapsulation on soft modules with this interface is strongly adhesive with an interfacial toughness of 0.24 N mm-1. As a proof of concept, we use this interface to assemble stretchable devices for in vivo neuromodulation and on-skin electromyography, with high signal quality and mechanical resistance. We expect such a plug-and-play interface to simplify and accelerate the development of on-skin and implantable stretchable devices.
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Affiliation(s)
- Ying Jiang
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore
| | - Shaobo Ji
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore
| | - Jing Sun
- CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences (CAS), Shenzhen, China
| | - Jianping Huang
- CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences (CAS), Shenzhen, China
| | - Yuanheng Li
- CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences (CAS), Shenzhen, China
| | - Guijin Zou
- Institute of High Performance Computing, Agency for Science, Technology and Research (A*STAR), Singapore, Singapore
| | - Teddy Salim
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore
| | - Changxian Wang
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore
| | - Wenlong Li
- Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), Singapore, Singapore
| | - Haoran Jin
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore
| | - Jie Xu
- Department of Chemical Engineering, Stanford University, Stanford, CA, USA
| | - Sihong Wang
- Department of Chemical Engineering, Stanford University, Stanford, CA, USA
| | - Ting Lei
- Department of Chemical Engineering, Stanford University, Stanford, CA, USA
| | - Xuzhou Yan
- Department of Chemical Engineering, Stanford University, Stanford, CA, USA
| | - Wendy Yen Xian Peh
- The N.1 Institute for Health, National University of Singapore, Singapore, Singapore
| | - Shih-Cheng Yen
- The N.1 Institute for Health, National University of Singapore, Singapore, Singapore
| | - Zhihua Liu
- Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), Singapore, Singapore
| | - Mei Yu
- CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences (CAS), Shenzhen, China
| | - Hang Zhao
- CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences (CAS), Shenzhen, China
| | - Zechao Lu
- CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences (CAS), Shenzhen, China
| | - Guanglin Li
- CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences (CAS), Shenzhen, China
| | - Huajian Gao
- Institute of High Performance Computing, Agency for Science, Technology and Research (A*STAR), Singapore, Singapore
- School of Mechanical and Aerospace Engineering, College of Engineering, Nanyang Technological University, Singapore, Singapore
| | - Zhiyuan Liu
- CAS Key Laboratory of Human-Machine Intelligence-Synergy Systems, Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Sciences (CAS), Shenzhen, China.
| | - Zhenan Bao
- Department of Chemical Engineering, Stanford University, Stanford, CA, USA.
| | - Xiaodong Chen
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, Singapore.
- Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR), Singapore, Singapore.
- Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, Singapore, Singapore.
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84
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Wang L, Yi Z, Zhao Y, Liu Y, Wang S. Stretchable conductors for stretchable field-effect transistors and functional circuits. Chem Soc Rev 2023; 52:795-835. [PMID: 36562312 DOI: 10.1039/d2cs00837h] [Citation(s) in RCA: 13] [Impact Index Per Article: 6.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 12/24/2022]
Abstract
Stretchable electronics have received intense attention due to their broad application prospects in many areas, and can withstand large deformations and form close contact with curved surfaces. Stretchable conductors are vital components of stretchable electronic devices used in wearables, soft robots, and human-machine interactions. Recent advances in stretchable conductors have motivated basic scientific and technological research efforts. Here, we outline and analyse the development of stretchable conductors in transistors and circuits, and examine advances in materials, device engineering, and preparation technologies. We divide the existing approaches to constructing stretchable transistors with stretchable conductors into the following two types: geometric engineering and intrinsic stretchability engineering. Finally, we consider the challenges and outlook in this field for delivering stretchable electronics.
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Affiliation(s)
- Liangjie Wang
- Department of Materials Science, Fudan University, Shanghai 200433, P. R. China.
| | - Zhengran Yi
- Department of Materials Science, Fudan University, Shanghai 200433, P. R. China.
| | - Yan Zhao
- Department of Materials Science, Fudan University, Shanghai 200433, P. R. China.
| | - Yunqi Liu
- Department of Materials Science, Fudan University, Shanghai 200433, P. R. China.
| | - Shuai Wang
- Department of Materials Science, Fudan University, Shanghai 200433, P. R. China. .,School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan 430074, P. R. China.
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85
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Wang X, Huang J, Liu Y, Tan J, Chen S, Avila R, Xie Z. Design of protective and high sensitivity encapsulation layers in wearable devices. SCIENCE CHINA. TECHNOLOGICAL SCIENCES 2022; 66:223-232. [PMID: 36593863 PMCID: PMC9798368 DOI: 10.1007/s11431-022-2034-y] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/08/2022] [Accepted: 03/17/2022] [Indexed: 06/17/2023]
Abstract
UNLABELLED Elastomeric encapsulation layers are widely used in soft, wearable devices to physically isolate rigid electronic components from external environmental stimuli (e.g., stress) and facilitate device sterilization for reusability. In devices experiencing large deformations, the stress-isolation effect of the top encapsulation layer can eliminate the damage to the electronic components caused by external forces. However, for health monitoring and sensing applications, the strain-isolation effect of the bottom encapsulation layer can partially block the physiological signals of interest and degrade the measurement accuracy. Here, an analytic model is developed for the strain- and stress-isolation effects present in wearable devices with elastomeric encapsulation layers. The soft, elastomeric encapsulation layers and main electronic components layer are modeled as transversely isotropic-elastic mediums and the strain- and stress-isolation effects are described using isolation indexes. The analysis and results show that the isolation effects strongly depend on the thickness, density, and elastic modulus of both the elastomeric encapsulation layers and the main electronic component layer. These findings, combined with the flexible mechanics design strategies of wearable devices, provide new design guidelines for future wearable devices to protect them from external forces while capturing the relevant physiological signals underneath the skin. ELECTRONIC SUPPLEMENTARY MATERIAL Supplementary material is available in the online version of this article at 10.1007/s11431-022-2034-y.
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Affiliation(s)
- XiuFeng Wang
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China
| | - JieLong Huang
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China
| | - YangChengYi Liu
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China
| | - JinYuan Tan
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China
| | - ShangDa Chen
- School of Materials Science and Engineering, Xiangtan University, Xiangtan, 411105 China
| | - Raudel Avila
- Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208 USA
| | - ZhaoQian Xie
- State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, 116024 China
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86
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Zhang Y, Luo Y, Wang L, Ng PF, Hu H, Chen F, Huang Q, Zheng Z. Destructive-Treatment-Free Rapid Polymer-Assisted Metal Deposition for Versatile Electronic Textiles. ACS APPLIED MATERIALS & INTERFACES 2022; 14:56193-56202. [PMID: 36475587 DOI: 10.1021/acsami.2c19278] [Citation(s) in RCA: 8] [Impact Index Per Article: 2.7] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/17/2023]
Abstract
Highly conductive, durable, and breathable metal-coated textiles are critical building block materials for future wearable electronics. In order to enhance the metal adhesion on the textile surface, existing solution-based approaches to preparing these materials require time-consuming presynthesis and/or premodification processes, typically in the order of tens of minutes to hours, on textiles prior to metal plating. Herein, we report a UV-induced rapid polymer-assisted metal deposition (r-PAMD) that offers a destructive-treatment-free process to deposit highly conductive metals on a wide variety of textile materials, including cotton, polyester, nylon, Kevlar, glass fiber, and carbon cloth. In comparison to the state of the arts, r-PAMD significantly shortens the modification time to several minutes and is compatible with the roll-to-roll fabrication manner. Moreover, the deposited metals show outstanding adhesion, which withstands rigorous flexing, abrasion, and machine washing tests. We demonstrate that these metal-coated textiles are suitable for applications in two vastly different fields, being wearable and washable sensors, and lithium batteries.
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Affiliation(s)
- Yaokang Zhang
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR 99077, China
| | - Yufeng Luo
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR 99077, China
| | - Lei Wang
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR 99077, China
| | - Pui Fai Ng
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR 99077, China
| | - Hong Hu
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR 99077, China
| | - Fan Chen
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR 99077, China
| | - Qiyao Huang
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR 99077, China
- Research Institute for Intelligent Wearable Systems, The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR 99077, China
| | - Zijian Zheng
- Laboratory for Advanced Interfacial Materials and Devices, School of Fashion and Textiles, The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR 99077, China
- Department of Applied Biology and Chemical Technology, Faculty of Science, The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR 99077, China
- Research Institute for Intelligent Wearable Systems, The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR 99077, China
- Research Institute for Smart Energy, The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR 99077, China
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87
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Liu H, Li H, Wang Z, Wei X, Zhu H, Sun M, Lin Y, Xu L. Robust and Multifunctional Kirigami Electronics with a Tough and Permeable Aramid Nanofiber Framework. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2207350. [PMID: 36222392 DOI: 10.1002/adma.202207350] [Citation(s) in RCA: 13] [Impact Index Per Article: 4.3] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/12/2022] [Revised: 10/03/2022] [Indexed: 06/16/2023]
Abstract
Kirigami designs are advantageous for the construction of wearable electronics due to their high stretchability and conformability on the 3D dynamic surfaces of the skin. However, suitable materials technologies that enable robust kirigami devices with desired functionality for skin-interfaces remain limited. Here, a versatile materials platform based on a composite nanofiber framework (CNFF) is exploited for the engineering of wearable kirigami electronics. The self-assembled fibrillar network involving aramid nanofibers and poly(vinyl alcohol) combines high toughness, permeability, and manufacturability, which are desirable for the fabrication of hybrid devices. Multiscale simulations are conducted to explain the high fracture resistance of the CNFF-based kirigami structures and provide essential guidance for the design, which can be further generalized to other kirigami devices. Various microelectronic sensors and electroactive polymers are integrated onto a CNFF-based materials platform to achieve electrocardiogram (ECG), electromyogram (EMG), skin-temperature measurements, and measurement of other physiological parameters. These mechanically robust, multifunctional, lightweight, and biocompatible kirigami devices can shed new insights for the development of advanced wearable systems and human-machine interfaces.
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Affiliation(s)
- Hongzhen Liu
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, 999077, P. R. China
| | - Hegeng Li
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, 999077, P. R. China
| | - Zuochen Wang
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, 999077, P. R. China
- Advanced Biomedical Instrumentation Centre Limited, Hong Kong SAR, 999077, P. R. China
| | - Xi Wei
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, 999077, P. R. China
- Advanced Biomedical Instrumentation Centre Limited, Hong Kong SAR, 999077, P. R. China
| | - Hengjia Zhu
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, 999077, P. R. China
| | - Mingze Sun
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, 999077, P. R. China
| | - Yuan Lin
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, 999077, P. R. China
- Advanced Biomedical Instrumentation Centre Limited, Hong Kong SAR, 999077, P. R. China
| | - Lizhi Xu
- Department of Mechanical Engineering, The University of Hong Kong, Hong Kong SAR, 999077, P. R. China
- Advanced Biomedical Instrumentation Centre Limited, Hong Kong SAR, 999077, P. R. China
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88
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Wu J, Wang N, Xie YR, Liu H, Huang X, Cong X, Chen HY, Ma J, Liu F, Zhao H, Zhang J, Tan PH, Wang H. Polymer-like Inorganic Double Helical van der Waals Semiconductor. NANO LETTERS 2022; 22:9054-9061. [PMID: 36321634 DOI: 10.1021/acs.nanolett.2c03394] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
Abstract
In high-performance flexible and stretchable electronic devices, conventional inorganic semiconductors made of rigid and brittle materials typically need to be configured into geometrically deformable formats and integrated with elastomeric substrates, which leads to challenges in scaling down device dimensions and complexities in device fabrication and integration. Here we report the extraordinary mechanical properties of the newly discovered inorganic double helical semiconductor tin indium phosphate. This spiral-shape double helical crystal shows the lowest Young's modulus (13.6 GPa) among all known stable inorganic materials. The large elastic (>27%) and plastic (>60%) bending strains are also observed and attributed to the easy slippage between neighboring double helices that are coupled through van der Waals interactions, leading to the high flexibility and deformability among known semiconducting materials. The results advance the fundamental understanding of the unique polymer-like mechanical properties and lay the foundation for their potential applications in flexible electronics and nanomechanics disciplines.
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Affiliation(s)
- Jiangbin Wu
- Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, California90089, United States
| | - Nan Wang
- Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, Los Angeles, California90089, United States
| | - Ya-Ru Xie
- State Key Laboratory of Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing100083, China
| | - Hefei Liu
- Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, California90089, United States
| | - Xinghao Huang
- Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, California90089, United States
| | - Xin Cong
- State Key Laboratory of Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing100083, China
| | - Hung-Yu Chen
- Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, California90089, United States
| | - Jiahui Ma
- Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, California90089, United States
| | - Fanxin Liu
- Collaborative Innovation Center for Information Technology in Biological and Medical Physics, and College of Science, Zhejiang University of Technology, Hangzhou310023, P. R. China
| | - Hangbo Zhao
- Department of Aerospace and Mechanical Engineering, University of Southern California, Los Angeles, California90089, United States
| | - Jun Zhang
- State Key Laboratory of Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing100083, China
| | - Ping-Heng Tan
- State Key Laboratory of Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing100083, China
| | - Han Wang
- Ming Hsieh Department of Electrical and Computer Engineering, University of Southern California, Los Angeles, California90089, United States
- Mork Family Department of Chemical Engineering and Materials Science, University of Southern California, Los Angeles, California90089, United States
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89
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Yentes JM, Liu WY, Zhang K, Markvicka E, Rennard SI. Updated Perspectives on the Role of Biomechanics in COPD: Considerations for the Clinician. Int J Chron Obstruct Pulmon Dis 2022; 17:2653-2675. [PMID: 36274993 PMCID: PMC9585958 DOI: 10.2147/copd.s339195] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/10/2022] [Accepted: 09/24/2022] [Indexed: 11/05/2022] Open
Abstract
Patients with chronic obstructive pulmonary disease (COPD) demonstrate extra-pulmonary functional decline such as an increased prevalence of falls. Biomechanics offers insight into functional decline by examining mechanics of abnormal movement patterns. This review discusses biomechanics of functional outcomes, muscle mechanics, and breathing mechanics in patients with COPD as well as future directions and clinical perspectives. Patients with COPD demonstrate changes in their postural sway during quiet standing compared to controls, and these deficits are exacerbated when sensory information (eg, eyes closed) is manipulated. If standing balance is disrupted with a perturbation, patients with COPD are slower to return to baseline and their muscle activity is differential from controls. When walking, patients with COPD appear to adopt a gait pattern that may increase stability (eg, shorter and wider steps, decreased gait speed) in addition to altered gait variability. Biomechanical muscle mechanics (ie, tension, extensibility, elasticity, and irritability) alterations with COPD are not well documented, with relatively few articles investigating these properties. On the other hand, dyssynchronous motion of the abdomen and rib cage while breathing is well documented in patients with COPD. Newer biomechanical technologies have allowed for estimation of regional, compartmental, lung volumes during activity such as exercise, as well as respiratory muscle activation during breathing. Future directions of biomechanical analyses in COPD are trending toward wearable sensors, big data, and cloud computing. Each of these offers unique opportunities as well as challenges. Advanced analytics of sensor data can offer insight into the health of a system by quantifying complexity or fluctuations in patterns of movement, as healthy systems demonstrate flexibility and are thus adaptable to changing conditions. Biomechanics may offer clinical utility in prediction of 30-day readmissions, identifying disease severity, and patient monitoring. Biomechanics is complementary to other assessments, capturing what patients do, as well as their capability.
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Affiliation(s)
- Jennifer M Yentes
- Department of Kinesiology & Sport Management, Texas A&M University, College Station, TX, USA
| | - Wai-Yan Liu
- Department of Orthopaedic Surgery & Trauma, Máxima MC, Eindhoven, the Netherlands
- Department of Orthopaedic Surgery & Trauma, Catharina Hospital, Eindhoven, the Netherlands
| | - Kuan Zhang
- Department of Electrical & Computer Engineering, University of Nebraska at Lincoln, Lincoln, NE, USA
| | - Eric Markvicka
- Department of Electrical & Computer Engineering, University of Nebraska at Lincoln, Lincoln, NE, USA
- Department of Mechanical & Materials Engineering, University of Nebraska at Lincoln, Lincoln, NE, USA
| | - Stephen I Rennard
- Department of Internal Medicine, Division of Pulmonary, Critical Care and Sleep Medicine, University of Nebraska Medical Center, Omaha, NE, USA
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90
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Mishra S, Mohanty S, Ramadoss A. Functionality of Flexible Pressure Sensors in Cardiovascular Health Monitoring: A Review. ACS Sens 2022; 7:2495-2520. [PMID: 36036627 DOI: 10.1021/acssensors.2c00942] [Citation(s) in RCA: 27] [Impact Index Per Article: 9.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/28/2023]
Abstract
As the highest percentage of global mortality is caused by several cardiovascular diseases (CVD), maintenance and monitoring of a healthy cardiovascular condition have become the primary concern of each and every individual. Simultaneously, recent progress and advances in wearable pressure sensor technology have provided many pathways to monitor and detect underlying cardiovascular illness in terms of irregularities in heart rate, blood pressure, and blood oxygen saturation. These pressure sensors can be comfortably attached onto human skin or can be implanted on the surface of vascular grafts for uninterrupted monitoring of arterial blood pressure. While the traditional monitoring systems are time-consuming, expensive, and not user-friendly, flexible sensor technology has emerged as a promising and dynamic practice to collect important health information at a comparatively low cost in a reliable and user-friendly way. This Review explores the importance and necessity of cardiovascular health monitoring while emphasizing the role of flexible pressure sensors in monitoring patients' health conditions to avoid adverse effects. A comprehensive discussion on the current research progress along with the real-time impact and accessibility of pressure sensors developed for cardiovascular health monitoring applications has been provided.
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Affiliation(s)
- Suvrajyoti Mishra
- School for Advanced Research in Petrochemicals: Laboratory for Advanced Research in Polymeric Materials (LARPM), Central Institute of Petrochemicals Engineering and Technology (CIPET), Bhubaneswar-751024, India
| | - Smita Mohanty
- School for Advanced Research in Petrochemicals: Laboratory for Advanced Research in Polymeric Materials (LARPM), Central Institute of Petrochemicals Engineering and Technology (CIPET), Bhubaneswar-751024, India
| | - Ananthakumar Ramadoss
- School for Advanced Research in Petrochemicals: Laboratory for Advanced Research in Polymeric Materials (LARPM), Central Institute of Petrochemicals Engineering and Technology (CIPET), Bhubaneswar-751024, India
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91
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Al-Sn-Al Bonding Strength Investigation Based on Deep Learning Model. Processes (Basel) 2022. [DOI: 10.3390/pr10101899] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/16/2022] Open
Abstract
Al-Sn-Al wafer bonding is a new semiconductor manufacturing technology that plays an important role in device manufacturing. Optimization of the bonding process and testing of the bonding strength remain key issues. However, using only physical experiments to study the above problems presents difficulties such as repeating many experiments, high costs, and low efficiency. Deep learning algorithms can quickly simulate complex physical correlations by training large amounts of data, which is a good solution to the difficulties in studying wafer bonding. Therefore, this paper proposes the use of deep learning models (2-layer CNN and 50-layer ResNet) to achieve autonomous recognition of bonding strengths corresponding to different bonding conditions, and the results from a comparative test set show that the ResNet model has an accuracy of 99.17%, outperforming the CNN model with an accuracy of 91.67%. Then, the identified images are analyzed using the Canny edge detector, which showed that the fracture surface morphology of the wafer is a hole-shaped structure, with the smaller the area of hole movement on the wafer surface, the higher the bonding strength. In addition, the effects of bonding time and bonding temperature on bonding strength are verified, showing that relatively short bonding times and relatively low bonding temperatures resulted in better wafer bonding strength. This research demonstrates the potential of using deep learning to accelerate wafer bonding strength identification and process condition optimization.
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92
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van Hazendonk L, Pinto AM, Arapov K, Pillai N, Beurskens MRC, Teunissen JP, Sneck A, Smolander M, Rentrop CHA, Bouten PCP, Friedrich H. Printed Stretchable Graphene Conductors for Wearable Technology. CHEMISTRY OF MATERIALS : A PUBLICATION OF THE AMERICAN CHEMICAL SOCIETY 2022; 34:8031-8042. [PMID: 36117880 PMCID: PMC9477090 DOI: 10.1021/acs.chemmater.2c02007] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 07/05/2022] [Revised: 08/15/2022] [Indexed: 06/15/2023]
Abstract
Skin-compatible printed stretchable conductors that combine a low gauge factor with a high durability over many strain cycles are still a great challenge. Here, a graphene nanoplatelet-based colloidal ink utilizing a skin-compatible thermoplastic polyurethane (TPU) binder with adjustable rheology is developed. Stretchable conductors that remain conductive even under 100% strain and demonstrate high fatigue resistance to cyclic strains of 20-50% are realized via printing on TPU. The sheet resistances of these conductors after drying at 120 °C are as low as 34 Ω □-1 mil-1. Furthermore, photonic annealing at several energy levels is used to decrease the sheet resistance to <10 Ω □-1 mil-1, with stretchability and fatigue resistance being preserved and tunable. The high conductivity, stretchability, and cyclic stability of printed tracks having excellent feature definition in combination with scalable ink production and adjustable rheology bring the high-volume manufacturing of stretchable wearables into scope.
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Affiliation(s)
- Laura
S. van Hazendonk
- Laboratory
of Physical Chemistry and Center for Multiscale Electron Microscopy,
Department of Chemical Engineering and Chemistry, Eindhoven University of Technology, P.O. Box 513, 5600MB Eindhoven, The Netherlands
| | - Artur M. Pinto
- Laboratory
of Physical Chemistry and Center for Multiscale Electron Microscopy,
Department of Chemical Engineering and Chemistry, Eindhoven University of Technology, P.O. Box 513, 5600MB Eindhoven, The Netherlands
- LEPABE, Faculdade
de Engenharia, Universidade do Porto, 4200-180 Porto, Portugal
| | - Kirill Arapov
- Laboratory
of Physical Chemistry and Center for Multiscale Electron Microscopy,
Department of Chemical Engineering and Chemistry, Eindhoven University of Technology, P.O. Box 513, 5600MB Eindhoven, The Netherlands
| | - Nikhil Pillai
- Pulseforge, 400 Parker Drive, Suite 1110, Austin, Texas 78728, United States
| | - Michiel R. C. Beurskens
- Laboratory
of Physical Chemistry and Center for Multiscale Electron Microscopy,
Department of Chemical Engineering and Chemistry, Eindhoven University of Technology, P.O. Box 513, 5600MB Eindhoven, The Netherlands
| | | | - Asko Sneck
- VTT
Technical Research Centre of Finland Ltd., P.O. Box 1000, FI-02044 Espoo, Finland
| | - Maria Smolander
- VTT
Technical Research Centre of Finland Ltd., P.O. Box 1000, FI-02044 Espoo, Finland
| | | | - Piet C. P. Bouten
- Holst
Centre - TNO, High Tech
Campus 31, 5656AE Eindhoven, The Netherlands
| | - Heiner Friedrich
- Laboratory
of Physical Chemistry and Center for Multiscale Electron Microscopy,
Department of Chemical Engineering and Chemistry, Eindhoven University of Technology, P.O. Box 513, 5600MB Eindhoven, The Netherlands
- Institute
for Complex Molecular Systems, Department of Chemical Engineering
and Chemistry, Eindhoven University of Technology, P.O. Box 513, 5600MB Eindhoven, The Netherlands
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93
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Deng HT, Wen DL, Feng T, Wang YL, Zhang XR, Huang P, Zhang XS. Silicone Rubber Based-Conductive Composites for Stretchable "All-in-One" Microsystems. ACS APPLIED MATERIALS & INTERFACES 2022; 14:39681-39700. [PMID: 36006298 DOI: 10.1021/acsami.2c08333] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/15/2023]
Abstract
Wearable electronics with development trends such as miniaturization, multifunction, and smart integration have become an important part of the Internet of Things (IoT) and have penetrated various sectors of modern society. To meet the increasing demands of wearable electronics in terms of deformability and conformability, many efforts have been devoted to overcoming the nonstretchable and poor conformal properties of traditional functional materials and endowing devices with outstanding mechanical properties. One of the promising approaches is composite engineering in which traditional functional materials are incorporated into the various polymer matrices to develop different kinds of functional composites and construct different functions of stretchable electronics. Herein, we focus on the approach of composite engineering and the polymer matrix of silicone rubber (SR), and we summarize the state-of-the-art details of silicone rubber-based conductive composites (SRCCs), including a summary of their conductivity mechanisms and synthesis methods and SRCC applications for stretchable electronics. For conductivity mechanisms, two conductivity mechanisms of SRCC are emphasized: percolation theory and the quantum tunneling mechanism. For synthesis methods of SRCCs, four typical approaches to synthesize different kinds of SRCCs are investigated: mixing/blending, infiltration, ion implantation, and in situ formation. For SRCC applications, different functions of stretchable electronics based on SRCCs for interconnecting, sensing, powering, actuating, and transmitting are summarized, including stretchable interconnects, sensors, nanogenerators, antennas, and transistors. These functions reveal the feasibility of constructing a stretchable all-in-one self-powered microsystem based on SRCC-based stretchable electronics. As a prospect, this microsystem is expected to integrate the functional sensing modulus, the energy harvesting modulus, and the process and response modulus together to sense and respond to environmental stimulations and human physiological signals.
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Affiliation(s)
- Hai-Tao Deng
- School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
| | - Dan-Liang Wen
- School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
| | - Tao Feng
- School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
| | - Yi-Lin Wang
- School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
| | - Xin-Ran Zhang
- School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
| | - Peng Huang
- School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
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94
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Bang J, Ahn J, Zhang J, Ko TH, Park B, Lee YM, Jung BK, Lee SY, Ok J, Kim BH, Kim TI, Choi JI, Lee CH, Oh SJ. Stretchable and Directly Patternable Double-Layer Structure Electrodes with Complete Coverage. ACS NANO 2022; 16:12134-12144. [PMID: 35925652 DOI: 10.1021/acsnano.2c02664] [Citation(s) in RCA: 7] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/15/2023]
Abstract
Stretchable electrodes are widely used in next-generation wearable electronics. Recent studies incorporated designs that help rigid electrodes attain stretchability. However, these structures exhibited unsatisfactory charge/signal extraction efficiency because of their low areal fill factor. Additionally, they cannot be photolithographically patterned on polymer substrates because of their low adhesion, requiring additional complicated fabrication steps. We developed photolithographically patternable stretchable electrodes with complete coverage and enhanced charge-extraction efficiency. The electrodes, comprising double layers, included a chemically treated Ag nanowire mesh and Au thin film. The interfacial linker role of polyvinylpyrrolidone chemically strengthened the interfacial bonds, and the reinforced concrete structure of nanowire-embedded metal thin films enhanced the mechanical properties. Therefore, the electrodes provided superior efficiency and stability in capturing physical, electromagnetic, and electrophysiological signals while exceeding the existing stretchable electrode limits. A broad range of applications are foreseen, such as electrocardiogram sensing electrodes, strain sensors, temperature sensors, and antennas.
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Affiliation(s)
- Junsung Bang
- Department of Materials Science and Engineering, Korea University, Seoul 02841, Republic of Korea
| | - Junhyuk Ahn
- Department of Materials Science and Engineering, Korea University, Seoul 02841, Republic of Korea
| | - Jinyuan Zhang
- Weldon School of Biomedical Engineering, Purdue University, West Lafayette, Indiana 47907, United States
| | - Tae Hee Ko
- Division of Cardiology, Department of Internal Medicine, Korea University College of Medicine and Korea University Medical Center, Seoul 02841, Republic of Korea
- Ion Channel Research Unit, Cardiovascular Research Institute, Korea University, Seoul 02841, Republic of Korea
| | - Byeonghak Park
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea
| | - Yong Min Lee
- Department of Semiconductor Systems Engineering, Korea University, Seoul 02841, Republic of Korea
| | - Byung Ku Jung
- Department of Materials Science and Engineering, Korea University, Seoul 02841, Republic of Korea
| | - Sang Yeop Lee
- Department of Materials Science and Engineering, Korea University, Seoul 02841, Republic of Korea
| | - Jehyung Ok
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea
| | - Bong Hoon Kim
- Department of Robotics and Mechatronics Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu 42988, Republic of Korea
| | - Tae-Il Kim
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea
- Biomedical Institute for Convergence at SKKU (BICS), Sungkyunkwan University (SKKU), Suwon 16419, Republic of Korea
| | - Jong-Il Choi
- Division of Cardiology, Department of Internal Medicine, Korea University College of Medicine and Korea University Medical Center, Seoul 02841, Republic of Korea
- Ion Channel Research Unit, Cardiovascular Research Institute, Korea University, Seoul 02841, Republic of Korea
| | - Chi Hwan Lee
- Weldon School of Biomedical Engineering, Purdue University, West Lafayette, Indiana 47907, United States
- School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47907, United States
- School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907, United States
- Brick Nanotechnology Center, Purdue University, West Lafayette, Indiana 47907, United States
| | - Soong Ju Oh
- Department of Materials Science and Engineering, Korea University, Seoul 02841, Republic of Korea
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95
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Xiong Y, Han J, Wang Y, Wang ZL, Sun Q. Emerging Iontronic Sensing: Materials, Mechanisms, and Applications. RESEARCH (WASHINGTON, D.C.) 2022; 2022:9867378. [PMID: 36072274 PMCID: PMC9414182 DOI: 10.34133/2022/9867378] [Citation(s) in RCA: 16] [Impact Index Per Article: 5.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 04/26/2022] [Accepted: 07/12/2022] [Indexed: 11/06/2022]
Abstract
Iontronic sensors represent a novel class of soft electronics which not only replicate the biomimetic structures and perception functions of human skin but also simulate the mechanical sensing mechanism. Relying on the similar mechanism with skin perception, the iontronic sensors can achieve ion migration/redistribution in response to external stimuli, promising iontronic sensing to establish more intelligent sensing interface for human-robotic interaction. Here, a comprehensive review on advanced technologies and diversified applications for the exploitation of iontronic sensors toward ionic skins and artificial intelligence is provided. By virtue of the excellent stretchability, high transparency, ultrahigh sensitivity, and mechanical conformality, numerous attempts have been made to explore various novel ionic materials to fabricate iontronic sensors with skin-like perceptive properties, such as self-healing and multimodal sensing. Moreover, to achieve multifunctional artificial skins and intelligent devices, various mechanisms based on iontronics have been investigated to satisfy multiple functions and human interactive experiences. Benefiting from the unique material property, diverse sensing mechanisms, and elaborate device structure, iontronic sensors have demonstrated a variety of applications toward ionic skins and artificial intelligence.
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Affiliation(s)
- Yao Xiong
- Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 101400, China
- School of Nanoscience and Technology, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Jing Han
- Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 101400, China
- School of Nanoscience and Technology, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Yifei Wang
- Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 101400, China
- School of Nanoscience and Technology, University of Chinese Academy of Sciences, Beijing 100049, China
| | - Zhong Lin Wang
- Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 101400, China
- School of Nanoscience and Technology, University of Chinese Academy of Sciences, Beijing 100049, China
- School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta GA 30332, USA
| | - Qijun Sun
- Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 101400, China
- School of Nanoscience and Technology, University of Chinese Academy of Sciences, Beijing 100049, China
- Center on Nanoenergy Research, School of Physical Science and Technology, Guangxi University, Nanning 530004, China
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96
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Ullah H, Wahab MA, Will G, Karim MR, Pan T, Gao M, Lai D, Lin Y, Miraz MH. Recent Advances in Stretchable and Wearable Capacitive Electrophysiological Sensors for Long-Term Health Monitoring. BIOSENSORS 2022; 12:bios12080630. [PMID: 36005025 PMCID: PMC9406032 DOI: 10.3390/bios12080630] [Citation(s) in RCA: 22] [Impact Index Per Article: 7.3] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 05/23/2022] [Revised: 07/22/2022] [Accepted: 07/27/2022] [Indexed: 05/27/2023]
Abstract
Over the past several years, wearable electrophysiological sensors with stretchability have received significant research attention because of their capability to continuously monitor electrophysiological signals from the human body with minimal body motion artifacts, long-term tracking, and comfort for real-time health monitoring. Among the four different sensors, i.e., piezoresistive, piezoelectric, iontronic, and capacitive, capacitive sensors are the most advantageous owing to their reusability, high durability, device sterilization ability, and minimum leakage currents between the electrode and the body to reduce the health risk arising from any short circuit. This review focuses on the development of wearable, flexible capacitive sensors for monitoring electrophysiological conditions, including the electrode materials and configuration, the sensing mechanisms, and the fabrication strategies. In addition, several design strategies of flexible/stretchable electrodes, body-to-electrode signal transduction, and measurements have been critically evaluated. We have also highlighted the gaps and opportunities needed for enhancing the suitability and practical applicability of wearable capacitive sensors. Finally, the potential applications, research challenges, and future research directions on stretchable and wearable capacitive sensors are outlined in this review.
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Affiliation(s)
- Hadaate Ullah
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, China
- State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
| | - Md A. Wahab
- Institute for Advanced Study, Chengdu University, Chengdu 610106, China
- School of Mechanical, Medical and Process Engineering, Faculty of Engineering, Queensland University of Technology, George St Brisbane, GPO Box 2434, Brisbane, QLD 4001, Australia
| | - Geoffrey Will
- School of Mechanical, Medical and Process Engineering, Faculty of Engineering, Queensland University of Technology, George St Brisbane, GPO Box 2434, Brisbane, QLD 4001, Australia
| | - Mohammad R. Karim
- Center of Excellence for Research in Engineering Materials (CEREM), Deanship of Scientific Research (DSR), King Saud University, Riyadh 11421, Saudi Arabia
- K.A. CARE Energy Research and Innovation Center, Riyadh 11451, Saudi Arabia
| | - Taisong Pan
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, China
- State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
| | - Min Gao
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, China
- State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
| | - Dakun Lai
- Biomedical Imaging and Electrophysiology Laboratory, School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 610054, China
| | - Yuan Lin
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, China
- State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
- Medico-Engineering Corporation on Applied Medicine Research Center, University of Electronic Science and Technology of China, Chengdu 610054, China
| | - Mahdi H. Miraz
- School of Computing and Data Science, Xiamen University Malaysia, Bandar Sunsuria, Sepang 43900, Malaysia
- School of Computing, Faculty of Arts, Science and Technology, Wrexham Glyndŵr University, Wrexham LL112AW, UK
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97
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Tetsuka H, Pirrami L, Wang T, Demarchi D, Shin SR. Wirelessly Powered 3D Printed Hierarchical Biohybrid Robots with Multiscale Mechanical Properties. ADVANCED FUNCTIONAL MATERIALS 2022; 32:2202674. [PMID: 36313126 PMCID: PMC9603592 DOI: 10.1002/adfm.202202674] [Citation(s) in RCA: 15] [Impact Index Per Article: 5.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/10/2023]
Abstract
The integration of flexible and stretchable electronics into biohybrid soft robotics can spur the development of new approaches to fabricate biohybrid soft machines, thus enabling a wide variety of innovative applications. Inspired by flexible and stretchable wireless-based bioelectronic devices, we have developed untethered biohybrid soft robots that can execute swimming motions, which are remotely controllable by the wireless transmission of electrical power into a cell simulator. To this end, wirelessly-powered, stretchable, and lightweight cell stimulators were designed to be integrated into muscle bodies without impeding the robots' underwater swimming abilities. The cell stimulators function by generating controlled monophasic pulses of up to ∼9 V in biological environments. By differentiating induced pluripotent stem cell-derived cardiomyocytes (iPSC-CMs) directly on the cell stimulators using an accordion-inspired, three-dimensional (3D) printing construct, we have replicated the native myofiber architecture with comparable robustness and enhanced contractibility. Wirelessly modulated electrical frequencies enabled us to control the speed and direction of the biohybrid soft robots. A maximum locomotion speed of ∼580 μm/s was achieved in robots possessing a large body size by adjusting the pacing frequency. This innovative approach will provide a platform for building untethered and biohybrid systems for various biomedical applications.
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Affiliation(s)
- Hiroyuki Tetsuka
- Division of Engineering in Medicine, Department of Medicine, Brigham and Women's Hospital, Harvard Medical School, 65 Lansdowne Street, Cambridge, Massachusetts, 02139 USA
- Future Mobility Research Department, Toyota Research Institute of North America, Toyota Motor North America, 1555 Woodridge Avenue, Ann Arbor, Michigan, 48105 USA
| | - Lorenzo Pirrami
- iPrint Institute, HEIA-FR, HES-SO University of Applied Sciences and Arts Western Switzerland, Fribourg-1700, Switzerland
| | - Ting Wang
- Division of Engineering in Medicine, Department of Medicine, Brigham and Women's Hospital, Harvard Medical School, 65 Lansdowne Street, Cambridge, Massachusetts, 02139 USA
| | - Danilo Demarchi
- Department of Electronics and Telecommunications, Politecnico di Torino, Turin 10129, Italy
| | - Su Ryon Shin
- Division of Engineering in Medicine, Department of Medicine, Brigham and Women's Hospital, Harvard Medical School, 65 Lansdowne Street, Cambridge, Massachusetts, 02139 USA
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98
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Jiang S, Liu J, Xiong W, Yang Z, Yin L, Li K, Huang Y. A Snakeskin-Inspired, Soft-Hinge Kirigami Metamaterial for Self-Adaptive Conformal Electronic Armor. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2204091. [PMID: 35680159 DOI: 10.1002/adma.202204091] [Citation(s) in RCA: 10] [Impact Index Per Article: 3.3] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/06/2022] [Revised: 06/03/2022] [Indexed: 06/15/2023]
Abstract
A majority of soft-body creatures evolve armor or shells to protect themselves. Similar protection demand is for flexible electronics working in complex environments. Existing works mainly focus on improving the sensing capabilities such as electronic skin (E-skin). Inspired by snakeskin, a novel electronic armor (E-armor) is proposed, which not only possesses mechanical flexibility and electronic functions similar to E-skin, but is also able to protect itself and the underlying soft body from external physical damage. The geometry of the kirigami mechanical metamaterial (Kiri-MM) ensures auxetic stretchability and meanwhile large areal coverage for sufficient protection. Moreover, to suppress the inherent but undesired out-of-plane buckling of conventional Kiri-MMs for conformal applications, soft hinges are used to form a distinct soft (hinges)-rigid (tiles) configuration. Analytical, computational, and experimental studies of the mechanical behaviors of the soft-hinge Kiri-MM E-armor demonstrate the merits of this design, i.e., stretchability, conformability, and protectability, as applied to flexible electronics. Deploying a conductive soft material at the hinges enables facile wiring strategies for large-scale circuit arrays. Functional E-armor systems for controllable display and sensing purposes provide simple examples of a wide spectrum of applications of this concept.
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Affiliation(s)
- Shan Jiang
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Jianpeng Liu
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Wennan Xiong
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Zhaoxi Yang
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Liting Yin
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - Kan Li
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
| | - YongAn Huang
- State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, 430074, China
- Flexible Electronics Research Center, Huazhong University of Science and Technology, Wuhan, 430074, China
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99
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Fabrication and Conductive Mechanism Analysis of Stretchable Electrodes Based on PDMS-Ag Nanosheet Composite with Low Resistance, Stability, and Durability. NANOMATERIALS 2022; 12:nano12152628. [PMID: 35957060 PMCID: PMC9370586 DOI: 10.3390/nano12152628] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 07/02/2022] [Revised: 07/25/2022] [Accepted: 07/28/2022] [Indexed: 02/04/2023]
Abstract
A flexible and stretchable electrode based on polydimethylsiloxane (PDMS)-Ag nanosheet composite with low resistance and stable properties has been investigated. Under the synergistic effect of the excellent flexibility and stretchability of PDMS and the excellent electrical conductivity of Ag nanosheets, the electrode possesses a resistivity as low as 4.28 Ωm, a low resistance variation in the 0–50% strain range, a stable electrical conductivity over 1000 cycles, and a rapid recovery ability after failure caused by destructive large stretching. Moreover, the conductive mechanism of the flexible electrode during stretching is explained by combining experimental tests, theoretical models of contact point-tunneling effect, and finite element simulation. This research provides a simple and effective solution for the structure design and material selection of flexible electrodes, and an analytical method for the conductive mechanism of stretchable electrodes, which has potential for applications in flexible electronic devices, smart sensing, wearable devices, and other fields.
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100
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Kim HJ, Ho JS. Wireless interfaces for brain neurotechnologies. PHILOSOPHICAL TRANSACTIONS. SERIES A, MATHEMATICAL, PHYSICAL, AND ENGINEERING SCIENCES 2022; 380:20210020. [PMID: 35658679 DOI: 10.1098/rsta.2021.0020] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 09/08/2021] [Accepted: 12/13/2021] [Indexed: 06/15/2023]
Abstract
Wireless interfaces enable brain-implanted devices to remotely interact with the external world. They are critical components in modern research and clinical neurotechnologies and play a central role in determining their overall size, lifetime and functionality. Wireless interfaces use a wide range of modalities-including radio-frequency fields, acoustic waves and light-to transfer energy and data to and from an implanted device. These forms of energy interact with living tissue through distinct mechanisms and therefore lead to systems with vastly different form factors, operating characteristics, and safety considerations. This paper reviews recent advances in the development of wireless interfaces for brain neurotechnologies. We summarize the requirements that state-of-the-art brain-implanted devices impose on the wireless interface, and discuss the working principles and applications of wireless interfaces based on each modality. We also investigate challenges associated with wireless brain neurotechnologies and discuss emerging solutions permitted by recent developments in electrical engineering and materials science. This article is part of the theme issue 'Advanced neurotechnologies: translating innovation for health and well-being'.
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Affiliation(s)
- Han-Joon Kim
- Department of Electrical and Computer Engineering National University of Singapore, Queenstown, Singapore
| | - John S Ho
- Department of Electrical and Computer Engineering National University of Singapore, Queenstown, Singapore
- The N.1 Institute for Health National University of Singapore, Queenstown, Singapore
- Institute for Health Innovation and Technology, National University of Singapore, Queenstown, Singapore
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