Transfer printing techniques for materials assembly and micro/nanodevice fabrication

Reevaluation of the adhesion between cellulose materials using macro spherical beads and flat model surfaces

Interactions between dry cellulose were studied using model systems, cellulose beads, and cellulose films, using custom-built contact adhesion testing equipment. Depending on the configuration of the substrates in contact, Polydimethylsiloxane (PDMS) film, cellulose films spin-coated either on PDMS or glass, the interaction shows three distinct processes. Firstly, molecular interlocking is formed between cellulose and cellulose when there is a soft PDMS thin film backing the cellulose film. Secondly, without backing, no initial attraction force between the surfaces is observed. Thirdly, a significant force increase, ∆F, is observed during the retraction process for cellulose on glass, and there is a maximum in ∆F when the retraction rate is increased. This is due to the kinetics of a contacting process occurring in the interaction zone between the surfaces caused by an interdigitation of a fine fibrillar structure at the nano-scale, whereas, for the spin-coated cellulose surfaces on the PDMS backing, there is a more direct adhesive failure. The results have generated understanding of the interaction between cellulose-rich materials, which helps design new, advanced cellulose-based materials. The results also show the complexity of the interaction between these surfaces and that earlier mechanisms, based on macroscopic material testing, are simply not adequate for molecular tailoring.

Silicon-based transient electronics: principles, devices and applications

Recent advances in materials science, device designs and advanced fabrication technologies have enabled the rapid development of transient electronics, which represents a class of devices or systems that their functionalities and constitutions can be partially/completely degraded via chemical reaction or physical disintegration over a stable operation. Therefore, numerous potentials, including zero/reduced waste electronics, bioresorbable electronic implants, hardware security, and others, are expected. In particular, transient electronics with biocompatible and bioresorbable properties could completely eliminate the secondary retrieval surgical procedure after their in-body operation, thus offering significant potentials for biomedical applications. In terms of material strategies for the manufacturing of transient electronics, silicon nanomembranes (SiNMs) are of great interest because of their good physical/chemical properties, modest mechanical flexibility (depending on their dimensions), robust and outstanding device performances, and state-of-the-art manufacturing technologies. As a result, continuous efforts have been made to develop silicon-based transient electronics, mainly focusing on designing manufacturing strategies, fabricating various devices with different functionalities, investigating degradation or failure mechanisms, and exploring their applications. In this review, we will summarize the recent progresses of silicon-based transient electronics, with an emphasis on the manufacturing of SiNMs, devices, as well as their applications. After a brief introduction, strategies and basics for utilizing SiNMs for transient electronics will be discussed. Then, various silicon-based transient electronic devices with different functionalities are described. After that, several examples regarding on the applications, with an emphasis on the biomedical engineering, of silicon-based transient electronics are presented. Finally, summary and perspectives on transient electronics are exhibited.

Substrate-Free Transfer of Silicon- and Metallic-Based Strain Sensors on Textile and in Composite Material for Structural Health Monitoring

New technologies to integrate electronics and sensors on or into objects can support the growth of embedded electronics. The method proposed in this paper has the huge advantage of being substrate-free and applicable to a wide range of target materials such as fiber-based composites, widely used in manufacturing, and for which monitoring applications such as fatigue, cracks, and deformation detection are crucial. Here, sensors are first fabricated on a donor substrate using standard microelectronic processes and then transferred to the host material by direct transfer printing. Results show the viability of composites instrumented by strain gauges. Indeed, dynamic and static measurements highlight that the deformations can be detected with high sensitivity both on the surface and at various points in the depth of the composite material. Thanks to this technology, for the first time, a substrate-free piezoresistive n-doped silicon strain sensor is transferred into a composite material and characterized as a function of strain applied on it. It is shown that the transfer process does not alter the electrical behavior of the sensors that are five times more sensitive than extensively used metallic ones. An application designed for monitoring the deformation of a rudder foil with a classic NACA profile in real time is presented.

Tailoring high-refractive-index nanocomposites for manufacturing of ultraviolet metasurfaces

Nanoimprint lithography (NIL) has been utilized to address the manufacturing challenges of high cost and low throughput for optical metasurfaces. To overcome the limitations inherent in conventional imprint resins characterized by a low refractive index (n), high-n nanocomposites have been introduced to directly serve as meta-atoms. However, comprehensive research on these nanocomposites is notably lacking. In this study, we focus on the composition of high-n zirconium dioxide (ZrO2) nanoparticle (NP) concentration and solvents used to produce ultraviolet (UV) metaholograms and quantify the transfer fidelity by the measured conversion efficiency. The utilization of 80 wt% ZrO2 NPs in MIBK, MEK, and acetone results in conversion efficiencies of 62.3%, 51.4%, and 61.5%, respectively, at a wavelength of 325 nm. The analysis of the solvent composition and NP concentration can further enhance the manufacturing capabilities of high-n nanocomposites in NIL, enabling potential practical use of optical metasurfaces.

Particle-Based Photoelectrodes for PEC Water Splitting: Concepts and Perspectives

This comprehensive review delves into the intricacies of the photoelectrochemical (PEC) water splitting process, specifically focusing on the design, fabrication, and optimization of particle-based photoelectrodes for efficient green hydrogen production. These photoelectrodes, composed of semiconductor materials, potentially harness light energy and generate charge carriers, driving water oxidation and reduction reactions. The versatility of particle-based photoelectrodes as a platform for investigating and enhancing various semiconductor candidates is explored, particularly the emerging complex oxides with compelling charge transfer properties. However, the challenges presented by many factors influencing the performance and stability of these photoelectrodes, including particle size, shape, composition, morphology, surface modification, and electrode configuration, are highlighted. The review introduces the fundamental principles of semiconductor photoelectrodes for PEC water splitting, presents an exhaustive overview of different synthesis methods for semiconductor powders and their assembly into photoelectrodes, and discusses recent advances and challenges in photoelectrode material development. It concludes by offering promising strategies for improving photoelectrode performance and stability, such as the adoption of novel architectures and heterojunctions.

3D hotspot engineering and analytes strategy enabled ultrasensitive SERS platform for biosensing of depression biomarker

Nowadays, the diagnose of depression mainly relies on clinical examination while impossible to accurately evaluate the occurrence of depression. Chemical approaches are captivating to analyze stress biomarkers for feedbacking body's endocrine response to stress stimuli. However, it remains challenging in exploring accurate, reliable and sensitive approaches. Herein, we rationally design a newly SERS platform with integrated hotspots engineering and analyte strategy to achieve highly sensitive analysis for estrogen, a typical depression biomarker in adolescent female. On the one hand, the 3D micro/nano plasmonic substrate containing Au-Ag Alloy Nanourchins (AAA-NUs) and arrays-based monolayer films of Au nanoparticles (Au NSs) was constructed to achieve high density and availability of hotspots. On the other hand, the analyte strategy was designed via rapid azotizing reaction to further enhance the scattering cross-section of estrogen in the form of azido compounds. With the synergism of them, the proposed SERS platform displayed high sensitivity for estrogen with a limit of detection down to 10-11 mg/mL. More importantly, the blood estrogen levels of depressed patients were evaluated via the proposed SERS platform and presented high consistence with clinical diagnostic results. This integrated SERS platform paves the way for universal and ultrasensitive biosensing and possess great potential for applying in multi-target detection and disease prediction.

Copper(I) Iodide Thin Films: Deposition Methods and Hole-Transporting Performance

The pursuit of p-type semiconductors has garnered considerable attention in academia and industry. Among the potential candidates, copper iodide (CuI) stands out as a highly promising p-type material due to its conductivity, cost-effectiveness, and low environmental impact. CuI can be employed to create thin films with >80% transparency within the visible range (400-750 nm) and utilizing various low-temperature, scalable deposition techniques. This review summarizes the deposition techniques for CuI as a hole-transport material and their performance in perovskite solar cells, thin-film transistors, and light-emitting diodes using diverse processing methods. The preparation methods of making thin films are divided into two categories: wet and neat methods. The advancements in CuI as a hole-transporting material and interface engineering techniques hold promising implications for the continued development of such devices.

Wafer-Recyclable, Eco-Friendly, and Multiscale Dry Transfer Printing by Transferable Photoresist for Flexible Epidermal Electronics

Flexible electronics have been of great interest in the past few decades for their wide-ranging applications in health monitoring, human-machine interaction, artificial intelligence, and biomedical engineering. Currently, transfer printing is a popular technology for flexible electronics manufacturing. However, typical sacrificial intermediate layer-based transfer printing through chemical reactions results in a series of challenges, such as time consumption and interface incompatibility. In this paper, we have developed a time-saving, wafer-recyclable, eco-friendly, and multiscale transfer printing method by using a stable transferable photoresist. Demonstration of photoresist with various, high-resolution, and multiscale patterns from the donor substrate of silicon wafer to different flexible polymer substrates without any damage is conducted using the as-developed dry transfer printing process. Notably, by utilizing the photoresist patterns as conformal masks and combining them with physical vapor deposition and dry lift-off processes, we have achieved in situ fabrication of metal patterns on flexible substrates. Furthermore, a mechanical experiment has been conducted to demonstrate the mechanism of photoresist transfer printing and dry lift-off processes. Finally, we demonstrated the application of in situ fabricated electrode devices for collecting electromyography and electrocardiogram signals. Compared to commercially available hydrogel electrodes, our electrodes exhibited higher sensitivity, greater stability, and the ability to achieve long-term health monitoring.

Dual-Use Strain Sensors for Acoustic Emission and Quasi-Static Bending Measurements

In this paper, a MEMS piezoresistive ultrathin silicon membrane-based strain sensor is presented. The sensor's ability to capture an acoustic emission signal is demonstrated using a Hsu-Nielsen source, and shows comparable frequency content to a commercial piezoceramic ultrasonic transducer. To the authors' knowledge, this makes the developed sensor the first known piezoresistive strain sensor which is capable of recording low-energy acoustic emissions. The improvements to the nondestructive evaluation and structural health monitoring arise from the sensor's low minimum detectable strain and wide-frequency bandwidth, which are generated from the improved fabrication process that permits crystalline semiconductor membranes and advanced polymers to be co-processed, thus enabling a dual-use application of both acoustic emission and static strain sensing. The sensor's ability to document quasi-static bending is also demonstrated and compared with an ultrasonic transducer, which provides no significant response. This dual-use application is proposed to effectively combine the uses of both strain and ultrasonic transducer sensor types within one sensor, making it a novel and useful method for nondestructive evaluations. The potential benefits include an enhanced sensitivity, a reduced sensor size, a lower cost, and a reduced instrumentation complexity.

Insights into Materials, Physics, and Applications in Flexible and Wearable Acoustic Sensing Technology

Sound plays a crucial role in the perception of the world. It allows to communicate, learn, and detect potential dangers, diagnose diseases, and much more. However, traditional acoustic sensors are limited in their form factors, being rigid and cumbersome, which restricts their potential applications. Recently, acoustic sensors have made significant advancements, transitioning from rudimentary forms to wearable devices and smart everyday clothing that can conform to soft, curved, and deformable surfaces or surroundings. In this review, the latest scientific and technological breakthroughs with insightful analysis in materials, physics, design principles, fabrication strategies, functions, and applications of flexible and wearable acoustic sensing technology are comprehensively explored. The new generation of acoustic sensors that can recognize voice, interact with machines, control robots, enable marine positioning and localization, monitor structural health, diagnose human vital signs in deep tissues, and perform organ imaging is highlighted. These innovations offer unique solutions to significant challenges in fields such as healthcare, biomedicine, wearables, robotics, and metaverse. Finally, the existing challenges and future opportunities in the field are addressed, providing strategies to advance acoustic sensing technologies for intriguing real-world applications and inspire new research directions.

Low-dimensional nanostructures for monolithic 3D-integrated flexible and stretchable electronics

Flexible/stretchable electronics, which are characterized by their ultrathin design, lightweight structure, and excellent mechanical robustness and conformability, have garnered significant attention due to their unprecedented potential in healthcare, advanced robotics, and human-machine interface technologies. An increasing number of low-dimensional nanostructures with exceptional mechanical, electronic, and/or optical properties are being developed for flexible/stretchable electronics to fulfill the functional and application requirements of information sensing, processing, and interactive loops. Compared to the traditional single-layer format, which has a restricted design space, a monolithic three-dimensional (M3D) integrated device architecture offers greater flexibility and stretchability for electronic devices, achieving a high-level of integration to accommodate the state-of-the-art design targets, such as skin-comfort, miniaturization, and multi-functionality. Low-dimensional nanostructures possess small size, unique characteristics, flexible/elastic adaptability, and effective vertical stacking capability, boosting the advancement of M3D-integrated flexible/stretchable systems. In this review, we provide a summary of the typical low-dimensional nanostructures found in semiconductor, interconnect, and substrate materials, and discuss the design rules of flexible/stretchable devices for intelligent sensing and data processing. Furthermore, artificial sensory systems in 3D integration have been reviewed, highlighting the advancements in flexible/stretchable electronics that are deployed with high-density, energy-efficiency, and multi-functionalities. Finally, we discuss the technical challenges and advanced methodologies involved in the design and optimization of low-dimensional nanostructures, to achieve monolithic 3D-integrated flexible/stretchable multi-sensory systems.

Transfer Printing of Ordered Plasmonic Nanoparticles at Hard and Soft Interfaces with Increased Fidelity and Biocompatibility Supports a Surface Lattice Resonance

Transfer printing, the relocation of structures assembled on one surface to a different substrate by adjusting adhesive forces at the surface-substrate interface, is widely used to print electronic circuits on biological substrates like human skin and plant leaves. The fidelity of original structures must be preserved to maintain the functionality of transfer-printed circuits. This work developed new biocompatible methods to transfer a nanoscale square lattice of plasmon resonant nanoparticles from a lithographed surface onto leaf and glass substrates. The fidelity of the ordered nanoparticles was preserved across a large area in order to yield, for the first time, an optical surface lattice resonance on glass substrates. To effect the transfer, interfacial adhesion was adjusted by using laser induction of plasmons or unmounted adhesive. Optical and confocal laser scanning microscopy showed that submicron spacing of the square lattice was preserved in ≥90% of transfer-printed areas up to 4 mm2. Up to 90% of ordered nanoparticles were transferred, yielding a surface lattice resonance measured by transmission UV-vis spectroscopy.

Laser-Assisted Structuring of Graphene Films with Biocompatible Liquid Crystal Polymer for Skin/Brain-Interfaced Electrodes

The work presented here introduces a facile strategy for the development of flexible and stretchable electrodes that harness the robust characteristics of carbon nanomaterials through laser processing techniques on a liquid crystal polymer (LCP) film. By utilizing LCP film as a biocompatible electronic substrate, control is demonstrated over the laser irradiation parameters to achieve efficient pattern generation and transfer printing processes, thereby yielding highly conductive laser-induced graphene (LIG) bioelectrodes. To enhance the resolution of the patterned LIG film, shadow masks are employed during laser scanning on the LCP film surface. This approach is compatible with surface-mounted device integration, enabling the circuit writing of LIG/LCP materials in a flexible format. Moreover, kirigami-inspired on-skin bioelectrodes are introduced that exhibit reasonable stretchability, enabling independent connections to healthcare hardware platforms for electrocardiogram (ECG) and electromyography (EMG) measurements. Additionally, a brain-interfaced LIG microelectrode array is proposed that combines mechanically compliant architectures with LCP encapsulation for stimulation and recording purposes, leveraging their advantageous structural features and superior electrochemical properties. This developed approach offers a cost-effective and scalable route for producing patterned arrays of laser-converted graphene as bioelectrodes. These bioelectrodes serve as ideal circuit-enabled flexible substrates with long-term reliability in the ionic environment of the human body.

"Visualization" Gas-Gas Sensors Based on High Performance Novel MXenes Materials

The detection of toxic, harmful, explosive, and volatile gases cannot be separated from gas sensors, and gas sensors are also used to monitor the greenhouse effect and air pollution. However, existing gas sensors remain with many drawbacks, such as lower sensitivity, lower selectivity, and unstable room temperature detection. Thus, there is an imperative need to find more suitable sensing materials. The emergence of a new 2D layered material MXenes has brought dawn to solve this problem. The multiple advantages of MXenes, namely high specific surface area, enriched terminal functionality groups, hydrophilicity, and good electrical conductivity, make them among the most prolific gas-sensing materials. Therefore, this review paper describes the current main synthesis methods of MXenes materials, and focuses on summarizing and organizing the latest research results of MXenes in gas sensing applications. It also introduces the possible gas sensing mechanisms of MXenes materials on NH3 , NO2 , CH3 , and volatile organic compounds (VOCs). In conclusion, it provides insight into the problems and upcoming challenges of MXenes materials for gas sensing.

Microelectronic Morphogenesis: Smart Materials with Electronics Assembling into Artificial Organisms

Microelectronic morphogenesis is the creation and maintenance of complex functional structures by microelectronic information within shape-changing materials. Only recently has in-built information technology begun to be used to reshape materials and their functions in three dimensions to form smart microdevices and microrobots. Electronic information that controls morphology is inheritable like its biological counterpart, genetic information, and is set to open new vistas of technology leading to artificial organisms when coupled with modular design and self-assembly that can make reversible microscopic electrical connections. Three core capabilities of cells in organisms, self-maintenance (homeostatic metabolism utilizing free energy), self-containment (distinguishing self from nonself), and self-reproduction (cell division with inherited properties), once well out of reach for technology, are now within the grasp of information-directed materials. Construction-aware electronics can be used to proof-read and initiate game-changing error correction in microelectronic self-assembly. Furthermore, noncontact communication and electronically supported learning enable one to implement guided self-assembly and enhance functionality. Here, the fundamental breakthroughs that have opened the pathway to this prospective path are reviewed, the extent and way in which the core properties of life can be addressed are analyzed, and the potential and indeed necessity of such technology for sustainable high technology in society is discussed.

Vertical serpentine interconnect-enabled stretchable and curved electronics

Stretchable and curved electronic devices are a promising technology trend due to their remarkable advantages. Many approaches have been developed to manufacture stretchable and curved electronics. Here, to allow such electronics to better serve practical applications, ranging from wearable devices to soft robotics, we propose a novel vertical serpentine conductor (VSC) with superior electrical stability to interconnect functional devices through a silicon-based microfabrication process. Conformal vacuum transfer printing (CVTP) technology was developed to transfer the networked platform onto complex curved surfaces to demonstrate feasibility. The mechanical and electrical performance were investigated numerically and experimentally. The VSC interconnected network provides a new approach for stretchable and curved electronics with high stretchability and reliability.

Wafer-scale patterning of high-resolution quantum dot films with a thickness over 10 μm for improved color conversion

Quantum dots (QDs) are promising color conversion materials for efficient full-color micro light-emitting diode (micro-LED) displays owing to their high color purity and wide color gamut. However, achieving high-resolution QD patterns with enough thickness for efficient color conversion is challenging. Here, we demonstrate a facile and compatible approach by combining replicate molding, plasma etching and transfer printing to produce QD patterns with a sufficient thickness over ten micrometers in a wide range of resolutions. Our technique can remarkably simplify the preparation of QD inks and minimize optical damage to QD materials. The pixel resolution and thickness of QD patterns can be controlled by well-defining the microstructures of the molding template and the etching process. The transfer printing process allows QD patterns to be assembled sequentially onto a receiving substrate, which will further improve the original pixel resolution and avoid repetitive optical damage to QDs during the patterning process. Consequently, various QD patterns can be fabricated in this work, including perovskite quantum dot (PQD) patterns with a pixel resolution of up to 669 pixels per inch (ppi) and a maximum thickness of up to 19.74 μm, a wafer-scale high-resolution PQD pattern with sufficient thickness on a flexible substrate, and a dual-color pattern comprising green PQDs and red CdSe QDs. Furthermore, these fabricated QD films with a thickness of over 10 μm show improved color conversion when integrated onto a blue micro-LED, revealing the potential of our technique for full-color micro-LED displays.

Flexible Electrodes for Brain-Computer Interface System

Brain-computer interface (BCI) has been the subject of extensive research recently. Governments and companies have substantially invested in relevant research and applications. The restoration of communication and motor function, the treatment of psychological disorders, gaming, and other daily and therapeutic applications all benefit from BCI. The electrodes hold the key to the essential, fundamental BCI precondition of electrical brain activity detection and delivery. However, the traditional rigid electrodes are limited due to their mismatch in Young's modulus, potential damages to the human body, and a decline in signal quality with time. These factors make the development of flexible electrodes vital and urgent. Flexible electrodes made of soft materials have grown in popularity in recent years as an alternative to conventional rigid electrodes because they offer greater conformance, the potential for higher signal-to-noise ratio (SNR) signals, and a wider range of applications. Therefore, the latest classifications and future developmental directions of fabricating these flexible electrodes are explored in this paper to further encourage the speedy advent of flexible electrodes for BCI. In summary, the perspectives and future outlook for this developing discipline are provided.

Progress in wearable acoustical sensors for diagnostic applications

With extensive and widespread uses of miniaturized and intelligent wearable devices, continuously monitoring subtle spatial and temporal changes in human physiological states becomes crucial for daily healthcare and professional medical diagnosis. Wearable acoustical sensors and related monitoring systems can be comfortably applied onto human body with a distinctive function of non-invasive detection. This paper reviews recent advances in wearable acoustical sensors for medical applications. Structural designs and characteristics of the structural components of wearable electronics, including piezoelectric and capacitive micromachined ultrasonic transducer (i.e., pMUT and cMUT), surface acoustic wave sensors (SAW) and triboelectric nanogenerators (TENGs) are discussed, along with their fabrication techniques and manufacturing processes. Diagnostic applications of these wearable sensors for detection of biomarkers or bioreceptors and diagnostic imaging have further been discussed. Finally, main challenges and future research directions in these fields are highlighted.

Technological Breakthroughs in Chip Fabrication, Transfer, and Color Conversion for High-Performance Micro-LED Displays

The implementation of high-efficiency and high-resolution displays has been the focus of considerable research interest. Recently, micro light-emitting diodes (micro-LEDs), which are inorganic light-emitting diodes of size <100 µm2 , have emerged as a promising display technology owing to their superior features and advantages over other displays like liquid crystal displays and organic light-emitting diodes. Although many companies have introduced micro-LED displays since 2012, obstacles to mass production still exist. Three major challenges, i.e., low quantum efficiency, time-consuming transfer, and complex color conversion, have been overcome with technological breakthroughs to realize cost-effective micro-LED displays. In the review, methods for improving the degraded quantum efficiency of GaN-based micro-LEDs induced by the size effect are examined, including wet chemical treatment, passivation layer adoption, LED structure design, and growing LEDs in self-passivated structures. Novel transfer technologies, including pick-up transfer and self-assembly methods, for developing large-area micro-LED displays with high yield and reliability are discussed in depth. Quantum dots as color conversion materials for high color purity, and deposition methods such as electrohydrodynamic jet printing or contact printing on micro-LEDs are also addressed. This review presents current status and critical challenges of micro-LED technology and promising technical breakthroughs for commercialization of high-performance displays.

Patterning Quantum Dots via Photolithography: A Review

Pixelating patterns of red, green, and blue quantum dots (QDs) is a critical challenge for realizing high-end displays with bright and vivid images for virtual, augmented, and mixed reality. Since QDs must be processed from a solution, their patterning process is completely different from the conventional techniques used in the organic light-emitting diode and liquid crystal display industries. Although innovative QD patterning technologies are being developed, photopatterning based on the light-induced chemical conversion of QD films is considered one of the most promising methods for forming micrometer-scale QD patterns that satisfy the precision and fidelity required for commercialization. Moreover, the practical impact will be significant as it directly exploits mature photolithography technologies and facilities that are widely available in the semiconductor industry. This article reviews recent progress in the effort to form QD patterns via photolithography. The review begins with a general description of the photolithography process. Subsequently, different types of photolithographical methods applicable to QD patterning are introduced, followed by recent achievements using these methods in forming high-resolution QD patterns. The paper also discusses prospects for future research directions.

Aphid-Inspired and Thermally-Actuated Soft Gripper Using 3D Printing Technology

Herein, a thermo-actuated aphid-inspired dry adhesive (TADA) that offers tunable and reversible adhesion is reported. It is easily fabricated through 3D printing using a polylactic acid (PLA) filament and silicone elastomer, avoiding the use of unfavorable methods for micro- and nanofabrication and unwanted particles for actuation. The tunable adhesive system mimics aphid biology to achieve adhesion switchability. Switching between adhesion states is enabled by the thermo-actuated PLA, which has shape memory properties. Additionally, silicone elastomer enables adherence to flat substrates such as glass, silicon wafers, and acrylic plates. The detachment time of the TADA can be controlled by changing the printing layer height, which is a 3D-printing parameter that results in a short detachment time when the printing layer height is small. The adhesion strength is measured by applying different preloads and varying the size of the adhesive area. The reversibility between the adhesion-on and adhesion-off states, revealing good repeatability with similar adhesion strengths is also demonstrated. The TADA has potential applications in transferring silicon wafers. In addition, it can be printed to fit a flat plate of any shape, enabling it to grip the plate stably.

Functionalizing nanophotonic structures with 2D van der Waals materials

The integration of two-dimensional (2D) van der Waals materials with nanostructures has triggered a wide spectrum of optical and optoelectronic applications. Photonic structures of conventional materials typically lack efficient reconfigurability or multifunctionality. Atomically thin 2D materials can thus generate new functionality and reconfigurability for a well-established library of photonic structures such as integrated waveguides, optical fibers, photonic crystals, and metasurfaces, to name a few. Meanwhile, the interaction between light and van der Waals materials can be drastically enhanced as well by leveraging micro-cavities or resonators with high optical confinement. The unique van der Waals surfaces of the 2D materials enable handiness in transfer and mixing with various prefabricated photonic templates with high degrees of freedom, functionalizing as the optical gain, modulation, sensing, or plasmonic media for diverse applications. Here, we review recent advances in synergizing 2D materials to nanophotonic structures for prototyping novel functionality or performance enhancements. Challenges in scalable 2D materials preparations and transfer, as well as emerging opportunities in integrating van der Waals building blocks beyond 2D materials are also discussed.

Toward Single Cell Tattoos: Biotransfer Printing of Lithographic Gold Nanopatterns on Live Cells

Lithographic nanopatterning techniques such as photolithography, electron-beam lithography, and nanoimprint lithography (NIL) have revolutionized modern-day electronics and optics. Yet, their application for creating nanobio interfaces is limited by the cytotoxic and two-dimensional nature of conventional fabrication methods. Here, we present a biocompatible and cost-effective transfer process that leverages (a) NIL to define sub-300 nm gold (Au) nanopattern arrays, (b) amine functionalization of Au to transfer the NIL-arrays from a rigid substrate to a soft transfer layer, (c) alginate hydrogel as a flexible, degradable transfer layer, and (d) gelatin conjugation of the Au NIL-arrays to achieve conformal contact with live cells. We demonstrate biotransfer printing of the Au NIL-arrays on rat brains and live cells with high pattern fidelity and cell viability and observed differences in cell migration on the Au NIL-dot and NIL-wire printed hydrogels. We anticipate that this nanolithography-compatible biotransfer printing method could advance bionics, biosensing, and biohybrid tissue interfaces.

Flexible Quantum Dot Light-Emitting Device for Emerging Multifunctional and Smart Applications

Quantum dot light-emitting diodes (QLEDs), owing to their exceptional performances in device efficiency, color purity/tunability in the visible region and solution-processing ability on various substrates, become a potential candidate for flexible and ultrathin electroluminescent (EL) lighting and display. Moreover, beyond the lighting and display, flexible QLEDs are enabled with endless possibilities in the era of the internet of things and artificial intelligence by acting as input/output ports in wearable integrated systems. Challenges remain in the development of flexible QLEDs with the goals for high performance, excellent flexibility/even stretchability, and emerging applications. In this paper, the recent developments of QLEDs including quantum dot materials, working mechanism, flexible/stretchable strategies and patterning strategies, and highlight its emerging multifunctional integrations and smart applications covering wearable optical medical devices, pressure-sensing EL devices, and neural smart EL devices, are reviewed. The remaining challenges are also summarized and an outlook on the future development of flexible QLEDs made. The review is expected to offer a systematic understanding and valuable inspiration for flexible QLEDs to simultaneously satisfy optoelectronic and flexible properties for emerging applications.

Fluidic self-assembly for MicroLED displays by controlled viscosity

Displays in which arrays of microscopic 'particles', or chiplets, of inorganic light-emitting diodes (LEDs) constitute the pixels, termed MicroLED displays, have received considerable attention^1,2 because they can potentially outperform commercially available displays based on organic LEDs^3,4 in terms of power consumption, colour saturation, brightness and stability and without image burn-in issues^1,2,5-7. To manufacture these displays, LED chiplets must be epitaxially grown on separate wafers for maximum device performance and then transferred onto the display substrate. Given that the number of LEDs needed for transfer is tremendous-for example, more than 24 million chiplets smaller than 100 μm are required for a 50-inch, ultra-high-definition display-a technique capable of assembling tens of millions of individual LEDs at low cost and high throughput is needed to commercialize MicroLED displays. Here we demonstrate a MicroLED lighting panel consisting of more than 19,000 disk-shaped GaN chiplets, 45 μm in diameter and 5 μm in thickness, assembled in 60 s by a simple agitation-based, surface-tension-driven fluidic self-assembly (FSA) technique with a yield of 99.88%. The creation of this level of large-scale, high-yield FSA of sub-100-μm chiplets was considered a significant challenge because of the low inertia of the chiplets. Our key finding in overcoming this difficulty is that the addition of a small amount of poloxamer to the assembly solution increases its viscosity which, in turn, increases liquid-to-chiplet momentum transfer. Our results represent significant progress towards the ultimate goal of low-cost, high-throughput manufacture of full-colour MicroLED displays by FSA.

Ordered growth of metal oxides in patterned multi-angle microstructures

Herein, we report a facile method combining top-down patterning transfer and bottom-up nanorod growth for preparing large-area and ordered TiO₂ nanorod arrays. Pre-crystallization seeding was patterned with nanostructured morphologies via interfacial tension-driven precursor solution scattering on various types and period templates. This is a widely applicable strategy for capillary force-driven interfacial patterns, which also shows great operability in complex substrate morphologies with multiple-angle mixing. Moreover, the customized patterned lithographic templates containing English words, Arabic numerals, and Chinese characters are used to verify the applicability and controllability of this hybrid method. In general, our work provides a versatile strategy for the low-cost and facile preparation of hydrothermally growable metal oxide (e.g., ZnO and MnO₂) nanostructures with potential applications in the fields of microelectronic devices, photoelectric devices, energy storage, and photocatalysis.

Toward single cell tattoos: Biotransfer printing of lithographic gold nanopatterns on live cells

Lithographic nanopatterning techniques like photolithography, electron-beam lithography, and nanoimprint lithography (NIL) have revolutionized modern-day electronics and optics. Yet, their application for creating nano-bio interfaces is limited by the cytotoxic and two-dimensional nature of conventional fabrication methods. Here, we present a biocompatible and cost-effective transfer process that leverages (a) NIL to define sub-300 nm gold (Au) nanopattern arrays, (b) amine functionalization of Au to transfer the NIL-arrays from a rigid substrate to a soft transfer layer, (c) alginate hydrogel as a flexible, degradable transfer layer, and (d) gelatin conjugation of the Au NIL-arrays to achieve conformal contact with live cells. We demonstrate biotransfer printing of the Au NIL-arrays on rat brains and live cells with high pattern fidelity and cell viability and observed differences in cell migration on the Au NIL-dot and NIL-wire printed hydrogels. We anticipate that this nanolithography-compatible biotransfer printing method could advance bionics, biosensing, and biohybrid tissue interfaces.

Highly reproducible van der Waals integration of two-dimensional electronics on the wafer scale

Two-dimensional (2D) semiconductors such as molybdenum disulfide (MoS₂) have attracted tremendous interest for transistor applications. However, the fabrication of 2D transistors using traditional lithography or deposition processes often causes undesired damage and contamination to the atomically thin lattices, partially degrading the device performance and leading to large variation between devices. Here we demonstrate a highly reproducible van der Waals integration process for wafer-scale fabrication of high-performance transistors and logic circuits from monolayer MoS₂ grown by chemical vapour deposition. By designing a quartz/polydimethylsiloxane semirigid stamp and adapting a standard photolithography mask-aligner for the van der Waals integration process, our strategy ensures a uniform mechanical force and a bubble-free wrinkle-free interface during the pickup/release process, which is crucial for robust van der Waals integration over a large area. Our scalable van der Waals integration process allows damage-free integration of high-quality contacts on monolayer MoS₂ at the wafer scale and enables high-performance 2D transistors. The van-der-Waals-contacted devices display an atomically clean interface with much smaller threshold variation, higher on-current, smaller off-current, larger on/off ratio and smaller subthreshold swing than those fabricated with conventional lithography. The approach is further used to create various logic gates and circuits, including inverters with a voltage gain of up to 585, and logic OR gates, NAND gates, AND gates and half-adder circuits. This scalable van der Waals integration method may be useful for reliable integration of 2D semiconductors with mature industry technology, facilitating the technological transition of 2D semiconductor electronics.

Applications of remote epitaxy and van der Waals epitaxy

Epitaxy technology produces high-quality material building blocks that underpin various fields of applications. However, fundamental limitations exist for conventional epitaxy, such as the lattice matching constraints that have greatly narrowed down the choices of available epitaxial material combinations. Recent emerging epitaxy techniques such as remote and van der Waals epitaxy have shown exciting perspectives to overcome these limitations and provide freestanding nanomembranes for massive novel applications. Here, we review the mechanism and fundamentals for van der Waals and remote epitaxy to produce freestanding nanomembranes. Key benefits that are exclusive to these two growth strategies are comprehensively summarized. A number of original applications have also been discussed, highlighting the advantages of these freestanding films-based designs. Finally, we discuss the current limitations with possible solutions and potential future directions towards nanomembranes-based advanced heterogeneous integration.

Papertronics: Marriage between Paper and Electronics Becoming a Real Scenario in Resource-Limited Settings

Integrating electronic applications with paper, placed next to or below printed images or graphics, can further expand the possible uses of paper substrates. Consuming paper as a substrate in the field of electronics can lead to significant innovations toward papertronics applications as paper comprises various advantages like being disposable, inexpensive, biodegradable, easy to handle, simple to use, and easily available. All of these advantages will definitely spur the advancement of the electronics field, but unfortunately, putting electronics on paper is not an easy task because, compared to plastics, the paper surface is not just rough but also porous. For example, in the case of lateral flow assay testing the sensor response is delayed if the pore size of the paper is enormous. This might be a disadvantage for most electrical devices printed directly on paper. Still, some methods make it compatible when fit with a rough, absorbent surface of the paper. Building electronic devices on a standard paper substrate have sparked much interest because of its lightweight, environmental friendliness, minimal cost, and simple fabrication. A slew of improvements have been achieved in recent years to make paper electronics perform better in various applications, including transistors, batteries, and displays. In addition, flexible electronics have gained much interest in human-machine interaction and wireless sensing. This review briefly examines the origins and fabrication of paper electronics and then moves on to applications and exciting possible paths for paper-based electronics.

Synthesis of Wrinkle-Free Metallic Thin Films in Polymer by Interfacial Instability Suppression with Nanoparticles

Synthesis of a smooth conductive film over an elastomer is vital to the development of flexible optics and wearable electronics, but applications are hindered by wrinkles and cracks in the film. To date, a large-scale wrinkle-free film in an elastomer has yet to be achieved. We present a robust method to fabricate wrinkle-free, stress-free, and optically smooth thin film in elastomer. Targeting underlying mechanisms, we applied nanoparticles between the film and elastomer to jam the interface and subsequently suppress interfacial instabilities to prevent the formation of wrinkles. Using polydimethylsiloxane (PDMS) and parylene-C as a model system, we have synthesized large-scale (>10 cm) wrinkle-free Al film over/in PDMS and demonstrated the principle of interface jamming by nanoparticles. We varied the jammer layer thickness to show that, as the layer exceeds a critical thickness (e.g., 150 nm), wrinkles are successfully suppressed. Nano-indentation experiments revealed that the interface becomes more elastic and less viscoelastic with respect to the jammer thickness, which further supports our assertion of the wrinkle suppression mechanism. Since the film was embedded in a polymer matrix, the resultant film was highly deformable, elastic, and optically smooth with applications for deformable optical sensors and actuators.

Lab on a Chip Device for Diagnostic Evaluation and Management in Chronic Renal Disease: A Change Promoting Approach in the Patients' Follow Up

Lab-on-a-chip (LOC) systems are miniaturized devices aimed to perform one or several analyses, normally carried out in a laboratory setting, on a single chip. LOC systems have a wide application range, including diagnosis and clinical biochemistry. In a clinical setting, LOC systems can be associated with the Point-of-Care Testing (POCT) definition. POCT circumvents several steps in central laboratory testing, including specimen transportation and processing, resulting in a faster turnaround time. Provider access to rapid test results allows for prompt medical decision making, which can lead to improved patient outcomes, operational efficiencies, patient satisfaction, and even cost savings. These features are particularly attractive for healthcare settings dealing with complicated patients, such as those affected by chronic kidney disease (CKD). CKD is a pathological condition characterized by progressive and irreversible structural or functional kidney impairment lasting for more than three months. The disease displays an unavoidable tendency to progress to End Stage Renal Disease (ESRD), thus requiring renal replacement therapy, usually dialysis, and transplant. Cardiovascular disease (CVD) is the major cause of death in CKD, with a cardiovascular risk ten times higher in these patients than the rate observed in healthy subjects. The gradual decline of the kidney leads to the accumulation of uremic solutes, with negative effect on organs, especially on the cardiovascular system. The possibility to monitor CKD patients by using non-invasive and low-cost approaches could give advantages both to the patient outcome and sanitary costs. Despite their numerous advantages, POCT application in CKD management is not very common, even if a number of devices aimed at monitoring the CKD have been demonstrated worldwide at the lab scale by basic studies (low Technology Readiness Level, TRL). The reasons are related to both technological and clinical aspects. In this review, the main technologies for the design of LOCs are reported, as well as the available POCT devices for CKD monitoring, with a special focus on the most recent reliable applications in this field. Moreover, the current challenges in design and applications of LOCs in the clinical setting are briefly discussed.

Advanced supramolecular design for direct ink writing of soft materials

The exciting advancements in 3D-printing of soft materials are changing the landscape of materials development and fabrication. Among various 3D-printers that are designed for soft materials fabrication, the direct ink writing (DIW) system is particularly attractive for chemists and materials scientists due to the mild fabrication conditions, compatibility with a wide range of organic and inorganic materials, and the ease of multi-materials 3D-printing. Inks for DIW need to possess suitable viscoelastic properties to allow for smooth extrusion and be self-supportive after printing, but molecularly facilitating 3D printability to functional materials remains nontrivial. While supramolecular binding motifs have been increasingly used for 3D-printing, these inks are largely optimized empirically for DIW. Hence, this review aims to establish a clear connection between the molecular understanding of the supramolecularly bound motifs and their viscoelastic properties at bulk. Herein, extrudable (but not self-supportive) and 3D-printable (self-supportive) polymeric materials that utilize noncovalent interactions, including hydrogen bonding, host-guest inclusion, metal-ligand coordination, micro-crystallization, and van der Waals interaction, have been discussed in detail. In particular, the rheological distinctions between extrudable and 3D-printable inks have been discussed from a supramolecular design perspective. Examples shown in this review also highlight the exciting macroscale functions amplified from the molecular design. Challenges associated with the hierarchical control and characterization of supramolecularly designed DIW inks are also outlined. The perspective of utilizing supramolecular binding motifs in soft materials DIW printing has been discussed. This review serves to connect researchers across disciplines to develop innovative solutions that connect top-down 3D-printing and bottom-up supramolecular design to accelerate the development of 3D-print soft materials for a sustainable future.

Electrochemical Replication and Transfer for Low-Cost, Sub-100 nm Patterning of Materials on Flexible Substrates

The fabrication of high-resolution patterns on flexible substrates is an essential step in the development of flexible electronics. However, the patterning process on flexible substrates often requires expensive equipment and tedious lithographic processing. Here, a bottom-up patterning technique, termed electrochemical replication and transfer (ERT) is reported, which fabricates multiscale patterns of a wide variety of materials by selective electrodeposition of target materials on a predefined template, and subsequent transfer of the electrodeposited materials to a flexible substrate, while leaving the undamaged template for reuse for over 100 times. The additive and parallel patterning attribute of ERT allows the fabrication of multiscale patterns with resolutions spanning from sub-100 nm to many centimeters simultaneously, which overcomes the trade-off between resolution and throughput of conventional patterning techniques. ERT is suitable for fabricating a wide variety of materials including metals, semiconductors, metal oxides, and polymers into arbitrary shapes on flexible substrates at a very low cost.

Flexible Azo-Polyimide-Based Smart Surface with Photoregulatable Surface Micropatterns: Toward Rewritable Information Storage and Wrinkle-Free Device Fabrication

Stimulus-sensitive materials are of great fascination in surface and interface science owing to their dynamically tunable surface properties and/or morphologies. Herein, we have synthesized an azobenzene-containing polyimide (azo-PI) with enhanced chain flexibility for the fabrication of photosensitive surface patterns on a film/substrate wrinkle system or wrinkle-free devices. The phototriggered cis-trans isomerization kinetics of azobenzene groups in the novel azo-PI with various chain structures were systematically investigated. On the basis of the characteristics of stress relaxation that azobenzene reversible cis-trans isomerization induces in the wrinkled azo-PI film/substrate system, a variety of rewritable visual surface patterns with high resolution and a long legibility time (>30 days) could be easily constructed via visible-light irradiation, enabling the wrinkled azo-PI surfaces to be used as rewritable information storage media. Meanwhile, because of the visible-light irradiation strategy, these photoresponsive surfaces could find potential application in the fabrication of wrinkle-free flexible devices. This study not only sheds light on the influence of the azo-polymer chain structure on its photoresponsive behavior but also provides a versatile strategy for realizing tailor-made smart surface patterns on multilayer functional devices.

Liquid Metal Patterning and Unique Properties for Next-Generation Soft Electronics

Room-temperature liquid metal (LM)-based electronics is expected to bring advancements in future soft electronics owing to its conductivity, conformability, stretchability, and biocompatibility. However, various difficulties arise when patterning LM because of its rheological features such as fluidity and surface tension. Numerous attempts are made to overcome these difficulties, resulting in various LM-patterning methods. An appropriate choice of patterning method based on comprehensive understanding is necessary to fully utilize the unique properties. Therefore, the authors aim to provide thorough knowledge about patterning methods and unique properties for LM-based future soft electronics. First, essential considerations for LM-patterning are investigated. Then, LM-patterning methods-serial-patterning, parallel-patterning, intermetallic bond-assisted patterning, and molding/microfluidic injection-are categorized and investigated. Finally, perspectives on LM-based soft electronics with unique properties are provided. They include outstanding features of LM such as conformability, biocompatibility, permeability, restorability, and recyclability. Also, they include perspectives on future LM-based soft electronics in various areas such as radio frequency electronics, soft robots, and heterogeneous catalyst. LM-based soft devices are expected to permeate the daily lives if patterning methods and the aforementioned features are analyzed and utilized.

Vertical full-colour micro-LEDs via 2D materials-based layer transfer

Micro-LEDs (µLEDs) have been explored for augmented and virtual reality display applications that require extremely high pixels per inch and luminance^1,2. However, conventional manufacturing processes based on the lateral assembly of red, green and blue (RGB) µLEDs have limitations in enhancing pixel density^3-6. Recent demonstrations of vertical µLED displays have attempted to address this issue by stacking freestanding RGB LED membranes and fabricating top-down^7-14, but minimization of the lateral dimensions of stacked µLEDs has been difficult. Here we report full-colour, vertically stacked µLEDs that achieve, to our knowledge, the highest array density (5,100 pixels per inch) and the smallest size (4 µm) reported to date. This is enabled by a two-dimensional materials-based layer transfer technique^15-18 that allows the growth of RGB LEDs of near-submicron thickness on two-dimensional material-coated substrates via remote or van der Waals epitaxy, mechanical release and stacking of LEDs, followed by top-down fabrication. The smallest-ever stack height of around 9 µm is the key enabler for record high µLED array density. We also demonstrate vertical integration of blue µLEDs with silicon membrane transistors for active matrix operation. These results establish routes to creating full-colour µLED displays for augmented and virtual reality, while also offering a generalizable platform for broader classes of three-dimensional integrated devices.

Photolithography-Based Microfabrication of Biodegradable Flexible and Stretchable Sensors

Biodegradable sensors based on integrating conductive layers with polymeric materials in flexible and stretchable forms have been established. However, the lack of a generalized microfabrication method results in large-sized, low spatial density, and low device yield compared to the silicon-based devices manufactured via batch-compatible microfabrication processes. Here, a batch fabrication-compatible photolithography-based microfabrication approach for biodegradable and highly miniaturized essential sensor components is presented on flexible and stretchable substrates. Up to 1600 devices are fabricated within a 1 cm² footprint and then the functionality of various biodegradable passive electrical components, mechanical sensors, and chemical sensors is demonstrated on flexible and stretchable substrates. The results are highly repeatable and consistent, proving the proposed method's high device yield and high-density potential. This simple, innovative, and robust fabrication recipe allows complete freedom over the applicability of various biodegradable materials with different properties toward the unique application of interests. The process offers a route to utilize standard micro-fabrication procedures toward scalable fabrication of highly miniaturized flexible and stretchable transient sensors and electronics.

Electrostatically Driven Vertical Combinatorial Patterning of Colloidal Nano-Objects

The hierarchically directed assembly of multiple types of colloidal nano-objects on surfaces is of interest for developing disruptive applications combining their original properties. We propose herein a versatile, electrostatically driven strategy to arrange various kinds of colloids vertically in the shape of 3D micropatterns by nanoxerography. We made the proof of concept of this vertical combinatorial nano-object patterning using two types of photoluminescent CdSe(S)/CdZnS core/shell nanoplatelets emitting in the red and green wavelengths as model colloidal nanoparticles. The key experimental parameters were investigated to tune the thickness of each independent level of nanoplatelets within the vertical stack. We finally applied such a concept to make dual-colored nanoplatelet patterns. Interestingly, we proved numerically that the relatively high index of the nanoplatelet level is responsible for the partially directed emissions observed in photoluminescence experiments.

Nanomembrane-assembled nanophotonics and optoelectronics: from materials to applications

Nanophotonics and optoelectronics are the keys to the information transmission technology field. The performance of the devices crucially depends on the light-matter interaction, and it is found that three-dimensional (3D) structures may be associated with strong light field regulation for advantageous application. Recently, 3D assembly of flexible nanomembranes has attracted increasing attention in optical field, and novel optoelectronic device applications have been demonstrated with fantastic 3D design. In this review, we first introduce the fabrication of various materials in the form of nanomembranes. On the basis of the deformability of nanomembranes, 3D structures can be built by patterning and release steps. Specifically, assembly methods to build 3D nanomembrane are summarized as rolling, folding, buckling and pick-place methods. Incorporating functional materials and constructing fine structures are two important development directions in 3D nanophotonics and optoelectronics, and we settle previous researches on these two aspects. The extraordinary performance and applicability of 3D devices show the potential of nanomembrane assembly for future optoelectronic applications in multiple areas.

Fabrication and Functionality Integration Technologies for Small-Scale Soft Robots

Small-scale soft robots are attracting increasing interest for visible and potential applications owing to their safety and tolerance resulting from their intrinsic soft bodies or compliant structures. However, it is not sufficient that the soft bodies merely provide support or system protection. More importantly, to meet the increasing demands of controllable operation and real-time feedback in unstructured/complicated scenarios, these robots are required to perform simplex and multimodal functionalities for sensing, communicating, and interacting with external environments during large or dynamic deformation with the risk of mismatch or delamination. Challenges are encountered during fabrication and integration, including the selection and fabrication of composite/materials and structures, integration of active/passive functional modules with robust interfaces, particularly with highly deformable soft/stretchable bodies. Here, methods and strategies of fabricating structural soft bodies and integrating them with functional modules for developing small-scale soft robots are investigated. Utilizing templating, 3D printing, transfer printing, and swelling, small-scale soft robots can be endowed with several perceptual capabilities corresponding to diverse stimulus, such as light, heat, magnetism, and force. The integration of sensing and functionalities effectively enhances the agility, adaptability, and universality of soft robots when applied in various fields, including smart manufacturing, medical surgery, biomimetics, and other interdisciplinary sciences.

Reflow transfer for conformal three-dimensional microprinting

From microcircuits to metamaterials, the micropatterning of surfaces adds valuable functionality. For nonplanar surfaces, incompatibility with conventional microlithography requires the transfer of originally planar micropatterns onto those surfaces; however, existing approaches accommodate only limited curvatures. A microtransfer approach was developed using reflowable materials that transform between solid and liquid on demand, freely stretching to yield transfers that naturally conform down to nanoscale radii of curvature and arbitrarily complex topographies. Such reflow transfer helps generalize microprinting, extending the reach of precision planar microlithography to highly nonplanar substrates and microstructures. With gentle water-based processing, reflow transfer can be applied to a range of materials, with microprinting demonstrated onto metal, plastic, paper, glass, polystyrene, semiconductor, elastomer, hydrogel, and multiple biological surfaces.

Transfer printing technologies for soft electronics

Soft electronics have received increasing attention in recent years, owing to their wide range of applications in dynamic nonplanar surface integration electronics that include skin electronics, implantable devices, and soft robotics. Transfer printing is a widely used assembly technology for micro- and nano-fabrication, which enables the integration of functional devices with flexible or elastomeric substrates for the manufacturing of soft electronics. Through advanced materials and process design, numerous impressive studies related to transfer printing strategies and applications have been proposed. Herein, a discussion of transfer printing technologies toward soft electronics in terms of mechanisms and example demonstrations is provided. Moreover, the perspectives on the potential challenges and future directions of this field are briefly discussed.

Nanoparticle contact printing with interfacial engineering for deterministic integration into functional structures

Deterministic, pristine, and scalable integration of individual nanoparticles onto arbitrary surfaces is an ongoing challenge, yet essential for harnessing their unique properties for functional nanoscale devices. To address this challenge, we present a versatile technique where spatially arranged nanoparticles assembled in a topographical template are printed onto diverse surfaces, through a single contact-and-release step, with >95% transfer yield and <50-nanometer placement accuracy. Through engineering of interfacial interactions, our approach uniquely promotes high-yield transfer of individual particles without needing solvents, surface treatments, and polymer sacrificial layers, which are conventionally inevitable. By avoiding these mediation steps, surfaces can remain damage and contamination free and accessible to integrate into functional structures. We demonstrate this in a particle-on-mirror model system, where >2000 precisely defined nanocavities display a consistent plasmonic response with minimized interstructure variability. Through fabricating arrays of emitter-coupled nanocavities, we further highlight the integration opportunities offered by our contact printing.

Self-assembly, alignment, and patterning of metal nanowires

Armed with the merits of one-dimensional nanostructures (flexibility, high aspect ratio, and anisotropy) and metals (high conductivity, plasmonic properties, and catalytic activity), metal nanowires (MNWs) have stood out as a new class of nanomaterials in the last two decades. They are envisaged to expedite significantly and even revolutionize a broad spectrum of applications related to display, sensing, energy, plasmonics, photonics, and catalysis. Compared with disordered MNWs, well-organized MNWs would not only enhance the intrinsic physical and chemical properties, but also create new functions and sophisticated architectures of optoelectronic devices. This paper presents a comprehensive review of assembly strategies of MNWs, including self-assembly for specific structures, alignment for anisotropic constructions, and patterning for precise configurations. The technical processes, underlying mechanisms, performance indicators, and representative applications of these strategies are described and discussed to inspire further innovation in assembly techniques and guide the fabrication of optoelectrical devices. Finally, a perspective on the critical challenges and future opportunities of MNW assembly is provided.

Mass Transfer Printing of Metal-Halide Perovskite Films and Nanostructures

Most methods of depositing perovskite films cannot meet the diverse requirements of real applications such as depositing films on various types of substrates, making patterns with different bandgaps for full-color display. Here, a robust mass transfer method of perovskite films and nanostructures is reported, meeting those requirements, by using an ultrathin branched polyethylenimine as interfacial chemical bonding layers. The transfer-printed perovskite films exhibit comparable morphology, composition, optoelectronic properties, and device performances with the counterparts made by optimized spin-coating methods. The perovskite light-emitting diodes (PeLEDs) using the transfer-printed films show decent external quantum efficiencies of 10.5% and 6.7% for red (680 nm) and sky-blue (493 nm) emissions, which are similar to the devices made by spin-coating. This robust transfer printing method also enables the the preparation of perovskite micropatterns with a high resolution up to 1270 pixels per inch. Horizontally aligned red and sky-blue perovskite microstripes are further obtained through multiple printing processes for white PeLEDs. This work demonstrates a feasible strategy for making perovskite films or micropatterns on various substrates for real applications in full-color display, white LEDs, lasing, etc.

Studies on the Mechanical Models and Behaviors for the Stamp/Film Interface in Microtransfer Printing

The adhesion/delamination characteristics at the stamp/film interface are critical for the efficiency of film microtransfer printing technology. To predict and regulate the interface mechanical behaviors, finite element models based on the J-integral, Virtual Crack Closure Technology (VCCT), and the cohesive zone method (CZM) were established and compared. Then, the effects of pulling speed and interface parameters on the pull-off force, which is used to characterize the interface adhesion strength, were investigated. Comparisons between the simulation results and previous experimental results demonstrated that the model based on the CZM was more applicable than the models based on the J-integral and VCCT in analyzing the adhesion/delamination behaviors of the stamp/film interface. Furthermore, the increase in pulling speed could enlarge the pull-off force for the viscoelastic stamp/film interface, while it had no influence on the pull-off force for the elastic stamp/film interface. In addition, a larger normal strength and normal fracture energy resulted in a larger pull-off force, which was beneficial to the realization of the picking-up process in microtransfer printing.

Recent Advances in Stretchable and Wearable Capacitive Electrophysiological Sensors for Long-Term Health Monitoring

Over the past several years, wearable electrophysiological sensors with stretchability have received significant research attention because of their capability to continuously monitor electrophysiological signals from the human body with minimal body motion artifacts, long-term tracking, and comfort for real-time health monitoring. Among the four different sensors, i.e., piezoresistive, piezoelectric, iontronic, and capacitive, capacitive sensors are the most advantageous owing to their reusability, high durability, device sterilization ability, and minimum leakage currents between the electrode and the body to reduce the health risk arising from any short circuit. This review focuses on the development of wearable, flexible capacitive sensors for monitoring electrophysiological conditions, including the electrode materials and configuration, the sensing mechanisms, and the fabrication strategies. In addition, several design strategies of flexible/stretchable electrodes, body-to-electrode signal transduction, and measurements have been critically evaluated. We have also highlighted the gaps and opportunities needed for enhancing the suitability and practical applicability of wearable capacitive sensors. Finally, the potential applications, research challenges, and future research directions on stretchable and wearable capacitive sensors are outlined in this review.