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She Y, Qi X, Wang W, Qiao Y, Xu L, Kang ET, Lu Z. Liquid Metal-Tannic Acid-Modified Cotton Yarn Prepared with Twist-Assisted Deposition Technique for Textile Electronics. ACS APPLIED MATERIALS & INTERFACES 2025. [PMID: 40393928 DOI: 10.1021/acsami.5c06856] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/22/2025]
Abstract
The past decade has witnessed the rapid growth of electronic textiles with a variety of textile-based smart devices being developed. However, the development of one-dimensional conductors that exhibit both excellent mechanical and electrical properties, while being compatible with conventional textile techniques, remains a challenge. Herein, a conductive cotton yarn was constructed using liquid metal as the conductive filler and tannic acid (TA) as the immobilizing linker via a twist-assisted deposition technique, in which eutectic gallium-indium alloy (EGaIn) droplets were effectively modified on cotton plies by using TA, followed by moderate twisting. By fully utilizing internal spaces between the adjacent fibers, the as-prepared EGaIn-TA-yarn exhibits high conductivity, with an average resistance of 11.20 Ω at a 10 cm length. When further wrapped with cotton fibers, the conductive yarn shows superior wash resistance, long-term stability, and excellent flexibility. It can withstand 25 washes, 3000 bending or twisting cycles, and 90 days of storage at ambient conditions without significant loss of conductivity. The cotton-wrapped EGaIn-TA-yarn could be used as a bendable, knottable, and sewable conductor to connect light-emitting diodes (LEDs) to power sources for lighting. This work could provide a simple, cost-effective approach to developing highly conductive yarns as promising candidates to replace traditional metal wires in textile electronics.
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Affiliation(s)
- Yu She
- School of Materials & Energy, Southwest University, Chongqing 400715, P. R. China
- Yibin Academy of Southwest University, Yibin 644000, P. R. China
| | - Xiulei Qi
- School of Materials & Energy, Southwest University, Chongqing 400715, P. R. China
- Yibin Academy of Southwest University, Yibin 644000, P. R. China
| | - Wei Wang
- Singapore Institute of Manufacturing Technology (SIMTech), Agency for Science, Technology and Research (A*STAR), 138634 Singapore, Republic of Singapore
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, 637457 Singapore, Republic of Singapore
| | - Yan Qiao
- School of Materials & Energy, Southwest University, Chongqing 400715, P. R. China
- Yibin Academy of Southwest University, Yibin 644000, P. R. China
| | - Liqun Xu
- School of Materials & Energy, Southwest University, Chongqing 400715, P. R. China
- Yibin Academy of Southwest University, Yibin 644000, P. R. China
| | - En-Tang Kang
- School of Materials & Energy, Southwest University, Chongqing 400715, P. R. China
- Department of Chemical and Biomolecular Engineering, National University of Singapore, 117576 Singapore, Republic of Singapore
| | - Zhisong Lu
- School of Materials & Energy, Southwest University, Chongqing 400715, P. R. China
- Yibin Academy of Southwest University, Yibin 644000, P. R. China
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2
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Qiu J, Yu R, Du X, Zhou T, Chen Y, Sun J, Wu L, Zhu M, Pan S. Liquid Metal Gel Ink with Self-Activating Conductivity for 3D Printing of Multifunctional Electronics. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2025:e2502722. [PMID: 40388652 DOI: 10.1002/smll.202502722] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/03/2025] [Revised: 04/26/2025] [Indexed: 05/21/2025]
Abstract
Liquid metal inks have emerged as promising conductive inks for the printing of soft circuits and multifunctional electronics. However, the printed patterns are typically nonconductive due to the native insulating oxide layer surrounding the liquid metal (LM) particles, which requires mechanical or chemical post-treatments to restore their electrical performance. In this study, the design and preparation of a self-activating LM gel ink are presented. This viscous gel ink consists of LM particles and supramolecular assemblies, which are formed by β-cyclodextrin (β-CD) and sodium dodecyl sulfate (SDS). These assemblies entangle to create a supramolecular gel network, which prevents the LM particles from settling and facilitates 3D printing. Moreover, the supramolecular assemblies are dissociated into host-guest complexes upon heating to 50 °C, thereby allowing the ink to transition its viscosity from ≈13 to ≈0.005 Pa·s at a shear rate of 1 s-1. This viscosity transition leads to the sedimentation of LM particles, resulting in the formation of a continuous liquid metal phase upon water evaporation, with a high electrical conductivity of 3.4 × 105 S m-1. The printed conductive patterns can subsequently be used in multifunctional devices, including stretchable displays, wireless power-transmission circuits, and fabric bioelectrodes.
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Affiliation(s)
- Jiexin Qiu
- State Key Laboratory of Advanced Fiber Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620, China
| | - Rouhui Yu
- State Key Laboratory of Advanced Fiber Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620, China
| | - Xiangheng Du
- State Key Laboratory of Advanced Fiber Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620, China
| | - Tao Zhou
- State Key Laboratory of Advanced Fiber Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620, China
| | - Yaqi Chen
- State Key Laboratory of Advanced Fiber Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620, China
| | - Jiale Sun
- State Key Laboratory of Advanced Fiber Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620, China
| | - Liang Wu
- State Key Laboratory of Advanced Fiber Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620, China
| | - Meifang Zhu
- State Key Laboratory of Advanced Fiber Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620, China
| | - Shaowu Pan
- State Key Laboratory of Advanced Fiber Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620, China
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3
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Zhao W, Yao L, Shen J, Chen S, Zhu S, Chen S, Wang L, Li Y, Liu S, Zhao Q. Advanced Liquid Metal-Based Hydrogels for Flexible Electronics. ACS APPLIED MATERIALS & INTERFACES 2025; 17:27713-27739. [PMID: 40323766 DOI: 10.1021/acsami.5c05225] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/07/2025]
Abstract
With the rapid development of flexible electronics in wearable devices, healthcare devices, and the Internet of Things (IoT), liquid metals (LMs)-based hydrogels have emerged as cutting-edge functional materials due to their high electrical conductivity, tunable mechanical properties, excellent biocompatibility, and unique self-healing properties. Through various physical or chemical methods, LMs can be integrated to form multifunctional LMs-based hydrogels, thus broadening the potential application fields. In this Review, the recent advancement in LMs-based hydrogels for flexible electronics is comprehensively and systematically reviewed from three aspects of synthesis methods, properties, and applications. For the first time, the existing innovative synthesis methods of LMs-based hydrogels are classified and summarized, including patterned LMs on/inside hydrogel substrates, LMs as conductive fillers in polymeric hydrogels, LMs as initiators in hydrogels, and LMs as cross-linkers with organic/inorganic materials. The synthesis mechanism is also stated in detail to highlight the multiple roles of LMs in adjusting the hydrogel properties. The versatile applications of LMs-based hydrogels in flexible electronics, including flexible sensors, wireless communications, electromagnetic interference (EMI) shielding, soft robot actuators, energy storage and conversion, etc., are separately described. Finally, the current challenges and future prospects of LMs-based hydrogels are proposed.
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Affiliation(s)
- Weiwei Zhao
- State Key Laboratory of Flexible Electronics (LoFE) and Institute of Advanced Materials (IAM), Nanjing University of Posts & Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
| | - Le Yao
- State Key Laboratory of Flexible Electronics (LoFE) and Institute of Advanced Materials (IAM), Nanjing University of Posts & Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
| | - Jiacheng Shen
- State Key Laboratory of Flexible Electronics (LoFE) and Institute of Advanced Materials (IAM), Nanjing University of Posts & Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
| | - Shujiao Chen
- State Key Laboratory of Flexible Electronics (LoFE) and Institute of Advanced Materials (IAM), Nanjing University of Posts & Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
| | - Shujing Zhu
- State Key Laboratory of Flexible Electronics (LoFE) and Institute of Advanced Materials (IAM), Nanjing University of Posts & Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
| | - Shu Chen
- State Key Laboratory of Flexible Electronics (LoFE) and Institute of Advanced Materials (IAM), Nanjing University of Posts & Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
| | - Longlu Wang
- College of Electronic and Optical Engineering & College of Flexible Electronics (Future Technology), Nanjing University of Posts & Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
| | - Yang Li
- College of Electronic and Optical Engineering & College of Flexible Electronics (Future Technology), Nanjing University of Posts & Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
| | - Shujuan Liu
- State Key Laboratory of Flexible Electronics (LoFE) and Institute of Advanced Materials (IAM), Nanjing University of Posts & Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
| | - Qiang Zhao
- State Key Laboratory of Flexible Electronics (LoFE) and Institute of Advanced Materials (IAM), Nanjing University of Posts & Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
- College of Electronic and Optical Engineering & College of Flexible Electronics (Future Technology), Nanjing University of Posts & Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
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4
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Lee GH, Lee Y, Seo H, Jo K, Yeo J, Kim S, Bae JY, Kim C, Majidi C, Kang J, Kang SK, Ryu S, Park S. Meter-scale heterostructure printing for high-toughness fiber electrodes in intelligent digital apparel. Nat Commun 2025; 16:4320. [PMID: 40346070 PMCID: PMC12064786 DOI: 10.1038/s41467-025-59703-4] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 09/20/2024] [Accepted: 04/29/2025] [Indexed: 05/11/2025] Open
Abstract
Intelligent digital apparel, which integrates electronic functionalities into clothing, represents the future of healthcare and ubiquitous control in wearable devices. Realizing such apparel necessitates developing meter-scale conductive fibers with high toughness, conductivity, stable conductance under deformation, and mechanical durability. In this study, we present a heterostructure printing method capable of producing meter-scale (~50 m) biphasic conductive fibers that meet these criteria. Our approach involves encapsulating deformable liquid metal particles (LMPs) within a functionalized thermoplastic polyurethane matrix. This encapsulation induces in situ assembly of LMPs during fiber formation, creating a heterostructure that seamlessly integrates the matrix's durability with the LMPs' superior electrical performance. Unlike rigid conductive materials, deformable LMPs offer stretchability and toughness with a low gauge factor. Through precise twisting using an engineered annealing machine, multiple fiber strands are transformed into robust, electrically stable meter-scale electrodes. This advancement enhances their practicality in various intelligent digital apparel applications, such as stretchable displays, wearable healthcare systems, and digital controls.
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Affiliation(s)
- Gun-Hee Lee
- Medical Research Center, Seoul National University, Seoul, Republic of Korea
- Departments of Cogno-Mechatronics Engineering and Optics & Mechatronics Engineering, Pusan National University, Busan, Republic of Korea
| | - Yunheum Lee
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
| | - Hyeonyeob Seo
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
| | - Kyunghyun Jo
- Program of Brain and Cognitive Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
| | - Jinwook Yeo
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
| | - Semin Kim
- Graduate School of Semiconductor Technology, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
| | - Jae-Young Bae
- Department of Materials Science and Engineering, Seoul National University, Seoul, Republic of Korea
| | - Chul Kim
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
| | - Carmel Majidi
- Department of Mechanical Engineering, Carnegie Mellon University, Pittsburgh, PA, USA
| | - Jiheong Kang
- Department of Chemistry, Seoul National University, Seoul, Seoul, Republic of Korea
| | - Seung-Kyun Kang
- Department of Materials Science and Engineering, Seoul National University, Seoul, Republic of Korea
| | - Seunghwa Ryu
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
| | - Seongjun Park
- Medical Research Center, Seoul National University, Seoul, Republic of Korea.
- School of Transdisciplinary Innovations, Seoul National University, Seoul, Republic of Korea.
- Department of Biomedical Science, College of Medicine, Seoul National University, Seoul, Republic of Korea.
- Interdisciplinary Program in Bioengineering, College of Engineering, Seoul National University, Seoul, Republic of Korea.
- Department of Transdisciplinary Medicine, Seoul National University Hospital, Seoul, Republic of Korea.
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5
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Chen J, Yi D, Shen B, Zheng W. Multifunctional Liquid-Metal Composites for Electromagnetic Communication and Attenuation. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2025:e2404595. [PMID: 40326960 DOI: 10.1002/adma.202404595] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/29/2024] [Revised: 04/15/2025] [Indexed: 05/07/2025]
Abstract
Efficient and reliable information transmission is crucial in the widespread use of electronic products and wireless communication. Additionally, it is vital to address the electromagnetic interference (EMI) and radiation that arise from the communication process. In particular, the emergence of flexible electronic products has posed new hurdles for EM functional materials with flexibility and high performance. Liquid metal (LM) is an innovative EM functional material that possesses both the conductivity of metals and the fluidity to reconfigure like a liquid. These characteristics paved the way for developing novel flexible electronic devices and products. This review provides an overview of the current status and future potential of LM-based EM functional materials. It highlights the latest progress in LM-based materials for applications such as EMI shielding, EM-wave absorption, and wireless communication (antennas). Finally, the primary obstacles of LM-based EM functional materials are discussed and revealed potential directions for their advancement. Overall, the current research on LM-based EM functional materials indicates that they have great potential to promote the development of EM functional materials, thus providing new possibilities for the advancement of flexible electronic products.
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Affiliation(s)
- Jiali Chen
- Laboratory of Polymers and Composites, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, Zhejiang, 315201, China
- University of Chinese Academy of Sciences, Beijing, 100049, China
| | - Da Yi
- College of Microelectronics and Communication Engineering, Chongqing University, Chongqing, 400044, China
| | - Bin Shen
- Laboratory of Polymers and Composites, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, Zhejiang, 315201, China
- University of Chinese Academy of Sciences, Beijing, 100049, China
| | - Wenge Zheng
- Laboratory of Polymers and Composites, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, Zhejiang, 315201, China
- University of Chinese Academy of Sciences, Beijing, 100049, China
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6
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Fan Y, Shen Y, Zhang W, Zeng G, Liu T, Wang Y, Wang S, Zheng J, Hou X. Electrochemical Redox Synergism-Enhanced Liquid Metal Locomotion for Unrestricted Circuit Substrate Patterning. Angew Chem Int Ed Engl 2025; 64:e202424637. [PMID: 39948716 DOI: 10.1002/anie.202424637] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 12/16/2024] [Accepted: 02/13/2025] [Indexed: 02/26/2025]
Abstract
The critical challenge in advancing liquid metal circuits (LMCs) lies in achieving interfacial compatibility with diverse substrates while dynamically balancing fabrication efficiency and quality to ensure robust conductive stability. Here we introduce an electrochemical redox synergistic liquid metal (E-rsLM) that enables the controllable generation of diverse intermetallic bond transition layers (Cu, Au, or Fe-based) between liquid metal and unrestricted substrate surfaces, applicable in pH-universal electrolytes. It involves enhanced locomotion of the liquid metal, driven by synergistic electrochemical energy transduction from cyclic changes in gallium redox states. Characterized by expansion-contraction-expansion, it enables unique self-propelled bouncing, tuning spreading speed (up to ~26.8 mm/s) and elongation rate (up to 1192 %) with a volume of only 80 μL. Additionally, we demonstrate the adaptability of E-rsLM fabrication across 30 different substrates, highlighting its versatility. The patterning displays the superimposed efficiency and self-indicated quality, leading to superior conductivity (with time-cost savings of 30.7 % and 13.4 % in heating-cooling cycles, and a nearly 90 % reduction in output resistance). The practical viability of these circuits is further showcased by the assembly of integrated circuits, marking a significant step in expanding LMCs applications beyond laboratory-scale prototypes.
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Affiliation(s)
- Yi Fan
- State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005, China
- Gating Inspired Future Technology Co., Ltd., Xiamen, 361005, China
| | - Yigang Shen
- State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005, China
- Machinery and Smart Structure, Research Center for Micro-Nano Device and System, College of Engineering, Zhejiang Normal University, Jinhua, 321004, China
| | - Wenli Zhang
- State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005, China
| | - Guochao Zeng
- State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005, China
| | - Tete Liu
- State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005, China
| | - Yilan Wang
- State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005, China
| | - Shuli Wang
- Fujian Engineering Research Center for Solid-State Lighting, Department of Electronic Science, School of Electronic Science and Engineering, Xiamen University, Xiamen, 361005, China
| | - Jing Zheng
- State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005, China
| | - Xu Hou
- State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen, 361005, China
- Institute of Artificial Intelligence, Xiamen University, Xiamen, 361005, China
- Institute of Electrochemical Science and Engineering, Xiamen University, Xiamen, 361005, China
- Research Institute for Biomimetics and Soft Matter, Fujian Provincial Key Laboratory for Soft Functional Materials Research, College of Physical Innovation Laboratory for Sciences and Technologies of Energy Materials of Fujian Province (IKKEM), Xiamen, 361005, China
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Lee S, Jaseem SA, Atar N, Wang M, Kim JY, Zare M, Kim S, Bartlett MD, Jeong JW, Dickey MD. Connecting the Dots: Sintering of Liquid Metal Particles for Soft and Stretchable Conductors. Chem Rev 2025; 125:3551-3585. [PMID: 40036064 DOI: 10.1021/acs.chemrev.4c00850] [Citation(s) in RCA: 2] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 03/06/2025]
Abstract
This review focuses on the sintering of liquid metal particles (LMPs). Here, sintering means the partial merging or connecting of particles (or droplets) to form a network of percolated and, thus, conductive electrical pathways. LMPs are attractive materials because they can be suspended in a carrier fluid to create printable inks or distributed in an elastomer to create soft, stretchable composites. However, films and traces of LMPs are not typically conductive as fabricated due to the native oxide that forms on the surface of the particles. In the case of composites, polymers can also get between particles, making sintering more challenging. Sintering can be done via a variety of ways, such as mechanical, thermal, and chemical processing. This review discusses the mechanisms to sinter these particles, patterning techniques that use sintering, unique properties of sintered LMPs, and their practical applications in fields such as stretchable electronics, soft robotics, and active materials.
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Affiliation(s)
- Simok Lee
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea
- Department of Chemical and Biomolecular Engineering, North Carolina State University (NCSU), Raleigh, North Carolina 27606, United States
| | - Syed Ahmed Jaseem
- Department of Chemical and Biomolecular Engineering, North Carolina State University (NCSU), Raleigh, North Carolina 27606, United States
| | - Nurit Atar
- Department of Chemical and Biomolecular Engineering, North Carolina State University (NCSU), Raleigh, North Carolina 27606, United States
| | - Meixiang Wang
- Department of Chemical and Biomolecular Engineering, North Carolina State University (NCSU), Raleigh, North Carolina 27606, United States
- Key Laboratory of Bioinspired Smart Interfacial Science and Technology of Ministry of Education, School of Chemistry, Beihang University, Beijing 100191, P. R. China
| | - Jeong Yong Kim
- Department of Chemical and Biomolecular Engineering, North Carolina State University (NCSU), Raleigh, North Carolina 27606, United States
| | - Mohammadreza Zare
- Department of Chemical and Biomolecular Engineering, North Carolina State University (NCSU), Raleigh, North Carolina 27606, United States
| | - Sooyoung Kim
- Department of Chemical and Biomolecular Engineering, North Carolina State University (NCSU), Raleigh, North Carolina 27606, United States
| | - Michael D Bartlett
- Mechanical Engineering, Soft Materials and Structures Lab, Virginia Tech, Blacksburg, Virginia 24061, United States
- Macromolecules Innovation Institute, Virginia Tech, Blacksburg, Virginia 24061, United States
| | - Jae-Woong Jeong
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea
- KAIST Institute for Health Science and Technology, Daejeon 34141, Republic of Korea
- KAIST Institute for NanoCentury, Daejeon 34141, Republic of Korea
| | - Michael D Dickey
- Department of Chemical and Biomolecular Engineering, North Carolina State University (NCSU), Raleigh, North Carolina 27606, United States
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Song Y, Chen K, Chen S, Zhang L, Wang Y, Wu K, Xu C, Li B, Zhang J, Liu G, Sun J. Stretchable and adhesive bilayers for electrical interfacing. MATERIALS HORIZONS 2025; 12:1981-1991. [PMID: 39744932 DOI: 10.1039/d4mh01166j] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 03/18/2025]
Abstract
Integrated stretchable devices, containing soft modules, rigid modules, and encapsulation modules, are of potential use in implantable bioelectronics and wearable devices. However, such systems often suffer from electrical deterioration due to debonding failure at the connection between rigid and soft modules induced by severe stress concentration, limiting their practical implementation. Here, we report a highly conductive and adhesive bilayer interface that can reliably connect soft-soft modules and soft-rigid modules together by simply pressing without conductive pastes. This interface configuration features a nanoscale styrene-ethylene-butylene-styrene (SEBS) elastomer layer and a SEBS-liquid metal (LM) composite layer. The top SEBS layer enables a strong adhesion with different modules. The connections between soft-soft and soft-rigid modules can be stretched to high strains of 400% and 250%, respectively. Coupling electron tunneling through an ultrathin SEBS layer with LM particle networks in a SEBS-LM composite layer renders continuous pathways for electrical conductivity. Such a bilayer interface exhibits a strain-insensitive high conductivity (3.7 × 105 S m-1) over a wide strain range from 0 to 680%, which can be facilely fabricated in a self-organized manner by sedimentation of LM particles. We present a proof-of-concept demonstration of this bilayer interface as an electrode, interconnect, and self-solder for monitoring physiological signals.
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Affiliation(s)
- Yuli Song
- State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
| | - Kai Chen
- State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
| | - Shimeng Chen
- State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
| | - Linyuan Zhang
- School of Biomedical Engineering, The Fourth Military Medical University, Xi'an, 710032, P. R. China.
| | - Yaqiang Wang
- State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
| | - Kai Wu
- State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
| | - Canhua Xu
- School of Biomedical Engineering, The Fourth Military Medical University, Xi'an, 710032, P. R. China.
| | - Bo Li
- State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
| | - Jinyu Zhang
- State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
| | - Gang Liu
- State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
| | - Jun Sun
- State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
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9
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Kwon Y, Kim J, Kim H, Kang TW, Lee J, Jang SS, Lee Y, Yeo WH. Printed Nanomaterials for All-in-One Integrated Flexible Wearables and Bioelectronics. ACS APPLIED MATERIALS & INTERFACES 2024; 16:68016-68026. [PMID: 39586587 DOI: 10.1021/acsami.4c17939] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/27/2024]
Abstract
Recent advancements in printing technologies allow for fabricating various wearable sensors, circuits, and integrated electronics. However, most printing tools have limited ranges of handling ink viscosity, a short working distance, and a limited feature size for developing sophisticated electronics. Here, this paper introduces an all-in-one integrated wearable electronic system via multilayer, multinanomaterial printing. Versatile, high-resolution aerosol-jet printing could successfully print Cu nanoparticles, Ag nanoparticles, PEDOT:PSS, and polyimide (PI) to manufacture nanomembrane composite structures, including skin-contact electrodes and wireless circuits. The printed polymer, PEDOT:PSS deposited on the Cu, ensures biocompatibility when making direct skin contact while enhancing electrical conductivity for electrodes. A self-assembled monolayer facilitates better adhesion of Cu nanoparticles on the PI. Also, using intensive pulsed light, a photonic sintering method minimizes Cu-oxidation while avoiding thermal damage. The combined experimental and computational study shows the mechanical flexibility and reliability of the printed integrated device. With human subjects, the flexible wireless bioelectronic system demonstrates superior performance in detecting high-fidelity physiological signals on the skin, including electromyograms, electrooculograms, electrocardiograms, and motions, proving its potential applications in portable human healthcare and persistent human-machine interfaces.
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Affiliation(s)
- Youngjin Kwon
- Wearable Intelligent Systems and Healthcare Center (WISH Center), Institute for Matter and Systems, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Jongsu Kim
- Wearable Intelligent Systems and Healthcare Center (WISH Center), Institute for Matter and Systems, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Hojoong Kim
- George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- Korea KIAT-Georgia Tech Semiconductor Electronics Center (K-GTSEC), Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Tae Woog Kang
- Wearable Intelligent Systems and Healthcare Center (WISH Center), Institute for Matter and Systems, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Jimin Lee
- Wearable Intelligent Systems and Healthcare Center (WISH Center), Institute for Matter and Systems, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Seung Soon Jang
- Wearable Intelligent Systems and Healthcare Center (WISH Center), Institute for Matter and Systems, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
| | - Yongkuk Lee
- Department of Biomedical Engineering, Wichita State University, Wichita, Kansas 67260, United States
| | - Woon-Hong Yeo
- Wearable Intelligent Systems and Healthcare Center (WISH Center), Institute for Matter and Systems, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- Korea KIAT-Georgia Tech Semiconductor Electronics Center (K-GTSEC), Georgia Institute of Technology, Atlanta, Georgia 30332, United States
- Wallace H. Coulter Department of Biomedical Engineering, Georgia Institute of Technology and Emory University School of Medicine, Atlanta, Georgia 30332, United States
- Parker H. Petit Institute for Bioengineering and Biosciences, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
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10
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Li D, Cui T, Xu Z, Xu S, Dong Z, Tao L, Liu H, Yang Y, Ren TL. Designs and Applications for the Multimodal Flexible Hybrid Epidermal Electronic Systems. RESEARCH (WASHINGTON, D.C.) 2024; 7:0424. [PMID: 39130493 PMCID: PMC11310101 DOI: 10.34133/research.0424] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 04/28/2024] [Accepted: 06/17/2024] [Indexed: 08/13/2024]
Abstract
Research on the flexible hybrid epidermal electronic system (FHEES) has attracted considerable attention due to its potential applications in human-machine interaction and healthcare. Through material and structural innovations, FHEES combines the advantages of traditional stiff electronic devices and flexible electronic technology, enabling it to be worn conformally on the skin while retaining complex system functionality. FHEESs use multimodal sensing to enhance the identification accuracy of the wearer's motion modes, intentions, or health status, thus realizing more comprehensive physiological signal acquisition. However, the heterogeneous integration of soft and stiff components makes balancing comfort and performance in designing and implementing multimodal FHEESs challenging. Herein, multimodal FHEESs are first introduced in 2 types based on their different system structure: all-in-one and assembled, reflecting totally different heterogeneous integration strategies. Characteristics and the key design issues (such as interconnect design, interface strategy, substrate selection, etc.) of the 2 multimodal FHEESs are emphasized. Besides, the applications and advantages of the 2 multimodal FHEESs in recent research have been presented, with a focus on the control and medical fields. Finally, the prospects and challenges of the multimodal FHEES are discussed.
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Affiliation(s)
- Ding Li
- School of Integrated Circuit,
Tsinghua University, Beijing, China
| | - Tianrui Cui
- School of Integrated Circuit,
Tsinghua University, Beijing, China
| | - Zigan Xu
- School of Integrated Circuit,
Tsinghua University, Beijing, China
| | - Shuoyan Xu
- School of Integrated Circuit,
Tsinghua University, Beijing, China
| | - Zirui Dong
- School of Integrated Circuit,
Tsinghua University, Beijing, China
| | - Luqi Tao
- Beijing National Research Center for Information Science and Technology (BNRist),
Tsinghua University, Beijing, China
| | - Houfang Liu
- Beijing National Research Center for Information Science and Technology (BNRist),
Tsinghua University, Beijing, China
| | - Yi Yang
- School of Integrated Circuit,
Tsinghua University, Beijing, China
- Beijing National Research Center for Information Science and Technology (BNRist),
Tsinghua University, Beijing, China
| | - Tian-Ling Ren
- School of Integrated Circuit,
Tsinghua University, Beijing, China
- Beijing National Research Center for Information Science and Technology (BNRist),
Tsinghua University, Beijing, China
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11
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Krisnadi F, Kim S, Im S, Chacko D, Vong MH, Rykaczewski K, Park S, Dickey MD. Printable Liquid Metal Foams That Grow When Watered. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024; 36:e2308862. [PMID: 38252810 DOI: 10.1002/adma.202308862] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/30/2023] [Revised: 11/30/2023] [Indexed: 01/24/2024]
Abstract
Pastes and "foams" containing liquid metal (LM) as the continuous phase (liquid metal foams, LMFs) exhibit metallic properties while displaying paste or putty-like rheological behavior. These properties enable LMFs to be patterned into soft and stretchable electrical and thermal conductors through processes conducted at room temperature, such as printing. The simplest LMFs, featured in this work, are made by stirring LM in air, thereby entraining oxide-lined air "pockets" into the LM. Here, it is reported that mixing small amounts of water (as low as 1 wt%) into such LMFs gives rise to significant foaming by harnessing known reactions that evolve hydrogen and produce oxides. The resulting structures can be ≈4-5× their original volume and possess a fascinating combination of attributes: porosity, electrical conductivity, and responsiveness to environmental conditions. This expansion can be utilized for a type of 4D printing in which patterned conductors "grow," fill cavities, and change shape and density with respect to time. Excessive exposure to water in the long term ultimately consumes the metal in the LMF. However, when exposure to water is controlled, the metallic properties of porous LMFs can be preserved.
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Affiliation(s)
- Febby Krisnadi
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC, 27695, USA
| | - Seoyeon Kim
- Department of Nano Convergence Engineering, Jeonbuk National University, Jeonju, 54896, South Korea
| | - Sooik Im
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC, 27695, USA
| | - Dennis Chacko
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC, 27695, USA
| | - Man Hou Vong
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC, 27695, USA
| | - Konrad Rykaczewski
- School for Engineering of Matter, Transport and Energy, Arizona State University, Tempe, AZ, 85287, USA
| | - Sungjune Park
- School of Chemical Engineering, Sungkyunkwan University, Suwon, 16419, South Korea
| | - Michael D Dickey
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, NC, 27695, USA
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12
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Wang X, Qi H, Shao Y, Zhao M, Chen H, Chen Y, Ying Y, Wang Y. Extrusion Printing of Surface-Functionalized Metal-Organic Framework Inks for a High-Performance Wearable Volatile Organic Compound Sensor. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2024; 11:e2400207. [PMID: 38655847 PMCID: PMC11220709 DOI: 10.1002/advs.202400207] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/07/2024] [Revised: 04/11/2024] [Indexed: 04/26/2024]
Abstract
Wearable sensors hold immense potential for real-time and non-destructive sensing of volatile organic compounds (VOCs), requiring both efficient sensing performance and robust mechanical properties. However, conventional colorimetric sensor arrays, acting as artificial olfactory systems for highly selective VOC profiling, often fail to meet these requirements simultaneously. Here, a high-performance wearable sensor array for VOC visual detection is proposed by extrusion printing of hybrid inks containing surface-functionalized sensing materials. Surface-modified hydrophobic polydimethylsiloxane (PDMS) improves the humidity resistance and VOC sensitivity of PDMS-coated dye/metal-organic frameworks (MOFs) composites. It also enhances their dispersion within liquid PDMS matrix, thereby promoting the hybrid liquid as high-quality extrusion-printing inks. The inks enable direct and precise printing on diverse substrates, forming a uniform and high particle-loading (70 wt%) film. The printed film on a flexible PDMS substrate demonstrates satisfactory flexibility and stretchability while retaining excellent sensing performance from dye/MOFs@PDMS particles. Further, the printed sensor array exhibits enhanced sensitivity to sub-ppm VOC levels, remarkable resistance to high relative humidity (RH) of 90%, and the differentiation ability for eight distinct VOCs. Finally, the wearable sensor proves practical by in situ monitoring of wheat scab-related VOC biomarkers. This study presents a versatile strategy for designing effective wearable gas sensors with widespread applications.
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Affiliation(s)
- Xiao Wang
- School of Biosystems Engineering and Food ScienceZhejiang UniversityHangzhou310058P. R. China
- Key Laboratory of Intelligent Equipment and Robotics for Agriculture of Zhejiang ProvinceHangzhou310058P. R. China
| | - Hao Qi
- State Key Laboratory of Rice BiologyZhejiang UniversityHangzhou310058P. R. China
- Key Laboratory of Molecular Biology of Crop Pathogens and Insects, Institute of BiotechnologyZhejiang UniversityHangzhou310058P. R. China
| | - Yuzhou Shao
- School of Biosystems Engineering and Food ScienceZhejiang UniversityHangzhou310058P. R. China
- Key Laboratory of Intelligent Equipment and Robotics for Agriculture of Zhejiang ProvinceHangzhou310058P. R. China
| | - Mingming Zhao
- School of Biosystems Engineering and Food ScienceZhejiang UniversityHangzhou310058P. R. China
- Key Laboratory of Intelligent Equipment and Robotics for Agriculture of Zhejiang ProvinceHangzhou310058P. R. China
| | - Huayun Chen
- School of Biosystems Engineering and Food ScienceZhejiang UniversityHangzhou310058P. R. China
- Key Laboratory of Intelligent Equipment and Robotics for Agriculture of Zhejiang ProvinceHangzhou310058P. R. China
| | - Yun Chen
- State Key Laboratory of Rice BiologyZhejiang UniversityHangzhou310058P. R. China
- Key Laboratory of Molecular Biology of Crop Pathogens and Insects, Institute of BiotechnologyZhejiang UniversityHangzhou310058P. R. China
| | - Yibin Ying
- School of Biosystems Engineering and Food ScienceZhejiang UniversityHangzhou310058P. R. China
- Key Laboratory of Intelligent Equipment and Robotics for Agriculture of Zhejiang ProvinceHangzhou310058P. R. China
- ZJU‐Hangzhou Global Scientific and Technological Innovation CenterHangzhou310058P. R. China
| | - Yixian Wang
- School of Biosystems Engineering and Food ScienceZhejiang UniversityHangzhou310058P. R. China
- Key Laboratory of Intelligent Equipment and Robotics for Agriculture of Zhejiang ProvinceHangzhou310058P. R. China
- ZJU‐Hangzhou Global Scientific and Technological Innovation CenterHangzhou310058P. R. China
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13
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Ragisha CM, Habeeb NM, Grace VL, Varanakkottu SN. Moving Meniscus-Assisted Template-Free Optothermofluidic Nanoparticle Patterning and Its Application in Optothermoconvective Particle Trapping. LANGMUIR : THE ACS JOURNAL OF SURFACES AND COLLOIDS 2024; 40:12276-12287. [PMID: 38828930 DOI: 10.1021/acs.langmuir.4c01442] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/05/2024]
Abstract
Moving meniscus-assisted vertical lifting is a commonly employed particle assembly technique to realize large-area particle patterning for the easy fabrication of colloidal photonic crystals and sensors. Though great success has been achieved for large-area patterning, inscribing desired patterns over the target substrate with precise control over the morphology remains a challenge. The target substrates need to be functionalized (physically or chemically) to realize desired patterns, which increases the complexity and limits their applicability to specific particle-liquid combinations. We demonstrate a new approach for the precise patterning of gold nanoparticles (Au NPs, diameter ∼60 nm) over solid substrates by the synergy of light-induced Marangoni flow and vertical lifting process (moving meniscus), without the requirement of photomasks or templates. The core idea relies on the particle accumulation due to light-induced Marangoni flow near the liquid meniscus in contact with a solid surface (due to plasmonic absorption of the particles) and the controlled lifting of the substrate. We present both the simulation and experimental results of the developed patterning technique. Various patterns such as continuous lines, intermittent lines with varying lengths, patterns with continuously varying widths, cross patterns, etc. are successfully inscribed. Dynamic control over the three-dimensional morphology of the deposited patterns is achieved by varying the lifting velocity, laser irradiation time, and lifting direction during the inscription process. Finally, we show the applicability of the developed plasmonically active surface for the large-area parallel manipulation of nonabsorbing microparticles based on optothermoconvective flow. The major advantage of the developed method compared to the existing light-controlled patterning techniques is its ability to inscribe patterns over large distances (up to several centimeters). We expect that the results presented in this paper will benefit different applications requiring precise particle patterning, such as optical elements, sensors, plasmonic substrates, microfluidic master templates, and electronic circuits.
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Affiliation(s)
- Chetteente Meethal Ragisha
- Optofluidics and Interface Science Laboratory, Department of Physics, National Institute of Technology Calicut, Kozhikode, Kerala 673601, India
| | - Nihal Muhammed Habeeb
- Optofluidics and Interface Science Laboratory, Department of Physics, National Institute of Technology Calicut, Kozhikode, Kerala 673601, India
| | - Vijayan Lija Grace
- Optofluidics and Interface Science Laboratory, Department of Physics, National Institute of Technology Calicut, Kozhikode, Kerala 673601, India
| | - Subramanyan Namboodiri Varanakkottu
- Optofluidics and Interface Science Laboratory, Department of Physics, National Institute of Technology Calicut, Kozhikode, Kerala 673601, India
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14
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Liu Q, Yu Z, Zhang B. Tackling the Challenges of Aqueous Zn-Ion Batteries via Polymer-Derived Strategies. SMALL METHODS 2024; 8:e2300255. [PMID: 37417207 DOI: 10.1002/smtd.202300255] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/27/2023] [Revised: 05/30/2023] [Indexed: 07/08/2023]
Abstract
Zn-ion batteries (ZIBs) have gathered unprecedented interest recently benefiting from their intrinsic safety, affordability, and environmental benignity. Nevertheless, their practical implementation is hampered by low rate performance, inferior Zn2+ diffusion kinetics, and undesired parasitic reactions. Innovative solutions are put forth to address these issues by optimizing the electrodes, separators, electrolytes, and interfaces. Remarkably, polymers with inherent properties of low-density, high processability, structural flexibility, and superior stability show great promising in tackling the challenges. Herein, the recent progress in the synthesis and customization of functional polymers in aqueous ZIBs is outlined. The recent implementations of polymers into each component are summarized, with a focus on the inherent mechanisms underlying their unique functions. The challenges of incorporating polymers into practical ZIBs are also discussed and possible solutions to circumvent them are proposed. It is hoped that such a deep analysis could accelerate the design of polymer-derived approaches to boost the performance of ZIBs and other aqueous battery systems as they share similarities in many aspects.
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Affiliation(s)
- Qun Liu
- Department of Applied Physics and Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hung Hom, Hong Kong, 999077, China
| | - Zhenlu Yu
- Department of Applied Physics and Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hung Hom, Hong Kong, 999077, China
| | - Biao Zhang
- Department of Applied Physics and Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hung Hom, Hong Kong, 999077, China
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15
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Lee JH, Hyun JE, Kim J, Yang J, Zhang H, Ahn H, Lee S, Kim JH, Lim T. A highly conductive, robust, self-healable, and thermally responsive liquid metal-based hydrogel for reversible electrical switches. J Mater Chem B 2024; 12:5238-5247. [PMID: 38699788 DOI: 10.1039/d4tb00209a] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 05/05/2024]
Abstract
This study introduces a thermally responsive smart hydrogel with enhanced electrical properties achieved through volume switching. This advancement was realized by incorporating multiscale liquid metal particles (LMPs) into the PNIPAM hydrogel during polymerization, using their inherent elasticity and conductivity when deswelled. Unlike traditional conductive additives, LMPs endow the PNIPAM hydrogel with a remarkably consistent volume switching ratio, significantly enhancing electrical switching. This is attributed to the minimal nucleation effect of LMPs during polymerization and their liquid-like behavior, like vacancies in the polymeric hydrogel under compression. The PNIPAM/LMP hydrogel exhibits the highest electrical switching, with an unprecedented switch of 6.1 orders of magnitude. Even after repeated swelling/deswelling cycles that merge some LMPs and increase the conductivity when swelled, the hydrogel consistently maintains an electrical switch exceeding 4.5 orders of magnitude, which is still the highest record to date. Comprehensive measurements reveal that the hydrogel possesses robust mechanical properties, a tissue-like compression modulus, biocompatibility, and self-healing capabilities. These features make the PNIPAM/LMP hydrogel an ideal candidate for long-term implantable bioelectronics, offering a solution to the mechanical mismatch with dynamic human tissues.
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Affiliation(s)
- Joo Hyung Lee
- The Research Institute of Industrial Science, Hanyang University, Seoul 04763, South Korea
| | - Ji Eun Hyun
- Department of Organic and Nano Engineering, Hanyang University, Seoul 04763, South Korea
| | - Jongbeom Kim
- Department of Materials Science and Engineering, Seoul National University, Seoul 08826, South Korea
| | - Jungin Yang
- Division of Chemical Engineering and Bioengineering, Kangwon National University, Chuncheon, Gangwon-do 24341, South Korea.
| | - Huanan Zhang
- Department of Chemical Engineering, University of Utah, Salt Lake City, Utah 84112, USA
| | - Hyunchul Ahn
- Department of Fiber System Engineering, Yeungnam University, Gyeongsan, Gyeongsangbuk-do 38541, South Korea.
| | - Sohee Lee
- Department of Clothing and Textiles, Gyeongsang National University, Jinju, Gyeongsangnam-do 52828, South Korea.
| | - Jung Han Kim
- Department of Materials Science and Engineering, Dong-A University, Busan 49315, South Korea.
| | - Taehwan Lim
- Division of Chemical Engineering and Bioengineering, Kangwon National University, Chuncheon, Gangwon-do 24341, South Korea.
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16
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Muller B, Feig VR, Colella NS, Traverso G, Hashmi SM. Thiol Coordination Softens Liquid Metal Particles To Improve On-Demand Conductivity. ACS NANO 2024; 18:13768-13780. [PMID: 38745441 PMCID: PMC11140741 DOI: 10.1021/acsnano.4c01988] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 02/09/2024] [Revised: 04/24/2024] [Accepted: 05/02/2024] [Indexed: 05/16/2024]
Abstract
Achieving tunable rupturing of eutectic gallium indium (EGaIn) particles holds great significance in flexible electronic applications, particularly pressure sensors. We tune the mechanosensitivity of EGaIn particles by preparing them in toluene with thiol surfactants and demonstrate an improvement over typical preparations in ethanol. We observe, across multiple length scales, that thiol surfactants and the nonpolar solvent synergistically reduce the applied stress requirements for electromechanical actuation. At the nanoscale, dodecanethiol and propanethiol in toluene suppress gallium oxide growth, as characterized by transmission electron microscopy and X-ray photoelectron spectroscopy. Quantitative AFM imaging produces force-indentation curves and height images, while conductive AFM measures current while probing individual EGaIn particles. As the applied force increases, thiolated particles demonstrate intensified softening, rupturing, and stress-induced electrical activation at forces 40% lower than those for bare particles in ethanol. To confirm that thiolation facilitates rupturing at the macroscale, a laser is used to ablate samples of EGaIn particles. Scanning electron microscopy and resistance measurements across macroscopic samples confirm that thiolated EGaIn particles coalesce to exhibit electrical activation at 0.1 W. Particles prepared in ethanol, however, require 3 times higher laser power to demonstrate a similar behavior. This unique collection of advanced techniques demonstrates that our particle synthesis conditions can facilitate on-demand functionality to benefit electronic applications.
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Affiliation(s)
- Benjamin
N. Muller
- Department
of Chemistry and Chemical Biology, Northeastern
University, Boston, Massachusetts 02115, United States
- Division
of Gastroenterology, Hepatology and Endoscopy, Brigham and Women’s
Hospital, Harvard Medical School, Boston, Massachusetts 02115, United States
- David
H. Koch Institute for Integrative Cancer Research, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States
| | - Vivian R. Feig
- Division
of Gastroenterology, Hepatology and Endoscopy, Brigham and Women’s
Hospital, Harvard Medical School, Boston, Massachusetts 02115, United States
- David
H. Koch Institute for Integrative Cancer Research, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States
| | - Nicholas S. Colella
- Center
for Nanoscale Systems, Harvard University, Cambridge, Massachusetts 02138, United States
| | - Giovanni Traverso
- Division
of Gastroenterology, Hepatology and Endoscopy, Brigham and Women’s
Hospital, Harvard Medical School, Boston, Massachusetts 02115, United States
- David
H. Koch Institute for Integrative Cancer Research, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States
- Department
of Mechanical Engineering, Massachusetts
Institute of Technology, Cambridge, Massachusetts 02139, United States
| | - Sara M. Hashmi
- Department
of Chemistry and Chemical Biology, Northeastern
University, Boston, Massachusetts 02115, United States
- Department
of Chemical Engineering, Northeastern University, Boston, Massachusetts 02115, United States
- Department
of Mechanical and Industrial Engineering, Northeastern University, Boston, Massachusetts 02115, United States
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17
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Li X, Hou K, Long Y, Song K. LM-Gel Plasticine Based on Binary Cooperative with Kneadable Shaping and Conductivity. ACS APPLIED MATERIALS & INTERFACES 2024. [PMID: 38711229 DOI: 10.1021/acsami.4c03471] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/08/2024]
Abstract
Liquid metal (LM)-based polymers have received growing interest for wearable health monitoring, electronic skins, and soft robotics. However, fabricating multifunctional LM-based polymers, in particular, featuring a convenient shaping ability while offering excellent deformability and conductivity remains a challenge. To overcome this obstacle, here, we propose a strategy to prepare LM-Gel "plasticine" (LGP) with great deformability, which is composed of a PVA (poly(vinyl alcohol)) soft network and an LM conductive phase. LGP can be easily constructed into different shapes such as plasticine and can be applied to different conditions (such as building a 3D circuit, circuit repair, and switch). Meanwhile, LGP has great conductivity (2.3 × 104 S/m) after surface annealing. Besides, LGP has a good electric heating performance, which shows the potential for application in wearable heating devices. Thus, this approach not only provides a way to prepare LM-polymer plasticine but also provides a novel perspective toward extending the applied range of LM-polymer composites.
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Affiliation(s)
- Xingchao Li
- Key Laboratory of Bio-Inspired Materials and Interfacial Science, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, P. R. China
- School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Kai Hou
- Key Laboratory of Bio-Inspired Materials and Interfacial Science, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, P. R. China
| | - Yue Long
- Key Laboratory of Bio-Inspired Materials and Interfacial Science, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, P. R. China
- Binzhou Institute of Technology, Weiqiao-UCAS Science and Technology Park, Binzhou City 256606, Shandong, P. R. China
| | - Kai Song
- Key Laboratory of Bio-Inspired Materials and Interfacial Science, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, P. R. China
- School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
- Binzhou Institute of Technology, Weiqiao-UCAS Science and Technology Park, Binzhou City 256606, Shandong, P. R. China
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18
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Papani R, Li Y, Wang S. Soft mechanical sensors for wearable and implantable applications. WILEY INTERDISCIPLINARY REVIEWS. NANOMEDICINE AND NANOBIOTECHNOLOGY 2024; 16:e1961. [PMID: 38723798 PMCID: PMC11108230 DOI: 10.1002/wnan.1961] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/24/2023] [Revised: 04/04/2024] [Accepted: 04/07/2024] [Indexed: 05/23/2024]
Abstract
Wearable and implantable sensing of biomechanical signals such as pressure, strain, shear, and vibration can enable a multitude of human-integrated applications, including on-skin monitoring of vital signs, motion tracking, monitoring of internal organ condition, restoration of lost/impaired mechanoreception, among many others. The mechanical conformability of such sensors to the human skin and tissue is critical to enhancing their biocompatibility and sensing accuracy. As such, in the recent decade, significant efforts have been made in the development of soft mechanical sensors. To satisfy the requirements of different wearable and implantable applications, such sensors have been imparted with various additional properties to make them better suited for the varied contexts of human-integrated applications. In this review, focusing on the four major types of soft mechanical sensors for pressure, strain, shear, and vibration, we discussed the recent material and device design innovations for achieving several important properties, including flexibility and stretchability, bioresorbability and biodegradability, self-healing properties, breathability, transparency, wireless communication capabilities, and high-density integration. We then went on to discuss the current research state of the use of such novel soft mechanical sensors in wearable and implantable applications, based on which future research needs were further discussed. This article is categorized under: Diagnostic Tools > Biosensing Diagnostic Tools > Diagnostic Nanodevices Implantable Materials and Surgical Technologies > Nanomaterials and Implants.
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Affiliation(s)
- Rithvik Papani
- Pritzker School of Molecular Engineering, The University of Chicago, Chicago, Illinois, USA
| | - Yang Li
- Pritzker School of Molecular Engineering, The University of Chicago, Chicago, Illinois, USA
| | - Sihong Wang
- Pritzker School of Molecular Engineering, The University of Chicago, Chicago, Illinois, USA
- Nanoscience and Technology Division and Center for Molecular Engineering, Argonne National Laboratory, Lemont, Illinois, United States
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19
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Li H, Tan P, Rao Y, Bhattacharya S, Wang Z, Kim S, Gangopadhyay S, Shi H, Jankovic M, Huh H, Li Z, Maharjan P, Wells J, Jeong H, Jia Y, Lu N. E-Tattoos: Toward Functional but Imperceptible Interfacing with Human Skin. Chem Rev 2024; 124:3220-3283. [PMID: 38465831 DOI: 10.1021/acs.chemrev.3c00626] [Citation(s) in RCA: 8] [Impact Index Per Article: 8.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 03/12/2024]
Abstract
The human body continuously emits physiological and psychological information from head to toe. Wearable electronics capable of noninvasively and accurately digitizing this information without compromising user comfort or mobility have the potential to revolutionize telemedicine, mobile health, and both human-machine or human-metaverse interactions. However, state-of-the-art wearable electronics face limitations regarding wearability and functionality due to the mechanical incompatibility between conventional rigid, planar electronics and soft, curvy human skin surfaces. E-Tattoos, a unique type of wearable electronics, are defined by their ultrathin and skin-soft characteristics, which enable noninvasive and comfortable lamination on human skin surfaces without causing obstruction or even mechanical perception. This review article offers an exhaustive exploration of e-tattoos, accounting for their materials, structures, manufacturing processes, properties, functionalities, applications, and remaining challenges. We begin by summarizing the properties of human skin and their effects on signal transmission across the e-tattoo-skin interface. Following this is a discussion of the materials, structural designs, manufacturing, and skin attachment processes of e-tattoos. We classify e-tattoo functionalities into electrical, mechanical, optical, thermal, and chemical sensing, as well as wound healing and other treatments. After discussing energy harvesting and storage capabilities, we outline strategies for the system integration of wireless e-tattoos. In the end, we offer personal perspectives on the remaining challenges and future opportunities in the field.
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Affiliation(s)
- Hongbian Li
- Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Philip Tan
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Yifan Rao
- Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Sarnab Bhattacharya
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Zheliang Wang
- Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Sangjun Kim
- Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Susmita Gangopadhyay
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Hongyang Shi
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Matija Jankovic
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Heeyong Huh
- Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Zhengjie Li
- Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Pukar Maharjan
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Jonathan Wells
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Hyoyoung Jeong
- Department of Electrical and Computer Engineering, University of California Davis, Davis, California 95616, United States
| | - Yaoyao Jia
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Nanshu Lu
- Department of Aerospace Engineering and Engineering Mechanics, The University of Texas at Austin, Austin, Texas 78712, United States
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Department of Biomedical Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States
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20
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Qi J, Yang S, Jiang Y, Cheng J, Wang S, Rao Q, Jiang X. Liquid Metal-Polymer Conductor-Based Conformal Cyborg Devices. Chem Rev 2024; 124:2081-2137. [PMID: 38393351 DOI: 10.1021/acs.chemrev.3c00317] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 02/25/2024]
Abstract
Gallium-based liquid metal (LM) exhibits exceptional properties such as high conductivity and biocompatibility, rendering it highly valuable for the development of conformal bioelectronics. When combined with polymers, liquid metal-polymer conductors (MPC) offer a versatile platform for fabricating conformal cyborg devices, enabling functions such as sensing, restoration, and augmentation within the human body. This review focuses on the synthesis, fabrication, and application of MPC-based cyborg devices. The synthesis of functional materials based on LM and the fabrication techniques for MPC-based devices are elucidated. The review provides a comprehensive overview of MPC-based cyborg devices, encompassing their applications in sensing diverse signals, therapeutic interventions, and augmentation. The objective of this review is to serve as a valuable resource that bridges the gap between the fabrication of MPC-based conformal devices and their potential biomedical applications.
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Affiliation(s)
- Jie Qi
- Shenzhen Key Laboratory of Smart Healthcare Engineering, Guangdong Provincial Key Laboratory of Advanced Biomaterials, Department of Biomedical Engineering. Southern University of Science and Technology, No. 1088, Xueyuan Rd, Xili, Nanshan District, Shenzhen, Guangdong 518055, P. R. China
- Guangzhou Municipal and Guangdong Provincial Key Laboratory of Molecular Target & Clinical Pharmacology, the NMPA and State Key Laboratory of Respiratory Disease, School of Pharmaceutical Sciences and the Fifth Affiliated Hospital, Guangzhou Medical University, Guangzhou, Guangdong 511436, P. R. China
| | - Shuaijian Yang
- Shenzhen Key Laboratory of Smart Healthcare Engineering, Guangdong Provincial Key Laboratory of Advanced Biomaterials, Department of Biomedical Engineering. Southern University of Science and Technology, No. 1088, Xueyuan Rd, Xili, Nanshan District, Shenzhen, Guangdong 518055, P. R. China
| | - Yizhou Jiang
- Shenzhen Key Laboratory of Smart Healthcare Engineering, Guangdong Provincial Key Laboratory of Advanced Biomaterials, Department of Biomedical Engineering. Southern University of Science and Technology, No. 1088, Xueyuan Rd, Xili, Nanshan District, Shenzhen, Guangdong 518055, P. R. China
- State Key Laboratory of Cardiovascular Disease, Fuwai Hospital, National Center for Cardiovascular Diseases, Chinese Academy of Medical Sciences and Peking Union Medical College, Beijing 100037, P. R. China
| | - Jinhao Cheng
- Shenzhen Key Laboratory of Smart Healthcare Engineering, Guangdong Provincial Key Laboratory of Advanced Biomaterials, Department of Biomedical Engineering. Southern University of Science and Technology, No. 1088, Xueyuan Rd, Xili, Nanshan District, Shenzhen, Guangdong 518055, P. R. China
| | - Saijie Wang
- Shenzhen Key Laboratory of Smart Healthcare Engineering, Guangdong Provincial Key Laboratory of Advanced Biomaterials, Department of Biomedical Engineering. Southern University of Science and Technology, No. 1088, Xueyuan Rd, Xili, Nanshan District, Shenzhen, Guangdong 518055, P. R. China
| | - Qingyan Rao
- Shenzhen Key Laboratory of Smart Healthcare Engineering, Guangdong Provincial Key Laboratory of Advanced Biomaterials, Department of Biomedical Engineering. Southern University of Science and Technology, No. 1088, Xueyuan Rd, Xili, Nanshan District, Shenzhen, Guangdong 518055, P. R. China
| | - Xingyu Jiang
- Shenzhen Key Laboratory of Smart Healthcare Engineering, Guangdong Provincial Key Laboratory of Advanced Biomaterials, Department of Biomedical Engineering. Southern University of Science and Technology, No. 1088, Xueyuan Rd, Xili, Nanshan District, Shenzhen, Guangdong 518055, P. R. China
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21
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Kwon DA, Lee S, Kim CY, Kang I, Park S, Jeong JW. Body-temperature softening electronic ink for additive manufacturing of transformative bioelectronics via direct writing. SCIENCE ADVANCES 2024; 10:eadn1186. [PMID: 38416839 PMCID: PMC10901467 DOI: 10.1126/sciadv.adn1186] [Citation(s) in RCA: 11] [Impact Index Per Article: 11.0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/23/2023] [Accepted: 01/29/2024] [Indexed: 03/01/2024]
Abstract
Mechanically transformative electronic systems (TESs) built using gallium have emerged as an innovative class of electronics due to their ability to switch between rigid and flexible states, thus expanding the versatility of electronics. However, the challenges posed by gallium's high surface tension and low viscosity have substantially hindered manufacturability, limiting high-resolution patterning of TESs. To address this challenge, we introduce a stiffness-tunable gallium-copper composite ink capable of direct ink write printing of intricate TES circuits, offering high-resolution (~50 micrometers) patterning, high conductivity, and bidirectional soft-rigid convertibility. These features enable transformative bioelectronics with design complexity akin to traditional printed circuit boards. These TESs maintain rigidity at room temperature for easy handling but soften and conform to curvilinear tissue surfaces at body temperature, adapting to dynamic tissue deformations. The proposed ink with direct ink write printing makes TES manufacturing simple and versatile, opening possibilities in wearables, implantables, consumer electronics, and robotics.
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Affiliation(s)
- Do A Kwon
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Simok Lee
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Choong Yeon Kim
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Inho Kang
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Steve Park
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
- KAIST Institute for Health Science and Technology, Daejeon 34141, Republic of Korea
| | - Jae-Woong Jeong
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
- KAIST Institute for Health Science and Technology, Daejeon 34141, Republic of Korea
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22
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Sakorikar T, Mihaliak N, Krisnadi F, Ma J, Kim TI, Kong M, Awartani O, Dickey MD. A Guide to Printed Stretchable Conductors. Chem Rev 2024; 124:860-888. [PMID: 38291556 DOI: 10.1021/acs.chemrev.3c00569] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 02/01/2024]
Abstract
Printing of stretchable conductors enables the fabrication and rapid prototyping of stretchable electronic devices. For such applications, there are often specific process and material requirements such as print resolution, maximum strain, and electrical/ionic conductivity. This review highlights common printing methods and compatible inks that produce stretchable conductors. The review compares the capabilities, benefits, and limitations of each approach to help guide the selection of a suitable process and ink for an intended application. We also discuss methods to design and fabricate ink composites with the desired material properties (e.g., electrical conductance, viscosity, printability). This guide should help inform ongoing and future efforts to create soft, stretchable electronic devices for wearables, soft robots, e-skins, and sensors.
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Affiliation(s)
- Tushar Sakorikar
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Nikolas Mihaliak
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Febby Krisnadi
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Jinwoo Ma
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Tae-Il Kim
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
- School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, Gyeonggi 16419, South Korea
| | - Minsik Kong
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
- Department of Materials Science and Engineering, Pohang University of Science and Technology (POSTECH), Pohang, 37673, Republic of Korea
| | - Omar Awartani
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Michael D Dickey
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
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23
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Park H, Kim DC. Structural and Material-Based Approaches for the Fabrication of Stretchable Light-Emitting Diodes. MICROMACHINES 2023; 15:66. [PMID: 38258185 PMCID: PMC10821428 DOI: 10.3390/mi15010066] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/03/2023] [Revised: 12/22/2023] [Accepted: 12/27/2023] [Indexed: 01/24/2024]
Abstract
Stretchable displays, capable of freely transforming their shapes, have received significant attention as alternatives to conventional rigid displays, and they are anticipated to provide new opportunities in various human-friendly electronics applications. As a core component of stretchable displays, high-performance stretchable light-emitting diodes (LEDs) have recently emerged. The approaches to fabricate stretchable LEDs are broadly categorized into two groups, namely "structural" and "material-based" approaches, based on the mechanisms to tolerate strain. While structural approaches rely on specially designed geometries to dissipate applied strain, material-based approaches mainly focus on replacing conventional rigid components of LEDs to soft and stretchable materials. Here, we review the latest studies on the fabrication of stretchable LEDs, which is accomplished through these distinctive strategies. First, we introduce representative device designs for efficient strain distribution, encompassing island-bridge structures, wavy buckling, and kirigami-/origami-based structures. For the material-based approaches, we discuss the latest studies for intrinsically stretchable (is-) electronic/optoelectronic materials, including the formation of conductive nanocomposite and polymeric blending with various additives. The review also provides examples of is-LEDs, focusing on their luminous performance and stretchability. We conclude this review with a brief outlook on future technologies.
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Affiliation(s)
- Hamin Park
- Department of Electronic Engineering, Kwangwoon University, 20, Gwangun-ro, Nowon-gu, Seoul 01897, Republic of Korea
| | - Dong Chan Kim
- Department of Chemical and Biological Engineering, Gachon University, 1342 Seongnam-daero, Sujeong-gu, Seongnam-si 13120, Republic of Korea
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24
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Zhu T, Wu K, Wang Y, Zhang J, Liu G, Sun J. Highly stable and strain-insensitive metal film conductors via manipulating strain distribution. MATERIALS HORIZONS 2023; 10:5920-5930. [PMID: 37873924 DOI: 10.1039/d3mh01399e] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 10/25/2023]
Abstract
Metal film-based stretchable conductors are essential elements of flexible electronics for wearable, biomedical, and robotic applications, which require strain-insensitive high conductivity over a wide strain range and excellent cyclic stability. However, they suffer from serious electrical failure under monotonic and cyclic tensile loading at a small strain due to the uncontrolled film cracking behavior. Here, we propose a novel in-plane crack control strategy of engineering hierarchical microstructures to achieve outstanding electromechanical performance via harnessing the strain distribution in metal films. The wrinkles delay the crack initiation at undercuts which should be the most vulnerable sites during the stretching process. The surface protrusions/grooves/undercuts inhibit the crack propagation because of the effective strain redistribution. In addition, hierarchical microstructures significantly improve cyclic stability due to the strong interfacial adhesion and stable crack patterns. The metal film-based conductors exhibit ultrahigh strain-insensitive conductivity (1.7 × 107 S m-1), negligible resistance change (ΔR/R0 = 0.007) over an ultra-wide strain range (>200%), and excellent cyclic strain durability (>15 000 cycles at 100% strain). A range of metal films was explored to establish the universality of this strategy, including ductile copper and silver, as well as brittle molybdenum and high entropy alloy. We demonstrate the strain-insensitive electrical functionality of a metal film-based conductor in a flexible light-emitting diode circuit.
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Affiliation(s)
- Ting Zhu
- State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
| | - Kai Wu
- State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
| | - Yaqiang Wang
- State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
| | - Jinyu Zhang
- State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
| | - Gang Liu
- State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
| | - Jun Sun
- State Key Laboratory for Mechanical Behavior of Materials, Xi'an Jiaotong University, Xi'an, 710049, P. R. China.
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25
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Ai L, Lin W, Cao C, Li P, Wang X, Lv D, Li X, Yang Z, Yao X. Tough soldering for stretchable electronics by small-molecule modulated interfacial assemblies. Nat Commun 2023; 14:7723. [PMID: 38001116 PMCID: PMC10673831 DOI: 10.1038/s41467-023-43574-8] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/05/2023] [Accepted: 11/13/2023] [Indexed: 11/26/2023] Open
Abstract
The rapid-developing soft robots and wearable devices require flexible conductive materials to maintain electric functions over a large range of deformations. Considerable efforts are made to develop stretchable conductive materials; little attention is paid to the frequent failures of integrated circuits caused by the interface mismatch of soft substrates and rigid silicon-based microelectronics. Here, we present a stretchable solder with good weldability that can strongly bond with electronic components, benefiting from the hierarchical assemblies of liquid metal particles, small-molecule modulators, and non-covalently crosslinked polymer matrix. Our self-solder shows high conductivity (>2×105 S m-1), extreme stretchability (~1000%, and >600% with chip-integrated), and high toughness (~20 MJ m-3). Additionally, the dynamic interactions within our solder's surface and interior enable a range of unique features, including ease of integration, component substitution, and circuit recyclability. With all these features, we demonstrated an application as thermoforming technology for three-dimensional (3D) conformable electronics, showing potential in reducing the complexity of microchip interfacing, as well as scalable fabrication of chip-integrated stretchable circuits and 3D electronics.
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Affiliation(s)
- Liqing Ai
- Department of Biomedical Sciences, City University of Hong Kong, Hong Kong, 999077, China
| | - Weikang Lin
- Department of Mechanical & Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong, 999077, China
- Department of Mechanical Engineering, City University of Hong Kong, Hong Kong, 999077, China
| | - Chunyan Cao
- Department of Biomedical Sciences, City University of Hong Kong, Hong Kong, 999077, China
| | - Pengyu Li
- Department of Mechanical & Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong, 999077, China
- Department of Mechanical Engineering, City University of Hong Kong, Hong Kong, 999077, China
| | - Xuejiao Wang
- Department of Biomedical Sciences, City University of Hong Kong, Hong Kong, 999077, China
| | - Dong Lv
- Department of Biomedical Sciences, City University of Hong Kong, Hong Kong, 999077, China
| | - Xin Li
- Department of Biomedical Sciences, City University of Hong Kong, Hong Kong, 999077, China
| | - Zhengbao Yang
- Department of Mechanical & Aerospace Engineering, Hong Kong University of Science and Technology, Hong Kong, 999077, China.
- Department of Mechanical Engineering, City University of Hong Kong, Hong Kong, 999077, China.
| | - Xi Yao
- Department of Biomedical Sciences, City University of Hong Kong, Hong Kong, 999077, China.
- City University of Hong Kong Shenzhen Research Institute, Shenzhen, 518000, China.
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26
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Lee GH, Lee DH, Jeon W, Yoon J, Ahn K, Nam KS, Kim M, Kim JK, Koo YH, Joo J, Jung W, Lee J, Nam J, Park S, Jeong JW, Park S. Conductance stable and mechanically durable bi-layer EGaIn composite-coated stretchable fiber for 1D bioelectronics. Nat Commun 2023; 14:4173. [PMID: 37443162 DOI: 10.1038/s41467-023-39928-x] [Citation(s) in RCA: 18] [Impact Index Per Article: 9.0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/03/2023] [Accepted: 07/04/2023] [Indexed: 07/15/2023] Open
Abstract
Deformable semi-solid liquid metal particles (LMP) have emerged as a promising substitute for rigid conductive fillers due to their excellent electrical properties and stable conductance under strain. However, achieving a compact and robust coating of LMP on fibers remains a persistent challenge, mainly due to the incompatibility of conventional coating techniques with LMP. Additionally, the limited durability and absence of initial electrical conductivity of LMP restrict their widespread application. In this study, we propose a solution process that robustly and compactly assembles mechanically durable and initially conductive LMP on fibers. Specifically, we present a shearing-based deposition of polymer-attached LMP followed by additional coating with CNT-attached LMP to create bi-layer LMP composite with exceptional durability, electrical conductivity, stretchability, and biocompatibility on various fibers. The versatility and reliability of this manufacturing strategy for 1D electronics are demonstrated through the development of sewn electrical circuits, smart clothes, stretchable biointerfaced fiber, and multifunctional fiber probes.
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Affiliation(s)
- Gun-Hee Lee
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Do Hoon Lee
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Woojin Jeon
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Jihwan Yoon
- School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, 599 Gwanak-ro, Gwanak-gu, Seoul, 08826, Republic of Korea
| | - Kwangguk Ahn
- School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, 599 Gwanak-ro, Gwanak-gu, Seoul, 08826, Republic of Korea
| | - Kum Seok Nam
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Min Kim
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Jun Kyu Kim
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Yong Hoe Koo
- Department of Biomedical Engineering, Ulsan National Institute of Science and Technology (UNIST), 50, UNIST-gil, Ulju-gun, Ulsan, 44919, Republic of Korea
| | - Jinmyoung Joo
- Department of Biomedical Engineering, Ulsan National Institute of Science and Technology (UNIST), 50, UNIST-gil, Ulju-gun, Ulsan, 44919, Republic of Korea
| | - WooChul Jung
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Jaehong Lee
- Department of Robotics and Mechatronics Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), 333 Techno Jungang-daero, Daegu, 42988, Republic of Korea
| | - Jaewook Nam
- School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, 599 Gwanak-ro, Gwanak-gu, Seoul, 08826, Republic of Korea
| | - Seongjun Park
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea.
- KAIST Institute for Health Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea.
- KAIST Institute for NanoCentury, 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea.
| | - Jae-Woong Jeong
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea.
- KAIST Institute for Health Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea.
| | - Steve Park
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea.
- KAIST Institute for Health Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea.
- KAIST Institute for NanoCentury, 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea.
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27
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Huh H, Yang X, Shin H, Lu N. A Multi-Day Wearable Surface EMG E-Tattoo for Fatigue Monitoring. ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY. IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY. ANNUAL INTERNATIONAL CONFERENCE 2023; 2023:1-4. [PMID: 38083647 DOI: 10.1109/embc40787.2023.10340880] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 12/18/2023]
Abstract
Surface electromyography (sEMG) is a commonly used technique for the non-invasive measurement of muscle activity. However, the traditional electrodes used for sEMG often have limitations regarding their long-term wearability. This study explored the feasibility of a wearable platform using a tattoo-like epidermal electrode (e-tattoo) for multi-day sEMG monitoring. Our sEMG e-tattoo provided stable and reliable sEMG signals over three days of application comparable to conventional gel electrodes. In addition, the e-tattoo has great resistance to motion artifacts and, therefore, maintains a high signal-to-noise ratio (SNR) and signal-to-motion ratio (SMR) during dynamic activities such as cycling. This robust wearable platform opens up new avenues for developing future wearable sEMG devices and advancing dynamic muscle fatigue research.Clinical relevance- The proposed wearable sEMG system can provide continuous and non-invasive monitoring of muscle activity, providing insights for improving rehabilitation and EMG-based prosthesis development for patients.
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28
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Wang S, Liu C, Liu J, Li S, Xu F, Xu D, Zhang W, Wu Y, Shang J, Liu Y, Li RW. Highly Stable Liquid Metal Conductors with Superior Electrical Stability and Tough Interface Bonding for Stretchable Electronics. ACS APPLIED MATERIALS & INTERFACES 2023; 15:22291-22300. [PMID: 37127569 DOI: 10.1021/acsami.3c03182] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/03/2023]
Abstract
Ga-based liquid metal stretchable conductors have recently gained interest in flexible electronic devices such as electrodes, antennas, and sensors. It is essential to maintain electrical stability under strain or cyclic strain for reliable data acquisition and exhibit tough interfacial bonding between liquid metal and polymers to prevent performance loss and device failure. Herein, a highly stable conductor with superior electrical stability and tough interface bonding is introduced by casting curable polymers and a peeling-activated process from liquid metal particles. Based on the compensating effect of liquid metal, similar to the recharge relationship of water between rivers and lakes in nature, the conductor is not only strain-insensitive (ΔR/R0 < 10% for 100% strain) but also immune to cyclic deformation (ΔR/R0 < 7% with 5000 stretching cycles at 50% strain). Embedding liquid metal within the elastomer to create stretchable conductors effectively improves interfacial adhesion properties (the fluid-solid interfacial adhesion force increases from 0.48 to 0.62 mN/mm2). The constructed tough interface could even withstand sonication treatment. Finally, by combining strategies in material design and fabrication, an integrated array composed of vertical interconnect access and robust electrodes is fabricated, which simultaneously holds tough interfacial bonding with the upper and lower layers.
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Affiliation(s)
- Shengding Wang
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Chao Liu
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- School of Materials Science and Chemical Engineering, Ningbo University, Ningbo 315211, People's Republic of China
| | - Jinyun Liu
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Shiying Li
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Feng Xu
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Dan Xu
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Wuxu Zhang
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Yuanzhao Wu
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Jie Shang
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Yiwei Liu
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
| | - Run-Wei Li
- CAS Key Laboratory of Magnetic Materials and Devices, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- Zhejiang Province Key Laboratory of Magnetic Materials and Application Technology, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, P. R. China
- College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, P. R. China
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29
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Sun T, Feng B, Huo J, Xiao Y, Peng J, Li Z, Wang W, Liu L, Zou G, Wang W. Switching ultra-stretchability and sensitivity in metal films for electronic skins: a pufferfish-inspired, interlayer regulation strategy. MATERIALS HORIZONS 2023. [PMID: 37067478 DOI: 10.1039/d3mh00252g] [Citation(s) in RCA: 4] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/19/2023]
Abstract
The booming development of electronic skins necessitates stretchable electrodes and flexible sensors that exhibit distinctly opposite requirements of electromechanical properties, both of which are difficult to be fulfilled on a single material. Here, a pufferfish-inspired, interlayer regulation strategy is proposed that realizes the above opposite properties in simple metal films, exhibiting either ultra-stretchability (295% strain) or sensitivity (maximum GF: ∼5500) on demand. It is revealed that the stretchability of the intrinsically strain-sensitive metal films can be improved by ∼20-fold via regulating the surface morphology of the inserted interlayer, accompanied by an intriguing transition in film cracking behavior from cut-through cracks to network patterns. By featuring these two antithetical but valuable properties, common metal films can be applied as diverse sensors and stretchable electrodes in electronic skins, showing application prospects in healthcare monitoring, human-machine interaction, and engineering services. Our proposed strategy substantially advances the application of metal film conductors in flexible electronics and broadens the horizons for developing more sophisticated electronic skins by interlayer engineering.
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Affiliation(s)
- Tianming Sun
- College of Materials Science and Engineering, Taiyuan University of Technology, Taiyuan 030024, Shanxi Province, China.
- Department of Mechanical Engineering, State Key Laboratory of Tribology, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Ministry of Education of PR China, Tsinghua University, Beijing 100084, P. R. China.
| | - Bin Feng
- Department of Mechanical Engineering, State Key Laboratory of Tribology, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Ministry of Education of PR China, Tsinghua University, Beijing 100084, P. R. China.
| | - Jinpeng Huo
- Department of Mechanical Engineering, State Key Laboratory of Tribology, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Ministry of Education of PR China, Tsinghua University, Beijing 100084, P. R. China.
| | - Yu Xiao
- Department of Mechanical Engineering, State Key Laboratory of Tribology, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Ministry of Education of PR China, Tsinghua University, Beijing 100084, P. R. China.
| | - Jin Peng
- Department of Mechanical Engineering, State Key Laboratory of Tribology, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Ministry of Education of PR China, Tsinghua University, Beijing 100084, P. R. China.
| | - Zehua Li
- Department of Mechanical Engineering, State Key Laboratory of Tribology, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Ministry of Education of PR China, Tsinghua University, Beijing 100084, P. R. China.
| | - Wengan Wang
- Department of Mechanical Engineering, State Key Laboratory of Tribology, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Ministry of Education of PR China, Tsinghua University, Beijing 100084, P. R. China.
| | - Lei Liu
- Department of Mechanical Engineering, State Key Laboratory of Tribology, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Ministry of Education of PR China, Tsinghua University, Beijing 100084, P. R. China.
| | - Guisheng Zou
- Department of Mechanical Engineering, State Key Laboratory of Tribology, Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Ministry of Education of PR China, Tsinghua University, Beijing 100084, P. R. China.
| | - Wenxian Wang
- College of Materials Science and Engineering, Taiyuan University of Technology, Taiyuan 030024, Shanxi Province, China.
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30
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Oh B, Lim YS, Ko KW, Seo H, Kim DJ, Kong D, You JM, Kim H, Kim TS, Park S, Kwon DS, Na JC, Han WK, Park SM, Park S. Ultra-soft and highly stretchable tissue-adhesive hydrogel based multifunctional implantable sensor for monitoring of overactive bladder. Biosens Bioelectron 2023; 225:115060. [PMID: 36701947 DOI: 10.1016/j.bios.2023.115060] [Citation(s) in RCA: 5] [Impact Index Per Article: 2.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/05/2022] [Revised: 01/02/2023] [Accepted: 01/03/2023] [Indexed: 01/05/2023]
Abstract
A highly stretchable and tissue-adhesive multifunctional sensor based on structurally engineered islets embedded in ultra-soft hydrogel is reported for monitoring of bladder activity in overactive bladder (OAB) induced rat and anesthetized pig. The use of hydrogel yielded a much lower sensor modulus (1 kPa) compared to that of the bladder (300 kPa), while the strong adhesiveness of the hydrogel (adhesive strength: 260.86 N/m) allowed firm attachment onto the bladder. The change in resistance of printed liquid metal particle thin-film lines under strain were used to detect bladder inflation and deflation; due to the high stretchability and reliability of the lines, surface strains of 200% could be measured repeatedly. Au electrodes coated with Platinum black were used to detect electromyography (EMG). These electrodes were placed on structurally engineered rigid islets so that no interfacial fracture occurs under high strains associated with bladder expansion. On the OAB induced rat, stronger signals (change in resistance and EMG root-mean-square) were detected near intra-bladder pressure maxima, thus showing correlation to bladder activity. Moreover, using robot-assisted laparoscopic surgery, the sensor was placed onto the bladder of an anesthetized pig. Under voiding and filling, bladder strain and EMG were once again monitored. These results confirm that our proposed sensor is a highly feasible, clinically relevant implantable device for continuous monitoring OAB for diagnosis and treatment.
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Affiliation(s)
- Byungkook Oh
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, Republic of Korea
| | - Young-Soo Lim
- Department of Convergence IT Engineering (CiTE), Pohang University of Science and Technology (POSTECH), 77 Cheongam-ro, Nam-gu, Pohang-si, Gyeongsangbuk-do, Republic of Korea
| | - Kun Woo Ko
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, Republic of Korea
| | - Hyeonyeob Seo
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, Republic of Korea
| | - Dong Jun Kim
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, Republic of Korea
| | - Dukyoo Kong
- Roen Surgical Inc, 193, Munji-ro, Yuseong-gu, Daejeon, 34051, Republic of Korea
| | - Jae Min You
- Roen Surgical Inc, 193, Munji-ro, Yuseong-gu, Daejeon, 34051, Republic of Korea
| | - Hansoul Kim
- Roen Surgical Inc, 193, Munji-ro, Yuseong-gu, Daejeon, 34051, Republic of Korea
| | - Taek-Soo Kim
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, Republic of Korea
| | - Seongjun Park
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, Republic of Korea; KAIST Institute for Health Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon, Republic of Korea
| | - Dong-Soo Kwon
- Roen Surgical Inc, 193, Munji-ro, Yuseong-gu, Daejeon, 34051, Republic of Korea
| | - Joon Chae Na
- Department of Urology, Urological Science Institute, Yonsei University College of Medicine, Seoul, Republic of Korea
| | - Woong Kyu Han
- Department of Urology, Urological Science Institute, Yonsei University College of Medicine, Center of Uro-Oncology, Yonsei Cancer Hospital, Seoul, Republic of Korea
| | - Sung-Min Park
- Department of Convergence IT Engineering (CiTE), Pohang University of Science and Technology (POSTECH), 77 Cheongam-ro, Nam-gu, Pohang-si, Gyeongsangbuk-do, Republic of Korea; Department of Electrical Engineering, Pohang University of Science and Technology (POSTECH), 77 Cheongam-ro, Nam-gu, Pohang-si, Gyeongsangbuk-do, Republic of Korea; Department of Mechanical Engineering, Pohang University of Science and Technology (POSTECH), 77 Cheongam-ro, Nam-gu, Pohang-si, Gyeongsangbuk-do, Republic of Korea; Institute of Convergence Science, Yonsei University, Seoul, Republic of Korea.
| | - Steve Park
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, Republic of Korea; KAIST Institute for Health Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon, Republic of Korea.
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31
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Luo Y, Abidian MR, Ahn JH, Akinwande D, Andrews AM, Antonietti M, Bao Z, Berggren M, Berkey CA, Bettinger CJ, Chen J, Chen P, Cheng W, Cheng X, Choi SJ, Chortos A, Dagdeviren C, Dauskardt RH, Di CA, Dickey MD, Duan X, Facchetti A, Fan Z, Fang Y, Feng J, Feng X, Gao H, Gao W, Gong X, Guo CF, Guo X, Hartel MC, He Z, Ho JS, Hu Y, Huang Q, Huang Y, Huo F, Hussain MM, Javey A, Jeong U, Jiang C, Jiang X, Kang J, Karnaushenko D, Khademhosseini A, Kim DH, Kim ID, Kireev D, Kong L, Lee C, Lee NE, Lee PS, Lee TW, Li F, Li J, Liang C, Lim CT, Lin Y, Lipomi DJ, Liu J, Liu K, Liu N, Liu R, Liu Y, Liu Y, Liu Z, Liu Z, Loh XJ, Lu N, Lv Z, Magdassi S, Malliaras GG, Matsuhisa N, Nathan A, Niu S, Pan J, Pang C, Pei Q, Peng H, Qi D, Ren H, Rogers JA, Rowe A, Schmidt OG, Sekitani T, Seo DG, Shen G, Sheng X, Shi Q, Someya T, Song Y, Stavrinidou E, Su M, Sun X, Takei K, Tao XM, Tee BCK, Thean AVY, Trung TQ, et alLuo Y, Abidian MR, Ahn JH, Akinwande D, Andrews AM, Antonietti M, Bao Z, Berggren M, Berkey CA, Bettinger CJ, Chen J, Chen P, Cheng W, Cheng X, Choi SJ, Chortos A, Dagdeviren C, Dauskardt RH, Di CA, Dickey MD, Duan X, Facchetti A, Fan Z, Fang Y, Feng J, Feng X, Gao H, Gao W, Gong X, Guo CF, Guo X, Hartel MC, He Z, Ho JS, Hu Y, Huang Q, Huang Y, Huo F, Hussain MM, Javey A, Jeong U, Jiang C, Jiang X, Kang J, Karnaushenko D, Khademhosseini A, Kim DH, Kim ID, Kireev D, Kong L, Lee C, Lee NE, Lee PS, Lee TW, Li F, Li J, Liang C, Lim CT, Lin Y, Lipomi DJ, Liu J, Liu K, Liu N, Liu R, Liu Y, Liu Y, Liu Z, Liu Z, Loh XJ, Lu N, Lv Z, Magdassi S, Malliaras GG, Matsuhisa N, Nathan A, Niu S, Pan J, Pang C, Pei Q, Peng H, Qi D, Ren H, Rogers JA, Rowe A, Schmidt OG, Sekitani T, Seo DG, Shen G, Sheng X, Shi Q, Someya T, Song Y, Stavrinidou E, Su M, Sun X, Takei K, Tao XM, Tee BCK, Thean AVY, Trung TQ, Wan C, Wang H, Wang J, Wang M, Wang S, Wang T, Wang ZL, Weiss PS, Wen H, Xu S, Xu T, Yan H, Yan X, Yang H, Yang L, Yang S, Yin L, Yu C, Yu G, Yu J, Yu SH, Yu X, Zamburg E, Zhang H, Zhang X, Zhang X, Zhang X, Zhang Y, Zhang Y, Zhao S, Zhao X, Zheng Y, Zheng YQ, Zheng Z, Zhou T, Zhu B, Zhu M, Zhu R, Zhu Y, Zhu Y, Zou G, Chen X. Technology Roadmap for Flexible Sensors. ACS NANO 2023; 17:5211-5295. [PMID: 36892156 PMCID: PMC11223676 DOI: 10.1021/acsnano.2c12606] [Show More Authors] [Citation(s) in RCA: 338] [Impact Index Per Article: 169.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/18/2023]
Abstract
Humans rely increasingly on sensors to address grand challenges and to improve quality of life in the era of digitalization and big data. For ubiquitous sensing, flexible sensors are developed to overcome the limitations of conventional rigid counterparts. Despite rapid advancement in bench-side research over the last decade, the market adoption of flexible sensors remains limited. To ease and to expedite their deployment, here, we identify bottlenecks hindering the maturation of flexible sensors and propose promising solutions. We first analyze challenges in achieving satisfactory sensing performance for real-world applications and then summarize issues in compatible sensor-biology interfaces, followed by brief discussions on powering and connecting sensor networks. Issues en route to commercialization and for sustainable growth of the sector are also analyzed, highlighting environmental concerns and emphasizing nontechnical issues such as business, regulatory, and ethical considerations. Additionally, we look at future intelligent flexible sensors. In proposing a comprehensive roadmap, we hope to steer research efforts towards common goals and to guide coordinated development strategies from disparate communities. Through such collaborative efforts, scientific breakthroughs can be made sooner and capitalized for the betterment of humanity.
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Affiliation(s)
- Yifei Luo
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Innovative Centre for Flexible Devices (iFLEX), School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
| | - Mohammad Reza Abidian
- Department of Biomedical Engineering, University of Houston, Houston, Texas 77024, United States
| | - Jong-Hyun Ahn
- School of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, Republic of Korea
| | - Deji Akinwande
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States
| | - Anne M Andrews
- Department of Chemistry and Biochemistry, California NanoSystems Institute, and Department of Psychiatry and Biobehavioral Sciences, Semel Institute for Neuroscience and Human Behavior, and Hatos Center for Neuropharmacology, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Markus Antonietti
- Colloid Chemistry Department, Max Planck Institute of Colloids and Interfaces, 14476 Potsdam, Germany
| | - Zhenan Bao
- Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
| | - Magnus Berggren
- Laboratory of Organic Electronics, Department of Science and Technology, Campus Norrköping, Linköping University, 83 Linköping, Sweden
- Wallenberg Initiative Materials Science for Sustainability (WISE) and Wallenberg Wood Science Center (WWSC), SE-100 44 Stockholm, Sweden
| | - Christopher A Berkey
- Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
| | - Christopher John Bettinger
- Department of Biomedical Engineering and Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, Pennsylvania 15213, United States
| | - Jun Chen
- Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Peng Chen
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Wenlong Cheng
- Nanobionics Group, Department of Chemical and Biological Engineering, Monash University, Clayton, Australia, 3800
- Monash Institute of Medical Engineering, Monash University, Clayton, Australia3800
| | - Xu Cheng
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
| | - Seon-Jin Choi
- Division of Materials of Science and Engineering, Hanyang University, 222 Wangsimni-ro, Seongdong-gu, Seoul 04763, Republic of Korea
| | - Alex Chortos
- School of Mechanical Engineering, Purdue University, West Lafayette, Indiana 47906, United States
| | - Canan Dagdeviren
- Media Lab, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States
| | - Reinhold H Dauskardt
- Department of Materials Science and Engineering, Stanford University, Stanford, California 94301, United States
| | - Chong-An Di
- Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
| | - Michael D Dickey
- Department of Chemical and Biomolecular Engineering, North Carolina State University, Raleigh, North Carolina 27606, United States
| | - Xiangfeng Duan
- Department of Chemistry and Biochemistry, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Antonio Facchetti
- Department of Chemistry and the Materials Research Center, Northwestern University, Evanston, Illinois 60208, United States
| | - Zhiyong Fan
- Department of Electronic and Computer Engineering and Department of Chemical and Biological Engineering, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong SAR, China
| | - Yin Fang
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Jianyou Feng
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Xue Feng
- Laboratory of Flexible Electronics Technology, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, China
| | - Huajian Gao
- School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798, Singapore
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Wei Gao
- Andrew and Peggy Cherng Department of Medical Engineering, California Institute of Technology, Pasadena, California, 91125, United States
| | - Xiwen Gong
- Department of Chemical Engineering, Department of Materials Science and Engineering, Department of Electrical Engineering and Computer Science, Applied Physics Program, and Macromolecular Science and Engineering Program, University of Michigan, Ann Arbor, Michigan, 48109 United States
| | - Chuan Fei Guo
- Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China
| | - Xiaojun Guo
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
| | - Martin C Hartel
- Department of Bioengineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Zihan He
- Beijing National Laboratory for Molecular Sciences, CAS Key Laboratory of Organic Solids, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China
| | - John S Ho
- Institute for Health Innovation and Technology, National University of Singapore, Singapore 117599, Singapore
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- The N.1 Institute for Health, National University of Singapore, Singapore 117456, Singapore
| | - Youfan Hu
- School of Electronics and Center for Carbon-Based Electronics, Peking University, Beijing 100871, China
| | - Qiyao Huang
- School of Fashion and Textiles, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
| | - Yu Huang
- Department of Materials Science and Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Fengwei Huo
- Key Laboratory of Flexible Electronics (KLOFE) and Institute of Advanced Materials (IAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, PR China
| | - Muhammad M Hussain
- mmh Labs, Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, Indiana 47906, United States
| | - Ali Javey
- Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States
- Materials Sciences Division, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States
| | - Unyong Jeong
- Department of Materials Science and Engineering, Pohang University of Science and Engineering (POSTECH), Pohang, Gyeong-buk 37673, Korea
| | - Chen Jiang
- Department of Electronic Engineering, Tsinghua University, Beijing 100084, China
| | - Xingyu Jiang
- Department of Biomedical Engineering, Southern University of Science and Technology, No 1088, Xueyuan Road, Xili, Nanshan District, Shenzhen, Guangdong 518055, PR China
| | - Jiheong Kang
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Daniil Karnaushenko
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
| | | | - Dae-Hyeong Kim
- Center for Nanoparticle Research, Institute for Basic Science (IBS), School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Il-Doo Kim
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea
| | - Dmitry Kireev
- Department of Electrical and Computer Engineering, The University of Texas at Austin, Austin, Texas 78712, United States
- Microelectronics Research Center, The University of Texas at Austin, Austin, Texas 78758, United States
| | - Lingxuan Kong
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
| | - Chengkuo Lee
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
- NUS Graduate School-Integrative Sciences and Engineering Programme (ISEP), National University of Singapore, Singapore 119077, Singapore
| | - Nae-Eung Lee
- School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
| | - Pooi See Lee
- School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
- Singapore-HUJ Alliance for Research and Enterprise (SHARE), Campus for Research Excellence and Technological Enterprise (CREATE), Singapore 138602, Singapore
| | - Tae-Woo Lee
- Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
- School of Chemical and Biological Engineering, Seoul National University, Seoul 08826, Republic of Korea
- Institute of Engineering Research, Research Institute of Advanced Materials, Seoul National University, Soft Foundry, Seoul 08826, Republic of Korea
- Interdisciplinary Program in Bioengineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Fengyu Li
- College of Chemistry and Materials Science, Jinan University, Guangzhou, Guangdong 510632, China
| | - Jinxing Li
- Department of Biomedical Engineering, Department of Electrical and Computer Engineering, Neuroscience Program, BioMolecular Science Program, and Institute for Quantitative Health Science and Engineering, Michigan State University, East Lansing, Michigan 48823, United States
| | - Cuiyuan Liang
- School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
| | - Chwee Teck Lim
- Department of Biomedical Engineering, National University of Singapore, Singapore 117583, Singapore
- Mechanobiology Institute, National University of Singapore, Singapore 117411, Singapore
- Institute for Health Innovation and Technology, National University of Singapore, Singapore 119276, Singapore
| | - Yuanjing Lin
- School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China
| | - Darren J Lipomi
- Department of Nano and Chemical Engineering, University of California, San Diego, La Jolla, California 92093-0448, United States
| | - Jia Liu
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Kai Liu
- School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
| | - Nan Liu
- Beijing Key Laboratory of Energy Conversion and Storage Materials, College of Chemistry, Beijing Normal University, Beijing 100875, PR China
| | - Ren Liu
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Yuxin Liu
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Department of Biomedical Engineering, N.1 Institute for Health, Institute for Health Innovation and Technology (iHealthtech), National University of Singapore, Singapore 119077, Singapore
| | - Yuxuan Liu
- Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Zhiyuan Liu
- Neural Engineering Centre, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, China 518055
| | - Zhuangjian Liu
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Xian Jun Loh
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
| | - Nanshu Lu
- Department of Aerospace Engineering and Engineering Mechanics, Department of Electrical and Computer Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Texas Materials Institute, The University of Texas at Austin, Austin, Texas 78712, United States
| | - Zhisheng Lv
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
| | - Shlomo Magdassi
- Institute of Chemistry and the Center for Nanoscience and Nanotechnology, The Hebrew University of Jerusalem, Jerusalem 9190401, Israel
| | - George G Malliaras
- Electrical Engineering Division, Department of Engineering, University of Cambridge CB3 0FA, Cambridge United Kingdom
| | - Naoji Matsuhisa
- Institute of Industrial Science, The University of Tokyo, 4-6-1 Komaba, Meguro-ku, Tokyo 153-8505, Japan
| | - Arokia Nathan
- Darwin College, University of Cambridge, Cambridge CB3 9EU, United Kingdom
| | - Simiao Niu
- Department of Biomedical Engineering, Rutgers University, Piscataway, New Jersey 08854, United States
| | - Jieming Pan
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
| | - Changhyun Pang
- School of Chemical Engineering and Samsung Advanced Institute for Health Science and Technology, Sungkyunkwan University, Suwon 16419, Republic of Korea
| | - Qibing Pei
- Department of Materials Science and Engineering, Department of Mechanical and Aerospace Engineering, California NanoSystems Institute, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Huisheng Peng
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Dianpeng Qi
- School of Chemistry and Chemical Engineering, Harbin Institute of Technology, Harbin, Heilongjiang 150001, China
| | - Huaying Ren
- Department of Chemistry and Biochemistry, University of California, Los Angeles, Los Angeles, California, 90095, United States
| | - John A Rogers
- Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, Illinois 60208, United States
- Department of Materials Science and Engineering, Department of Mechanical Engineering, Department of Biomedical Engineering, Departments of Electrical and Computer Engineering and Chemistry, and Department of Neurological Surgery, Northwestern University, Evanston, Illinois 60208, United States
| | - Aaron Rowe
- Becton, Dickinson and Company, 1268 N. Lakeview Avenue, Anaheim, California 92807, United States
- Ready, Set, Food! 15821 Ventura Blvd #450, Encino, California 91436, United States
| | - Oliver G Schmidt
- Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Chemnitz University of Technology, Chemnitz 09126, Germany
- Material Systems for Nanoelectronics, Chemnitz University of Technology, Chemnitz 09107, Germany
- Nanophysics, Faculty of Physics, TU Dresden, Dresden 01062, Germany
| | - Tsuyoshi Sekitani
- The Institute of Scientific and Industrial Research (SANKEN), Osaka University, Osaka, Japan 5670047
| | - Dae-Gyo Seo
- Department of Materials Science and Engineering, Seoul National University, Seoul 08826, Republic of Korea
| | - Guozhen Shen
- School of Integrated Circuits and Electronics, Beijing Institute of Technology, Beijing 100081, China
| | - Xing Sheng
- Department of Electronic Engineering, Beijing National Research Center for Information Science and Technology, Institute for Precision Medicine, Center for Flexible Electronics Technology, and IDG/McGovern Institute for Brain Research, Tsinghua University, Beijing, 100084, China
| | - Qiongfeng Shi
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Center for Intelligent Sensors and MEMS (CISM), National University of Singapore, Singapore 117608, Singapore
- National University of Singapore Suzhou Research Institute (NUSRI), Suzhou Industrial Park, Suzhou 215123, China
| | - Takao Someya
- Department of Electrical Engineering and Information Systems, Graduate School of Engineering, The University of Tokyo, Tokyo 113-8656, Japan
| | - Yanlin Song
- Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
| | - Eleni Stavrinidou
- Laboratory of Organic Electronics, Department of Science and Technology, Linköping University, SE-601 74 Norrkoping, Sweden
| | - Meng Su
- Key Laboratory of Green Printing, Institute of Chemistry, Chinese Academy of Sciences, Beijing, Beijing 100190, China
| | - Xuemei Sun
- State Key Laboratory of Molecular Engineering of Polymers, Department of Macromolecular Science, and Laboratory of Advanced Materials, Fudan University, Shanghai 200438, PR China
| | - Kuniharu Takei
- Department of Physics and Electronics, Osaka Metropolitan University, Sakai, Osaka 599-8531, Japan
| | - Xiao-Ming Tao
- Research Institute for Intelligent Wearable Systems, School of Fashion and Textiles, Hong Kong Polytechnic University, Hong Kong, China
| | - Benjamin C K Tee
- Materials Science and Engineering, National University of Singapore, Singapore 117575, Singapore
- iHealthtech, National University of Singapore, Singapore 119276, Singapore
| | - Aaron Voon-Yew Thean
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Tran Quang Trung
- School of Advanced Materials Science and Engineering, Sungkyunkwan University, Suwon, Kyunggi-do 16419, Republic of Korea
| | - Changjin Wan
- School of Electronic Science and Engineering, Nanjing University, Nanjing 210023, China
| | - Huiliang Wang
- Department of Biomedical Engineering, University of Texas at Austin, Austin, Texas 78712, United States
| | - Joseph Wang
- Department of Nanoengineering, University of California, San Diego, California 92093, United States
| | - Ming Wang
- Frontier Institute of Chip and System, State Key Laboratory of Integrated Chip and Systems, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, 200433, China
- the Shanghai Qi Zhi Institute, 41th Floor, AI Tower, No.701 Yunjin Road, Xuhui District, Shanghai 200232, China
| | - Sihong Wang
- Pritzker School of Molecular Engineering, The University of Chicago, Chicago, Illinois, 60637, United States
| | - Ting Wang
- State Key Laboratory of Organic Electronics and Information Displays and Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Nanjing University of Posts and Telecommunications, 9 Wenyuan Road, Nanjing 210023, China
| | - Zhong Lin Wang
- Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China
- Georgia Institute of Technology, Atlanta, Georgia 30332-0245, United States
| | - Paul S Weiss
- California NanoSystems Institute, Department of Chemistry and Biochemistry, Department of Bioengineering, and Department of Materials Science and Engineering, University of California, Los Angeles, Los Angeles, California 90095, United States
| | - Hanqi Wen
- School of Chemistry, Chemical Engineering and Biotechnology, Nanyang Technological University, Singapore 637457, Singapore
- Institute of Flexible Electronics Technology of THU, Jiaxing, Zhejiang, China 314000
| | - Sheng Xu
- Department of Nanoengineering, Department of Electrical and Computer Engineering, Materials Science and Engineering Program, and Department of Bioengineering, University of California San Diego, La Jolla, California, 92093, United States
| | - Tailin Xu
- School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong, 518060, PR China
| | - Hongping Yan
- Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States
| | - Xuzhou Yan
- School of Chemistry and Chemical Engineering, Frontiers Science Center for Transformative Molecules, Shanghai Jiao Tong University, Shanghai 200240, PR China
| | - Hui Yang
- Tianjin Key Laboratory of Molecular Optoelectronic Sciences, Department of Chemistry, School of Science, Tianjin University, Tianjin, China, 300072
| | - Le Yang
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Department of Materials Science and Engineering, National University of Singapore (NUS), 9 Engineering Drive 1, #03-09 EA, Singapore 117575, Singapore
| | - Shuaijian Yang
- School of Biomedical Sciences, Faculty of Biological Sciences, University of Leeds, Leeds, LS2 9JT, United Kingdom
| | - Lan Yin
- School of Materials Science and Engineering, The Key Laboratory of Advanced Materials of Ministry of Education, State Key Laboratory of New Ceramics and Fine Processing, and Center for Flexible Electronics Technology, Tsinghua University, Beijing, 100084, China
| | - Cunjiang Yu
- Department of Engineering Science and Mechanics, Department of Biomedical Engineering, Department of Material Science and Engineering, Materials Research Institute, Pennsylvania State University, University Park, Pennsylvania, 16802, United States
| | - Guihua Yu
- Materials Science and Engineering Program and Walker Department of Mechanical Engineering, The University of Texas at Austin, Austin, Texas, 78712, United States
| | - Jing Yu
- School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
| | - Shu-Hong Yu
- Department of Chemistry, Institute of Biomimetic Materials and Chemistry, Hefei National Research Center for Physical Science at the Microscale, University of Science and Technology of China, Hefei 230026, China
| | - Xinge Yu
- Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China
| | - Evgeny Zamburg
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Haixia Zhang
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication; Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Xiangyu Zhang
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Xiaosheng Zhang
- School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
| | - Xueji Zhang
- School of Biomedical Engineering, Health Science Center, Shenzhen University, Shenzhen, Guangdong 518060, PR China
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics; Laboratory of Flexible Electronics Technology, Tsinghua University, Beijing 100084, PR China
| | - Yu Zhang
- Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117583, Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), Singapore 117583, Singapore
| | - Siyuan Zhao
- John A. Paulson School of Engineering and Applied Sciences, Harvard University, Boston, Massachusetts, 02134, United States
| | - Xuanhe Zhao
- Department of Mechanical Engineering, Department of Civil and Environmental Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, United States
| | - Yuanjin Zheng
- Center for Integrated Circuits and Systems, School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
| | - Yu-Qing Zheng
- National Key Laboratory of Science and Technology on Micro/Nano Fabrication; School of Integrated Circuits, Peking University, Beijing 100871, China
| | - Zijian Zheng
- Department of Applied Biology and Chemical Technology, Faculty of Science, Research Institute for Intelligent Wearable Systems, Research Institute for Smart Energy, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong SAR, China
| | - Tao Zhou
- Center for Neural Engineering, Department of Engineering Science and Mechanics, The Huck Institutes of the Life Sciences, Materials Research Institute, The Pennsylvania State University, University Park, Pennsylvania 16802, United States
| | - Bowen Zhu
- Key Laboratory of 3D Micro/Nano Fabrication and Characterization of Zhejiang Province, School of Engineering, Westlake University, Hangzhou 310024, China
| | - Ming Zhu
- Institute for Digital Molecular Analytics and Science (IDMxS), Nanyang Technological University, 59 Nanyang Drive, Singapore 636921, Singapore
| | - Rong Zhu
- Department of Precision Instrument, Tsinghua University, Beijing 100084, China
| | - Yangzhi Zhu
- Terasaki Institute for Biomedical Innovation, Los Angeles, California, 90064, United States
| | - Yong Zhu
- Department of Mechanical and Aerospace Engineering, Department of Materials Science and Engineering, and Department of Biomedical Engineering, North Carolina State University, Raleigh, North Carolina 27695, United States
| | - Guijin Zou
- Institute of High Performance Computing (IHPC), Agency for Science, Technology and Research (A*STAR), 1 Fusionopolis Way, #16-16 Connexis, Singapore 138632, Republic of Singapore
| | - Xiaodong Chen
- Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, #08-03 Innovis, Singapore 138634, Republic of Singapore
- Innovative Center for Flexible Devices (iFLEX), Max Planck-NTU Joint Laboratory for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore 639798, Singapore
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Kim M, Lim H, Ko SH. Liquid Metal Patterning and Unique Properties for Next-Generation Soft Electronics. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2023; 10:e2205795. [PMID: 36642850 PMCID: PMC9951389 DOI: 10.1002/advs.202205795] [Citation(s) in RCA: 20] [Impact Index Per Article: 10.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 10/06/2022] [Revised: 11/27/2022] [Indexed: 05/28/2023]
Abstract
Room-temperature liquid metal (LM)-based electronics is expected to bring advancements in future soft electronics owing to its conductivity, conformability, stretchability, and biocompatibility. However, various difficulties arise when patterning LM because of its rheological features such as fluidity and surface tension. Numerous attempts are made to overcome these difficulties, resulting in various LM-patterning methods. An appropriate choice of patterning method based on comprehensive understanding is necessary to fully utilize the unique properties. Therefore, the authors aim to provide thorough knowledge about patterning methods and unique properties for LM-based future soft electronics. First, essential considerations for LM-patterning are investigated. Then, LM-patterning methods-serial-patterning, parallel-patterning, intermetallic bond-assisted patterning, and molding/microfluidic injection-are categorized and investigated. Finally, perspectives on LM-based soft electronics with unique properties are provided. They include outstanding features of LM such as conformability, biocompatibility, permeability, restorability, and recyclability. Also, they include perspectives on future LM-based soft electronics in various areas such as radio frequency electronics, soft robots, and heterogeneous catalyst. LM-based soft devices are expected to permeate the daily lives if patterning methods and the aforementioned features are analyzed and utilized.
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Affiliation(s)
- Minwoo Kim
- Applied Nano and Thermal Science LabDepartment of Mechanical EngineeringSeoul National University1 Gwanak‐ro, Gwanak‐guSeoul08826South Korea
| | - Hyungjun Lim
- Applied Nano and Thermal Science LabDepartment of Mechanical EngineeringSeoul National University1 Gwanak‐ro, Gwanak‐guSeoul08826South Korea
- Department of Mechanical EngineeringPohang University of Science and Technology77 Chungam‐ro, Nam‐guPohang37673South Korea
| | - Seung Hwan Ko
- Applied Nano and Thermal Science LabDepartment of Mechanical EngineeringSeoul National University1 Gwanak‐ro, Gwanak‐guSeoul08826South Korea
- Institute of Advanced Machinery and Design/Institute of Engineering ResearchSeoul National University1 Gwanak‐ro, Gwanak‐guSeoul08826South Korea
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Zhao Z, Soni S, Lee T, Nijhuis CA, Xiang D. Smart Eutectic Gallium-Indium: From Properties to Applications. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2023; 35:e2203391. [PMID: 36036771 DOI: 10.1002/adma.202203391] [Citation(s) in RCA: 36] [Impact Index Per Article: 18.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 04/14/2022] [Revised: 07/30/2022] [Indexed: 05/27/2023]
Abstract
Eutectic gallium-indium (EGaIn), a liquid metal with a melting point close to or below room temperature, has attracted extensive attention in recent years due to its excellent properties such as fluidity, high conductivity, thermal conductivity, stretchability, self-healing capability, biocompatibility, and recyclability. These features of EGaIn can be adjusted by changing the experimental condition, and various composite materials with extended properties can be further obtained by mixing EGaIn with other materials. In this review, not only the are unique properties of EGaIn introduced, but also the working principles for the EGaIn-based devices are illustrated and the developments of EGaIn-related techniques are summarized. The applications of EGaIn in various fields, such as flexible electronics (sensors, antennas, electronic circuits), molecular electronics (molecular memory, opto-electronic switches, or reconfigurable junctions), energy catalysis (heat management, motors, generators, batteries), biomedical science (drug delivery, tumor therapy, bioimaging and neural interfaces) are reviewed. Finally, a critical discussion of the main challenges for the development of EGaIn-based techniques are discussed, and the potential applications in new fields are prospected.
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Affiliation(s)
- Zhibin Zhao
- Institute of Modern Optics and Center of Single Molecule Sciences, Tianjin Key Laboratory of Micro-scale Optical Information Science and Technology, Nankai University, 300350, Tianjin, P. R. China
| | - Saurabh Soni
- Department of Molecules and Materials, MESA+ Institute for Nanotechnology, Molecules Center and Center for Brain-Inspired Nano Systems, Faculty of Science and Technology, University of Twente, Enschede, 7500 AE, The Netherlands
| | - Takhee Lee
- Department of Physics and Astronomy, Institute of Applied Physics, Seoul National University, Seoul, 08826, Korea
| | - Christian A Nijhuis
- Department of Molecules and Materials, MESA+ Institute for Nanotechnology, Molecules Center and Center for Brain-Inspired Nano Systems, Faculty of Science and Technology, University of Twente, Enschede, 7500 AE, The Netherlands
| | - Dong Xiang
- Institute of Modern Optics and Center of Single Molecule Sciences, Tianjin Key Laboratory of Micro-scale Optical Information Science and Technology, Nankai University, 300350, Tianjin, P. R. China
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34
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Yang B, Yang Z, Tang L. Recent progress in fiber-based soft electronics enabled by liquid metal. Front Bioeng Biotechnol 2023; 11:1178995. [PMID: 37187888 PMCID: PMC10175636 DOI: 10.3389/fbioe.2023.1178995] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 03/03/2023] [Accepted: 04/20/2023] [Indexed: 05/17/2023] Open
Abstract
Soft electronics can seamlessly integrate with the human skin which will greatly improve the quality of life in the fields of healthcare monitoring, disease treatment, virtual reality, and human-machine interfaces. Currently, the stretchability of most soft electronics is achieved by incorporating stretchable conductors with elastic substrates. Among stretchable conductors, liquid metals stand out for their metal-grade conductivity, liquid-grade deformability, and relatively low cost. However, the elastic substrates usually composed of silicone rubber, polyurethane, and hydrogels have poor air permeability, and long-term exposure can cause skin redness and irritation. The substrates composed of fibers usually have excellent air permeability due to their high porosity, making them ideal substrates for soft electronics in long-term applications. Fibers can be woven directly into various shapes, or formed into various shapes on the mold by spinning techniques such as electrospinning. Here, we provide an overview of fiber-based soft electronics enabled by liquid metals. An introduction to the spinning technology is provided. Typical applications and patterning strategies of liquid metal are presented. We review the latest progress in the design and fabrication of representative liquid metal fibers and their application in soft electronics such as conductors, sensors, and energy harvesting. Finally, we discuss the challenges of fiber-based soft electronics and provide an outlook on future prospects.
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Affiliation(s)
- Bowen Yang
- Beijing Key Laboratory of Fundamental Research on Biomechanics in Clinical Application, School of Biomedical Engineering, Capital Medical University, Beijing, China
| | - Zihan Yang
- Fashion Accessory Art and Engineering College, Beijing Institute of Fashion Technology, Beijing, China
- *Correspondence: Zihan Yang, ; Lixue Tang,
| | - Lixue Tang
- Beijing Key Laboratory of Fundamental Research on Biomechanics in Clinical Application, School of Biomedical Engineering, Capital Medical University, Beijing, China
- Beijing Advanced Innovation Center for Big Data-Based Precision Medicine, Capital Medical University, Beijing, China
- *Correspondence: Zihan Yang, ; Lixue Tang,
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35
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Zhang J, Ma B, Chen G, Chen Y, Xu C, Hao Q, Zhao C, Liu H. Surface-Embedded Liquid Metal Electrodes with Abrasion Resistance via Direct Magnetic Printing. ACS APPLIED MATERIALS & INTERFACES 2022; 14:53405-53412. [PMID: 36382935 DOI: 10.1021/acsami.2c15282] [Citation(s) in RCA: 6] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
Abstract
Gallium-based liquid metals (LMs) featuring both high conductivity and fluidity are ideal conductors for soft and stretchable electronics. However, their liquid nature is a double-edged sword in many key applications since LMs are inherently prone to mechanical damage. Although additional encapsulation is frequently used for the protection of delicate LM electrodes, it hinders the electrical interfacing with other objects for interconnection, sensing, and stimulation. Here, different from conventional patterning methods that deposit LM on or inside substrates, we for the first time report a simple strategy to create surface-embedded LM of eutectic gallium-indium (EGaIn) circuits with mechanical damage endurance. This was achieved by using direct magnetic printing to overcome the high surface tension of LM, allowing it to be passively filled into the laser-patterned microgrooves on soft substrates. We show that the surface-embedded LM circuits are resistant to mechanical erasure, washing, and peeling. We also show the applications of our surface-embedded LM electrodes in respiration monitoring and electrical stimulation of nerves. This work provides a simple and efficient way to create mechanically reliable LM microelectrodes, holding great promise for wearable and implantable bioelectronics.
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Affiliation(s)
- Jin Zhang
- State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China
| | - Biao Ma
- State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China
| | - Gangsheng Chen
- State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China
| | - Yi Chen
- State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China
| | - Chengtao Xu
- State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China
| | - Qing Hao
- State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China
| | - Chao Zhao
- State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China
| | - Hong Liu
- State Key Laboratory of Bioelectronics, School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China
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36
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Lee W, Kim H, Kang I, Park H, Jung J, Lee H, Park H, Park JS, Yuk JM, Ryu S, Jeong JW, Kang J. Universal assembly of liquid metal particles in polymers enables elastic printed circuit board. Science 2022; 378:637-641. [DOI: 10.1126/science.abo6631] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/12/2022]
Abstract
An elastic printed circuit board (E-PCB) is a conductive framework used for the facile assembly of system-level stretchable electronics. E-PCBs require elastic conductors that have high conductivity, high stretchability, tough adhesion to various components, and imperceptible resistance changes even under large strain. We present a liquid metal particle network (LMP
Net
) assembled by applying an acoustic field to a solid-state insulating liquid metal particle composite as the elastic conductor. The LMP
Net
conductor satisfies all the aforementioned requirements and enables the fabrication of a multilayered high-density E-PCB, in which numerous electronic components are intimately integrated to create highly stretchable skin electronics. Furthermore, we could generate the LMP
Net
in various polymer matrices, including hydrogels, self-healing elastomers, and photoresists, thus showing their potential for use in soft electronics.
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Affiliation(s)
- Wonbeom Lee
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Hyunjun Kim
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Inho Kang
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Hongjun Park
- Center for Nanomaterials and Chemical Reactions, Institute for Basic Science (IBS), Daejeon 34141, Republic of Korea
| | - Jiyoung Jung
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Haeseung Lee
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Hyunchang Park
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Ji Su Park
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Jong Min Yuk
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Seunghwa Ryu
- Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Jae-Woong Jeong
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Jiheong Kang
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
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37
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Alves WA, King GM, Guha S. Looking into a crystal ball: printing and patterning self-assembled peptide nanostructures. NANOSCALE 2022; 14:15607-15616. [PMID: 36268821 DOI: 10.1039/d2nr03750e] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
Abstract
The solution processability of organic semiconductors and conjugated polymers along with the advent of nanomaterials as conducting inks have revolutionized next-generation flexible consumer electronics. Another equally important class of nanomaterials, self-assembled peptides, heralded as next-generation materials for bioelectronics, have a lot of potential in printed technology. In this minireview, we address the self-assembly process in dipeptides, their application in electronics, and recent progress in three-dimensional printing. The prospect of a generalizable path for nanopatterning self-assembled peptides using ice lithography and its challenges are further discussed.
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Affiliation(s)
- Wendel A Alves
- Centro de Ciências Naturais e Humanas, Universidade Federal do ABC, 09219-580 Santo Andre, Sao Paulo, Brazil
| | - Gavin M King
- Department of Physics and Astronomy, University of Missouri, Columbia, MO 65211, USA.
- Joint with Department of Biochemistry, University of Missouri, Columbia, MO 65211, USA
| | - Suchismita Guha
- Department of Physics and Astronomy, University of Missouri, Columbia, MO 65211, USA.
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38
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Duan L, Zhang Y, Zhao J, Zhang J, Li Q, Lu Q, Fu L, Liu J, Liu Q. New Strategy and Excellent Fluorescence Property of Unique Core-Shell Structure Based on Liquid Metals/Metal Halides. SMALL (WEINHEIM AN DER BERGSTRASSE, GERMANY) 2022; 18:e2204056. [PMID: 36101903 DOI: 10.1002/smll.202204056] [Citation(s) in RCA: 6] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 07/02/2022] [Revised: 08/11/2022] [Indexed: 06/15/2023]
Abstract
The further applications of liquid metals (LMs) are limited by their common shortcoming of silver-white physical appearance, which deviates from the impose stringent requirements for color and aesthetics. Herein, a concept is proposed for constructing fluorescent core-shell structures based on the components and properties of LMs, and metal halides. The metal halides endow LMs with polychromatic and stable fluorescence characteristics. As a proof-of-concept, LMs-Al obtained by mixing of LMs with aluminum (Al) is reported. The surface of LMs-Al is transformed directly from Al to a multi-phase metal halide of K3 AlCl6 with double perovskites structure, via redox reactions with KCl + HCl solution in a natural environment. The formation of core-shell structure from the K3 AlCl6 and LMs is achieved, and the shell with different phases can emit a cyan light by the superimposition of the polychromatic spectrum. Furthermore, the LMs can be directly converted into a fluorescent shell without affecting their original features. In particular, the luminescence properties of shells can be regulated by the components in LMs. This study provides a new direction for research in spontaneous interfacial modification and fluorescent functionalization of LMs and promises potential applications, such as lighting and displays, anti-counterfeiting measures, sensing, and chameleon robots.
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Affiliation(s)
- Liangfei Duan
- Yunnan Key Laboratory for Micro/Nano Materials & Technology, International Joint Research Center for Optoelectronic and Energy Materials, School of Materials and Energy, Yunnan University, Kunming, 650091, China
| | - Yumin Zhang
- Yunnan Key Laboratory for Micro/Nano Materials & Technology, International Joint Research Center for Optoelectronic and Energy Materials, School of Materials and Energy, Yunnan University, Kunming, 650091, China
| | - Jianhong Zhao
- Yunnan Key Laboratory for Micro/Nano Materials & Technology, International Joint Research Center for Optoelectronic and Energy Materials, School of Materials and Energy, Yunnan University, Kunming, 650091, China
| | - Jin Zhang
- Yunnan Key Laboratory for Micro/Nano Materials & Technology, International Joint Research Center for Optoelectronic and Energy Materials, School of Materials and Energy, Yunnan University, Kunming, 650091, China
| | - Qian Li
- CAS Key Laboratory of Cryogenics and Beijing Key Laboratory of Cryo- Biomedical Engineering, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, 100190, China
| | - Qingjie Lu
- Yunnan Key Laboratory for Micro/Nano Materials & Technology, International Joint Research Center for Optoelectronic and Energy Materials, School of Materials and Energy, Yunnan University, Kunming, 650091, China
| | - Li Fu
- Yunnan Key Laboratory for Micro/Nano Materials & Technology, International Joint Research Center for Optoelectronic and Energy Materials, School of Materials and Energy, Yunnan University, Kunming, 650091, China
| | - Jing Liu
- CAS Key Laboratory of Cryogenics and Beijing Key Laboratory of Cryo- Biomedical Engineering, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, 100190, China
- Department of Biomedical Engineering School of Medicine Tsinghua University Beijing, Beijing, 100084, China
| | - Qingju Liu
- Yunnan Key Laboratory for Micro/Nano Materials & Technology, International Joint Research Center for Optoelectronic and Energy Materials, School of Materials and Energy, Yunnan University, Kunming, 650091, China
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39
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Gan T, Xiao Q, Handschuh-Wang S, Huang X, Wang H, Deng X, Hu S, Wang B, Wu Q, Zhou X. Conformally Adhesive, Large-Area, Solidlike, yet Transient Liquid Metal Thin Films and Patterns via Gelatin-Regulated Droplet Deposition and Sintering. ACS APPLIED MATERIALS & INTERFACES 2022; 14:42744-42756. [PMID: 36068651 DOI: 10.1021/acsami.2c12880] [Citation(s) in RCA: 5] [Impact Index Per Article: 1.7] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/15/2023]
Abstract
Adhesion and spreading of liquid metals (LMs) on substrates are essential steps for the generation of flexible electronics and thermal management devices. However, the controlled deposition is limited by the high surface tension and peculiar wetting and adhesion behavior of LMs. Herein, we introduce gelatin-regulated LM droplet deposition and sintering (GLMDDS), for the upscalable production of conformally adhesive, solidlike, yet transient LM thin films and patterns on diverse substrates. This method involves four steps: homogeneous deposition of LM microdroplets, gelation of the LM-gelatin solution, toughening of the gelatin hydrogel by solvent displacement, and peeling-induced sintering of LM microdroplets. The LM thin film exhibits a three-layer structure, comprising an LM microdroplet-embedded tough organohydrogel adhesion layer, a continuous LM layer, and an oxide skin. The composite exhibits high stretchability and mechanical robustness, conformal adhesion to various substrates, high conductivity (4.35 × 105 S·m-1), and transience (86% LM recycled). Large-scale deposition (i.e., 5.6 dm2) and the potential for patterns on diverse substrates demonstrate its upscalability and broad suitability. Finally, the LM thin films and patterns are applied for flexible and wearable devices, i.e., pressure sensors, heaters, human motion tracking devices, and thermal management devices, illustrating the broad applicability of this strategy.
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Affiliation(s)
- Tiansheng Gan
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Qi Xiao
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Stephan Handschuh-Wang
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Xiaoqin Huang
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Haifei Wang
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Xiaobo Deng
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Shuangyan Hu
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Ben Wang
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Qixing Wu
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
| | - Xuechang Zhou
- College of Chemistry and Environmental Engineering, Shenzhen University, Shenzhen 518060, P. R. China
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Lee GH, Woo H, Yoon C, Yang C, Bae JY, Kim W, Lee DH, Kang H, Han S, Kang SK, Park S, Kim HR, Jeong JW, Park S. A Personalized Electronic Tattoo for Healthcare Realized by On-the-Spot Assembly of an Intrinsically Conductive and Durable Liquid-Metal Composite. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2204159. [PMID: 35702762 DOI: 10.1002/adma.202204159] [Citation(s) in RCA: 34] [Impact Index Per Article: 11.3] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/09/2022] [Revised: 05/31/2022] [Indexed: 06/15/2023]
Abstract
Conventional electronic (e-) skins are a class of thin-film electronics mainly fabricated in laboratories or factories, which is incapable of rapid and simple customization for personalized healthcare. Here a new class of e-tattoos is introduced that can be directly implemented on the skin by facile one-step coating with various designs at multi-scale depending on the purpose of the user without a substrate. An e-tattoo is realized by attaching Pt-decorated carbon nanotubes on gallium-based liquid-metal particles (CMP) to impose intrinsic electrical conductivity and mechanical durability. Tuning the CMP suspension to have low-zeta potential, excellent wettability, and high-vapor pressure enables conformal and intimate assembly of particles directly on the skin in 10 s. Low-cost, ease of preparation, on-skin compatibility, and multifunctionality of CMP make it highly suitable for e-tattoos. Demonstrations of electrical muscle stimulators, photothermal patches, motion artifact-free electrophysiological sensors, and electrochemical biosensors validate the simplicity, versatility, and reliability of the e-tattoo-based approach in biomedical engineering.
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Affiliation(s)
- Gun-Hee Lee
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Heejin Woo
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Chanwoong Yoon
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Congqi Yang
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Jae-Young Bae
- Department of Materials Science and Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, Republic of Korea
| | - Wonsik Kim
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Do Hoon Lee
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Heemin Kang
- Department of Materials Science and Engineering, Korea University, 145 Anam-ro, Seongbuk-gu, Seoul, 02841, Republic of Korea
| | - Seungmin Han
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Seung-Kyun Kang
- Department of Materials Science and Engineering, Seoul National University, 1 Gwanak-ro, Gwanak-gu, Seoul, 08826, Republic of Korea
| | - Seongjun Park
- Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
- KAIST Institute for Health Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Hyung-Ryong Kim
- Department of Pharmacology, College of Dentistry, Jeonbuk National University, 567 Baekje-daero, Jeonju, 54896, Republic of Korea
| | - Jae-Woong Jeong
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
- KAIST Institute for Health Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
| | - Steve Park
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
- KAIST Institute for Health Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea
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