Curvilinear electronics formed using silicon membrane circuits and elastomeric transfer elements

Substrate-Free Transfer of Silicon- and Metallic-Based Strain Sensors on Textile and in Composite Material for Structural Health Monitoring

New technologies to integrate electronics and sensors on or into objects can support the growth of embedded electronics. The method proposed in this paper has the huge advantage of being substrate-free and applicable to a wide range of target materials such as fiber-based composites, widely used in manufacturing, and for which monitoring applications such as fatigue, cracks, and deformation detection are crucial. Here, sensors are first fabricated on a donor substrate using standard microelectronic processes and then transferred to the host material by direct transfer printing. Results show the viability of composites instrumented by strain gauges. Indeed, dynamic and static measurements highlight that the deformations can be detected with high sensitivity both on the surface and at various points in the depth of the composite material. Thanks to this technology, for the first time, a substrate-free piezoresistive n-doped silicon strain sensor is transferred into a composite material and characterized as a function of strain applied on it. It is shown that the transfer process does not alter the electrical behavior of the sensors that are five times more sensitive than extensively used metallic ones. An application designed for monitoring the deformation of a rudder foil with a classic NACA profile in real time is presented.

A Review of Structure Engineering of Strain-Tolerant Architectures for Stretchable Electronics

Stretchable electronics possess significant advantages over their conventional rigid counterparts and boost game-changing applications such as bioelectronics, flexible displays, wearable health monitors, etc. It is, nevertheless, a formidable task to impart stretchability to brittle electronic materials such as silicon. This review provides a concise but critical discussion of the prevailing structural engineering strategies for achieving strain-tolerant electronic devices. Not only the more commonly discussed lateral designs of structures such as island-bridge, wavy structures, fractals, and kirigami, but also the less discussed vertical architectures such as strain isolation and elastoplastic principle are reviewed. Future opportunities are envisaged at the end of the paper.

Mechanically-Guided 3D Assembly for Architected Flexible Electronics

Architected flexible electronic devices with rationally designed 3D geometries have found essential applications in biology, medicine, therapeutics, sensing/imaging, energy, robotics, and daily healthcare. Mechanically-guided 3D assembly methods, exploiting mechanics principles of materials and structures to transform planar electronic devices fabricated using mature semiconductor techniques into 3D architected ones, are promising routes to such architected flexible electronic devices. Here, we comprehensively review mechanically-guided 3D assembly methods for architected flexible electronics. Mainstream methods of mechanically-guided 3D assembly are classified and discussed on the basis of their fundamental deformation modes (i.e., rolling, folding, curving, and buckling). Diverse 3D interconnects and device forms are then summarized, which correspond to the two key components of an architected flexible electronic device. Afterward, structure-induced functionalities are highlighted to provide guidelines for function-driven structural designs of flexible electronics, followed by a collective summary of their resulting applications. Finally, conclusions and outlooks are given, covering routes to achieve extreme deformations and dimensions, inverse design methods, and encapsulation strategies of architected 3D flexible electronics, as well as perspectives on future applications.

Fabrication of a Flexible, Wireless Micro-Heater on Elastomer for Wearable Gas Sensor Applications

Thin-film microdevices can be applied to various wearable devices due to their high flexibility compared to conventional bulk-type electronic devices. Among the various microdevice types, many IoT-based sensor devices have been developed recently. In the case of such sensor elements, it is important to control the surrounding environment to optimize the sensing characteristics. Among these environmental factors, temperature often has a great influence. There are cases where temperature significantly affects the sensor characteristics, as is the case for gas sensors. For this purpose, the development of thin-film-type micro-heaters is important. For this study, a wirelessly driven thin-film micro-heater was fabricated on the flexible and stretchable elastomer, a polydimethylsiloxane (PDMS); the antenna was optimized; and the heater was driven at the temperature up to 102 degrees Celsius. The effect of its use on gas-sensing characteristics was compared through the application of the proposed micro-heater to a gas sensor. The heated SnO₂ nanowire gas sensor improved the performance of detecting carbon monoxide (CO) by more than 20%, and the recovery time was reduced to less than half. It is expected that thin-film-type micro-heaters that can be operated wirelessly are suitable for application in various wearable devices, including those for smart sensors and health monitoring.

Flexible Sensory Systems: Structural Approaches

Biology is characterized by smooth, elastic, and nonplanar surfaces; as a consequence, soft electronics that enable interfacing with nonplanar surfaces allow applications that could not be achieved with the rigid and integrated circuits that exist today. Here, we review the latest examples of technologies and methods that can replace elasticity through a structural approach; these approaches can modify mechanical properties, thereby improving performance, while maintaining the existing material integrity. Furthermore, an overview of the recent progress in wave/wrinkle, stretchable interconnect, origami/kirigami, crack, nano/micro, and textile structures is provided. Finally, potential applications and expected developments in soft electronics are discussed.

Flexible dual-channel digital auscultation patch with active noise reduction for bowel sound monitoring and application

Bowel sounds (BSs) have important clinical value in the auxiliary diagnosis of digestive diseases, but due to the inconvenience of long-term monitoring and too much interference from environmental noise, they have not been well studied. Most of the current electronic stethoscopes are hard and bulky without the function of noise reduction, and their application for long-term wearable monitoring of BS in noisy clinical environments is very limited. In this paper, a flexible dual-channel digital auscultation patch with active noise reduction is designed and developed, which is wireless, wearable, and conformably attached to abdominal skin to record BS more accurately. The ambient noise can be greatly reduced through active noise reduction based on the adaptive filter. At the same time, some nonstationary noises appearing intermittently (e.g., frictional noise) can also be removed from BS by the cross validation of multichannel simultaneous acquisition. Then, two kinds of typical BS signals are taken as examples, and the feature parameters of the BS in the time domain and frequency domain are extracted through the time-frequency analysis algorithm. Furthermore, based on the short-term energy ratio between the four channels of dual patches, the two-dimensional localization of BS on the abdomen mapping plane is realized. Finally, the continuous wearable monitoring of BS for patients with postoperative ileus (POI) in the noisy ward from pre-operation (POD0) to postoperative Day 7 (POD7) was carried out. The obtained change curve of the occurrence frequency of BS provides guidance for doctors to choose a reasonable feeding time for patients after surgery and accelerate their recovery. Therefore, flexible dual-channel digital auscultation patches with active noise reduction will have promising applications in the clinical auxiliary diagnosis of digestive diseases.

Emerging Iontronic Sensing: Materials, Mechanisms, and Applications

Iontronic sensors represent a novel class of soft electronics which not only replicate the biomimetic structures and perception functions of human skin but also simulate the mechanical sensing mechanism. Relying on the similar mechanism with skin perception, the iontronic sensors can achieve ion migration/redistribution in response to external stimuli, promising iontronic sensing to establish more intelligent sensing interface for human-robotic interaction. Here, a comprehensive review on advanced technologies and diversified applications for the exploitation of iontronic sensors toward ionic skins and artificial intelligence is provided. By virtue of the excellent stretchability, high transparency, ultrahigh sensitivity, and mechanical conformality, numerous attempts have been made to explore various novel ionic materials to fabricate iontronic sensors with skin-like perceptive properties, such as self-healing and multimodal sensing. Moreover, to achieve multifunctional artificial skins and intelligent devices, various mechanisms based on iontronics have been investigated to satisfy multiple functions and human interactive experiences. Benefiting from the unique material property, diverse sensing mechanisms, and elaborate device structure, iontronic sensors have demonstrated a variety of applications toward ionic skins and artificial intelligence.

Flexible Ultrasonic Patch for Accelerating Chronic Wound Healing

Ultrasound treatment is an effective method for accelerating chronic wound healing. However, it is not widely used because traditional ultrasonic probes cannot be conformal to the wound surface, which leads to limitations of use and unstable treatment effects. In addition, the use of liquid coupling agent increases the chance of wound infection. A strategy is proposed to design and fabricate a flexible ultrasonic patch for treating chronic wounds effectively. The piezoelectric ceramic in the patch is discretized into several linearly arranged units, which are integrated on a flexible circuit substrate. A thin hydrogel patch is used as both encapsulation and coupling layer to avoid wound infection and ensure the penetration of ultrasound. The ultrasonic patch is soft, light, and can completely conform to the treatment area. Bending of the patch focuses the sound beams on the center of the bending circle, which achieves control of the target treatment area. Ultrasound treatment experiments are carried out on some type-II diabetic rats. Immunohistochemical (IHC) results indicate that ultrasound accelerates wound healing by activating Rac1 in both dermal and epidermal layers. Treatment results show that wound treated with the ultrasound heals faster than wounds without. The healing time is shortened by ≈40%.

Well-rounded devices: the fabrication of electronics on curved surfaces - a review

With the arrival of the internet of things and the rise of wearable computing, electronics are playing an increasingly important role in our everyday lives. Until recently, however, the rigid angular nature of traditional electronics has prevented them from being integrated into many of the organic, curved shapes that interface with our bodies (such as ergonomic equipment or medical devices) or the natural world (such as aerodynamic or optical components). In the past few years, many groups working in advanced manufacturing and soft robotics have endeavored to develop strategies for fabricating electronics on these curved surfaces. This is their story. In this work, we describe the motivations, challenges, methodologies, and applications of curved electronics, and provide a outlook for this promising field.

Artificial Skin Perception

Skin is the largest organ, with the functionalities of protection, regulation, and sensation. The emulation of human skin via flexible and stretchable electronics gives rise to electronic skin (e-skin), which has realized artificial sensation and other functions that cannot be achieved by conventional electronics. To date, tremendous progress has been made in data acquisition and transmission for e-skin systems, while the implementation of perception within systems, that is, sensory data processing, is still in its infancy. Integrating the perception functionality into a flexible and stretchable sensing system, namely artificial skin perception, is critical to endow current e-skin systems with higher intelligence. Here, recent progress in the design and fabrication of artificial skin perception devices and systems is summarized, and challenges and prospects are discussed. The strategies for implementing artificial skin perception utilize either conventional silicon-based circuits or novel flexible computing devices such as memristive devices and synaptic transistors, which enable artificial skin to surpass human skin, with a distributed, low-latency, and energy-efficient information-processing ability. In future, artificial skin perception would be a new enabling technology to construct next-generation intelligent electronic devices and systems for advanced applications, such as robotic surgery, rehabilitation, and prosthetics.

Flexible Electronics and Healthcare Applications

Flexible electronics has attracted tremendous attention in recent years. The essential requirements for flexible electronics include excellent electrical properties, flexibility and stretchability. By introducing special structures or using flexible materials, electronic devices can be given excellent flexibility and stretchability. In this paper we review the realization of flexible electronics from the perspective of structural design strategies and materials; then, healthcare application of flexible electronic systems was introduced. Finally, a brief summary and outlook are presented.

Material innovation and mechanics design for substrates and encapsulation of flexible electronics: a review

Advances in materials and mechanics designs have led to the development of flexible electronics, which have important applications to human healthcare due to their good biocompatibility and conformal integration with biological tissue. Material innovation and mechanics design have played a key role in designing the substrates and encapsulations of flexible electronics for various bio-integrated systems. This review first introduces the inorganic materials and novel organic materials used for the substrates and encapsulation of flexible electronics, and summarizes their mechanics properties, permeability and optical transmission properties. The structural designs of the substrates are then introduced to ensure the reliability of flexible electronics, including the patterned and pre-strained designs to improve the stretchability, and the strain-isolation and -limiting substrates to reduce the deformation. Some emerging encapsulations are presented to protect the flexible electronics from degradation, environmental erosion or contamination, though they may slightly reduce the stretchability of flexible electronics.

Bending Analysis of Polymer-Based Flexible Antennas for Wearable, General IoT Applications: A Review

Flexible substrates have become essential in order to provide increased flexibility in wearable sensors, including polymers, plastic, paper, textiles and fabrics. This study is to comprehensively summarize the bending capabilities of flexible polymer substrate for general Internet of Things (IoTs) applications. The basic premise is to investigate the flexibility and bending ability of polymer materials as well as their tendency to withstand deformation. We start by providing a chronological order of flexible materials which have been used during the last few decades. In the future, the IoT is expected to support a diverse set of technologies to enable new applications through wireless connectivity. For wearable IoTs, flexibility and bending capabilities of materials are required. This paper provides an overview of some abundantly used polymer substrates and compares their physical, electrical and mechanical properties. It also studies the bending effects on the radiation performance of antenna designs that use polymer substrates. Moreover, we explore a selection of flexible materials for flexible antennas in IoT applications, namely Polyimides (PI), Polyethylene Terephthalate (PET), Polydimethylsiloxane (PDMS), Polytetrafluoroethylene (PTFE), Rogers RT/Duroid and Liquid Crystal Polymer (LCP). The study includes a complete analysis of bending and folding effects on the radiation characteristics such as S-parameters, resonant frequency deviation and the impedance mismatch with feedline of the flexible polymer substrate microstrip antennas. These flexible polymer substrates are useful for future wearable devices and general IoT applications.

Electrically compensated, tattoo-like electrodes for epidermal electrophysiology at scale

Epidermal electrophysiology is widely carried out for disease diagnosis, performance monitoring, human-machine interaction, etc. Compared with thick, stiff, and irritating gel electrodes, emerging tattoo-like epidermal electrodes offer much better wearability and versatility. However, state-of-the-art tattoo-like electrodes are limited in size (e.g., centimeters) to perform electrophysiology at scale due to challenges including large-area fabrication, skin lamination, and electrical interference from long interconnects. Therefore, we report large-area, soft, breathable, substrate- and encapsulation-free electrodes designed into transformable filamentary serpentines that can be rapidly fabricated by cut-and-paste method. We propose a Cartan curve-inspired transfer process to minimize strain in the electrodes when laminated on nondevelopable skin surfaces. Unwanted signals picked up by the unencapsulated interconnects can be eliminated through a previously unexplored electrical compensation strategy. These tattoo-like electrodes can comfortably cover the whole chest, forearm, or neck for applications such as multichannel electrocardiography, sign language recognition, prosthetic control or mapping of neck activities.

Gate-Tunable Semiconductor Heterojunctions from 2D/3D van der Waals Interfaces

van der Waals (vdW) semiconductors are attractive for highly scaled devices and heterogeneous integration as they can be isolated into self-passivated, two-dimensional (2D) layers that enable superior electrostatic control. These attributes have led to numerous demonstrations of field-effect devices ranging from transistors to triodes. By exploiting the controlled, substitutional doping schemes in covalently bonded, three-dimensional (3D) semiconductors and the passivated surfaces of 2D semiconductors, one can construct devices that can exceed performance metrics of "all-2D" vdW heterojunctions. Here, we demonstrate 2D/3D semiconductor heterojunctions using MoS₂ as the prototypical 2D semiconductor laid upon Si and GaN as the 3D semiconductor layers. By tuning the Fermi levels in MoS₂, we demonstrate devices that concurrently exhibit over 7 orders of magnitude modulation in rectification ratios and conductance. Our results further suggest that the interface quality does not necessarily affect Fermi level tuning at the junction, opening up possibilities for novel 2D/3D heterojunction device architectures.

Mechanically-Guided Structural Designs in Stretchable Inorganic Electronics

Over the past decade, the area of stretchable inorganic electronics has evolved very rapidly, in part because the results have opened up a series of unprecedented applications with broad interest and potential for impact, especially in bio-integrated systems. Low modulus mechanics and the ability to accommodate extreme mechanical deformations, especially high levels of stretching, represent key defining characteristics. Most existing studies exploit structural material designs to achieve these properties, through the integration of hard inorganic electronic components configured into strategic 2D/3D geometries onto patterned soft substrates. The diverse structural geometries developed for stretchable inorganic electronics are summarized, covering the designs of functional devices and soft substrates, with a focus on fundamental principles, design approaches, and system demonstrations. Strategies that allow spatial integration of 3D stretchable device layouts are also highlighted. Finally, perspectives on the remaining challenges and open opportunities are provided.

Electro-mechanically controlled assembly of reconfigurable 3D mesostructures and electronic devices based on dielectric elastomer platforms

The manufacture of 3D mesostructures is receiving rapidly increasing attention, because of the fundamental significance and practical applications across wide-ranging areas. The recently developed approach of buckling-guided assembly allows deterministic formation of complex 3D mesostructures in a broad set of functional materials, with feature sizes spanning nanoscale to centimeter-scale. Previous studies mostly exploited mechanically controlled assembly platforms using elastomer substrates, which limits the capabilities to achieve on-demand local assembly, and to reshape assembled mesostructures into distinct 3D configurations. This work introduces a set of design concepts and assembly strategies to utilize dielectric elastomer actuators as powerful platforms for the electro-mechanically controlled 3D assembly. Capabilities of sequential, local loading with desired strain distributions allow access to precisely tailored 3D mesostructures that can be reshaped into distinct geometries, as demonstrated by experimental and theoretical studies of ∼30 examples. A reconfigurable inductive–capacitive radio-frequency circuit consisting of morphable 3D capacitors serves as an application example.

Micro/Nanoscale 3D Assembly by Rolling, Folding, Curving, and Buckling Approaches

The miniaturization of electronics has been an important topic of study for several decades. The established roadmaps following Moore's Law have encountered bottlenecks in recent years, as planar processing techniques are already close to their physical limits. To bypass some of the intrinsic challenges of planar technologies, more and more efforts have been devoted to the development of 3D electronics, through either direct 3D fabrication or indirect 3D assembly. Recent research efforts into direct 3D fabrication have focused on the development of 3D transistor technologies and 3D heterogeneous integration schemes, but these technologies are typically constrained by the accessible range of sophisticated 3D geometries and the complexity of the fabrication processes. As an alternative route, 3D assembly methods make full use of mature planar technologies to form predefined 2D precursor structures in the desired materials and sizes, which are then transformed into targeted 3D mesostructures by mechanical deformation. The latest progress in the area of micro/nanoscale 3D assembly, covering the various classes of methods through rolling, folding, curving, and buckling assembly, is discussed, focusing on the design concepts, principles, and applications of different methods, followed by an outlook on the remaining challenges and open opportunities.

Paper-Cut Flexible Multifunctional Electronics Using MoS2 Nanosheet

Art and science represent human creativity and rational thinking, respectively. When the two seemingly opposite fields are intertwined, there is always a life-changing spark. In particular, the integration of ancient traditional Chinese art into the latest electronic devices is always been an unexcavated topic. Fabricating two-dimensional material with a tensile strain less than 3% with an ultimate global stretch has been an important problem that plagues the current flexible electronics field. The current research is limited to material in small scale, and it is always necessary to develop and extend large-sized flexible electronic systems. Here, inspired by the traditional Chinese paper-cut structure, we present a highly deformable multifunctional electronic system based on the MoS2 nanosheet. In this work, we first demonstrate how the traditional paper-cut structure can open the view of flexible electronics. In order to obtain a large area of MoS2 with excellent performance, we use a metal-assisted exfoliation method to transfer MoS2, followed by fabricating a field effect transistor to characterize its excellent electrical properties. Two photodetectors and a temperature sensor are produced with good performance. The mechanical simulation proves that the structure has more advantages in stretchability than other typical paper-cut structures. From the experimental and mechanical point of view, it is proved that the device can work stably under high deformation. We finally show that the device has broad application prospects in highly deformed organs, tissues, and joints. These findings set a good example of traditional Chinese culture to guide innovation in the field of electronic devices.

Softening gold for elastronics

Gold, one of the noble metals, has played a significant role in human society throughout history. Gold's excellent electrical, optical and chemical properties make the element indispensable in maintaining a prosperous modern electronics industry. In the emerging field of stretchable electronics (elastronics), the main challenge is how to utilize these excellent material properties under various mechanical deformations. This review covers the recent progress in developing "softening" gold chemistry for various applications in elastronics. We systematically present material synthesis and design principles, applications, and challenges and opportunities ahead.

Transfer Printing and its Applications in Flexible Electronic Devices

Flexible electronic systems have received increasing attention in the past few decades because of their wide-ranging applications that include the flexible display, eyelike digital camera, skin electronics, and intelligent surgical gloves, among many other health monitoring devices. As one of the most widely used technologies to integrate rigid functional devices with elastomeric substrates for the manufacturing of flexible electronic devices, transfer printing technology has been extensively studied. Though primarily relying on reversible interfacial adhesion, a variety of advanced transfer printing methods have been proposed and demonstrated. In this review, we first summarize the characteristics of a few representative methods of transfer printing. Next, we will introduce successful demonstrations of each method in flexible electronic devices. Moreover, the potential challenges and future development opportunities for transfer printing will then be briefly discussed.

Materials and Structures toward Soft Electronics

Soft electronics are intensively studied as the integration of electronics with dynamic nonplanar surfaces has become necessary. Here, a discussion of the strategies in materials innovation and structural design to build soft electronic devices and systems is provided. For each strategy, the presentation focuses on the fundamental materials science and mechanics, and example device applications are highlighted where possible. Finally, perspectives on the key challenges and future directions of this field are presented.

Tape nanolithography: a rapid and simple method for fabricating flexible, wearable nanophotonic devices

This paper describes a tape nanolithography method for the rapid and economical manufacturing of flexible, wearable nanophotonic devices. This method involves the soft lithography of a donor substrate with air-void nanopatterns, subsequent deposition of materials onto the substrate surface, followed by direct taping and peeling of the deposited materials by an adhesive tape. Without using any sophisticated techniques, the nanopatterns, which are preformed on the surface of the donor substrate, automatically emerge in the deposited materials. The nanopatterns can then be transferred to the tape surface. By leveraging the works of adhesion at the interfaces of the donor substrate-deposited material-tape assembly, this method not only demonstrates sub-hundred-nanometer resolution in the transferred nanopatterns on an area of multiple square inches but also exhibits high versatility and flexibility for configuring the shapes, dimensions, and material compositions of tape-supported nanopatterns to tune their optical properties. After the tape transfer, the materials that remain at the bottom of the air-void nanopatterns on the donor substrate exhibit shapes complementary to the transferred nanopatterns on the tape surface but maintain the same composition, thus also acting as functional nanophotonic structures. Using tape nanolithography, we demonstrate several tape-supported plasmonic, dielectric, and metallo-dielectric nanostructures, as well as several devices such as refractive index sensors, conformable plasmonic surfaces, and Fabry-Perot cavity resonators. Further, we demonstrate tape nanolithography-assisted manufacturing of a standalone plasmonic nanohole film and its transfer to unconventional substrates such as a cleaved facet and the curved side of an optical fiber.

Continuous reversible tuning of the gap size and plasmonic coupling of bow tie nanoantennas on flexible substrates

As a multifunctional device for sensing experiments and fundamental research, tailor-made plasmonic nanostructures with continuously tunable resonances are created by preparing bow tie-shaped nanostructures on a flexible substrate. The bow ties are fabricated by electron beam lithography on a chromium sacrificial layer and transferred to a polydimethylsiloxane (PDMS) substrate. The structures on PDMS are analyzed by reflection dark-field spectroscopy and scanning electron microscopy. Dark-field spectra of individual nano-antennas are obtained while the substrate is relaxed, and while strain is applied and the substrate is elastically stretched. Depending on the alignment of the bow ties relative to the direction of the strain, the deformation of the substrates leads to an increase or decrease of the nanostructure gaps, and therefore to a fully reversible decrease or increase of the antenna coupling, respectively. The continuous change in coupling is visible as a blue-shift in the resonance of the coupling mode for increasing gap widths, and a red-shift for decreasing gap widths. This configuration offers interesting perspectives for molecular transport and sensing investigations under variable coupling conditions as well as for tunable SERS substrates and optical strain sensor applications. In particular, very narrow gaps are within reach in the transversal configuration.

Robotic Flexible Electronics with Self-Bendable Films

Mechanical flexibility introduced in functional electronic devices has allowed electronics to avoid mechanical breakage, conform to nonplanar surfaces, or attach to deformable surfaces, leading to greatly expanded applications, and some research efforts have already led to commercialization. However, most of these devices are passively bendable by external driving forces. Actively bendable flexible thin film devices can be applied to new fields with new functionalities. Here, we report robotic flexible electronics with actively self-bendable flexible films that can serve as a platform for flexible electronics and other applications with the capability of reversible bending and unbending by electrical control. Experimental studies along with mechanical modeling enable the predictable and reversible transformation into different structures by adjusting the design parameters. Demonstrations for self-bendable flexible displays and soft robotic hands prove the feasibility of the concept.

Recent Advances in Biointegrated Optoelectronic Devices

With recent progress in the design of materials and mechanics, opportunities have arisen to improve optoelectronic devices, circuits, and systems in curved, flexible, stretchable, and biocompatible formats, thereby enabling integration of customized optoelectronic devices and biological systems. Here, the core material technologies of biointegrated optoelectronic platforms are discussed. An overview of the design and fabrication methods to form semiconductor materials and devices in flexible and stretchable formats is presented, strategies incorporating various heterogeneous substrates, interfaces, and encapsulants are discussed, and their applications in biomimetic, wearable, and implantable systems are highlighted.

Vibration of Mechanically-Assembled 3D Microstructures Formed by Compressive Buckling

Micro-electromechanical systems (MEMS) that rely on structural vibrations have many important applications, ranging from oscillators and actuators, to energy harvesters and vehicles for measurement of mechanical properties. Conventional MEMS, however, mostly utilize two-dimensional (2D) vibrational modes, thereby imposing certain limitations that are not present in 3D designs (e.g., multi-directional energy harvesting). 3D vibrational microplatforms assembled through the techniques of controlled compressive buckling are promising because of their complex 3D architectures and the ability to tune their vibrational behaviour (e.g., natural frequencies and modes) by reversibly changing their dimensions by deforming their soft, elastomeric substrates. A clear understanding of such strain-dependent vibration behaviour is essential for their practical applications. Here, we present a study on the linear and nonlinear vibration of such 3D mesostructures through analytical modeling, finite element analysis (FEA) and experiment. An analytical solution is obtained for the vibration mode and linear natural frequency of a buckled ribbon, indicating a mode change as the static deflection amplitude increases. The model also yields a scaling law for linear natural frequency that can be extended to general, complex 3D geometries, as validated by FEA and experiment. In the regime of nonlinear vibration, FEA suggests that an increase of amplitude of external loading represents an effective means to enhance the bandwidth. The results also uncover a reduced nonlinearity of vibration as the static deflection amplitude of the 3D structures increases. The developed analytical model can be used in the development of new 3D vibrational microplatforms, for example, to enable simultaneous measurement of diverse mechanical properties (density, modulus, viscosity etc.) of thin films and biomaterials.

Large-Area Self-Assembly of Silica Microspheres/Nanospheres by Temperature-Assisted Dip-Coating

This work reports a temperature-assisted dip-coating method for self-assembly of silica (SiO₂) microspheres/nanospheres (SPs) as monolayers over large areas (∼cm²). The area over which self-assembled monolayers (SAMs) are formed can be controlled by tuning the suspension temperature (T_s), which allows precise control over the meniscus shape. Furthermore, the formation of periodic stripes of SAMs, with excellent dimensional control (stripe width and stripe-to-stripe spacing), is demonstrated using a suitable set of dip-coating parameters. These findings establish the role of T_s, and other parameters such as withdrawal speed (V_w), withdrawal angle (θ_w), and withdrawal step length (L_w). For T_s ranged between 25 and 80 °C, the morphological analysis of dip-coatings shows layered structures comprising of defective layers (25-60 °C), single layers (70 °C), and multilayers (>70 °C) owing to the variation of SP flux at the meniscus/substrate assembling interface. At T_s = 70 °C, there is an optimum V_w, approximately equal to the downshift speed of the meniscus (V_m = 1.3 μm/s), which allows the SAM formation over areas (2.25 cm²) roughly 10 times larger than reported in the literature using nanospheres. Finally, the large-area SAM is used to demonstrate the enhanced performance of antireflective coatings for photovoltaic cells and to create metal nanomesh for Si nanowire synthesis.

Lab-on-Skin: A Review of Flexible and Stretchable Electronics for Wearable Health Monitoring

Skin is the largest organ of the human body, and it offers a diagnostic interface rich with vital biological signals from the inner organs, blood vessels, muscles, and dermis/epidermis. Soft, flexible, and stretchable electronic devices provide a novel platform to interface with soft tissues for robotic feedback and control, regenerative medicine, and continuous health monitoring. Here, we introduce the term "lab-on-skin" to describe a set of electronic devices that have physical properties, such as thickness, thermal mass, elastic modulus, and water-vapor permeability, which resemble those of the skin. These devices can conformally laminate on the epidermis to mitigate motion artifacts and mismatches in mechanical properties created by conventional, rigid electronics while simultaneously providing accurate, non-invasive, long-term, and continuous health monitoring. Recent progress in the design and fabrication of soft sensors with more advanced capabilities and enhanced reliability suggest an impending translation of these devices from the research lab to clinical environments. Regarding these advances, the first part of this manuscript reviews materials, design strategies, and powering systems used in soft electronics. Next, the paper provides an overview of applications of these devices in cardiology, dermatology, electrophysiology, and sweat diagnostics, with an emphasis on how these systems may replace conventional clinical tools. The review concludes with an outlook on current challenges and opportunities for future research directions in wearable health monitoring.

Conformal Electronics Wrapped Around Daily Life Objects Using an Original Method: Water Transfer Printing

The water transfer printing method is used to transfer patterned films on random three-dimensional objects. This industrially viable technology has been demonstrated to intimately wrap metallic and polymeric films around different materials. This method avoids the use of rigid substrate during the transfer step. Patterns can be transferred to objects without folds even when holed, addressing a challenging issue in the field of conformal electronics. This technique allows high film bending properties to be reached. This promising method enables us to integrate large-area films onto daily life objects. A bent capacitive touchpad is fabricated showing the potential applications of this technology.

Soft Multifunctional Composites and Emulsions with Liquid Metals

Binary mixtures of liquid metal (LM) or low-melting-point alloy (LMPA) in an elastomeric or fluidic carrier medium can exhibit unique combinations of electrical, thermal, and mechanical properties. This emerging class of soft multifunctional composites have potential applications in wearable computing, bio-inspired robotics, and shape-programmable architectures. The dispersion phase can range from dilute droplets to connected networks that support electrical conductivity. In contrast to deterministically patterned LM microfluidics, LMPA- and LM-embedded elastomer (LMEE) composites are statistically homogenous and exhibit effective bulk properties. Eutectic Ga-In (EGaIn) and Ga-In-Sn (Galinstan) alloys are typically used due to their high conductivity, low viscosity, negligible nontoxicity, and ability to wet to nonmetallic materials. Because they are liquid-phase, these alloys can alter the electrical and thermal properties of the composite while preserving the mechanics of the surrounding medium. For composites with LMPA inclusions (e.g., Field's metal, Pb-based solder), mechanical rigidity can be actively tuned with external heating or electrical activation. This progress report, reviews recent experimental and theoretical studies of this emerging class of soft material architectures and identifies current technical challenges and opportunities for further advancement.

Review of Flexible Temperature Sensing Networks for Wearable Physiological Monitoring

Physiological temperature varies temporally and spatially. Accurate and real-time detection of localized temperature changes in biological tissues regardless of large deformation is crucial to understand thermal principle of homeostasis, to assess sophisticated health conditions, and further to offer possibilities of building a smart healthcare and medical system. Additionally, continuous temperature mapping in flexible and stretchable formats opens up many other potential areas, such as artificially electronic skins and reflection of emotional changes. This review exploits a comprehensive investigation onto recent advances in flexible temperature sensors, stretchable sensor networks, and platforms constructed in soft and compliant formats for wearable physiological monitoring. The most recent examples of flexible temperature sensors are first discussed regarding to their materials, structures, electrical and mechanical properties; temperature sensing network technologies in new materials and structural designs are then presented based on platforms comprised of multiple physical sensors and stretchable electronics. Finally, wearable applications of the sensing network are described, such as detection of human activities, monitoring of health conditions, and emotion-related bodily sensations. Conclusions are made with emphasis on critical issues and new trends in the field of wearable temperature sensor network technologies.

Stretchable Organic Semiconductor Devices

Stretchable electronics are essential for the development of intensely packed collapsible and portable electronics, wearable electronics, epidermal and bioimplanted electronics, 3D surface compliable devices, bionics, prosthesis, and robotics. However, most stretchable devices are currently based on inorganic electronics, whose high cost of fabrication and limited processing area make it difficult to produce inexpensive, large-area devices. Therefore, organic stretchable electronics are highly attractive due to many advantages over their inorganic counterparts, such as their light weight, flexibility, low cost and large-area solution-processing, the reproducible semiconductor resources, and the easy tuning of their properties via molecular tailoring. Among them, stretchable organic semiconductor devices have become a hot and fast-growing research field, in which great advances have been made in recent years. These fantastic advances are summarized here, focusing on stretchable organic field-effect transistors, light-emitting devices, solar cells, and memory devices.

Adhesiveless Transfer Printing of Ultrathin Microscale Semiconductor Materials by Controlling the Bending Radius of an Elastomeric Stamp

High-performance electronic devices integrated onto unconventional substrates provide opportunities for use in diverse applications, such as wearable or implantable forms of electronic devices. However, the interlayer adhesives between the electronic devices and substrates often limit processing temperature or cause electrical or thermal resistance at the interface. This paper introduces a very simple but effective transfer printing method that does not require an interlayer adhesive. Controlling the bending radius of a simple flat stamp enables picking up or printing of microscale semiconductor materials onto rigid, curvilinear, or flexible surfaces without the aid of a liquid adhesive. Theoretical and experimental studies reveal the underlying mechanism of the suggested approach. Adhesiveless printing of thin Si plates onto diverse substrates demonstrates the capability of this method.

Wrinkling of a stiff thin film bonded to a pre-strained, compliant substrate with finite thickness

A stiff thin film bonded to a pre-strained, compliant substrate wrinkles into a sinusoidal form upon release of the pre-strain. Many analytical models developed for the critical pre-strain for wrinkling assume that the substrate is semi-infinite. This critical pre-strain is actually much smaller than that for a substrate with finite thickness (Ma Y et al. 2016 Adv. Funct. Mater. (doi:10.1002/adfm.201600713)). An analytical solution of the critical pre-strain for a system of a stiff film bonded to a pre-strained, finite-thickness, compliant substrate is obtained, and it agrees well with the finite-element analysis. The finite-thickness effect is significant when the substrate tensile stiffness cannot overwhelm the film tensile stiffness.

CMOS-Technology-Enabled Flexible and Stretchable Electronics for Internet of Everything Applications

Flexible and stretchable electronics can dramatically enhance the application of electronics for the emerging Internet of Everything applications where people, processes, data and devices will be integrated and connected, to augment quality of life. Using naturally flexible and stretchable polymeric substrates in combination with emerging organic and molecular materials, nanowires, nanoribbons, nanotubes, and 2D atomic crystal structured materials, significant progress has been made in the general area of such electronics. However, high volume manufacturing, reliability and performance per cost remain elusive goals for wide commercialization of these electronics. On the other hand, highly sophisticated but extremely reliable, batch-fabrication-capable and mature complementary metal oxide semiconductor (CMOS)-based technology has facilitated tremendous growth of today's digital world using thin-film-based electronics; in particular, bulk monocrystalline silicon (100) which is used in most of the electronics existing today. However, one fundamental challenge is that state-of-the-art CMOS electronics are physically rigid and brittle. Therefore, in this work, how CMOS-technology-enabled flexible and stretchable electronics can be developed is discussed, with particular focus on bulk monocrystalline silicon (100). A comprehensive information base to realistically devise an integration strategy by rational design of materials, devices and processes for Internet of Everything electronics is offered.

Mechanics and thermal management of stretchable inorganic electronics

Stretchable electronics enables lots of novel applications ranging from wearable electronics, curvilinear electronics to bio-integrated therapeutic devices that are not possible through conventional electronics that is rigid and flat in nature. One effective strategy to realize stretchable electronics exploits the design of inorganic semiconductor material in a stretchable format on an elastomeric substrate. In this review, we summarize the advances in mechanics and thermal management of stretchable electronics based on inorganic semiconductor materials. The mechanics and thermal models are very helpful in understanding the underlying physics associated with these systems, and they also provide design guidelines for the development of stretchable inorganic electronics.

Wide-angle structured light with a scanning MEMS mirror in liquid

Microelectromechanical (MEMS) mirrors have extended vision capabilities onto small, low-power platforms. However, the field-of-view (FOV) of these MEMS mirrors is usually less than 90° and any increase in the MEMS mirror scanning angle has design and fabrication trade-offs in terms of power, size, speed and stability. Therefore, we need techniques to increase the scanning range while still maintaining a small form factor. In this paper we exploit our recent breakthrough that has enabled the immersion of MEMS mirrors in liquid. While allowing the MEMS to move, the liquid additionally provides a "Snell's window" effect and enables an enlarged FOV (≈ 150°). We present an optimized MEMS mirror design and use it to demonstrate applications in extreme wide-angle structured light.

Implantable neurotechnologies: a review of micro- and nanoelectrodes for neural recording

Electrodes serve as the first critical interface to the biological organ system. In neuroprosthetic applications, for example, electrodes interface to the tissue for either signal recording or tissue stimulation. In this review, we consider electrodes for recording neural activity. Recording electrodes serve as wiretaps into the neural tissues, providing readouts of electrical activity. These signals give us valuable insights into the organization and functioning of the nervous system. The recording interfaces have also shown promise in aiding treatment of motor and sensory disabilities caused by neurological disorders. Recent advances in fabrication technology have generated wide interest in creating tiny, high-density electrode interfaces for neural tissues. An ideal electrode should be small enough and be able to achieve reliable and conformal integration with the structures of the nervous system. As a result, the existing electrode designs are being shrunk and packed to form small form factor interfaces to tissue. Here, an overview of the historic and state-of-the-art electrode technologies for recording neural activity is presented first with a focus on their development road map. The fact that the dimensions of recording electrode sites are being scaled down from micron to submicron scale to enable dense interfaces is appreciated. The current trends in recording electrode technologies are then reviewed. Current and future considerations in electrode design, including the use of inorganic nanostructures and biologically inspired or biocomapatible materials are discussed, along with an overview of the applications of flexible materials and transistor transduction schemes. Finally, we detail the major technical challenges facing chronic use of reliable recording electrode technology.

Analysis of deformation of flexible hemispherical lens arrays based on soft elastomers

In this paper, flexible hemispherical lens arrays based on soft elastomers were fabricated. Then, the effects of various geometric parameters on the deformation (i.e., hemispherical deformation and radial extension) of these lens arrays were investigated experimentally and were verified by finite element analysis. We focused on determining the relationship between the geometric parameters and the radius of curvature of the lens. We found that the height of the lens support post plays an important role in minimizing changes in the radius of curvature of the lens. The results of this research offer valuable design principles for flexible lens arrays, which can be used as an optical component of various flexible optoelectronic devices.

Mechanical Designs for Inorganic Stretchable Circuits in Soft Electronics

Mechanical concepts and designs in inorganic circuits for different levels of stretchability are reviewed in this paper, through discussions of the underlying mechanics and material theories, fabrication procedures for the constituent microscale/nanoscale devices, and experimental characterization. All of the designs reported here adopt heterogeneous structures of rigid and brittle inorganic materials on soft and elastic elastomeric substrates, with mechanical design layouts that isolate large deformations to the elastomer, thereby avoiding potentially destructive plastic strains in the brittle materials. The overall stiffnesses of the electronics, their stretchability, and curvilinear shapes can be designed to match the mechanical properties of biological tissues. The result is a class of soft stretchable electronic systems that are compatible with traditional high-performance inorganic semiconductor technologies. These systems afford promising options for applications in portable biomedical and health-monitoring devices. Mechanics theories and modeling play a key role in understanding the underlining physics and optimization of these systems.

Three-dimensionally deformable, highly stretchable, permeable, durable and washable fabric circuit boards

This paper reports fabric circuit boards (FCBs), a new type of circuit boards, that are three-dimensionally deformable, highly stretchable, durable and washable ideally for wearable electronic applications. Fabricated by using computerized knitting technologies at ambient dry conditions, the resultant knitted FCBs exhibit outstanding electrical stability with less than 1% relative resistance change up to 300% strain in unidirectional tensile test or 150% membrane strain in three-dimensional ball punch test, extraordinary fatigue life of more than 1 000 000 loading cycles at 20% maximum strain, and satisfactory washing capability up to 30 times. To the best of our knowledge, the performance of new FCBs has far exceeded those of previously reported metal-coated elastomeric films or other organic materials in terms of changes in electrical resistance, stretchability, fatigue life and washing capability as well as permeability. Theoretical analysis and numerical simulation illustrate that the structural conversion of knitted fabrics is attributed to the effective mitigation of strain in the conductive metal fibres, hence the outstanding mechanical and electrical properties. Those distinctive features make the FCBs particularly suitable for next-to-skin electronic devices. This paper has further demonstrated the application potential of the knitted FCBs in smart protective apparel for in situ measurement during ballistic impact.

Geckoprinting: assembly of microelectronic devices on unconventional surfaces by transfer printing with isolated gecko setal arrays

Developing electronics in unconventional forms provides opportunities to expand the use of electronics in diverse applications including bio-integrated or implanted electronics. One of the key challenges lies in integrating semiconductor microdevices onto unconventional substrates without glue, high pressure or temperature that may cause damage to microdevices, substrates or interfaces. This paper describes a solution based on natural gecko setal arrays that switch adhesion mechanically on and off, enabling pick and place manipulation of thin microscale semiconductor materials onto diverse surfaces including plants and insects whose surfaces are usually rough and irregular. A demonstration of functional 'geckoprinted' microelectronic devices provides a proof of concept of our results in practical applications.

A first implementation of an automated reel-to-reel fluidic self-assembly machine

A first automated reel-to-reel fluidic selfassembly process for macroelectronic applications is reported. This system enables high-speed assembly of semiconductor dies (15 000 chips per hour using a 2.5 cm-wide web) over large-area substrates. The optimization of the system (>99% assembly yield) is based on identification, calculation, and optimization of the relevant forces. As an application, the production of a solid-state lighting panel is discussed, involving a novel approach to apply a conductive layer through lamination.